SE9702593D0 - Device on a circuit board - Google Patents

Device on a circuit board

Info

Publication number
SE9702593D0
SE9702593D0 SE9702593A SE9702593A SE9702593D0 SE 9702593 D0 SE9702593 D0 SE 9702593D0 SE 9702593 A SE9702593 A SE 9702593A SE 9702593 A SE9702593 A SE 9702593A SE 9702593 D0 SE9702593 D0 SE 9702593D0
Authority
SE
Sweden
Prior art keywords
circuit board
thermally conductive
plateaus
power component
conductive layer
Prior art date
Application number
SE9702593A
Other languages
Swedish (sv)
Inventor
Hans Hallberg
Original Assignee
Electrolux Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrolux Ab filed Critical Electrolux Ab
Priority to SE9702593A priority Critical patent/SE9702593D0/en
Publication of SE9702593D0 publication Critical patent/SE9702593D0/en
Priority to PCT/SE1998/001256 priority patent/WO1999002023A1/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)

Abstract

A device for a circuit board (10) having one or more printed circuits with electronic components (14, 15). At least one of the components is a heat emitting power component (15) that is thermally connected to a plate (11) of thermally conductive material arranged as a sandwich or laminate construction at the circuit board. The thermally conductive plate (11) includes plateaus (16) extending toward the circuit board. The plateaus are covered by an electrically insulating and thermally conductive layer (13). The power component (15) is provided with a heat transferring surface (20) which abuts the plateau (16) or the thermally conductive layer (13).
SE9702593A 1997-07-04 1997-07-04 Device on a circuit board SE9702593D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE9702593A SE9702593D0 (en) 1997-07-04 1997-07-04 Device on a circuit board
PCT/SE1998/001256 WO1999002023A1 (en) 1997-07-04 1998-06-26 Device for a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9702593A SE9702593D0 (en) 1997-07-04 1997-07-04 Device on a circuit board

Publications (1)

Publication Number Publication Date
SE9702593D0 true SE9702593D0 (en) 1997-07-04

Family

ID=20407646

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702593A SE9702593D0 (en) 1997-07-04 1997-07-04 Device on a circuit board

Country Status (2)

Country Link
SE (1) SE9702593D0 (en)
WO (1) WO1999002023A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19919781A1 (en) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Printed circuit board and method of mounting it
EP1307587A2 (en) 2000-03-03 2003-05-07 THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES MULTIPLEX HYBRIDIZATION SYSTEM FOR IDENTIFICATION OF PATHOGENIC i MYCOBACTERIUM /i AND METHOD OF USE
US6657866B2 (en) * 2002-03-15 2003-12-02 Robert C. Morelock Electronics assembly with improved heatsink configuration
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102005039374A1 (en) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Housing for an electronic circuit having one housing part formed as a heat sink
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system

Also Published As

Publication number Publication date
WO1999002023A1 (en) 1999-01-14

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