CN206644406U - Nano metal substrate for ultra fine-line FPC and COF material - Google Patents
Nano metal substrate for ultra fine-line FPC and COF material Download PDFInfo
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- CN206644406U CN206644406U CN201720283213.9U CN201720283213U CN206644406U CN 206644406 U CN206644406 U CN 206644406U CN 201720283213 U CN201720283213 U CN 201720283213U CN 206644406 U CN206644406 U CN 206644406U
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Abstract
The utility model discloses a kind of nano metal substrate for ultra fine-line FPC and COF material; including low thermal expansion coefficient polyimide layer, it is formed at the roughening polyimide layer of low thermal expansion coefficient polyimide layer at least one side, is formed at the ultrathin nanometer metal level and protection film layer for being roughened polyimide layer another side; it is roughened polyimide layer between low thermal expansion coefficient polyimide layer and ultrathin nanometer metal level, ultrathin nanometer metal level is between roughening polyimide layer and protection film layer.The utility model has splendid resistance to ion transport, dimensional stability, resistance to chemical reagents, heat resisting and adhesion；Suitable for radium-shine processing, suitable for processing blind hole by laser/micropore, and pin hole is not likely to produce, is adapted to fine rule road etching, is not easy lateral erosion；The utility model is designed using Nanometer Copper, meets the needs of substrate graph thinning development.
Description
Technical field
The utility model belongs to electric substrate technical field, is used for ultra fine-line FPC and COF material more particularly to one kind
Nano metal substrate.
Background technology
FPC (Flexible Printed Circuit), i.e. flexible printed circuit board, are commonly called as " soft board ", have it is light, thin,
The advantages that short, small, it is widely adopted in the small-sized electronic products such as mobile phone, digital camera, digital camera, and COF (Chip
On Film, chip on film encapsulation) technology is to make encapsulation chip carrier by chip and flexible PCB electricity with flexible PCB
The technology that road combines.As electronic product tends to microminaturization development, FPC or COF flexible PCBs are functionally required to more
Developing direction that is powerful and tending to high frequency, high density and graph thinning.
Flexibility coat copper plate is the baseplate material of FPC or COF processing, and the high density of flexibility coat copper plate, the performance of graph thinning
It is largely dependent on the processing technology of thin copper foil part.
Processing of the substrate manufacturer to thin copper foil part at present mainly uses two class methods：When sputtering method/copper-plating method, second,
Carrier copper foil method.
Sputtering method/copper-plating method, using PI (polyimides) films as base material, alloy of the sputter containing chromium is as intermediary on PI films
Layer, then sputter copper metal is crystal seed layer, then electro-coppering thickens layers of copper.But general PI films surface roughness is in 10-20nm,
Adhesion is bad, it is necessary to be surface-treated to PI films with plasma-based or short wavelength ultraviolet, but the PI films after handling are to follow-up
Heat treatment requirements are high, and otherwise adhesion deterioration is peeled off；Further, since the surface of PI films has certain roughness, in very thin copper
Surface easily produces pin hole when paper tinsel is electroplated；And thin copper foil made of this method often results in etching in COF or FPC etch process
Not exclusively, the problem of chromium metal of circuit root residual minim can cause Ion transfer, and influence fine rule road COF or FPC
Quality.
And carrier copper foil method, it may be difficult to peel off although carrier layer protects copper foil not injured, pressure wound, when peeling off, make
Into processing difficulties, and stress-retained when peeling off easily causes copper foil deformation and the change of size harmomegathus, in addition, extra thin copper foil price
It is expensive and be difficult to obtain, it is not easy plus extra thin copper foil processing, so existing copper thickness is difficult to be less than below 6um.
Utility model content
The utility model is mainly solving the technical problems that provide a kind of nanometer for ultra fine-line FPC and COF material
Metal substrate, there is splendid resistance to ion transport, dimensional stability, resistance to chemical reagents, heat resisting and adhesion；It is applicable
In radium-shine processing, suitable for processing blind hole by laser/micropore, and pin hole is not likely to produce, is adapted to fine rule road etching, is not easy lateral erosion；This
Utility model is designed using Nanometer Copper, meets the needs of substrate graph thinning development.
In order to solve the above technical problems, the technical scheme that the utility model uses is：One kind is provided and is used for superfine wire
The nano metal substrate of road FPC and COF material, including low thermal expansion coefficient polyimide layer, it is formed at the low-thermal-expansion system
The roughening polyimide layer of number polyimide layer at least one side, the ultrathin nanometer for being formed at the roughening polyimide layer another side
Metal level and protection film layer, the roughening polyimide layer is between the low thermal expansion coefficient polyimide layer and described ultra-thin receives
Between rice metal level, the ultrathin nanometer metal level is between the roughening polyimide layer and the protection film layer；
The thickness of the low thermal expansion coefficient polyimide layer is 12.5-100um；
The thickness of the roughening polyimide layer is 2-5um；
The thickness of the ultrathin nanometer metal level is 90-800nm；
The thickness of the protection film layer is 6-60um；
The low thermal expansion coefficient polyimide layer refers to the polyimide layer that thermal coefficient of expansion is 4-19ppm/ DEG C；
The roughening polyimide layer be the face that contact with ultrathin nanometer metal level be mat surface and surface roughness between
Polyimide layer between 50-800nm；
The ultrathin nanometer metal level is sputtered layer or electrodeposited coating.
Further say, the nano metal substrate is by low thermal expansion coefficient polyimide layer, is formed at the low-heat
The roughening polyimide layer of expansion polyimide layer any surface, it is formed at the ultra-thin of the roughening polyimide layer another side
The one side nano metal substrate that nano metal layer and protection film layer are formed.
Further say, the nano metal substrate is by low thermal expansion coefficient polyimide layer, is formed at the low-heat
The two-sided roughening polyimide layer of expansion polyimide layer, be formed at it is described roughening the ultra-thin of polyimide layer another side receive
The double-face nanometer metal substrate that rice metal level and protection film layer are formed.
Further say, the thickness of the low thermal expansion coefficient polyimide layer is 12.5-50um, the ultrathin nanometer gold
The thickness for belonging to layer is 90-200nm, and the thickness of the protection film layer is 28-60um, the low thermal expansion coefficient polyimide layer
Thermal coefficient of expansion is 4-11ppm/ DEG C, and the roughening polyimide layer is that polyamides of the surface roughness between 80-400nm is sub-
Amine layer.
Further say, the structure for forming the mat surface of the roughening polyimide layer can be by surface corona
Or it could be formed with plasma-based processing or the roughening polyimide layer and with the surface that ultrathin nanometer metal level contacts
Powder roughened layer, the powder roughened layer are by containing in silica, titanium dioxide, aluminum oxide, aluminium hydroxide and calcium carbonate
The material layer that forms of at least one mineral powder or contain at least one of halogen, phosphorus system, nitrogen and boron system anti-flammability
The material layer that compound powder is formed.
Further say, the ultrathin nanometer metal level is the multilayer that copper foil layer or copper foil layer are formed with other metal levels
Alloying metal layer, other described metal levels refer to silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum
Layer and at least one of layer gold, wherein, the thickness of the copper foil layer is 90-150nm, every thickness degree of other metal levels
For 5-15nm.
Further say, the ultrathin nanometer metal level is one kind in following six kinds of structures：
First, a Rotating fields：It is made up of individual layer copper foil layer, the thickness of the copper foil layer is 0.1-0.2um；
2nd, two stacking structure：It is made up of copper foil layer and the nickel dam for being formed at copper foil layer any surface, the thickness of the copper foil layer
For 90-150nm, the thickness of the nickel dam is 5-15nm；
3rd, two stacking structure：It is made up of copper foil layer and the silver layer for being formed at copper foil layer any surface, the thickness of the copper foil layer
For 90-150nm, the thickness of the silver layer is 5-15nm；
4th, three stacking structure：By copper foil layer and it is formed at and the laminated nickel dam of copper foil and is formed at copper foil layer another side
Silver layer is formed, and the thickness of the copper foil layer is 90-150nm, and the thickness of the nickel dam and the silver layer is respectively 5-15nm；
5th, three stacking structure：It is made up of copper foil layer and the nickel dam for being respectively formed in copper foil layer two sides, the thickness of the copper foil layer
Spend for 90-150nm, the thickness of nickel dam is respectively 5-15nm described in two sides；
6th, three stacking structure：By copper foil layer and it is formed at and the laminated layers of copper of copper foil and is formed at copper foil layer another side
Nickel dam is formed, and the thickness of the copper foil layer is 90-150nm, and the thickness of the layers of copper and the nickel dam is respectively 5-15nm.
Further say, the protection film layer is carrier layer, and the carrier layer is by PET (poly terephthalic acid second two
Ester) layer and it is formed at the low adhesion layer on a surface of the pet layer and forms, the carrier layer passes through the low adhesion layer
The ultrathin nanometer layer on surface of metal is covered on, wherein, the thickness of the pet layer is 23-50um, the thickness of the low adhesion layer
For 5-10um, the off-type force of the low adhesion layer is 1-5g.
Further say, the protection film layer is photopolymer layer, and the photopolymer layer includes photosensitive resin layer and light-transmissive film layer, institute
The one side covering light-transmissive film layer and another side for stating photosensitive resin layer are covered on the ultrathin nanometer layer on surface of metal.
The beneficial effects of the utility model at least have it is following some：
First, the multi-laminate structure that low thermal expansion coefficient polyimide layer of the present utility model and roughening polyimide layer are formed,
CTE (thermal coefficient of expansion) value of nano metal substrate can be reduced so that the size harmomegathus of nano metal substrate is smaller, has pole
Good dimensional stability, suitable for the application of ultra fine-line；
2nd, due to it is of the present utility model roughening polyimide layer using surface roughness between 50-800nm
PI films, the PI films are a kind of PI resins by roughening treatment, can increase the adhesion with metal level, and its surface coarsening
Processing contains the compound of mineral powder or anti-flammability by the powder roughened layer of surface corona, plasma-based processing or surface, can
To lift surface energy, the adhesion between increase roughening polyimide layer and ultrathin nanometer metal level, mineral powder or fire-retardant
The compound of property can also lift the hardness and anti-flammability on its surface；
3rd, the utility model ultrathin nanometer metal level includes the multilayer alloying metal that copper foil layer is formed with other metal levels
Layer, alloy-layer are designed with the graph thinning that FPC or COF materials are improved beneficial to the resistance to ion transport for improving nano metal substrate
Quality and insulating properties；
4th, carrier layer or photopolymer layer can be selected in protection film layer of the present utility model, and carrier film or dry film are suitable for half
Addition process technique, the slim highdensity graph thinning line requirements of the more applicable FPC or COF materials of technology of semi-additive process；And carry
Body film and dry film can protect not injured, pressure wound and the oxidation before FPC or the addition processing procedures of COF half of ultrathin nanometer metal level；
When protection film layer selects carrier layer, carrier layer is made up of pet layer and low adhesion layer, and carrier layer passes through low
Adhesion layer is covered on ultrathin nanometer layer on surface of metal, and for PET temperature tolerance at 180-220 DEG C, heat resisting is good；Low adhesion layer
Off-type force be only 1-5g, therefore carrier layer is easily stripped, and does not easily cause the viscous glutinous copper particle of nano metal substrate after stripping
In in carrier film, the residual stress small dimensional stability that ultrathin nanometer metal level will not be caused to deform, do not influence substrate during stripping,
Be advantageous to use and the lifting yield of Downstream processing；
When protection film layer selects photopolymer layer, photopolymer layer includes photosensitive resin layer and light-transmissive film layer, and the one of photosensitive resin layer
Face covers light-transmissive film layer and another side and is covered on ultrathin nanometer layer on surface of metal, by ultraviolet irradiation, in photosensitive resin layer
Part resin crosslinks curing reaction, forms a kind of material of stabilization and is attached in plate face, then develops, demoulding, produces required
Circuit, thus it is high using dry film imaging reliability, it is possible to reduce Downstream processing process, it is allowed to be directly used in the erosion of exposure imaging circuit
Carve, be advantageously implemented mechanization and automation；
5th, when low adhesion layer selects high temperature resistant silicon glue adhesion layer or acrylic acid adhesion layer, its adherence is splendid, and high temperature is high
It is wet it is lower will not delamination/separate with the interface of ultrathin nanometer metal level；
6th, nano metal substrate of the present utility model will not crimp, and dimensional stability is excellent, be adapted to radium-shine processing,
Suitable for micropore/blind hole and the requirement of any hole shape；And multiple sputter or multi-layer plating alloy are used, plating aspect copper is uniform, no
Pin hole is also easy to produce, is adapted to fine rule road etching, is not easy lateral erosion；
7th, the thickness of ultrathin nanometer metal level of the present utility model is 90-200nm, and line width/line-spacing can be to 15/15um, very
To 10/10um or lower line requirements, the design of Nanometer Copper meets the graph thinning requirement of FPC or COF substrates.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model one side nano metal substrate；
Fig. 2 is the structural representation of the utility model double-face nanometer metal substrate；
Fig. 3 is the structural representation of the utility model carrier layer；
Fig. 4 is the structural representation of the utility model photopolymer layer；
Fig. 5 is the first schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 6 is second of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 7 is the third schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 8 is the 4th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 9 is the 5th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Figure 10 is the 6th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Figure 11 is the template drawing that substrate intercepts in the utility model embodiment；
The mark of each part is as follows in accompanying drawing：
100- low thermal expansion coefficient polyimide layers；
200- is roughened polyimide layer；
300- ultrathin nanometer metal levels；
301- copper foil layers, 302- nickel dams, 303- silver layers, 304- layers of copper；
400- protection film layers；
The low adhesion layer of 401-PET layers, 402-, 403- photosensitive resin layers and 404- light-transmissive film layers.
Embodiment
Preferred embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, it is apparent clear and definite so as to be made to the scope of protection of the utility model
Define.
Embodiment：A kind of nano metal substrate for ultra fine-line FPC and COF material, as Figure 1-10 shows, this practicality
It is new including low thermal expansion coefficient polyimide layer 100, be formed at least one side of low thermal expansion coefficient polyimide layer 100
Roughening polyimide layer 200, be formed at it is described roughening the another side of polyimide layer 200 ultrathin nanometer metal level 300 and protect
Cuticular layer 400, the roughening polyimide layer 200 is between the low thermal expansion coefficient polyimide layer 100 and described ultra-thin receives
Between rice metal level 300, the ultrathin nanometer metal level 300 is between the roughening polyimide layer 200 and the protection film layer
Between 400；
The thickness of the low thermal expansion coefficient polyimide layer 100 is 12.5-100um；
The thickness of the roughening polyimide layer 200 is 2-5um；
The thickness of the ultrathin nanometer metal level 300 is 90-800nm；
The thickness of the protection film layer 400 is 6-60um；
The low thermal expansion coefficient polyimide layer refers to the polyimide layer that thermal coefficient of expansion is 4-19ppm/ DEG C；
The roughening polyimide layer 200 is that the face contacted with ultrathin nanometer metal level is situated between for mat surface and surface roughness
Polyimide layer between 50-800nm；
The ultrathin nanometer metal level 300 is sputtered layer or electrodeposited coating.
The nano metal substrate is by low thermal expansion coefficient polyimide layer 100, is formed at the low thermal coefficient of expansion
The roughening polyimide layer 200 of any surface of polyimide layer 100, it is formed at the super of the roughening another side of polyimide layer 200
The one side nano metal substrate that thin nano metal layer 300 and protection film layer 400 are formed.
The nano metal substrate is by low thermal expansion coefficient polyimide layer 100, is formed at the low thermal coefficient of expansion
The two-sided roughening polyimide layer 200 of polyimide layer 100, it is formed at the ultra-thin of the roughening another side of polyimide layer 200
The double-face nanometer metal substrate that nano metal layer 300 and protection film layer 400 are formed.
The thickness of the low thermal expansion coefficient polyimide layer 100 is 12.5-50um, the ultrathin nanometer metal level 300
Thickness be 90-200nm, the thickness of the protection film layer 400 is 28-60um, the low thermal expansion coefficient polyimide layer 100
Thermal coefficient of expansion be 4-11ppm/ DEG C, the roughening polyimide layer 200 is surface roughness between 80-400nm
Polyimide layer.
Low thermal expansion coefficient polyimide layer and roughening polyimide layer use color be all black, yellow, white or
Transparent color, but not limited to this.Low thermal expansion coefficient polyimide layer of the present utility model and roughening polyimide layer are all using black
Color, the adhesion ＞ 0.8kgf/cm of black roughening polyimide layer and ultrathin nanometer metal level.
The structure for forming the mat surface of the roughening polyimide layer 200 can be by surface corona or plasma-based
Powder roughening is could be formed with reason or the roughening polyimide layer and with the surface that ultrathin nanometer metal level contacts
Layer, the powder roughened layer is by containing at least one in silica, titanium dioxide, aluminum oxide, aluminium hydroxide and calcium carbonate
The material layer or contain at least one of halogen, phosphorus system, nitrogen and boron system fire-retardant compound powder that the mineral powder of kind is formed
The material layer that body is formed.
The ultrathin nanometer metal level 300 is the multilayer alloying metal that copper foil layer or copper foil layer are formed with other metal levels
Layer, other described metal levels refer to silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum layer and layer gold
At least one of, wherein, the thickness of the copper foil layer is 90-150nm, and every thickness degree of other metal levels is 5-
15nm。
The ultrathin nanometer metal level 300 is one kind in following six kinds of structures：
First, a Rotating fields：It is made up of individual layer copper foil layer 301, the thickness of the copper foil layer 301 is 0.1-0.2um；
2nd, two stacking structure：It is made up of copper foil layer 301 and the nickel dam 302 for being formed at copper foil layer any surface, the copper foil layer
301 thickness is 90-150nm, and the thickness of the nickel dam 302 is 5-15nm；
3rd, two stacking structure：It is made up of copper foil layer 301 and the silver layer 303 for being formed at copper foil layer any surface, the copper foil layer
301 thickness is 90-150nm, and the thickness of the silver layer 303 is 5-15nm；
4th, three stacking structure：By copper foil layer 301 and it is formed at the laminated nickel dam 302 of copper foil and to be formed at copper foil layer another
Silver layer 303 simultaneously is formed, and the thickness of the copper foil layer 301 is 90-150nm, the thickness of the nickel dam 302 and the silver layer 303
Degree is respectively 5-15nm；
5th, three stacking structure：It is made up of copper foil layer 301 and the nickel dam 302 for being respectively formed in copper foil layer two sides, the copper foil
The thickness of layer 301 is 90-150nm, and the thickness of nickel dam 302 is respectively 5-15nm described in two sides；
6th, three stacking structure：By copper foil layer 301 and it is formed at the laminated layers of copper 304 of copper foil and to be formed at copper foil layer another
Nickel dam 302 simultaneously is formed, and the thickness of the copper foil layer 301 is 90-150nm, the layers of copper 304 and the nickel dam 303 thickness
Degree is respectively 5-15nm.
The protection film layer 400 is carrier layer, and the carrier layer is by pet layer 401 and is formed at the pet layer
The low adhesion layer on 401 surface is formed, and the carrier layer is covered on the ultrathin nanometer by the low adhesion layer 402
The surface of metal level 300, wherein, the thickness of the pet layer 401 is 23-50um, and the thickness of the low adhesion layer 402 is 5-10um,
The off-type force of the low adhesion layer 402 is 1-5g.
When low adhesion layer selects high temperature resistant silicon glue adhesion layer or acrylic acid adhesion layer, its adherence is splendid, hot and humid
Under, will not delamination/separate with the interface of ultrathin nanometer metal level.
The protection film layer 400 is photopolymer layer, and the photopolymer layer includes photosensitive resin layer 403 and light-transmissive film layer 404, described
The one side of photosensitive resin layer 403 covers the light-transmissive film layer 404 and another side is covered on the table of ultrathin nanometer metal level 300
Face.
Dimensional stability is carried out to nano metal substrate made from the embodiment 1- embodiments 5 in table 1 below by the following method
It can test, and compared with existing nano metal substrate (comparative example), record such as table 1 below：
The method of testing of dimensional stability is carried out according to the following steps：
1st, substrate is cut as after Figure 11 sizes, is got four holes in surrounding with perforating press and is marked with A, B, C, D respectively；
2nd, A-B, C-D, A-C are measured with Quadratic Finite Element coordinatograph respectively, the distance at B-D holes center simultaneously records its (I)；
3rd, the copper of substrate is fully etched, after cleaning 1min with clear water, wipes and dry (23 ± 2 DEG C；50 ± 5%RH),
Stand 24h；
4th, A-B, C-D, A-C are measured with Quadratic Finite Element coordinatograph respectively, the distance at B-D holes center simultaneously records its (F1), in terms of
The dimensional stability data that formula 1 calculates MD, TD are calculated, it is Method B result；
5th, above substrate is put into drying box (23 ± 2 DEG C, 50 ± 5%RH) with 150 ± 2 DEG C of 30 ± 2min of baking, taking-up
Stand 24h；
6th, A-B, C-D, A-C being measured with Quadratic Finite Element coordinatograph respectively again, the distance at B-D holes center simultaneously records its (F2), with
Calculation formula 1 calculates MD, TD dimensional stability data, and it is Method C result, and with Method B result and
Method C result calculates its MD, TD rate of change.
Calculation formula 1:
Note：AB:A to B distance
CD:C to D distance
AC:A to C distance
BD:B to D distance
MD：The variable quantity of operating direction
TD：The variable quantity of the line of production
I：Initial state measured value
F (F1, F2)：Final states measured value
Table 1
As shown in Table 1, the size harmomegathus rate of nano metal substrate of the present utility model is smaller, and dimensional stability is good, is applicable
In the application of ultra fine-line.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalent structure transformation made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in other correlations
Technical field, similarly it is included in scope of patent protection of the present utility model.
Claims (9)
- A kind of 1. nano metal substrate for ultra fine-line FPC and COF material, it is characterised in that：Including low thermal coefficient of expansion Polyimide layer, the roughening polyimide layer for being formed at the low thermal expansion coefficient polyimide layer at least one side, it is formed at institute The ultrathin nanometer metal level and protection film layer of roughening polyimide layer another side are stated, the roughening polyimide layer is between described low Between thermal coefficient of expansion polyimide layer and the ultrathin nanometer metal level, the ultrathin nanometer metal level is poly- between the roughening Between imide layer and the protection film layer；The thickness of the low thermal expansion coefficient polyimide layer is 12.5-100um；The thickness of the roughening polyimide layer is 2-5um；The thickness of the ultrathin nanometer metal level is 90-800nm；The thickness of the protection film layer is 6-60um；The low thermal expansion coefficient polyimide layer refers to the polyimide layer that thermal coefficient of expansion is 4-19ppm/ DEG C；The roughening polyimide layer is the face contacted with ultrathin nanometer metal level for mat surface and surface roughness is between 50- Polyimide layer between 800nm；The ultrathin nanometer metal level is sputtered layer or electrodeposited coating.
- 2. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute State nano metal substrate be by low thermal expansion coefficient polyimide layer, to be formed at the low thermal expansion coefficient polyimide layer any The roughening polyimide layer in face, the ultrathin nanometer metal level for being formed at the roughening polyimide layer another side and protection film layer institute The one side nano metal substrate of composition.
- 3. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute State nano metal substrate be by low thermal expansion coefficient polyimide layer, to be formed at the low thermal expansion coefficient polyimide layer two-sided Roughening polyimide layer, be formed at it is described roughening polyimide layer another side ultrathin nanometer metal level and protection film layer institute structure Into double-face nanometer metal substrate.
- 4. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute The thickness for stating low thermal expansion coefficient polyimide layer is 12.5-50um, and the thickness of the ultrathin nanometer metal level is 90-200nm, The thickness of the protection film layer is 28-60um, and the thermal coefficient of expansion of the low thermal expansion coefficient polyimide layer is 4-11ppm/ DEG C, the roughening polyimide layer is polyimide layer of the surface roughness between 80-400nm.
- 5. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Structure The structure of the mat surface into the roughening polyimide layer is：On the roughening polyimide layer and with ultrathin nanometer metal Formed with powder roughened layer, the powder roughened layer is the material layer or anti-flammability being made up of mineral powder on the surface of layer contact The material layer that compound powder is formed.
- 6. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute It is the multilayer alloying metal layer that copper foil layer or copper foil layer are formed with other metal levels to state ultrathin nanometer metal level, other described gold Category layer refers at least one of silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum layer and layer gold, Wherein, the thickness of the copper foil layer is 90-150nm, and every thickness degree of other metal levels is 5-15nm.
- 7. the nano metal substrate according to claim 6 for ultra fine-line FPC and COF material, it is characterised in that：Institute It is one kind in following six kinds of structures to state ultrathin nanometer metal level：First, a Rotating fields：It is made up of individual layer copper foil layer, the thickness of the copper foil layer is 0.1-0.2um；2nd, two stacking structure：It is made up of copper foil layer and the nickel dam for being formed at copper foil layer any surface, the thickness of the copper foil layer is 90-150nm, the thickness of the nickel dam is 5-15nm；3rd, two stacking structure：It is made up of copper foil layer and the silver layer for being formed at copper foil layer any surface, the thickness of the copper foil layer is 90-150nm, the thickness of the silver layer is 5-15nm；4th, three stacking structure：By copper foil layer and it is formed at and the laminated nickel dam of copper foil and is formed at the silver layer of copper foil layer another side Form, the thickness of the copper foil layer is 90-150nm, and the thickness of the nickel dam and the silver layer is respectively 5-15nm；5th, three stacking structure：It is made up of copper foil layer and the nickel dam for being respectively formed in copper foil layer two sides, the thickness of the copper foil layer is 90-150nm, the thickness of nickel dam is respectively 5-15nm described in two sides；6th, three stacking structure：By copper foil layer and it is formed at and the laminated layers of copper of copper foil and is formed at the nickel dam of copper foil layer another side Form, the thickness of the copper foil layer is 90-150nm, and the thickness of the layers of copper and the nickel dam is respectively 5-15nm.
- 8. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute It is carrier layer to state protection film layer, and the carrier layer is by pet layer and is formed at the low of surface of the pet layer and sticks together Layer is formed, and the carrier layer is covered on the ultrathin nanometer layer on surface of metal by the low adhesion layer, wherein, the PET The thickness of layer is 23-50um, and the thickness of the low adhesion layer is 5-10um.
- 9. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute It is photopolymer layer to state protection film layer, and the photopolymer layer includes photosensitive resin layer and light-transmissive film layer, and the one side of the photosensitive resin layer is covered Cover the light-transmissive film layer and another side is covered on the ultrathin nanometer layer on surface of metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720283213.9U CN206644406U (en) | 2017-03-22 | 2017-03-22 | Nano metal substrate for ultra fine-line FPC and COF material |
| TW106143347A TWI640424B (en) | 2017-02-13 | 2017-12-11 | Nano metal substrate for FPC and COF materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108621513A (en) * | 2017-03-22 | 2018-10-09 | 昆山雅森电子材料科技有限公司 | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material |
| CN110267460A (en) * | 2019-07-08 | 2019-09-20 | 深圳市景旺电子股份有限公司 | A kind of production method and Mini LED board of Mini LED board |
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2017
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108621513A (en) * | 2017-03-22 | 2018-10-09 | 昆山雅森电子材料科技有限公司 | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material |
| CN108621513B (en) * | 2017-03-22 | 2019-11-12 | 昆山雅森电子材料科技有限公司 | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material |
| CN110267460A (en) * | 2019-07-08 | 2019-09-20 | 深圳市景旺电子股份有限公司 | A kind of production method and Mini LED board of Mini LED board |
| CN110267460B (en) * | 2019-07-08 | 2020-09-04 | 深圳市景旺电子股份有限公司 | Mini LED board and manufacturing method thereof |
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