CN201270625Y - Printed circuit board and adhering structure for heat radiation fin - Google Patents
Printed circuit board and adhering structure for heat radiation fin Download PDFInfo
- Publication number
- CN201270625Y CN201270625Y CNU2008202030054U CN200820203005U CN201270625Y CN 201270625 Y CN201270625 Y CN 201270625Y CN U2008202030054 U CNU2008202030054 U CN U2008202030054U CN 200820203005 U CN200820203005 U CN 200820203005U CN 201270625 Y CN201270625 Y CN 201270625Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fin
- groove
- radiating flange
- dress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202030054U CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202030054U CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201270625Y true CN201270625Y (en) | 2009-07-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008202030054U Expired - Fee Related CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Country Status (1)
Country | Link |
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CN (1) | CN201270625Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117580260A (en) * | 2023-12-08 | 2024-02-20 | 皆利士多层线路版(中山)有限公司 | Connecting process of PCB radiating fins |
-
2008
- 2008-11-04 CN CNU2008202030054U patent/CN201270625Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117580260A (en) * | 2023-12-08 | 2024-02-20 | 皆利士多层线路版(中山)有限公司 | Connecting process of PCB radiating fins |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HUIZHOU MEIRUI ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: MERIX CORPORATION Effective date: 20120518 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516008 HUIZHOU, GUANGDONG PROVINCE TO: 516001 HUIZHOU, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120518 Address after: 516001 Guangdong city of Huizhou province Chen town DESAY Industrial Park third Patentee after: Huizhou Meirui Electronic Technology Co., Ltd. Address before: 516008 No. 16 Gu Tong industrial area, Guangdong, Huizhou Patentee before: Merix Circuit (Huizhou) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090708 Termination date: 20171104 |