CN113079647A - Method for manufacturing flexible die-cut conductor circuit - Google Patents
Method for manufacturing flexible die-cut conductor circuit Download PDFInfo
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- CN113079647A CN113079647A CN202110317698.XA CN202110317698A CN113079647A CN 113079647 A CN113079647 A CN 113079647A CN 202110317698 A CN202110317698 A CN 202110317698A CN 113079647 A CN113079647 A CN 113079647A
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- conductor foil
- conductor
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- foil
- film layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a flexible die-cut conductor circuit, which comprises the following steps: s1: preparing a conductor foil for die cutting or stamping processing and a carrier film layer with adhesive property; wherein, the quantity of the prepared one part of conductor foil material needs to correspond to the quantity of the prepared two parts of bearing film layers; s2: the prepared conductor foil and the prepared bearing film layer are both arranged on die cutting processing equipment or punching machine processing equipment, one bearing film layer is arranged above the conductor foil, and the other bearing film layer is arranged below the conductor foil; performing primary processing treatment on the conductor foil by using a pre-prepared die to divide the conductor foil into a primary processing area and a secondary processing area; simultaneously attaching the bearing film layers above and below the conductor foil to the conductor foil; s3: and placing the conductor foil subjected to the first processing in laser cutting processing equipment, and carrying out second cutting processing on the secondary processing area. The invention can solve the defects of line breakage and the like of the die cutting process and simultaneously give consideration to the production efficiency.
Description
Technical Field
The invention relates to the technical field of conductor circuit manufacturing processes, in particular to a flexible die-cutting conductor circuit manufacturing method.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. The flexible circuit can provide excellent electrical performance, can meet the design requirements for smaller and higher density mounting, and also contributes to reduced assembly processes and enhanced reliability. At present, flexible circuit boards are divided into single-layer boards, double-layer boards, multi-layer boards, double-sided boards and the like according to the layer number of conductive copper foils, and no matter what flexible circuit board is, the flexible circuit board basically adopts a material of a base material and copper foils, and then the copper foils are subjected to processes such as etching and the like to obtain a required circuit. Currently, etching technology is relatively mature, and flexible conductor lines in various shapes can be processed by using an etching process.
However, this technique has the disadvantages that the use cost is high, the pollution is large, and it is more difficult to etch the substrate with a larger thickness, and in addition, in the mass production, the material can only be etched in units of half a meter, and in the actual use, the connection of the two circuit boards needs to be realized by welding at the connection position, so the cold joint phenomenon is easy to occur, the efficiency is seriously affected, and the cost is increased. In order to overcome the problems generated by the etching process, a scheme for producing a flexible conductor circuit board by a die cutting process or a laser cutting process is also available in the market, but the die cutting process is easy to have process defects such as wire breakage and the like when producing a fine conductor circuit, and the production efficiency of the laser cutting process is too low to apply large-scale production requirements.
Disclosure of Invention
Therefore, it is necessary to provide a method for manufacturing a flexible die-cut conductor circuit, which aims at the problems of controlling cost efficiently, reducing pollution, and simultaneously considering production efficiency and avoiding process defects such as wire breakage.
The invention provides a method for manufacturing a flexible die-cut conductor circuit, which comprises the following steps:
s1: preparing a conductor foil for die cutting or stamping processing and a carrier film layer with adhesive property; wherein, the quantity of the prepared one part of conductor foil material needs to correspond to the quantity of the prepared two parts of bearing film layers;
s2: the prepared conductor foil and the prepared bearing film layer are both arranged on die cutting processing equipment or punching machine processing equipment, one bearing film layer is arranged above the conductor foil, and the other bearing film layer is arranged below the conductor foil; performing primary processing treatment on the conductor foil by using a pre-prepared die to divide the conductor foil into a primary processing area and a secondary processing area; simultaneously attaching the bearing film layers above and below the conductor foil to the conductor foil;
s3: and placing the conductor foil subjected to the first processing in laser cutting processing equipment, and carrying out second cutting processing on the secondary processing area.
Preferably, the conductive foil used in step S1 is a foil having a conductive substance.
Preferably, the supporting film layer used in step S1 is made of PET, PI, PEN, PPS, PTFE, PVC, or PO.
Further, in step S2, the circuit area with the line width greater than 0.20mm is the primary processing area, and the circuit area with the line width not less than 0.01mm and not more than 0.20mm is the secondary processing area.
Preferably, in step S2, the circuit area with the line width of 0.50mm or more and 5mm or less is the primary processing area, and the circuit area with the line width of 0.05mm or more and 0.15mm or less is the secondary processing area.
Further, in the step S2, the process of attaching the carrier film layer to the conductor foil includes heating and pressing the carrier film layer with a laminating device to integrate the conductor foil and the carrier film layer.
Furthermore, in step S3, the conductor foil after the second processing can further remove the unwanted area, specifically by manual peeling, mechanical peeling, vacuum absorption, local heating or bonding with an adhesive tape.
Furthermore, in step S3, the structural strength of the conductor foil after the second processing may be enhanced, specifically by coating a photosensitive curing agent or coating a thermoplastic liquid crystal polymer.
According to the manufacturing method of the flexible die-cutting conductor circuit, the scheme of combining the die-cutting or stamping process with the laser cutting process is applied, the flexible conductor circuit is divided into a primary processing area and a secondary processing area, and the die-cutting or stamping processing process with high production efficiency is used for the thicker conductor circuit in the primary processing area; the laser cutting process which is poor in production efficiency and accurate in machining is used for the thin conductor line in the secondary machining area, the two processes are combined, the problems of line breakage and the like caused by the traditional die cutting process or the punching process can be effectively solved, and the problem of low production efficiency of the laser cutting process can be effectively solved. Meanwhile, the introduction of an etching process which is accurate in processing, high in cost and heavy in pollution can be avoided.
The manufacturing method of the flexible die-cut conductor circuit can be widely applied to the fields including thin conductor circuits such as safety circuits.
Drawings
FIG. 1 is a schematic flow chart of a method of making a flexible die-cut conductor circuit according to the present invention;
FIG. 2 is a schematic diagram of a flexible die-cut conductor circuit structure made using the present invention;
FIG. 3 is a schematic diagram of an intermediate structure for making the embodiment of FIG. 2;
FIG. 4 is a schematic diagram of another intermediate form structure for making the embodiment of FIG. 2;
FIG. 5 is a schematic diagram of another intermediate structure for making the embodiment of FIG. 2.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Referring to fig. 1, a method 1 for manufacturing a flexible die-cut conductor circuit according to the present invention includes the following steps:
s1: preparing a conductor foil for die cutting or stamping processing and a carrier film layer with adhesive property; wherein, the quantity of the prepared one part of conductor foil material needs to correspond to the quantity of the prepared two parts of bearing film layers;
s2: the prepared conductor foil and the prepared bearing film layer are both placed on die cutting processing equipment or punch processing equipment, one part of the bearing film layer is placed above the conductor foil, and the other part of the bearing film layer is placed below the conductor foil; performing primary processing treatment on the conductor foil by using a pre-prepared die to divide the conductor foil into a primary processing area and a secondary processing area; simultaneously attaching the bearing film layers above and below the conductor foil to the conductor foil;
s3: and placing the conductor foil subjected to the first processing on laser cutting processing equipment, and carrying out second cutting processing on the secondary processing area.
The invention can avoid the pollution problem caused by the etching process and also can solve the defect problems of the disconnection and the like of the flexible conductor circuit with smaller size caused by the traditional die cutting or stamping processing mode.
Preferably, in step S1, the conductive foil may be copper foil, aluminum foil, graphene, graphite or carbon film, or other foils with conductive material.
Preferably, in step S1, the carrier film layer is made of PET, PI, PEN, PPS, PTFE, PVC, or PO;
further, in step S2, the primary processing area and the secondary processing area may be generally divided according to the size of the conductor line to be processed, and the specific division rule is: in the conductor circuit, a circuit area with the line width larger than 0.20mm is used as a primary processing area, and die cutting equipment or punching equipment is used for processing in primary processing; in the conductor line, a line region with a line width of 0.01mm or more and 0.20mm or less is used as a secondary processing region, and then further processing is performed by using a laser cutting device in the subsequent step S3.
Preferably, in the rule of dividing the primary processing region and the secondary processing region, the conductor line width of the primary processing region is more preferably: the line width is not less than 0.50mm and not more than 5 mm; the more optimal conductor line width in the secondary processing area is as follows: the line width is not less than 0.05mm and not more than 0.15 mm.
In step S2, the process of attaching the carrier film layers above and below the conductor foil to the conductor foil generally includes heating and pressing the carrier film layers with a laminating device to integrate the conductor foil and the insulating layer.
The desired flexible conductor circuit product is generally obtained, but some of the processed conductor foils require further stripping process treatment, via step S3. The conductor foil after the second processing treatment can further remove the unnecessary area, specifically, only the required conductor foil circuit area is reserved after the treatment through manual stripping, mechanical stripping, vacuum adsorption, local heating or adhesive tape bonding and the like;
further, in step S3, the structural strength of the conductor foil after the second processing may be enhanced, specifically, coating a photosensitive curing agent, coating a thermoplastic liquid crystal polymer, and the like. After the step S3, the product reserved in the secondary processing area is small in size and easy to break, photosensitive curing agents such as UV (ultraviolet) glue and the like can be coated on the surface structure of the product to be protected, and after the product is cured, the structural strength of the product can be improved. Binders such as thermoplastic liquid crystal polymers may also be applied to achieve similar results.
Fig. 2 shows a specific example of a flexible conductor circuit manufactured by the present invention. The circuit 101 on both sides of the product is thicker than the circuit 102 in the middle of the product. Such a structure has a wide range of applications, for example, it can be applied to a fusible safety line, and when the load in the line exceeds a preset value, the thinner line 2 is fused, thereby protecting the whole line from overload. The invention can avoid the defect of the thin circuit 102 caused by directly using a single die cutting or punching processing technology.
Please refer to fig. 3 to 5, which are schematic process diagrams illustrating key steps for fabricating the case of fig. 2 according to the present invention, wherein fig. 3 corresponds to step S2 of the present invention, and fig. 4 corresponds to step S3 of the present invention. In addition, the process schematic of step S1 is omitted.
As shown in fig. 3, after the first processing treatment is performed on the conductor foil by the die cutting processing device or the punch processing device, the conductor foil is divided into a first processing area 101a and a second processing area 102 a. In the primary processing region 101a, the circuits 101 on the left and right sides of the conductor foil are completed, and a secondary processing region 102a is reserved in the middle of the conductor foil. The reserved secondary processing area 102a needs to be slightly larger than the whole size of the line 2, so that the position of the product subjected to secondary positioning during secondary processing is allowed to have certain offset, and the shortage of the allowance of the secondary processing is avoided.
As shown in fig. 4, the conductor foil processed for the first time is placed on a laser cutting device, the laser cutting track moves in the secondary processing area 102a reserved in the previous step, and the laser cutting device performs the second cutting processing on the product, so as to complete the preparation of the circuit 102.
After the above steps, as shown in fig. 5, it is sometimes necessary to further process and remove the unnecessary regions in the conductive foil, specifically, the unnecessary regions may be removed by manual peeling, mechanical peeling, vacuum suction, local heating, or tape bonding. Since the remaining wires 102 are small in size and easily broken, they need to be further structurally reinforced in subsequent steps, and the purpose of increasing their strength can be usually achieved by applying a photosensitive curing agent, applying a thermoplastic liquid crystal polymer, or the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method for manufacturing a flexible die-cut conductor circuit is characterized by comprising the following steps:
s1: preparing a conductor foil for die cutting or stamping processing and a carrier film layer with adhesive property; wherein, the quantity of the prepared one part of conductor foil material needs to correspond to the quantity of the prepared two parts of bearing film layers;
s2: the prepared conductor foil and the prepared bearing film layer are both arranged on die cutting processing equipment or punching machine processing equipment, one bearing film layer is arranged above the conductor foil, and the other bearing film layer is arranged below the conductor foil; performing primary processing treatment on the conductor foil by using a pre-prepared die to divide the conductor foil into a primary processing area and a secondary processing area; simultaneously attaching the bearing film layers above and below the conductor foil to the conductor foil;
s3: and placing the conductor foil subjected to the first processing in laser cutting processing equipment, and carrying out second cutting processing on the secondary processing area.
2. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: the conductive foil used in step S1 is a foil having a conductive material.
3. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: the supporting film layer adopted in the step S1 is made of PET, PI, PEN, PPS, PTFE, PVC, or PO.
4. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: in the step S2, the circuit region with the line width greater than 0.20mm is a primary processing region, and the circuit region with the line width not less than 0.01mm and not more than 0.20mm is a secondary processing region.
5. A method of making a flexible die-cut conductor line as claimed in claim 4, wherein: in step S2, the line region with a line width of 0.50mm or more and 5mm or less is a primary processing region, and the line region with a line width of 0.05mm or more and 0.15mm or less is a secondary processing region.
6. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: in step S2, the process of attaching the carrier film layer to the conductor foil is to use a laminating device to heat and press the carrier film layer, so that the conductor foil and the carrier layer are integrated.
7. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: in step S3, the conductor foil after the second processing may further remove the unwanted area, specifically by manual peeling, mechanical peeling, vacuum absorption, local heating or bonding with an adhesive tape.
8. A method of making a flexible die-cut conductor line as claimed in claim 1, wherein: in step S3, the structural strength of the conductor foil after the second processing may also be enhanced, specifically by coating a photosensitive curing agent or coating a thermoplastic liquid crystal polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110317698.XA CN113079647A (en) | 2021-03-25 | 2021-03-25 | Method for manufacturing flexible die-cut conductor circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110317698.XA CN113079647A (en) | 2021-03-25 | 2021-03-25 | Method for manufacturing flexible die-cut conductor circuit |
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| CN113079647A true CN113079647A (en) | 2021-07-06 |
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| CN202110317698.XA Pending CN113079647A (en) | 2021-03-25 | 2021-03-25 | Method for manufacturing flexible die-cut conductor circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
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| US20060019075A1 (en) * | 2004-07-26 | 2006-01-26 | Samsung Electro-Mechanics Co., Ltd. | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| CN106252815A (en) * | 2016-01-05 | 2016-12-21 | 张健 | A kind of Apparatus and method for producing RFID antenna |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN112188745A (en) * | 2020-09-30 | 2021-01-05 | 深圳光韵达激光应用技术有限公司 | Die-cutting conductor circuit manufacturing process |
-
2021
- 2021-03-25 CN CN202110317698.XA patent/CN113079647A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060019075A1 (en) * | 2004-07-26 | 2006-01-26 | Samsung Electro-Mechanics Co., Ltd. | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| CN106252815A (en) * | 2016-01-05 | 2016-12-21 | 张健 | A kind of Apparatus and method for producing RFID antenna |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN112188745A (en) * | 2020-09-30 | 2021-01-05 | 深圳光韵达激光应用技术有限公司 | Die-cutting conductor circuit manufacturing process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
| CN114799553B (en) * | 2022-04-22 | 2023-10-20 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
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