SE9702593D0 - Anordning vid ett kretskort - Google Patents

Anordning vid ett kretskort

Info

Publication number
SE9702593D0
SE9702593D0 SE9702593A SE9702593A SE9702593D0 SE 9702593 D0 SE9702593 D0 SE 9702593D0 SE 9702593 A SE9702593 A SE 9702593A SE 9702593 A SE9702593 A SE 9702593A SE 9702593 D0 SE9702593 D0 SE 9702593D0
Authority
SE
Sweden
Prior art keywords
circuit board
thermally conductive
plateaus
power component
conductive layer
Prior art date
Application number
SE9702593A
Other languages
English (en)
Inventor
Hans Hallberg
Original Assignee
Electrolux Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrolux Ab filed Critical Electrolux Ab
Priority to SE9702593A priority Critical patent/SE9702593D0/sv
Publication of SE9702593D0 publication Critical patent/SE9702593D0/sv
Priority to PCT/SE1998/001256 priority patent/WO1999002023A1/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
SE9702593A 1997-07-04 1997-07-04 Anordning vid ett kretskort SE9702593D0 (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE9702593A SE9702593D0 (sv) 1997-07-04 1997-07-04 Anordning vid ett kretskort
PCT/SE1998/001256 WO1999002023A1 (en) 1997-07-04 1998-06-26 Device for a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9702593A SE9702593D0 (sv) 1997-07-04 1997-07-04 Anordning vid ett kretskort

Publications (1)

Publication Number Publication Date
SE9702593D0 true SE9702593D0 (sv) 1997-07-04

Family

ID=20407646

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702593A SE9702593D0 (sv) 1997-07-04 1997-07-04 Anordning vid ett kretskort

Country Status (2)

Country Link
SE (1) SE9702593D0 (sv)
WO (1) WO1999002023A1 (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19919781A1 (de) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Leiterplatte und Verfahren zu ihrer Anbringung
AU2001241934A1 (en) 2000-03-03 2001-09-17 Beckman Coulter Inc. Multiplex hybridization system for identification of pathogenic mycobacterium and method of use
US6657866B2 (en) * 2002-03-15 2003-12-02 Robert C. Morelock Electronics assembly with improved heatsink configuration
DE102005034546A1 (de) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Baugruppe mit Kühlvorrichtung
DE102005039374A1 (de) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Gehäuse für Elektronikbaugruppen
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
DE102009051632A1 (de) * 2009-11-02 2011-05-05 Beru Ag Leiterplatte mit Kühlkörper

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system

Also Published As

Publication number Publication date
WO1999002023A1 (en) 1999-01-14

Similar Documents

Publication Publication Date Title
KR930011201A (ko) 반도체 장치
MY143326A (en) Lightweight circuit board with conductive constraining cores
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
EP1659839A3 (en) Thermal management of surface-mount circuit devices on laminate ceramic substrate
WO2001084898A3 (de) Eine elektronische steuerbaugruppe für ein fahrzeug
TW200509420A (en) Heatsinking electronic devices
SE9702923L (sv) Monteringsstruktur för en effekttransistormodul
ATE242954T1 (de) Mehrschichtleiterplatte
KR970063013A (ko) 표시장치
AU7036200A (en) A printed circuit board assembly
DE502006003209D1 (de) Leiterplatte
MY143173A (en) Compact power semiconductor module having a connecting device
CA2355037A1 (en) Circuit board assembly with heat sinking
DK1393605T3 (da) Printplade med mindst én elektronisk komponent
SE9802157L (sv) Elektrisk komponent
DE59710570D1 (de) Leiterplattenanordnung
ATE415805T1 (de) Wärmeableitung für mehrere integrierte schaltkreise montiert auf einer leiterplatte
DK1775769T3 (da) Effekthalvledermodul
SE9702593D0 (sv) Anordning vid ett kretskort
ES2128450T3 (es) Subconjunto electrico.
GB0413420D0 (en) Heat management in printed wiring boards
EP1253636A4 (en) ELECTRONIC EQUIPMENT
GB2324753B (en) Printed circuit and printed wiring boards and methods of manufacture
TW200623996A (en) Electronic device comprising a flexible printed circuit board
KR910005443A (ko) 직접 장착 반도체 팩케이지