CN210444598U

CN210444598U - Circuit piece bonding appurtenance

Info

Publication number: CN210444598U
Application number: CN201921062832.0U
Authority: CN
Inventors: 黄小熊
Original assignee: Chengdu Jingli Electronic Technology Co ltd
Current assignee: Chengdu Jingli Electronic Technology Co ltd
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2020-05-01
Anticipated expiration: 2029-07-09

Abstract

The utility model discloses a circuit piece bonding appurtenance, it includes base plate, anti-overflow spare and briquetting, the shape of anti-overflow spare and briquetting is the same with treating bonding circuit piece, the base plate is the plane board, anti-overflow spare sets up between base plate and briquetting, and anti-overflow spare pastes in the front of treating bonding circuit piece, the briquetting is located treats the bonding circuit piece back and presses anti-overflow spare and treat bonding circuit piece on the base plate, be provided with the layering on the briquetting, be provided with the locating lever on the edge of briquetting, be provided with the locating hole with the locating lever relevant position on the base plate. Through the utility model discloses the circuit piece that bonds, the glue that does not have the high temperature sticky tape on the circuit piece is remained, has promoted the quality of circuit piece by a wide margin. After adopting this appurtenance simultaneously, operating personnel's operation is more convenient, simple, has promoted production efficiency when guaranteeing product quality.

Description

Circuit piece bonding appurtenance

Technical Field

The utility model belongs to the technical field of electronic information, concretely relates to circuit piece bonding appurtenance.

Background

The electronic assembly technology is a technology for assembling substrate electronic material components to form an electronic product. At present, when assembling electronic products with high assembly density, small electronic product volume, light weight and the like, a common assembly process is to bond the components such as the circuit chip and the base, the chip device and the box body, and the chip and the circuit chip by using epoxy conductive adhesive to ensure that the components are assembled into a whole in a physical supporting mode according to specific design requirements to form a module product capable of working independently.

In the circuit chip bonding operation, it needs to be ensured that no conductive adhesive overflows from the surface of the circuit chip in the bonding process of the circuit chip. However, the inventor finds that in the long-term working process, when the circuit sheet with holes is bonded in the existing operation method, a polytetrafluoroethylene film with the size consistent with that of the circuit sheet is arranged on the circuit sheet in a padding mode, and then a pressing block is arranged on the circuit sheet, so that when the conductive adhesive is coated, if the adhesive amount around the holes is too large, the adhesive can overflow to the front face of the circuit sheet, and the circuit sheet is polluted. Therefore, how to solve the technical problem that the bonding of the empty circuit chip is too heavy, the circuit chip is not polluted, and the working efficiency can be improved is important.

Disclosure of Invention

For overcoming the not enough of above-mentioned existence, the utility model discloses an inventor constantly reforms transform and innovate through long-term exploration attempt and many times's experiment and effort, has provided a circuit piece bonding appurtenance, and this instrument avoids the downthehole conducting resin of circuit piece to spill over the circuit piece openly effectively, pollutes the circuit piece, has still ensured work efficiency simultaneously.

In order to realize the purpose, the utility model adopts the technical scheme that: the utility model provides a circuit piece bonding appurtenance, its includes base plate, anti-overflow spare and briquetting, the shape of anti-overflow spare and briquetting is the same with waiting to bond the circuit piece, the base plate is the plane board, anti-overflow spare sets up between base plate and briquetting, and anti-overflow spare pastes in the front of waiting to bond the circuit piece, the briquetting is located waits to bond the circuit piece back and presses anti-overflow spare and the circuit piece of waiting to bond on the base plate, be provided with the layering on the briquetting, be provided with the locating lever on the edge of briquetting, be provided with the locating hole with the locating lever relevant position on the base plate.

According to the utility model discloses in circuit piece bonding appurtenance, its further preferred technical scheme is, the base plate is the metal sheet.

According to the utility model discloses in circuit piece bonding appurtenance, its further preferred technical scheme is, the anti-overflow piece is the high temperature sticky tape.

According to the utility model discloses in circuit piece bonding appurtenance, its further preferred technical scheme is, the base plate size is also the same with waiting to bond the circuit piece.

According to the utility model discloses in circuit piece bonding appurtenance, its further preferred technical scheme is, briquetting size and shape structure are the same with waiting to bond the circuit piece.

Compared with the prior art the utility model has the advantages of as follows:

the utility model discloses an operation tool has the easy advantage of getting up of easy operation, is suitable for using widely by a large scale, and the low cost of product preparation simultaneously realizes easily, reduces the manufacturing cost of enterprise.

Through the utility model discloses the circuit piece that bonds, the glue that does not have the high temperature sticky tape on the circuit piece is remained, has promoted the quality of circuit piece by a wide margin. After adopting this appurtenance simultaneously, operating personnel's operation is more convenient, simple, has promoted production efficiency when guaranteeing product quality.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: the anti-overflow device comprises a base plate 1, a pressing block 2, an anti-overflow piece 3, a pressing strip 4, a positioning rod 5 and a positioning hole 6.

Detailed Description

To make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the claimed invention, but is merely representative of selected embodiments of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

Examples

As shown in fig. 1: the utility model provides a circuit piece bonding appurtenance, its includes base plate 1, anti-overflow piece 3 and briquetting 2, the shape of anti-overflow piece 3 and briquetting 2 is the same with waiting to bond the circuit piece, base plate 1 is the flat board, the size and the shape structure of briquetting 2 are the same with waiting to bond the circuit piece. The anti-overflow piece 3 is arranged between the substrate 1 and the pressing block 2, the high-temperature adhesive tape of the anti-overflow piece 3 is attached to the front face of the circuit piece to be bonded, and the pressing block 2 is positioned on the back face of the circuit piece to be bonded and presses the anti-overflow piece 3 and the circuit piece to be bonded on the substrate 1.

The pressing block 3 is provided with a pressing strip 4, so that the circuit pieces can be conveniently fixed and pressed in the bonding process. A positioning rod 5 is arranged on the edge of the pressing block 2, and a positioning hole 6 is arranged on the substrate 1 corresponding to the positioning rod 5, so that the substrate, the anti-overflow piece, the circuit piece to be bonded and the pressing block are conveniently aligned.

The auxiliary tool of the embodiment can ensure that no conductive adhesive overflows from the surface of the circuit piece in the bonding process of the circuit piece.

Compared with the traditional process, when the circuit sheet with holes is bonded, a polytetrafluoroethylene film with the same size as the circuit sheet is laid on the circuit sheet, and then the pressing block is pressed. When the conductive adhesive is coated, if the amount of the adhesive around the holes is too much, the adhesive can overflow to the front surface of the circuit chip to pollute the circuit chip. In the embodiment, the high-temperature adhesive tape which is in accordance with the shape of the circuit chip is attached to the front surface of the circuit chip in order to prevent the conductive adhesive in the circuit chip hole from overflowing to the front surface of the circuit chip and polluting the circuit chip. Therefore, a proper amount of conductive adhesive is coated on the bonding surface of the circuit piece, and the pressing block is arranged on the circuit piece, so that the conductive adhesive cannot overflow from the hole in the bonding process, and the surface of the soft base circuit piece is ensured to have no conductive adhesive residue.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. The first feature being "under," "below," and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or merely indicates that the first feature is at a lower level than the second feature.

The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the spirit and scope of the invention, and such modifications and enhancements are intended to be within the scope of the invention.

Claims

1. The utility model provides a circuit piece bonding appurtenance which characterized in that: including base plate, anti-overflow spare and briquetting, the shape of anti-overflow spare and briquetting is the same with waiting to bond the circuit piece, the base plate is the plane board, anti-overflow spare sets up between base plate and briquetting, and anti-overflow spare pastes in the front of waiting to bond the circuit piece, the briquetting is located waits to bond the circuit piece back and presses anti-overflow spare and waiting to bond the circuit piece on the base plate, be provided with the layering on the briquetting, be provided with the locating lever on the edge of briquetting, be provided with the locating hole with the locating lever relevant position on the base plate.

2. The die attachment aid of claim 1, wherein the substrate is a metal plate.

3. The die attachment aid of claim 1 wherein the spill guard is a high temperature adhesive tape.

4. The die attachment aid of claim 1, wherein the substrate is also the same size as the die to be attached.

5. The die attachment aid of claim 1, wherein the press block is the same size and shape as the die to be attached.