WO2009141413A1 - Printed circuit board with co-planar plate and method of manufacturing therefor - Google Patents

Printed circuit board with co-planar plate and method of manufacturing therefor Download PDF

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Publication number
WO2009141413A1
WO2009141413A1 PCT/EP2009/056199 EP2009056199W WO2009141413A1 WO 2009141413 A1 WO2009141413 A1 WO 2009141413A1 EP 2009056199 W EP2009056199 W EP 2009056199W WO 2009141413 A1 WO2009141413 A1 WO 2009141413A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
plate
metal plate
raised portion
Prior art date
Application number
PCT/EP2009/056199
Other languages
French (fr)
Inventor
Timothy Edward Gee
Richard Sharples
Original Assignee
Nujira Limited
Tru-Lon Printed Circuits (Royston) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nujira Limited, Tru-Lon Printed Circuits (Royston) Limited filed Critical Nujira Limited
Publication of WO2009141413A1 publication Critical patent/WO2009141413A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • Fig. 2 there is generally illustrated a PCB arrangement 302 and a metal plate arrangement 304.
  • the PCB arrangement 302 is provided with an opening 303 in a portion thereof.
  • the opening is a square opening, but the shape of the opening is not relevant.
  • the PCB 302 may be a laminate structure.
  • the thickness of the opening in the PCB 302 and thus the size of the opening 303, is denoted by d.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

There is disclosed a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is coplanar with the surface of the raised portion of the metal plate.

Description

PRINTED CIRCUIT BOARD WITH CO-PLANAR PLATE
BACKGROUND TO THE INVENTION:
Field of the Invention:
The present invention relates to the provision of a plate in a printed circuit board arrangement, and particularly to the provision of such a plate for the transfer of heat from one surface of the printed circuit board to another surface of the printed circuit board.
Description of the Related Art:
It is known in printed circuit board technology to provide metal plates associated with the printed circuit board which allow for conduction of heat associated with a circuit component on one side of the board to a heat dissipating arrangement on the other side of the board. Typically a material is chosen for the plate which allows for good thermal conduction, such as copper. With reference to Fig. 1, there is illustrated a typical prior art arrangement. Reference numeral 110 of Fig. 1 denotes a cross section through a printed circuit board, which comprises a laminate 102 including a middle layer 106, an upper layer 104, and a lower layer 108. In practice one or more of the layers 104, 106 and 108 may further be laminates themselves. As denoted by reference numeral 114, an opening is provided through each of the layers 104, 106 and 108. The opening in the middle layer 106 is larger than the opening in the upper layer 104 and lower layer 108. As can be seen, in this opening a metal plate 112 is provided. The metal plate 112 is formed, in cross section, of a "cross" shape. The cross shape fits into the larger opening provided in the middle layer 106, and ensures that in situ the metal plate is retained. As can be seen from the cross section of Fig. 1, an upper surface of the metal plate 112 is generally in line with the upper surface of the upper layer 104, and a lower surface of the plate 112 is generally in line with the lower surface of the layer 108. In practice, one surface of the printed circuit board 110, such as the upper surface of upper layer 104, is provided for connection of components. The other surface, for example the lower surface of the lower layer 108, may also be provided for the connection of components but in addition may be provided for connection to a heat dissipation means for dissipating heat associated with one or more components formed on the upper surface of the layer 104. Thus, for example, an electrical component may be formed on the upper surface of layer 104 having its body generally placed on the upper surface of metal plate 114. The printed circuit board 110 is then placed over a heat dissipation means, such that the lower surface of the metal plate 112 forms a connection to the heat dissipation arrangement.
A problem arises in prior art arrangements such as that disclosed in Fig. 1. Due to the poor tolerance of a printed circuit board's finish thickness, it is very difficult to bond the laminated layers 102 to the metal plate 112, and achieve a co-planar surface between the upper and lower surfaces of the metal plate 112, and the respective upper and lower surfaces of the laminated PCB structure 102. If co-planarity is not achieved between the respective surfaces of the plate 112 and surfaces of the laminated PCB 102, then either the mechanical integrity of components formed on the surface may be effected due to the plate 112 forcing the position of such components away from the surface, or else thermal conduction between the component itself and the metal plate 112 may be effected.
A solution to this problem is, in the event that the surface of the metal plate 112 stands proud to some extent of the surface of the layers 104 or 108, to machine away the raised surface. However it is very difficult to perform such machining without damaging the surface of the printed circuit board, and any such machining is also time-consuming and costly.
It is therefore an aim of the present invention to provide an improved arrangement for the provision of such a plate in a printed circuit board arrangement.
SUMMARY OF THE INVENTION:
In accordance with the invention there is provided a method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is co-planar with the surface of the raised portion of the metal plate. The step of compressing comprises compressing the raised portion of the plate. The method is preferably further adapted such that co- planarity with the lead frames of a lead frame assembly is provided for.
In accordance with the invention there is also provided a printed circuit board assembly made in accordance with the defined method.
The height of said raised portion of the plate is preferably equal to or greater than the thickness of the printed circuit board plus an associated tolerance.
The plate is preferably a ductile material. The plate is preferably copper.
The method may further comprise the step of providing an adhesive between the printed circuit board and the plate.
The plate may extend beyond the raised portion on the lower surface of the printed circuit board. The printed circuit board may be a laminated printed circuit board or a non-laminated printed circuit board.
The laminated printed circuit board may be formed in the step of laminating the printed circuit board and the plate.
The step of laminating the printed circuit board and the plate may be formed in the step of compressing.
The invention also provides a printed circuit board assembly including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, a surface of the plate being co-planar with a surface of the printed circuit board.
BRIEF DESCRIPTION OF THE FIGQRES: The invention will now be described by way of example with reference to the accompanying Figures, in which:
Fig. 1 illustrates a prior art arrangement of a printed circuit board provided with a metal plate;
Figs. 2 to 4 illustrate the provision of a printed circuit board with a metal plate in accordance with the principles of the present invention;
Fig. 5 illustrates the formation of the final structure of a printed circuit board with metal plate in accordance with the principles of the present invention to achieve an advantageous final structure;
Fig. 6 illustrates a modification to the inventive arrangement to provide full electrical connection to the metal plate; and
Figs. 7 and 8 illustrate the printed circuit board with metal plate in accordance with the principles of the invention and illustrating electronic components formed on a surface of the printed circuit board.
DESCRIPTION OF THE PREFERRED EMBODIMENTS: The invention will now be described by way of example with reference to particular preferred embodiments. One skilled in the art will appreciate that the invention in its broadest sense is not limited to any specific aspects of any described embodiment.
The general principles of the present invention are now described with reference to Figs. 2 to 4. With regard to Fig. 2, there is generally illustrated a PCB arrangement 302 and a metal plate arrangement 304. As can be seen in Fig. 2, the PCB arrangement 302 is provided with an opening 303 in a portion thereof. In the example illustrated the opening is a square opening, but the shape of the opening is not relevant. The PCB 302 may be a laminate structure. The thickness of the opening in the PCB 302 , and thus the size of the opening 303, is denoted by d.
As also shown in Fig, 2, the metal plate 304 is generally provided having an overall shape corresponding to the shape of the printed circuit board 302. Thus, in this example, the footprint of the printed circuit board coincides with the footprint of the metal plate 304. The metal plate 304 is shown to have a region denoted by reference numeral 306 which is raised with respect to, or stands proud of, the main body of the metal plate 304. The dimensions of the portion 306 of the metal plate, in width and length, correspond to the dimensions of the opening 303 in the printed circuit board 302, in width and length. However the dimensions must be arranged such that the raised portion 306 of the metal plate 304 will fit into the opening of the board 302. The height of the metal portion 306, standing proud from the main metal portion 304, is denoted by dr .
The dimensions d and dr are approximately equal, but are arranged such that df is greater than d. In general, d' is greater than or equal to the value of d plus an associated tolerance . Also shown in Fig. 2 is an adhesive layer 305 formed on the underside of the printed circuit board 302, namely the side facing the upperside of the metal plate 304 which side has the proud portion 306. As denoted by arrow 308, in fabrication the printed circuit board 302 and metal plate 304 are brought together such that the proud portion 306 of the metal plate 304 extends into the opening 303 of the printed circuit board 302, and the underside of the printed circuit board 302 adheres to the portion of the upperside of the metal plate 304 excluding the raised portion 306 by way of adhesive 305.
Fig. 3 illustrates cross sections through A-A of the printed circuit board 302 of Fig. 2, and cross sections through B-B of the metal plate 304 of Fig. 2. As illustrated in Fig. 3, the proud portion 306 of the metal plate 304 may be formed such that it has a tapered wall, its dimensions at the surface of the metal plate 304 corresponding approximately to the opening 303. Alternatively the edges of the proud section 306 of the metal plate may simply be perpendicular to the surface of the metal plate 304. In general the raised portion 306 must fit the opening 303 such that the adhesive layer can bond the metal plate to the board.
As can be seen more clearly in Fig. 3, the metal plate 304 is formed to have the proud section 306 by deforming the shape of the metal plate 304. Thus an indentation 310 is formed in the opposite surface of the metal plate 304 to the surface upon which the proud section 306 is formed. Thus the forming of the proud portion 306 from a flat metal plate will be understood by one skilled in the art. This may be achieved, for example, by punching the metal plate. As mentioned above and as shown in each of Figs. 2 and 3 by arrow 308, the printed circuit board 302 and metal plate 304 are brought together to form a structure as illustrated in Fig. 4. The adhesive 303 bonds the printed circuit board 302 to the metal plate 304 in regions other than the region in which the opening 303 is formed in the printed circuit board. The proud section 306 of the metal plate 304 thus extends through the opening 303.
As illustrated in Fig. 4, a laminate structure results in which the proud portion of the metal plate generally extends through the opening of the printed circuit board. However as can be seen in Fig. 4, due to the deliberate manufacture of the proud portion of the copper plate to be higher than the depth of the opening in the printed circuit board {d'>d) , the upper surface of the copper plate in the opening extends above the upper surface of the printed circuit board 302 by a height x.
Thereafter, as illustrated in Fig. 5, the laminate structure 510 of Fig. 4 is placed between two pressure plates 502 and 504. A pressure plate 502 is positioned generally on the upper surface of the printed circuit board 302 and the upper surface of the proud portion 306 of the metal plate. The pressure plate 504 is generally placed on the lower surface of the metal plate 304. Pressure is then applied to each of the pressure plates, as denoted by arrows 506 and 508, so as to compress the laminate structure 510. As a result of the compression of the laminate structure 510, the upper surface of the proud portion 306 of the metal plate 304 accurately achieves co-planarity with the upper surface of the printed circuit board 302. The forming of the laminate structure of Fig. 4 as illustrated in Figs. 2 and 3, and the compression of the laminated structure as shown in Fig. 5, may all be achieved in the same step. In addition, the printed circuit board 302 may itself be formed of multiple layers, and therefore comprise a laminate, and the compression of these multiple layers may also take place in the same single step.
The operation of Fig. 5 may take place in a laminating press, under a raised temperature. A raised temperature may be appropriate where any bonding material used is heat sensitive material. For example the adhesive layer 305 may be a hot melt layer. The forming of the final compressed laminated structure may therefore be achieved under pressure and raised temperature. To ensure co-planarity of the bonded printed circuit board to the raised surface of the metal plate, the raised surface of the metal plate is raised to a height greater than the maximum thickness of the printed circuit board including any tolerance. Tolerance can be of the order of 10%, and thus the raised surface of the metal plate may be raised to a height which corresponds to the thickness of the printed circuit board plus an additional 10%.
In the final structure from Fig. 5, not only is there achieved co-planarity of the upper surface of the printed circuit board with the upper surface of the raised portion of the metal plate, but the printed circuit board is also fixedly bonded to the metal plate.
Thus the lamination press operation of Fig. 5 may ensure that the printed circuit board is bonded to the metal plate whilst compressing the raised areas of the metal plate to ensure they are co-planar with the upper surface of the printed circuit board, regardless of the finished height of the printed circuit board, provided it is within the expected tolerance .
The material for the metal plate 304 may be any conductive material which is capable of being compressed, and which is preferably ductile. In a preferred arrangement the material is copper.
The primary conductive characteristic of the metal plate is that it is thermally conductive. The compression operation of Fig, 5, or any compression operation associated with forming the structure in accordance with the invention, may be carried out in a conventional printed circuit board press or in a different press.
Thus in accordance with the principles of the invention there is formed a laminated printed circuit board and metal plate structure in which a surface of the printed circuit board is accurately co-planar with a surface of the metal plate. This overcomes the problem of not being able to accurately form the printed circuit board to have a predicted thickness, even though the metal plate can be formed to have an accurate thickness.
In an additional modification, the metal plate 304 may be electrically connected to the printed circuit board 302. This is illustrated with reference to Fig. 6. With reference to Fig. 6, it can be seen that the side edgings of the opening 303 in the printed circuit board 302 are formed with metallised edges. One or more portions of solder, denoted by reference numerals 606 and 608 in Fig. 6, are then formed in the opening between the metallised edges 602 and 604 and the raised portion of the metal plate 304. In this way one or more copper geometry or copper features, such as tracks, traces lans etc., formed on the printed circuit board 302 may terminate at the metal edge plate 602 or 604, and be connected via solder formation 606 or 608 to the metal plate 304.
With reference to Fig. 7, there is illustrated an advantageous formation of an electrical component on the surface of the thus formed printed circuit board with the metal plate. Illustrated in Fig. 7 is an electrical component 702. It is assumed that the electrical component 702 is one which has a high level of heat generation, and which therefore needs an effective heat dissipation means . An example of such an electrical component is a power amplifier.
As illustrated in Fig. 7, the electrical component 702 is formed such that its main body rests directly on the upper surface of the raised portion of the metal layer 304. At either side of the electrical component 702 there is formed solder bumps 704 and 706, which make electrical connection between the lead frames of the electrical component 702 and the copper features, e.g. tracks or traces, of the printed circuit board 302. Thus there is achieved highly accurate surface mount of an electrical component to ensure electrical connection with the printed circuit board, whilst also ensuring good connection with the metal layer 304 to provide heat dissipation.
In Fig. 7 the surface of the printed circuit board 302 is shown lower than the surface of the extended portion of the metal plate 304. This is for illustrative purposes only, and it will be understood by one skilled in the art that in practice the solder bumps 704 and 706 providing surface mount connectivity for electrical component 702 require the upper surface of the printed circuit board 302 to effectively coincide with the lower surface of the electrical component 702, such that when the body of the electrical component 702 rests on the upper surface of the metal plate 304, the electrical connections of the electrical component 702 can be soldered to the co-planar surface of the printed circuit board 302.
With reference to Fig. 8, there is illustrated a further advantageous formation of an electrical component on the surface of a formed printed circuit board with the metal plate. Illustrated in Fig. 8 is an electrical component 802 requiring heat dissipation means.
As illustrated in Fig. 8, the electrical component 802 is formed such that its main body rests directly on the upper surface of the raised portion of the metal layer 304. In this arrangement r a solder bump 808 is formed to solder the body of the electrical component 802 to the surface of the raised metal plate. This may allow for electrical connectivity between the electrical component and the metal plate. At the sides of the electrical component 802 there extend lead frames, such as lead frame 804, for connection to the printed circuit board 302. Lead frames make electrical connection from the electrical component to the printed circuit board via solder bumps, such as solder bump 806. Thus there is shown in Figure 8 an alternative implementation where highly accurate mounting of an electrical component is achieved in combination with good connection to a metal plate to provide heat dissipation.
The characteristic of the invention is that the surface of the printed circuit board and the surface of the metal plate are formed so as to be co-planar. In addition, the electrical connection to an electrical component to be formed on the printed circuit board is preferably co-planer with the surface of the printed circuit board and the surface of the metal plate.
With the present invention, electrical and mechanical components can be mounted onto the printed circuit board and bonded to a metal plate in the same plane, allowing the plate to act as a direct thermal path for those components without requiring secondary machining to compensate for the tolerance of the printed circuit board or the plate.
The present invention has been described herein by way of reference to particular preferred examples, and one skilled in the art will appreciate the invention is not limited to the specifics of any described example. In addition, aspects of various embodiments described herein may be selectively combined with other features described herein. The scope of protection afforded by the invention is defined by the appended claims .

Claims

CLAIMS :
1. A method of forming a printed circuit board including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, the method comprising the steps of: providing an opening in the printed circuit board extending from the upper surface to the lower surface; providing a raised portion on the plate having dimensions corresponding to the opening in the printed circuit board, the height of said raised portion being greater than the thickness of the printed circuit board; laminating the printed circuit board and the metal plate to form the raised portion of the plate in the opening of the printed circuit board; and compressing the laminated structure to form a structure in which the upper surface of the printed circuit board is co- planar with the surface of the raised portion of the metal plate, the step of compressing comprising compressing the raised portion of the plate.
2. The method of claim 1 wherein the height of said raised portion of the plate is equal to or greater than the thickness of the printed circuit board plus an associated tolerance.
3. The method of claim 1 or claim 2 wherein the plate is a ductile material.
4. The method of any one of claims 1 to 3 wherein the plate is copper.
5. The method of any one of claims 1 to 4 further comprising the step of providing an adhesive between the printed circuit board and the plate.
6. The method of any one of claims 1 to 5 wherein the plate extends beyond the raised portion on the lower surface of the printed circuit board.
7. The method of any one of claims 1 to 6 wherein the printed circuit board is a laminated printed circuit board.
8. The method of claim 7 wherein the laminated printed circuit board is formed in the step of laminating the printed circuit board and the plate.
9. The method of any one of claims 1 to 8 wherein the step of laminating the printed circuit board and the plate is formed in the step of compressing.
10. A printed circuit board assembly including a plate for providing thermal conductivity from an upper surface of the printed circuit board to a lower surface of the printed circuit board, a surface of the plate being co-planar with a surface of the printed circuit board.
PCT/EP2009/056199 2008-05-21 2009-05-21 Printed circuit board with co-planar plate and method of manufacturing therefor WO2009141413A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0809270.2 2008-05-21
GB0809270A GB2460124A (en) 2008-05-21 2008-05-21 Printed circuit board with co-planar plate

Publications (1)

Publication Number Publication Date
WO2009141413A1 true WO2009141413A1 (en) 2009-11-26

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WO (1) WO2009141413A1 (en)

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US8587377B2 (en) 2010-12-13 2013-11-19 Skyworks Solutions, Inc. Apparatus and methods for biasing a power amplifier
US8598950B2 (en) 2010-12-14 2013-12-03 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8610503B2 (en) 2010-12-17 2013-12-17 Skyworks Solutions, Inc. Apparatus and methods for oscillation suppression
US8717100B2 (en) 2011-03-15 2014-05-06 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8718188B2 (en) 2011-04-25 2014-05-06 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking
US8797103B2 (en) 2010-12-07 2014-08-05 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8989682B2 (en) 2011-02-07 2015-03-24 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking calibration
CN104918424A (en) * 2015-07-03 2015-09-16 深圳市迅捷兴电路技术有限公司 Method for stabilizing size of circuit board with core boards of different thicknesses
US9331653B2 (en) 2013-04-23 2016-05-03 Skyworks Solutions, Inc. Apparatus and methods for envelope shaping in power amplifier systems
US9445371B2 (en) 2014-08-13 2016-09-13 Skyworks Solutions, Inc. Apparatus and methods for wideband envelope tracking systems
US9602056B2 (en) 2014-09-19 2017-03-21 Skyworks Solutions, Inc. Amplifier with base current reuse
US10103693B2 (en) 2015-09-30 2018-10-16 Skyworks Solutions, Inc. Power amplifier linearization system and method
US10110169B2 (en) 2016-09-14 2018-10-23 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking systems with automatic mode selection
US10236831B2 (en) 2017-05-12 2019-03-19 Skyworks Solutions, Inc. Envelope trackers providing compensation for power amplifier output load variation
US10516368B2 (en) 2017-06-21 2019-12-24 Skyworks Solutions, Inc. Fast envelope tracking systems for power amplifiers
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US9088249B2 (en) 2010-12-07 2015-07-21 Skyworks Solutions, Inc. Apparatus and methods for reducing capacitive loading of an envelope tracker
US8797103B2 (en) 2010-12-07 2014-08-05 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8587377B2 (en) 2010-12-13 2013-11-19 Skyworks Solutions, Inc. Apparatus and methods for biasing a power amplifier
US8598950B2 (en) 2010-12-14 2013-12-03 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US9859846B2 (en) 2010-12-14 2018-01-02 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction in a mobile device
US9548702B2 (en) 2010-12-14 2017-01-17 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction of an envelope tracker
US9257940B2 (en) 2010-12-14 2016-02-09 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8610503B2 (en) 2010-12-17 2013-12-17 Skyworks Solutions, Inc. Apparatus and methods for oscillation suppression
US10382147B2 (en) 2011-02-07 2019-08-13 Skyworks Solutions, Inc. Methods of calibrating a power amplifier system to compensate for envelope amplitude misalignment
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