CN113692130A - FPC structure and manufacturing method thereof - Google Patents
FPC structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN113692130A CN113692130A CN202110996856.9A CN202110996856A CN113692130A CN 113692130 A CN113692130 A CN 113692130A CN 202110996856 A CN202110996856 A CN 202110996856A CN 113692130 A CN113692130 A CN 113692130A
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- China
- Prior art keywords
- film
- copper foil
- jig
- cover film
- circuit copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an FPC structure and a manufacturing method thereof, wherein the FPC structure comprises a second cover film, a first adhesive layer, a circuit copper foil, a second adhesive layer and a first cover film, the second cover film and the first cover film are respectively arranged on two surfaces of the circuit copper foil, the first adhesive layer is arranged between the second cover film and the circuit copper foil, and the second adhesive layer is arranged between the first cover film and the circuit copper foil. The manufacturing method comprises the following steps: cutting the copper foil into a circuit copper foil according to the circuit diagram; manufacturing a corresponding jig according to the shape and the size of the circuit copper foil; attaching the circuit copper foil to a jig, and heating and fixing by using a soldering iron; and respectively pressing the second covering film and the first covering film on two sides of the circuit copper foil by using a quick press. The second covering film and the first covering film are respectively pressed on two sides of the circuit copper foil by using a quick press, so that the two sides of the circuit copper foil can be conveniently provided with copper windows, the windowing process is simplified, and the production efficiency and the product precision are improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to an FPC structure and a manufacturing method thereof.
Background
A Flexible Printed Circuit (FPC), which is a circuit board having a conventional structure including Copper foil (Copper foil), thermosetting Adhesive (Adhesive), and PI film (Polyimide film). The board has the advantages of space saving, light weight, high flexibility and the like, and has extremely wide application in daily life, particularly various electronic products with the figure. According to the structure of the FPC, the FPC can be divided into a single panel, a double-sided board, a multilayer board and a rigid-flex board according to the number of conductor layers. Printed circuit boards are basic products in the electronics industry, are widely used in electronic products such as communication equipment, computers, automotive electronics, industrial equipment, various household appliances and the like, and have the main function of supporting circuit elements and interconnecting circuit elements.
The general structure of the single panel comprises a CVL layer, a copper layer, an adhesive layer and a PI layer, or comprises the CVL layer, the copper layer and the PI layer (wherein the CVL layer also comprises the adhesive layer and the PI layer in a two-layer structure), so that only single-side windowing can be performed to expose copper, and if double-side windowing is performed, the PI/adhesive at the position needing windowing can only be ablated by laser on a non-covered film surface. The process of exposing copper by ablating PI/glue at the position needing windowing by laser to make double-sided windowing is complex, high in cost, low in yield and not in line with market requirements. Or the film is prepared by dry film exposure, development, etching and film stripping, but the method has the disadvantages of long flow, long time consumption, high cost and poor practicability.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the FPC structure and the manufacturing method thereof, wherein the second cover film and the first cover film are respectively pressed on two sides of the circuit copper foil, and the double-sided copper window is manufactured, so that the production efficiency and the yield of the FPC can be improved.
In one aspect, an embodiment of the present invention provides a method for manufacturing an FPC, including the following steps:
cutting a copper foil into a circuit copper foil according to a circuit diagram, and manufacturing a corresponding first jig and a corresponding second jig according to the shape and the size of the circuit copper foil;
placing the first jig on a heating platform, and sleeving a first covering film on a positioning needle of the first jig according to corresponding positioning holes;
placing the second jig pasted with the release film on the first cover film according to the corresponding positioning hole cover, placing the circuit copper foil into the hollowed area of the second jig, and taking out the second jig after placing;
according to the positioning pin of the first jig, a second covering film is attached to the first jig, and then the second covering film is lightly pressed by an iron for pre-attaching;
and respectively pressing the second covering film and the first covering film on two sides of the circuit copper foil by using a quick press.
The FPC manufacturing method provided by the embodiment of the invention at least has the following beneficial effects: manufacturing a corresponding jig according to the shape and the size of the circuit copper foil, and attaching the circuit copper foil to the jig, so that the problem that the circuit copper foil is easy to deviate is solved; the second cover film and the first cover film are respectively pressed on two sides of the circuit copper foil by using a quick press, and the manufacturing method of the embodiment of the invention enables the two sides of the circuit copper foil to be conveniently provided with copper windows, thereby simplifying the windowing process.
According to some embodiments of the present invention, the first fixture is placed on the heating platform, and the first cover film is sleeved on the positioning pins of the first fixture according to the corresponding positioning holes, further comprising the following steps: the glue surface of the first cover film is placed upwards.
According to some embodiments of the invention, the method for manufacturing the cover plate comprises the following steps of: the release film is arranged opposite to the glue surface of the first covering film.
According to some embodiments of the invention, a glue-blocking film is further disposed between the release film and the second cover film.
According to some embodiments of the invention, the second cover film and the first cover film are further provided with an adhesive glue layer.
According to some embodiments of the present invention, a second cover film is attached to the first jig according to the positioning pin of the first jig, and then the first jig is lightly pressed by an iron for pre-attachment, further comprising the steps of: the glue side of the second cover film is placed downwards.
On the other hand, the embodiment of the invention also provides an FPC structure, which comprises a first cover film, a first adhesive layer, a circuit copper foil, a second adhesive layer and a second cover film, wherein the second cover film and the first cover film are respectively arranged on two surfaces of the circuit copper foil, the first adhesive layer is arranged between the second cover film and the circuit copper foil, and the second adhesive layer is arranged between the first cover film and the circuit copper foil.
According to some embodiments of the invention, the second cover film and the first cover film are PI films.
According to some embodiments of the invention, the FPC structure further comprises a copper window disposed on both sides of the circuit copper foil, the copper window penetrating the second coverlay film and the first adhesive layer, or the copper window penetrating the first coverlay film and the second adhesive layer.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
Additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a block diagram of the steps of a FPC manufacturing method according to an embodiment of the present invention;
FIG. 2 is a schematic view of an FPC structure of an embodiment of the present invention;
fig. 3 is a schematic view of a first fixture according to an embodiment of the invention;
FIG. 4 is a schematic view of a second fixture according to an embodiment of the invention;
fig. 5 is a schematic view of a cover film of an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 1, in one aspect, an embodiment of the present invention provides a method for manufacturing an FPC, including:
s100, cutting the copper foil into a circuit copper foil according to a circuit diagram, and manufacturing a corresponding first jig and a second jig according to the shape and the size of the circuit copper foil;
s200, placing the first jig on the heating platform, and sleeving the first covering film on the positioning needle of the first jig according to the corresponding positioning hole;
s300, placing the second jig pasted with the release film on the first cover film according to the corresponding positioning hole cover, placing the circuit copper foil into the hollowed area of the second jig, and taking out the second jig after placing;
s400, attaching the second covering film to the first jig according to the positioning pin of the first jig, and slightly pressing the second covering film by using an iron for pre-attaching;
and S500, respectively pressing the second covering film and the first covering film on two sides of the circuit copper foil by using a quick press.
In this embodiment, a soldering iron or other heating device may be used to replace an iron to slightly press the first jig for pre-bonding, a corresponding jig is manufactured according to the shape and size of the circuit copper foil, and the circuit copper foil is bonded to the jig, so as to solve the problem that the circuit copper foil is easy to shift; the second covering film and the first covering film are respectively pressed on the two sides of the circuit copper foil by using a quick press, so that the two sides of the circuit copper foil can be conveniently provided with copper windows.
According to some embodiments of the present invention, before cutting the copper foil into a circuit copper foil according to the circuit diagram, the method further comprises the following steps: the sizes of the copper foil, the second covering film and the first covering film are designed according to requirements, and customers usually make certain requirements on the materials and the sizes of the copper foil, the second covering film and the first covering film so as to save cost.
According to some embodiments of the present invention, before attaching the circuit copper foil to the jig and heating and fixing the circuit copper foil by using an iron or a soldering iron, the method further includes the following steps: and after the second covering film is sleeved into the first jig, the second jig pasted with the release film is covered on the second covering film, the jig comprises a first jig and a second jig, wherein the first jig is arranged below the second jig, the second jig is arranged above the second jig, and the release film is used for isolating the second covering film so that the second covering film is not easy to adhere together.
According to some embodiments of the present invention, a glue-blocking film is further disposed between the release film and the second cover film, and the glue-blocking film is used to control excessive glue overflow at the opening position when the copper foil is laminated with the two cover films, which affects the size of the opening and the quality of the copper surface.
According to some embodiments of the present invention, the second cover film and the first cover film are further provided with an adhesive layer, and the adhesive layer is integrated with the cover film so that the cover film and the circuit copper foil are tightly adhered together.
According to some embodiments of the present invention, after the second coverlay film and the first coverlay film are respectively laminated on both sides of the circuit copper foil by using a rapid press, the method further comprises the following steps: and baking the copper foil for 1 hour in a temperature environment of 150 ℃ to enhance the adhesion between the covering film and the circuit copper foil.
On the other hand, referring to fig. 2, an embodiment of the present invention further provides an FPC structure, including a first cover film 121, a first adhesive layer 111, a circuit copper foil 100, a second adhesive layer 112, and a second cover film 122, where the second cover film 122 and the first cover film 121 are respectively disposed on two sides of the circuit copper foil 100, the first adhesive layer 111 is disposed between the second cover film 122 and the circuit copper foil 100, and the second adhesive layer 112 is disposed between the first cover film 121 and the circuit copper foil 100. The second cover film 122 and the first cover film 121 are respectively pressed on two sides of the circuit copper foil 100 by using a quick press, and the two sides of the circuit copper foil 100 can be conveniently provided with the copper windows 130 by the FPC structure of the embodiment of the invention, so that the windowing process is simplified.
According to some embodiments of the present invention, the second cover film 122 and the first cover film 121 are PI films having outstanding high temperature resistance, radiation resistance, chemical resistance and electrical insulation properties.
According to some embodiments of the present invention, the FPC structure further includes a copper window 130 disposed on both sides of the circuit copper foil 100, the copper window 130 penetrating the second coverlay film 122 and the first adhesive layer 111, or the copper window 130 penetrating the first coverlay film 121 and the second adhesive layer 112.
According to some embodiments of the present invention, the jig includes a first jig and a second jig, as shown in fig. 3, fig. 3 is a schematic view of the first jig 141, which includes a first positioning hole 1411. Fig. 4 is a schematic view of the second fixture 142, the second fixture 142 is provided with a milled-out area 144, the copper foil 143 is placed on the milled-out area 144, and the second fixture 142 is also provided with a first positioning hole 1411.
According to some embodiments of the present invention, fig. 5 is a schematic view of a cover film for a fenestration, which includes a second positioning hole 151.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. A FPC manufacturing method is characterized by comprising the following steps:
cutting a copper foil into a circuit copper foil according to a circuit diagram, and manufacturing a corresponding first jig and a corresponding second jig according to the shape and the size of the circuit copper foil;
placing the first jig on a heating platform, and sleeving a first covering film on a positioning needle of the first jig according to corresponding positioning holes;
placing the second jig pasted with the release film on the first cover film according to the corresponding positioning hole cover, placing the circuit copper foil into the hollowed area of the second jig, and taking out the second jig after placing;
attaching a second covering film to the first jig according to the positioning pin of the first jig, and slightly pressing the first jig by using an iron for pre-attaching;
and respectively pressing the second covering film and the first covering film on two sides of the circuit copper foil by using a quick press.
2. The FPC manufacturing method of claim 1, wherein a first jig is placed on the heating platform, and then the first cover film is sleeved on the positioning pins of the first jig according to the corresponding positioning holes, further comprising the steps of: the glue surface of the first cover film is placed upwards.
3. The FPC manufacturing method according to claim 1, wherein the second jig to which the release film is attached is covered on the first coverlay film according to a corresponding positioning hole, further comprising the steps of: the release film is arranged opposite to the glue surface of the first covering film.
4. The FPC manufacturing method according to claim 1, wherein a glue-blocking film is further disposed between the release film and the second cover film.
5. The FPC manufacturing method according to claim 1, wherein the second coverlay film and the first coverlay film are further provided with an adhesive layer.
6. The FPC manufacturing method according to claim 1, wherein a second coverlay film is attached to the first jig according to a positioning pin of the first jig, and the second coverlay film is lightly pressed by an iron for pre-attachment, further comprising: the glue side of the second cover film is placed downwards.
7. An FPC structure, its characterized in that: including first cover film, first bonding glue film, circuit copper foil, second bonding glue film and second cover film, the second cover film with first cover film set up respectively in two faces of circuit copper foil, the second cover film with be provided with between the circuit copper foil first bonding glue film, first cover film with be provided with between the circuit copper foil the second bonding glue film.
8. The FPC structure of claim 7, wherein: the second cover film and the first cover film are PI films.
9. The FPC structure of claim 7, wherein: the FPC structure still includes the copper window that circuit copper foil both sides set up, the copper window runs through the second cover film with first bonding glue film, perhaps the copper window runs through first cover film with the second bonding glue film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110996856.9A CN113692130A (en) | 2021-08-27 | 2021-08-27 | FPC structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110996856.9A CN113692130A (en) | 2021-08-27 | 2021-08-27 | FPC structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113692130A true CN113692130A (en) | 2021-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110996856.9A Pending CN113692130A (en) | 2021-08-27 | 2021-08-27 | FPC structure and manufacturing method thereof |
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| CN (1) | CN113692130A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114710888A (en) * | 2022-04-13 | 2022-07-05 | 深圳市安元达电子有限公司 | FPC structure and preparation method thereof |
| CN116347779A (en) * | 2023-04-12 | 2023-06-27 | 珠海智锐科技有限公司 | Manufacturing method of staggered windowed hollowed-out plate |
-
2021
- 2021-08-27 CN CN202110996856.9A patent/CN113692130A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114710888A (en) * | 2022-04-13 | 2022-07-05 | 深圳市安元达电子有限公司 | FPC structure and preparation method thereof |
| CN116347779A (en) * | 2023-04-12 | 2023-06-27 | 珠海智锐科技有限公司 | Manufacturing method of staggered windowed hollowed-out plate |
| CN116347779B (en) * | 2023-04-12 | 2023-09-19 | 珠海智锐科技有限公司 | Manufacturing method of staggered windowed hollowed-out plate |
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