CN114710888A - FPC structure and preparation method thereof - Google Patents
FPC structure and preparation method thereof Download PDFInfo
- Publication number
- CN114710888A CN114710888A CN202210385704.XA CN202210385704A CN114710888A CN 114710888 A CN114710888 A CN 114710888A CN 202210385704 A CN202210385704 A CN 202210385704A CN 114710888 A CN114710888 A CN 114710888A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- circuit
- fpc structure
- bonding pad
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
- 239000011889 copper foil Substances 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000001723 curing Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims abstract description 8
- 238000001029 thermal curing Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 238000003698 laser cutting Methods 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of FPC structure preparation, and discloses an FPC structure and a preparation method thereof, wherein the method comprises the following steps: roll-coating a thermosetting adhesive layer on a roll-type copper foil material, and performing semi-curing; die-cutting the copper foil material into a line copper foil by a circular knife die-cutting machine; respectively pressing two layers of PI films to two sides of the circuit copper foil through hot rollers, and performing thermocuring; according to a preset circuit, carrying out laser cutting on the position of the circuit bonding pad subjected to thermal curing so as to expose the copper surface bonding pad; and carrying out plasma cleaning on the copper surface bonding pad, and coating an anti-oxidation layer on the surface of the copper surface bonding pad to obtain the FPC structure. The invention can improve the production efficiency of the FPC structure, has no pollution in the preparation process and reduces the manufacturing cost of the FPC structure.
Description
Technical Field
The invention relates to the technical field of FPC structure preparation, in particular to an FPC structure and a preparation method thereof.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible circuit board is called a flexible board or FPC for short, and has the characteristics of high wiring density, light weight and thin thickness.
In the prior art, the traditional FPC structure preparation process needs steps of dry film exposure, development, etching, film removal and the like, and has a long process, long time consumption and high manufacturing cost.
Therefore, how to provide an FPC structure and a method for manufacturing the same to improve the production efficiency of the FPC structure becomes an urgent technical problem to be solved.
Disclosure of Invention
The invention aims to provide an FPC structure and a preparation method thereof, so as to improve the production efficiency of the FPC structure.
Therefore, according to a first aspect, an embodiment of the present invention discloses a method for manufacturing an FPC structure, including: rolling and coating a thermosetting adhesive layer on the rolled copper foil material, and semi-curing; die-cutting the copper foil material into a line copper foil by a circular knife die-cutting machine; respectively pressing the two laminating films to two sides of the circuit copper foil through hot rollers, and performing thermocuring; according to a preset circuit, carrying out laser cutting on the circuit copper foil subjected to thermosetting so as to expose the copper surface bonding pad; and carrying out plasma cleaning on the copper surface bonding pad, and coating an anti-oxidation layer on the surface of the copper surface bonding pad to obtain the FPC structure.
The invention is further arranged that the method comprises the following steps of coating a thermosetting adhesive layer on the rolled copper foil material in a rolling way, performing semi-curing, and performing die cutting on the copper foil material by a circular knife die cutting machine to form a circuit copper foil, and also comprises the following steps:
preparing a corresponding circular knife mold according to a preset circuit;
and installing the semi-cured copper foil material in the circular knife mold.
The invention is further set that the circuit copper foil after the hot roller pressing is put into an oven for baking and curing.
The invention is further configured to arrange hot air channels on the production line to cure the circuit copper foil and the laminating film.
The invention is further configured that the laminating film is a PI film.
The invention further provides that the copper foil material is a single-sided or double-sided FCCL substrate.
According to a second aspect, an embodiment of the present invention discloses an FPC structure, including: the circuit copper foil of circuit is predetermine to having, the two sides of circuit copper foil are equipped with respectively and press the membrane, press the membrane with be equipped with the thermosetting glue film between the circuit copper foil, the thermosetting glue film be used for with press the membrane with circuit copper foil bonds fixedly.
The invention is further configured to further include: and the copper surface bonding pad penetrates through the laminating film and the thermosetting adhesive layer.
The invention is further configured such that the copper-side bonding pad is a single-side bonding pad or a double-side bonding pad.
The invention is further configured that the laminating film is a PI film.
The invention has the following beneficial effects: the embodiment of the invention discloses a preparation method of an FPC structure, which comprises the steps of coating a roll-type copper foil material with a thermosetting adhesive layer in a rolling way, and semi-curing; die-cutting the copper foil material into a line copper foil by a circular knife die-cutting machine; respectively pressing two layers of laminating films to two sides of the circuit copper foil through hot rollers, and performing thermosetting; according to a preset circuit, carrying out laser cutting on the circuit copper foil subjected to thermosetting so as to expose the copper surface bonding pad; and carrying out plasma cleaning on the copper surface bonding pad, and coating an anti-oxidation layer on the surface of the copper surface bonding pad to obtain the FPC structure. Compared with the prior art, the invention can improve the production efficiency of the FPC structure, has no pollution in the preparation process and reduces the manufacturing cost of the FPC structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a method for manufacturing an FPC structure disclosed in this embodiment;
fig. 2 is a schematic perspective view of an FPC structure disclosed in this embodiment;
fig. 3 is a schematic perspective view of another FPC structure disclosed in this embodiment.
Reference numerals: 1. a circuit copper foil; 2. laminating the film; 3. a thermosetting adhesive layer; 4. and a copper surface bonding pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
According to a first aspect, an embodiment of the present invention discloses a method for manufacturing an FPC structure, as shown in fig. 1, including:
step S101, roll-type copper foil material is coated with a thermosetting adhesive layer 3 in a rolling mode and semi-cured;
step S102, cutting the copper foil material into a line copper foil 1 by a circular knife die-cutting machine; respectively pressing the two laminating films 2 to two sides of the circuit copper foil 1 through hot rollers, and performing thermocuring;
step S103, according to a preset circuit, carrying out laser cutting on the position of the line bonding pad subjected to thermal curing so as to expose the copper surface bonding pad 4;
and step S104, carrying out plasma cleaning on the copper surface bonding pad 4, and coating an anti-oxidation layer on the surface of the copper surface bonding pad 4 to obtain the FPC structure.
The preparation method of the FPC structure disclosed in the embodiment of the present invention includes roll-coating a roll-type copper foil material with a thermosetting adhesive layer 3, and semi-curing; cutting the copper foil material by a circular knife die cutting machine to form a line copper foil 1; respectively pressing the two laminating films 2 to two sides of the circuit copper foil 1 through hot rollers, and performing thermocuring; according to a preset circuit, carrying out laser cutting on the circuit copper foil 1 subjected to thermal curing so as to expose the copper surface bonding pad 4; and (4) carrying out plasma cleaning on the copper surface bonding pad 4, and coating an anti-oxidation layer on the surface of the copper surface bonding pad 4 to obtain the FPC structure. Compared with the prior art, the invention can improve the production efficiency of the FPC structure, has no pollution in the preparation process and reduces the manufacturing cost of the FPC structure.
It should be further noted that the preparation method disclosed by the invention is suitable for preparing single-sided or double-sided circuit boards with the line spacing larger than 0.3 mm.
In a specific implementation process, between step S101 and step S102, the method further includes:
preparing a corresponding circular knife mold according to a preset circuit;
and installing the semi-cured copper foil material in a circular knife mold.
In an alternative embodiment, the circuit copper foil 1 after the hot roll bonding is put into an oven for baking and curing.
In an alternative embodiment, hot air channels are arranged on the production line to cure the circuit copper foil 1 and the laminating film 2.
In an alternative embodiment, the laminating film 2 is a PI film. It should be noted that PI films have outstanding resistance to high temperatures, radiation, chemical corrosion and electrical insulation.
In an alternative embodiment, the copper foil material is a single or double sided FCCL substrate.
According to a second aspect, an embodiment of the present invention discloses an FPC structure, as shown in fig. 2 and 3, including: the circuit copper foil 1 with predetermineeing the circuit, the two sides of circuit copper foil 1 are equipped with respectively and cover the pressure membrane 2, are equipped with thermosetting glue film 3 between cover pressure membrane 2 and the circuit copper foil 1, and thermosetting glue film 3 is used for fixedly bonding cover pressure membrane 2 and circuit copper foil 1. In the implementation process, the circuit copper foil 1 can be made of a single-sided or double-sided FCCL substrate.
As shown in fig. 2 and 3, the method further includes: and the copper surface bonding pad 4 is arranged on the circuit copper foil 1, and the copper surface bonding pad 4 penetrates through the laminating film 2 and the thermosetting adhesive layer 3.
As shown in fig. 2 and 3, the copper-side pads 4 are single-side pads or double-side pads.
As shown in fig. 2 and 3, the laminating film 2 is a PI film. It should be noted that PI films have outstanding resistance to high temperatures, radiation, chemical corrosion and electrical insulation.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A method for manufacturing an FPC structure is characterized by comprising the following steps:
rolling and coating a thermosetting adhesive layer on the rolled copper foil material, and semi-curing;
die-cutting the copper foil material into a line copper foil by a circular knife die-cutting machine;
respectively pressing the two laminating films to two sides of the circuit copper foil through hot rollers, and performing thermocuring;
according to a preset circuit, carrying out laser cutting on the circuit copper foil subjected to thermosetting so as to expose the copper surface bonding pad;
and carrying out plasma cleaning on the copper surface bonding pad, and coating an anti-oxidation layer on the surface of the copper surface bonding pad to obtain the FPC structure.
2. The method for manufacturing the FPC structure of claim 1, wherein between the roll-type copper foil material being roll-coated with the thermosetting adhesive layer and being semi-cured and the copper foil material being die-cut by a circular knife die cutter to form a circuit copper foil, the method further comprises:
preparing a corresponding circular knife mold according to a preset circuit;
and installing the semi-cured copper foil material in the circular knife mold.
3. The method of claim 1, wherein the circuit copper foil after the hot roll bonding is placed in an oven for baking and curing.
4. The method of manufacturing an FPC structure according to claim 1, wherein a hot air passage is arranged on a production line to cure the wiring copper foil and the laminating film.
5. The method of any one of claims 1-4, wherein the laminating film is a PI film.
6. The method of any one of claims 1-4, wherein the copper foil material is a single-sided or double-sided FCCL substrate.
7. An FPC structure, comprising: the circuit copper foil with predetermine the circuit, the two sides of circuit copper foil are equipped with respectively and cover the pressure membrane, cover the pressure membrane with be equipped with the thermosetting glue film between the circuit copper foil, the thermosetting glue film be used for with cover the pressure membrane with the circuit copper foil bonds fixedly.
8. The FPC structure of claim 7, further comprising: and the copper surface bonding pad penetrates through the laminating film and the thermosetting adhesive layer.
9. The FPC structure of claim 8, wherein the copper-side pads are single-sided pads or double-sided pads.
10. The FPC structure of any one of claims 7-9, wherein the laminating film is a PI film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210385704.XA CN114710888A (en) | 2022-04-13 | 2022-04-13 | FPC structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210385704.XA CN114710888A (en) | 2022-04-13 | 2022-04-13 | FPC structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114710888A true CN114710888A (en) | 2022-07-05 |
Family
ID=82174704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210385704.XA Pending CN114710888A (en) | 2022-04-13 | 2022-04-13 | FPC structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114710888A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116095592A (en) * | 2023-02-20 | 2023-05-09 | 东莞市纳声电子设备科技有限公司 | Automatic assembly production line for web film and FPC |
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|---|---|---|---|---|
| JP2002171032A (en) * | 2000-11-30 | 2002-06-14 | Fujikura Ltd | Copper clad laminate for double-sided flexible printed board, and method of manufacturing the same |
| CN101714692A (en) * | 2009-11-23 | 2010-05-26 | 北京澳普林特精密电子有限公司 | Preparation method of copper foil antenna |
| CN201491395U (en) * | 2009-06-18 | 2010-05-26 | 苏州工业园区久泰精密电子有限公司 | FPC die-cutting production system |
| CN204272493U (en) * | 2014-12-31 | 2015-04-15 | 广州市宝利邦德高分子材料有限公司 | A kind of flexible LED substrate |
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| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN113692130A (en) * | 2021-08-27 | 2021-11-23 | 广东则成科技有限公司 | FPC structure and manufacturing method thereof |
| CN114340156A (en) * | 2021-11-04 | 2022-04-12 | 新余市木林森线路板有限公司 | Manufacturing method of PET material die cutting process flexible single panel |
| CN217160119U (en) * | 2022-04-13 | 2022-08-09 | 深圳市安元达电子有限公司 | FPC structure |
-
2022
- 2022-04-13 CN CN202210385704.XA patent/CN114710888A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002171032A (en) * | 2000-11-30 | 2002-06-14 | Fujikura Ltd | Copper clad laminate for double-sided flexible printed board, and method of manufacturing the same |
| CN201491395U (en) * | 2009-06-18 | 2010-05-26 | 苏州工业园区久泰精密电子有限公司 | FPC die-cutting production system |
| CN101714692A (en) * | 2009-11-23 | 2010-05-26 | 北京澳普林特精密电子有限公司 | Preparation method of copper foil antenna |
| CN204272493U (en) * | 2014-12-31 | 2015-04-15 | 广州市宝利邦德高分子材料有限公司 | A kind of flexible LED substrate |
| CN106827716A (en) * | 2017-03-20 | 2017-06-13 | 成都三益新材料有限公司 | A kind of thin-type flexible copper-clad plate and preparation method thereof |
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN113692130A (en) * | 2021-08-27 | 2021-11-23 | 广东则成科技有限公司 | FPC structure and manufacturing method thereof |
| CN114340156A (en) * | 2021-11-04 | 2022-04-12 | 新余市木林森线路板有限公司 | Manufacturing method of PET material die cutting process flexible single panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116095592A (en) * | 2023-02-20 | 2023-05-09 | 东莞市纳声电子设备科技有限公司 | Automatic assembly production line for web film and FPC |
| CN116095592B (en) * | 2023-02-20 | 2024-04-05 | 东莞市纳声电子设备科技有限公司 | Automatic assembly production line for web film and FPC |
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