SE9702923D0 - Power transistor module packaging structure - Google Patents

Power transistor module packaging structure

Info

Publication number
SE9702923D0
SE9702923D0 SE9702923A SE9702923A SE9702923D0 SE 9702923 D0 SE9702923 D0 SE 9702923D0 SE 9702923 A SE9702923 A SE 9702923A SE 9702923 A SE9702923 A SE 9702923A SE 9702923 D0 SE9702923 D0 SE 9702923D0
Authority
SE
Sweden
Prior art keywords
circuit board
power transistor
packaging structure
heat sink
transistor module
Prior art date
Application number
SE9702923A
Other languages
English (en)
Other versions
SE521666C2 (sv
SE9702923L (sv
Inventor
Takahiro Ishigami
Hitoshi Tanifuji
Yoshihiko Kikkawa
Yoshihiro Iwasaki
Hiroaki Suzuki
Makoto Tanikawa
Masahito Mori
Isao Kawasaki
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE9702923D0 publication Critical patent/SE9702923D0/sv
Publication of SE9702923L publication Critical patent/SE9702923L/sv
Publication of SE521666C2 publication Critical patent/SE521666C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SE9702923A 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon SE521666C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06808997A JP3416450B2 (ja) 1997-03-21 1997-03-21 パワートランジスタモジュールの実装構造

Publications (3)

Publication Number Publication Date
SE9702923D0 true SE9702923D0 (sv) 1997-08-14
SE9702923L SE9702923L (sv) 1998-09-22
SE521666C2 SE521666C2 (sv) 2003-11-25

Family

ID=13363672

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702923A SE521666C2 (sv) 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon

Country Status (4)

Country Link
US (1) US5946192A (sv)
JP (1) JP3416450B2 (sv)
CN (1) CN1109362C (sv)
SE (1) SE521666C2 (sv)

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CN100334717C (zh) * 2005-05-14 2007-08-29 河北华整实业有限公司 一种电力电子功率器件模块
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
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DE102006018854A1 (de) * 2006-04-22 2007-11-22 Sma Technologie Ag Gehäuse eines Stromrichters
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US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US7554805B2 (en) * 2007-06-25 2009-06-30 Shuttle Inc. Heat dissipation structure for electronic devices
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JP5125355B2 (ja) * 2007-09-27 2013-01-23 ダイキン工業株式会社 空気調和装置
JP5094562B2 (ja) * 2008-05-29 2012-12-12 三菱電機株式会社 屋外用制御基板及び空気調和機の室外機
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JP4973702B2 (ja) * 2009-02-02 2012-07-11 ダイキン工業株式会社 電装品モジュール及び冷却部材の結合方法、及び空気調和装置
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CN103096674B (zh) * 2011-11-02 2015-11-11 纬创资通股份有限公司 固定机构、电子装置及固定电子组件的方法
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CN103369924B (zh) * 2012-04-17 2016-05-04 苏州方林科技股份有限公司 散热片及应用该散热片的电源模组
CN104682670B (zh) * 2013-11-26 2017-12-12 台达电子企业管理（上海）有限公司 电源转换装置与其电源转换板组件
JP6335515B2 (ja) * 2014-01-15 2018-05-30 三菱電機株式会社 半導体素子の保護構造および空気調和機の室外機
JP6349807B2 (ja) * 2014-03-14 2018-07-04 オムロン株式会社 電子機器
AT515828B1 (de) * 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
KR102257795B1 (ko) * 2014-08-29 2021-05-28 한온시스템 주식회사 전동 압축기
US10128723B2 (en) 2015-07-07 2018-11-13 Milwaukee Electric Tool Corporation Printed circuit board spacer
CN108702849B (zh) * 2016-03-04 2020-09-29 三菱电机株式会社 电气部件模块及空调机的室外机
EP3214911A1 (en) * 2016-03-04 2017-09-06 Thomson Licensing Apparatus comprising a housing with an improved cooling
JP2017187214A (ja) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 冷却装置、冷凍サイクル装置、及び冷却装置の製造方法
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
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CN109579242A (zh) * 2019-01-21 2019-04-05 广东美的暖通设备有限公司 控制器和空调器
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
CN112530876B (zh) * 2020-12-22 2023-05-09 江西龙芯微科技有限公司 一种集成电路sip封装结构

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Also Published As

Publication number Publication date
SE521666C2 (sv) 2003-11-25
CN1194467A (zh) 1998-09-30
CN1109362C (zh) 2003-05-21
JP3416450B2 (ja) 2003-06-16
JPH10267326A (ja) 1998-10-09
US5946192A (en) 1999-08-31
SE9702923L (sv) 1998-09-22

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