CN201270625Y - Printed circuit board and adhering structure for heat radiation fin - Google Patents
Printed circuit board and adhering structure for heat radiation fin Download PDFInfo
- Publication number
- CN201270625Y CN201270625Y CNU2008202030054U CN200820203005U CN201270625Y CN 201270625 Y CN201270625 Y CN 201270625Y CN U2008202030054 U CNU2008202030054 U CN U2008202030054U CN 200820203005 U CN200820203005 U CN 200820203005U CN 201270625 Y CN201270625 Y CN 201270625Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fin
- groove
- radiating flange
- dress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a mounting and pasting structure of a printed circuit board and a radiating flange. The mounting and pasting structure comprises a circuit board and the radiating flange, wherein a groove which is used to mount and paste the radiating flange is arranged on the circuit board, and the radiating flange is installed in the groove. An epoxy resin piece adhesive layer which contains silvery is also arranged between the bottom of the groove and the radiating flange. The epoxy resin in the structure guarantees the strong adhesion between the radiating flange and the circuit board, a large amount of silver content which is contained in the epoxy resin enables the radiating flange and the circuit board to have good conductivity, and the whole mounting and pasting structure has good heat dissipating performance, and the heat dissipation demands of a high frequency circuit board are satisfied.
Description
Technical field
The utility model relates to a kind of dress subsides structure with printed substrate and fin of excellent heat dispersion performance.
Background technology
Along with being extensive use of of high-frequency electronic signal, the thermal energy that is produced on PCB (printed circuit board (PCB)) can cause very big infringement to pcb board, need to utilize heat radiation or cooling means to help heat energy is discharged, therefore a kind of effective heat dissipating method of design effectively distributes the high heat that produces in the high-frequency circuit running just necessary at any time on PCB.Common solution is to paste a fin at the place dress that the plate heater element is relatively concentrated to help efficiently radiates heat.In the practical application usually since contact between fin and the pcb board bad, heat conductivility is poor, and does not reach the heat radiation requirement.
The utility model content
The purpose of this utility model provides a kind of new printed substrate and the dress of fin pastes structure, the bad problem of heat radiation when working to solve the HF link plate.
For achieving the above object, the technical scheme that the utility model is taked is: provide the dress of a kind of printed substrate and fin to paste structure, described dress pastes structure and comprises wiring board, fin, and described wiring board is provided with the groove that dress pastes fin, and fin is installed in the groove.Between described bottom portion of groove and fin, also be provided with the epoxy sheet adhesive layer of one deck argentiferous.
Dress described in the utility model pastes structure fin and wiring board is effectively linked together, wherein epoxy sheet has guaranteed strong binding between fin and the circuit board, contained a large amount of silver-colored composition makes and has good conduction between fin and the wiring board in the epoxy sheet, therefore whole dress pastes structure and has good performance of heat dissipation, has satisfied the radiating requirements of HF link plate.
Description of drawings
Fig. 1 is that the utility model structure is formed schematic diagram.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As Fig. 1, the dress of described printed substrate and fin pastes structure, comprises wiring board 1, fin 2, and described wiring board is provided with the groove 21 that dress pastes fin, and fin is installed in the groove 21.Described wiring board and fin are that epoxy sheet is bonded together by the conducting resinl 3 of argentiferous composition.
Fin will use special pre-pressing mold earlier the epoxy sheet of argentiferous composition to be pressed together on the fin in advance before assembling with wiring board.
When wiring board and fin assembling, earlier wiring board is fixed on the assembly jig, the fin that will press conducting resinl more in advance is placed on the relevant position, and wiring board needs pressing fin place normally to be arranged to groove.After covering barrier film, pressure buffer paper, aluminum cover plate on the fin successively, integral body is placed on carries out the machine pressing on the pressing table.
Epoxy resin has guaranteed the strong binding between fin and the circuit board in the utility model, and contained a large amount of silver-colored composition makes and has good conduction between fin and the wiring board in the epoxy resin, makes whole dress paste structure and has good performance of heat dissipation.
Claims (2)
1, the dress of a kind of printed substrate and fin pastes structure, comprises wiring board, fin, it is characterized in that: described wiring board is provided with the groove that dress pastes fin, and fin is installed in the groove.
2, the dress of printed substrate according to claim 1 and fin pastes structure, it is characterized in that: the epoxy sheet adhesive layer that also is provided with one deck argentiferous between described bottom portion of groove and fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202030054U CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202030054U CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201270625Y true CN201270625Y (en) | 2009-07-08 |
Family
ID=40843234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202030054U Expired - Fee Related CN201270625Y (en) | 2008-11-04 | 2008-11-04 | Printed circuit board and adhering structure for heat radiation fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201270625Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117580260A (en) * | 2023-12-08 | 2024-02-20 | 皆利士多层线路版(中山)有限公司 | Connecting process of PCB radiating fins |
-
2008
- 2008-11-04 CN CNU2008202030054U patent/CN201270625Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117580260A (en) * | 2023-12-08 | 2024-02-20 | 皆利士多层线路版(中山)有限公司 | Connecting process of PCB radiating fins |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUIZHOU MEIRUI ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: MERIX CORPORATION Effective date: 20120518 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516008 HUIZHOU, GUANGDONG PROVINCE TO: 516001 HUIZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120518 Address after: 516001 Guangdong city of Huizhou province Chen town DESAY Industrial Park third Patentee after: Huizhou Meirui Electronic Technology Co., Ltd. Address before: 516008 No. 16 Gu Tong industrial area, Guangdong, Huizhou Patentee before: Merix Circuit (Huizhou) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090708 Termination date: 20171104 |