CN111234286A - Flexible conductive film and preparation method thereof - Google Patents
Flexible conductive film and preparation method thereof Download PDFInfo
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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Abstract
The invention discloses a flexible conductive film and a preparation method thereof, and the preparation method comprises the following steps: and coating nano copper ink on the surface of the substrate, and performing light wave sintering to form a copper film on the substrate. The preparation method of the flexible conductive film combines the nano-copper printing ink and the light wave sintering, partial copper film is formed by partial melting during sintering, the continuous copper film can be partially embedded on the surface of the flexible substrate to form strong bonding force, the copper film can be prevented from being oxidized in the air by the light wave sintering, and the ultrathin copper film with the thickness of less than 1 micron and low resistance is prepared on the substrate without any intermediate bonding layer.
Description
Technical Field
The invention belongs to the field of integrated circuits, and particularly relates to a flexible conductive film and a preparation method thereof.
Background
The flexible printed circuit board FPC mainly uses a Polyimide (PI) copper clad laminate (FCCL) or a Polyester (PET) copper clad laminate, particularly the PI copper clad laminate, and is widely used in electronic products such as aerospace equipment, mobile phones, digital cameras, automotive electronic liquid crystal televisions, notebook computers and the like at present. With the continuous development of electronic products in the directions of light weight, thinness, short length and small size, the performance of the flexible copper-clad foil is required to be improved continuously, the high resolution and the line width of the conductive line are required to reach the requirement of 10 micrometers, and the thickness of the copper foil is required to be smaller and smaller. Existing adhesive flexible copper clad laminates are manufactured by bonding a metal foil to a commercially available polyimide film with an adhesive such as epoxy resin, and therefore, the heat resistance, chemical resistance, flame retardancy, electrical properties, etc. thereof are governed by the properties of the specific adhesive used. To overcome the shortcomings of prior art flexible metal foil/polyimide laminates using adhesives, there is a market demand for glue-free flexible copper clad laminates. Flexible metal foil laminates without an adhesive layer have been developed which are produced by casting and coating a polyimide resin or a polyimide resin precursor (polyamic acid) varnish directly on a metal foil. The polyimide resin in the layer in contact with the metal foil generally has a lower glass transition temperature (Tg) than the polyimide resin in the remaining layers to ensure the adhesive strength to the metal foil. The heat resistance and the like of these flexible metal foil laminates are significantly improved, but the advantage of the advantageous properties of polyimide films is still not fully utilized. The other method is a vacuum sputtering method, wherein a copper film or a copper foil is deposited on a PI substrate in vacuum, and in order to improve the bonding force between the copper foil and the PI, the bonding force between the copper and the PI film is generally required to be enhanced through a dielectric layer. However, the copper and PI bonding force of the copper foil is still not the same as that of the base material copper-clad plate. It has been reported that the binding force between copper and the PI film is enhanced by using Cr as a medium, but Cr is hardly etched away when forming a circuit pattern, which affects the manufacture of the circuit pattern. Meanwhile, no matter the glue base material or the laminated non-glue base material exists, the copper foil is thick and large in surface roughness at present, the application requirement in the aspect of high frequency 5G cannot be met, the manufacturing requirement of a fine circuit cannot be met, particularly, only an ultrathin copper film can be found for a circuit with the resolution of less than 10 micrometers/10 micrometers, at present, the ultrathin copper required in the market is 5 micrometers, the copper foil is generally prepared by a vacuum sputtering method, and the problems of weak bonding force and high manufacturing cost still exist.
Disclosure of Invention
Based on the flexible conductive film and the preparation method thereof, the invention aims to prepare the low-resistance ultrathin copper film with the thickness of less than 1 micron on the substrate, and the ultrathin copper film has strong bonding force with the substrate without any intermediate bonding layer.
In order to achieve the purpose, the invention adopts the technical scheme that: a preparation method of a flexible conductive film comprises the following steps: and coating nano copper ink on the surface of the substrate, and performing light wave sintering to form a copper film on the substrate.
In a preferred embodiment, a method for preparing a flexible conductive film comprises the following steps: and coating nano copper ink on the two sides of the surface of the substrate, and sintering the two sides by using double light waves to form copper films on the two sides of the substrate.
In a preferred embodiment, the nano-copper ink consists of the following components in parts by weight: 10-60 parts of nano copper particles, 0.5-20 parts of solvent and 1-10 parts of dispersing agent.
In a preferred embodiment, the solvent is selected from one or more of benzyl alcohol, isopropanol and ethyl acetate; the dispersant is one or more selected from octylamine, hexylamine and diethylamine. The solvent is not limited to the above-mentioned ones, and may be low boiling point (less than 250 ℃ C.) alcohols and esters, and the boiling point of the solvent is generally less than 250 ℃ C, preferably less than 150 ℃ C. The dispersant is not limited to the above-mentioned ones, and may be a low-boiling amine having a boiling point of less than 250 ℃.
In a preferred embodiment, the particle size of the nano-copper particles is 20nm to 100nm, and the particle size of the nano-copper particles is preferably 25nm to 80 nm.
In a preferred embodiment, the substrate is selected from polyimide or polyester; the thickness of the substrate is 25-150 μm.
In a preferred embodiment, the coating of the nano-copper ink on the surface of the substrate is specifically to coat the nano-copper ink on the substrate by a doctor blading method, or to coat the nano-copper ink on the substrate by a roll-to-roll method.
In a preferred embodiment, the light wave sintering is to perform irradiation sintering on the nano-copper ink at normal pressure and room temperature by using a short-pulse high-intensity light wave source to form the copper film on the substrate.
In a preferred embodiment, the short-pulse high-light-intensity light wave source adopts a high-energy-density xenon lamp light source, and the pulse width is 1-4 ms.
In a preferred embodiment, a method for preparing a flexible conductive film further comprises the following steps: after the nano-copper ink is coated on the surface of the substrate, the nano-copper ink is dried at 100 ℃, and the thickness of a copper ink film after drying is 0.1-1 mu m.
In a preferred embodiment, a method for preparing a flexible conductive film further comprises the following steps: after the light wave sintering is carried out to form a copper film on the substrate, copper is electroplated on the copper film, and the thickness of the electroplated copper film is 3-15 microns.
The flexible conductive film prepared by the preparation method of the flexible conductive film. The surface roughness of the flexible conductive film is less than 0.1 μm.
A preparation method of a flexible circuit board with patterns comprises the following steps:
s01, coating nano-copper ink on the surface of the substrate;
s02, arranging a mask on the nano-copper ink film, and performing light wave sintering to form a copper film on the substrate;
and S03, removing the unsintered nano-copper ink by using a solvent, and sintering the formed copper film to form the flexible circuit board with the pattern.
In a preferred embodiment, a method for manufacturing a flexible printed circuit board having a pattern further includes the steps of: after step S03, copper is electroplated on the copper film formed by sintering, and the thickness of the copper film after electroplating is 3-10 μm.
In a preferred embodiment, in step S02, a common photolithography mask is used as a mask, and the photolithography mask can be selected from metal masks prepared on commercially available quartz glass, and the resolution can reach below 1 micron.
In a preferred embodiment, a method for manufacturing a flexible circuit board with a pattern includes the steps of:
s01, coating nano-copper ink on two sides of the substrate;
s02, arranging masks on the two sides of the nano-copper ink film, and sintering the two sides by light waves to form a copper film on the substrate;
and S03, removing the unsintered nano-copper ink by using a solvent, and sintering the formed copper film to form the flexible circuit board with the pattern.
In a preferred embodiment, the nano-copper ink consists of the following components in parts by weight: 10-60 parts of nano copper particles, 0.5-20 parts of solvent and 1-10 parts of dispersing agent.
In a preferred embodiment, the solvent is selected from one or more of benzyl alcohol, isopropanol and ethyl acetate; the solvent is one or more selected from octylamine, hexylamine and diethylamine. The solvent is not limited to the above-mentioned ones, and may be low boiling point (less than 250 ℃ C.) alcohols and esters, and the boiling point of the solvent is generally less than 250 ℃ C, preferably less than 150 ℃ C. The dispersant is not limited to the above-mentioned ones, and may be a low-boiling amine having a boiling point of less than 250 ℃.
In a preferred embodiment, the particle size of the nano-copper particles is 20nm to 100nm, and the particle size of the nano-copper particles is preferably 25nm to 80 nm.
In a preferred embodiment, the substrate is selected from polyimide or polyester; the thickness of the substrate is 25-150 μm.
In a preferred embodiment, the coating of the nano-copper ink on the surface of the substrate is specifically to coat the nano-copper ink on the substrate by a doctor blading method, or to coat the nano-copper ink on the substrate by a roll-to-roll method.
In a preferred embodiment, the light wave sintering is to perform irradiation sintering on the nano-copper ink at normal pressure and room temperature by using a short-pulse high-intensity light wave source to form the copper film on the substrate.
In a preferred embodiment, the short-pulse high-light-intensity light wave source adopts a high-energy-density xenon lamp light source, and the pulse width is 1-4 ms.
In a preferred embodiment, a method for manufacturing a flexible printed circuit board having a pattern further includes the steps of: after the nano-copper ink is coated on the surface of the substrate, the nano-copper ink is dried at 100 ℃, and the thickness of a copper ink film after drying is 0.1-1 mu m.
In a preferred embodiment, the solvent is used to remove the unsintered nano-copper ink, and the solvent is the same as the solvent in the nano-copper ink.
A flexible circuit board manufactured by the manufacturing method of the flexible circuit board with the pattern.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the preparation method of the flexible conductive film utilizes the nano-copper printing ink to coat on the surface of the substrate, then utilizes the light wave sintering to form the copper film on the substrate, and prepares the ultrathin copper film with the thickness less than 1 mu m on the substrate, and the ultrathin copper film directly forms strong bonding force with the substrate without any intermediate bonding layer.
2. According to the preparation method of the flexible conductive film, short-pulse high-intensity-density pulse light wave sintering is utilized at room temperature and in air, the nano copper is partially melted to form a continuous copper film during sintering, and can be partially embedded on the surface of the flexible substrate to form strong bonding force, an oxide layer in the nano copper is reduced to metal copper under the action of light waves, meanwhile, millisecond-level light wave sintering can also avoid oxidation of the copper film in the air, and finally a low-resistance copper film is formed on the substrate.
3. According to the preparation method of the flexible conductive film, the nano metal printing ink does not contain inorganic and organic adhesives, only contains a low-boiling-point solvent and a dispersing agent, hardly leaves residues after drying and sintering, is compact in copper film sintering and less in cavity, has the resistivity of less than 3 mu omega cm, and can be used as a seed layer to be electroplated and thickened to the required copper foil thickness.
4. According to the preparation method of the flexible conductive film, the nano copper material is sprayed on two sides, and then light wave sintering is carried out on the two sides, so that sintering shrinkage stress on the two sides of the substrate is balanced, and warping of the base material caused by shrinkage of the copper paste on one side during sintering on one side is avoided.
5. According to the preparation method of the flexible conductive film, the sintered ultrathin copper film can be thickened on the copper film by an electroplating method, the required copper foil thickness is obtained, and the needed adhesive-free flexible conductive film is prepared.
6. A method for preparing a flexible circuit board with patterns adopts a nano-copper ink technology and a high-resolution mask light wave sintering technology, and utilizes a mask to prepare the flexible circuit board with patterns on a substrate, thereby replacing the prior production mode of FPC glue-free or glue-containing copper foil, reducing material consumption, improving binding force and substrate dielectric property, and reducing environmental protection pressure.
7. A preparation method of a flexible circuit board with patterns is characterized in that a solvent is adopted to remove unsintered nano copper ink, and a copper film formed by sintering forms the flexible circuit board with patterns. Because the copper ink does not contain any adhesive, the adhesion force of the copper ink which is not subjected to light wave sintering on the PI substrate is poor, the copper ink is easy to wash away by using a solvent, the solvent for washing away the copper ink which is not subjected to light wave sintering can be the solvent used in the formula of the copper ink, and the washed ink can be reused and can be prepared into the copper ink for use.
8. The surface roughness of the flexible conductive film and the flexible circuit board is less than 0.1 micron, and the surface of the flexible conductive film formed after the copper printing ink is sintered is smooth.
Drawings
Fig. 1 is a flow chart of a method for preparing a flexible conductive film according to the present invention.
Fig. 2 is a flowchart of a method for manufacturing a flexible printed circuit board having a pattern according to the present invention.
Fig. 3 to 6 are schematic flow charts of a method for manufacturing a flexible printed circuit board having a pattern according to the present invention.
Fig. 7 is a product diagram of a mask selective sintering copper ink step of a method for manufacturing a flexible circuit board having a pattern according to the present invention.
Wherein the reference numerals are as follows:
101-a substrate; 102-nano copper ink film; 103-masking; 104-unsintered nano-copper ink film; 105-sintered nano-copper film; 106-thickened nano-copper film.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention will be further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A method for preparing a flexible conductive film, a process flow diagram is shown in fig. 1, and the specific embodiment is as follows:
example 1
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the surface of the PI substrate by adopting a scraping method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle size of the nano-copper particles is 40nm, and the thickness of the PI substrate is 100 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the copper ink film after drying is 0.8 μm;
and S03, irradiating and sintering the nano-copper ink at normal pressure and room temperature by using a high-energy-density hernia lamp light source to form a copper film on the PI substrate, wherein the pulse width is 1-4 ms.
Example 2
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the surface of the PET substrate by a ink scraping method, wherein the nano-copper ink consists of 60 parts of nano-copper particles, 20 parts of isopropanol and 5 parts of hexylamine, the particle size of the nano-copper particles is 25nm, and the thickness of the PET is 120 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 1 mu m;
and S03, irradiating and sintering the nano copper ink at normal pressure and room temperature by using a high-energy-density hernia lamp light source to form a copper film on the PET substrate, wherein the pulse width is 1-4 ms.
Example 3
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the surface of the PI substrate by adopting a scraping method, wherein the nano-copper ink consists of 20 parts of nano-copper particles, 5 parts of ethyl acetate and 1 part of diethylamine, and the particle size of the nano-copper particles is 80 nm. The thickness of the PI substrate was 50 μm.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 0.3 μm;
and S03, irradiating and sintering the nano-copper ink at normal pressure and room temperature by using a high-energy-density hernia lamp light source to form a copper film on the PI substrate, wherein the pulse width is 1-4 ms.
Example 4
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the two sides of the PI substrate by adopting a scraping method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle size of the nano-copper particles is 40nm, and the thickness of the PI substrate is 25 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 0.8 μm;
s03, the high-light-intensity light waves are used for irradiating and sintering the nano-copper printing ink on the two sides at normal pressure and room temperature, copper films are formed on the two sides of the PI substrate, the short-pulse high-light-intensity light wave source adopts a high-energy-density hernia lamp light source, and the pulse width is 1-4 ms.
Example 5
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the two sides of the PI substrate by a roll-to-roll method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle size of the nano-copper particles is 40nm, and the thickness of the PI substrate is 25 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 0.8 μm;
s03, the high-light-intensity light waves are used for irradiating and sintering the nano-copper printing ink on the two sides at normal pressure and room temperature, copper films are formed on the two sides of the PI substrate, the short-pulse high-light-intensity light wave source adopts a high-energy-density hernia lamp light source, and the pulse width is 1-4 ms.
Example 6
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the surface of the PI substrate by adopting a scraping method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle size of the nano-copper particles is 40nm, and the thickness of the PI substrate is 100 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 0.8 μm;
and S03, irradiating and sintering the nano-copper ink at normal pressure and room temperature by using a high-energy-density hernia lamp light source to form a copper film on the PI substrate, wherein the pulse width is 1-4 ms.
And S04, electroplating copper on the copper film, wherein the thickness of the copper film after electroplating is 5 mu m.
Example 7
A preparation method of a flexible conductive film comprises the following steps:
s01, coating the nano-copper ink on the two sides of the PI substrate by a roll-to-roll method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle size of the nano-copper particles is 40nm, and the thickness of the PI substrate is 100 microns.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the dried copper ink film is 0.8 μm;
s03, the high-light-intensity light waves are used for irradiating and sintering the nano-copper printing ink on the two sides at normal pressure and room temperature, copper films are formed on the two sides of the PI substrate, the short-pulse high-light-intensity light wave source adopts a high-energy-density hernia lamp light source, and the pulse width is 1-4 ms.
And S04, electroplating copper on the copper film in a double-sided manner, wherein the thickness of the copper film after double-sided electroplating is 10 mu m.
The surface roughness of the flexible film obtained by the preparation method of the flexible conductive film of test example 1-7 is less than 0.1 micron, and the resistivity is less than 3 mu omega cm.
The flexible film of the invention can also be applied to a preparation method of a flexible circuit board with patterns, and the following specific description is provided by combining the embodiment:
a method for manufacturing a flexible printed circuit board with a pattern, as shown in fig. 2, comprises the following steps:
s01, coating the nano-copper ink on the surface 101 of the PI substrate by a scraping method, wherein the nano-copper ink is composed of 50 parts of nano-copper particles, 10 parts of benzyl alcohol and 5 parts of octylamine, the particle diameter of the nano-copper particles is 40nm, and the thickness of the PI substrate is 100 μm, as shown in figure 3.
S02, drying the nano-copper ink at 100 ℃, wherein the thickness of the copper ink film 102 after drying is 0.8 μm;
s03, using a common photolithography mask as a mask 103, the mask being disposed on the copper ink film 102, as shown in fig. 4, disposing the mask 103 in the non-circuit forming area, and performing irradiation sintering of the nano-copper ink at room temperature and normal pressure using a high energy density xenon lamp light source to form the copper film 105 on the part of the PI substrate 101, wherein the pulse width is 1-4 ms. The mask setting region does not have a sintered copper film formed. The sintered copper film is a circuit pattern with the line width less than 25 microns, as shown in fig. 7, the photoetching plate can be a metal mask plate prepared on common quartz glass in the market, the resolution can reach below 1 micron, and a conductive circuit with the resolution below 10 microns/10 microns can be prepared by using the photoetching plate as a mask.
S04, removing the unsintered nano-copper ink film 104 with benzyl alcohol, and sintering the formed copper film 105 to form the flexible circuit board with pattern, as shown in fig. 5. Because the copper ink does not contain any adhesive, the adhesion force of the copper ink which is not subjected to light wave sintering on the PI substrate is poor, the copper ink is easy to wash away by using a solvent, the solvent for washing away the copper ink which is not subjected to light wave sintering can be the solvent used in the formula of the copper ink, and the washed ink can be reused and can be prepared into the copper ink for use.
S05, electroplating copper on the flexible circuit board 1, wherein the thickness of the copper film 106 after electroplating is 5-20 μm as shown in figure 6.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (16)
1. The preparation method of the flexible conductive film is characterized by comprising the following steps: and coating nano copper ink on the surface of the substrate, and performing light wave sintering to form a copper film on the substrate.
2. The method of making a flexible conductive film according to claim 1, comprising the steps of: and coating nano copper ink on the two sides of the surface of the substrate, and sintering the two sides by using double light waves to form copper films on the two sides of the substrate.
3. The method for preparing a flexible conductive film according to claim 1 or 2, wherein the nano-copper ink comprises the following components in parts by weight:
10-60 parts of nano-copper particles,
0.5 to 20 parts of a solvent,
1-10 parts of a dispersing agent.
4. The method for preparing a flexible conductive film according to claim 3, wherein the solvent is selected from one or more of benzyl alcohol, isopropanol and ethyl acetate; and/or the dispersant is one or more selected from octylamine, hexylamine and diethylamine.
5. The method of claim 3, wherein the particle size of the copper nanoparticles is 25nm to 80 nm.
6. The method of claim 1 or 2, wherein the substrate is selected from polyimide or polyester; and/or the thickness of the substrate is 25-150 μm.
7. The method for preparing a flexible conductive film according to claim 1 or 2, wherein the step of coating the nano-copper ink on the surface of the substrate is to coat the nano-copper ink on the substrate by a doctor-blading method, or to coat the nano-copper ink on the substrate by a roll-to-roll method.
8. The method for preparing a flexible conductive film according to claim 1 or 2, wherein the light wave sintering is performed to form the copper film on the PI substrate by using a short-pulse high-intensity-density light wave source to perform irradiation sintering on the nano-copper ink at normal pressure and room temperature.
9. The method for preparing a flexible conductive film according to claim 8, wherein the short-pulse high-intensity light source is a high-energy-density xenon lamp light source, and the pulse width is 1-4 ms.
10. The method of making a flexible conductive film according to claim 1 or 2, further comprising the steps of: after the nano-copper ink is coated on the surface of the substrate, the nano-copper ink is dried at 100 ℃, and the thickness of a copper ink film after drying is 0.1-1 mu m.
11. The method of making a flexible conductive film according to claim 1 or 2, further comprising the steps of: after the light wave sintering is carried out to form a copper film on the substrate, copper is electroplated on the copper film, and the thickness of the electroplated copper film is 3-10 mu m.
12. A flexible conductive film, characterized in that the flexible conductive film is produced by the method for producing a flexible conductive film according to claim 1 or 2.
13. The flexible conductive film of claim 12, wherein the surface roughness of the flexible conductive film is less than 0.1 μm.
14. A method for preparing a flexible circuit board with patterns is characterized by comprising the following steps:
s01, coating nano-copper ink on the surface of the substrate;
s02, arranging a mask on the nano-copper ink film, and forming a copper film on the substrate by adopting light wave sintering;
and S03, removing the unsintered nano-copper ink by using a solvent, and sintering the formed copper film to form the flexible circuit board with the pattern.
15. The method for manufacturing a flexible circuit board having a pattern according to claim 14, wherein: also comprises the following steps: after step S03, copper is electroplated on the copper film formed by sintering, and the thickness of the copper film after electroplating is 3-10 μm.
16. A flexible circuit board, characterized by being produced by the method for producing a flexible circuit board having a pattern according to claim 14 or 15.
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| CN202010027722.1A CN111234286A (en) | 2020-01-10 | 2020-01-10 | Flexible conductive film and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970843A (en) * | 2020-08-25 | 2020-11-20 | 江西华创触控科技有限公司 | Preparation method of circuit base material, circuit base material and circuit board |
| CN112040662A (en) * | 2020-08-25 | 2020-12-04 | 江西华创触控科技有限公司 | Preparation method of circuit base material, circuit base material and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101801674A (en) * | 2007-05-18 | 2010-08-11 | 应用纳米技术控股股份有限公司 | metallic ink |
| CN104750311A (en) * | 2015-03-16 | 2015-07-01 | 深圳市宇顺电子股份有限公司 | Manufacturing method of metal mesh conducting film, metal mesh conducting film and touch panel |
| WO2016163695A1 (en) * | 2015-04-06 | 2016-10-13 | 한양대학교 산학협력단 | Method for manufacturing multi-layer printed circuit board using conductive copper ink and light sintering, and multi-layer printed circuit board manufactured thereby |
| CN106981342A (en) * | 2016-01-15 | 2017-07-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Adhesiveness high copper conductive film, its preparation method and application |
-
2020
- 2020-01-10 CN CN202010027722.1A patent/CN111234286A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101801674A (en) * | 2007-05-18 | 2010-08-11 | 应用纳米技术控股股份有限公司 | metallic ink |
| CN104750311A (en) * | 2015-03-16 | 2015-07-01 | 深圳市宇顺电子股份有限公司 | Manufacturing method of metal mesh conducting film, metal mesh conducting film and touch panel |
| WO2016163695A1 (en) * | 2015-04-06 | 2016-10-13 | 한양대학교 산학협력단 | Method for manufacturing multi-layer printed circuit board using conductive copper ink and light sintering, and multi-layer printed circuit board manufactured thereby |
| CN106981342A (en) * | 2016-01-15 | 2017-07-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Adhesiveness high copper conductive film, its preparation method and application |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970843A (en) * | 2020-08-25 | 2020-11-20 | 江西华创触控科技有限公司 | Preparation method of circuit base material, circuit base material and circuit board |
| CN112040662A (en) * | 2020-08-25 | 2020-12-04 | 江西华创触控科技有限公司 | Preparation method of circuit base material, circuit base material and circuit board |
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Application publication date: 20200605 |