SE9702923L - Monteringsstruktur för en effekttransistormodul - Google Patents

Monteringsstruktur för en effekttransistormodul

Info

Publication number
SE9702923L
SE9702923L SE9702923A SE9702923A SE9702923L SE 9702923 L SE9702923 L SE 9702923L SE 9702923 A SE9702923 A SE 9702923A SE 9702923 A SE9702923 A SE 9702923A SE 9702923 L SE9702923 L SE 9702923L
Authority
SE
Sweden
Prior art keywords
circuit board
heat sink
mounting structure
power transistor
transistor module
Prior art date
Application number
SE9702923A
Other languages
Unknown language ( )
English (en)
Other versions
SE521666C2 (sv
SE9702923D0 (sv
Inventor
Takahiro Ishigami
Hitoshi Tanifuji
Yoshihiko Kikkawa
Yoshihiro Iwasaki
Hiroaki Suzuki
Makoto Tanikawa
Masahito Mori
Isao Kawasaki
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE9702923D0 publication Critical patent/SE9702923D0/sv
Publication of SE9702923L publication Critical patent/SE9702923L/sv
Publication of SE521666C2 publication Critical patent/SE521666C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE9702923A 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon SE521666C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06808997A JP3416450B2 (ja) 1997-03-21 1997-03-21 パワートランジスタモジュールの実装構造

Publications (3)

Publication Number Publication Date
SE9702923D0 SE9702923D0 (sv) 1997-08-14
SE9702923L true SE9702923L (sv) 1998-09-22
SE521666C2 SE521666C2 (sv) 2003-11-25

Family

ID=13363672

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702923A SE521666C2 (sv) 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon

Country Status (4)

Country Link
US (1) US5946192A (sv)
JP (1) JP3416450B2 (sv)
CN (1) CN1109362C (sv)
SE (1) SE521666C2 (sv)

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JP3958589B2 (ja) * 2002-01-23 2007-08-15 株式会社オートネットワーク技術研究所 電気接続箱
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FR2871534B1 (fr) * 2004-06-15 2006-08-04 Siemens Vdo Automotive Sas Groupe moto ventilateur a commande electronique refroidie par air ambiant pulse
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US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
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CN100334717C (zh) * 2005-05-14 2007-08-29 河北华整实业有限公司 一种电力电子功率器件模块
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US7532474B2 (en) * 2006-02-21 2009-05-12 3Com Corporation Apparatus for dissipating heat from electronic components in an enclosed housing
JP4692323B2 (ja) * 2006-02-21 2011-06-01 パナソニック株式会社 空気調和機
DE102006018854A1 (de) * 2006-04-22 2007-11-22 Sma Technologie Ag Gehäuse eines Stromrichters
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US7554805B2 (en) * 2007-06-25 2009-06-30 Shuttle Inc. Heat dissipation structure for electronic devices
FR2920491B1 (fr) * 2007-09-03 2013-07-19 Siemens Vdo Automotive Groupe moto-ventilateur avec carte electronique de commande refroidie par air pulse
JP5125355B2 (ja) * 2007-09-27 2013-01-23 ダイキン工業株式会社 空気調和装置
JP5094562B2 (ja) * 2008-05-29 2012-12-12 三菱電機株式会社 屋外用制御基板及び空気調和機の室外機
DE102008041366A1 (de) * 2008-08-20 2010-02-25 Robert Bosch Gmbh Elektronikmodul
US7724526B2 (en) * 2008-10-10 2010-05-25 Delphi Technologies, Inc. Electronic module with heat sink
JP4973702B2 (ja) * 2009-02-02 2012-07-11 ダイキン工業株式会社 電装品モジュール及び冷却部材の結合方法、及び空気調和装置
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
DE102009026886A1 (de) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Formteil zur Aufnahme mehrerer elektrischer Bauteile
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KR100972447B1 (ko) * 2009-10-01 2010-07-26 김지희 무접점 릴레이
JP5236771B2 (ja) * 2011-04-18 2013-07-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
CN102306638A (zh) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 带有半导体三极管的组装散热片
CN103096674B (zh) * 2011-11-02 2015-11-11 纬创资通股份有限公司 固定机构、电子装置及固定电子组件的方法
JP5773904B2 (ja) * 2012-02-07 2015-09-02 三菱電機株式会社 電気品箱および空気調和機
CN103369924B (zh) * 2012-04-17 2016-05-04 苏州方林科技股份有限公司 散热片及应用该散热片的电源模组
CN104682670B (zh) * 2013-11-26 2017-12-12 台达电子企业管理（上海）有限公司 电源转换装置与其电源转换板组件
JP6335515B2 (ja) * 2014-01-15 2018-05-30 三菱電機株式会社 半導体素子の保護構造および空気調和機の室外機
JP6349807B2 (ja) * 2014-03-14 2018-07-04 オムロン株式会社 電子機器
AT515828B1 (de) * 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
KR102257795B1 (ko) * 2014-08-29 2021-05-28 한온시스템 주식회사 전동 압축기
US10128723B2 (en) * 2015-07-07 2018-11-13 Milwaukee Electric Tool Corporation Printed circuit board spacer
EP3214911A1 (en) * 2016-03-04 2017-09-06 Thomson Licensing Apparatus comprising a housing with an improved cooling
JP6537700B2 (ja) * 2016-03-04 2019-07-03 三菱電機株式会社 電装品モジュール及び空気調和機の室外機
JP2017187214A (ja) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 冷却装置、冷凍サイクル装置、及び冷却装置の製造方法
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
EP3416467B1 (en) * 2017-06-13 2022-05-04 ABB Schweiz AG Heat exchanger structure for a rack assembly
CN109579242A (zh) * 2019-01-21 2019-04-05 广东美的暖通设备有限公司 控制器和空调器
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
CN112530876B (zh) * 2020-12-22 2023-05-09 江西龙芯微科技有限公司 一种集成电路sip封装结构

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DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
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JPH06123449A (ja) * 1992-10-12 1994-05-06 Hitachi Ltd 空気調和機の室外ユニット
JPH0886473A (ja) * 1994-09-20 1996-04-02 Fujitsu General Ltd 空気調和機の室外機
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics

Also Published As

Publication number Publication date
JPH10267326A (ja) 1998-10-09
CN1194467A (zh) 1998-09-30
SE521666C2 (sv) 2003-11-25
JP3416450B2 (ja) 2003-06-16
SE9702923D0 (sv) 1997-08-14
CN1109362C (zh) 2003-05-21
US5946192A (en) 1999-08-31

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