FR2809231B1 - Module de dispositif a semi-conducteur - Google Patents

Module de dispositif a semi-conducteur

Info

Publication number
FR2809231B1
FR2809231B1 FR0105872A FR0105872A FR2809231B1 FR 2809231 B1 FR2809231 B1 FR 2809231B1 FR 0105872 A FR0105872 A FR 0105872A FR 0105872 A FR0105872 A FR 0105872A FR 2809231 B1 FR2809231 B1 FR 2809231B1
Authority
FR
France
Prior art keywords
circuit board
ims
cavity
supports
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0105872A
Other languages
English (en)
Other versions
FR2809231A1 (fr
Inventor
Ajit Dubhashi
Stephen Nicholas Siu
Heny W Lin
Bertrand P Vaysse
Michael A Corfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of FR2809231A1 publication Critical patent/FR2809231A1/fr
Application granted granted Critical
Publication of FR2809231B1 publication Critical patent/FR2809231B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
FR0105872A 1999-11-17 2001-05-02 Module de dispositif a semi-conducteur Expired - Fee Related FR2809231B1 (fr)

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Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577015B1 (en) * 2000-03-07 2003-06-10 Micron Technology, Inc. Partial slot cover for encapsulation process
TW575949B (en) * 2001-02-06 2004-02-11 Hitachi Ltd Mixed integrated circuit device, its manufacturing method and electronic apparatus
DE10151153A1 (de) * 2001-10-19 2003-04-30 Bombardier Transp Gmbh Vorrichtung zum Laden von Batterien für Elektrofahrtzeuge
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
US6538313B1 (en) * 2001-11-13 2003-03-25 National Semiconductor Corporation IC package with integral substrate capacitor
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7187548B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US7061775B2 (en) * 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US6982873B2 (en) * 2002-01-16 2006-01-03 Rockwell Automation Technologies, Inc. Compact vehicle drive module having improved thermal control
US7032695B2 (en) * 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
US7177153B2 (en) * 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US7142434B2 (en) * 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
JP2003234442A (ja) * 2002-02-06 2003-08-22 Hitachi Ltd 半導体装置及びその製造方法
JP2003258141A (ja) * 2002-02-27 2003-09-12 Nec Compound Semiconductor Devices Ltd 電子部品及びその製造方法
US7136269B2 (en) * 2002-04-24 2006-11-14 Sanyo Electric Co., Ltd. Inverted circuit overcurrent protection device and hybrid integrated circuit device with the same incorporated
JP2004047157A (ja) * 2002-07-09 2004-02-12 Izumi Products Co 電源供給器
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US6781360B1 (en) * 2003-02-10 2004-08-24 Siemens Vdo Automotive Inc. Jump bar shunt structure for power components
US6975513B2 (en) * 2003-05-14 2005-12-13 Cyntec Co., Ltd. Construction for high density power module package
US7116557B1 (en) * 2003-05-23 2006-10-03 Sti Electronics, Inc. Imbedded component integrated circuit assembly and method of making same
US8742944B2 (en) * 2004-06-21 2014-06-03 Siemens Energy, Inc. Apparatus and method of monitoring operating parameters of a gas turbine
US7296916B2 (en) * 2004-12-21 2007-11-20 3M Innovative Properties Company Illumination assembly and method of making same
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US20060131601A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
US7166917B2 (en) * 2005-01-05 2007-01-23 Advanced Semiconductor Engineering Inc. Semiconductor package having passive component disposed between semiconductor device and substrate
US7633177B2 (en) * 2005-04-14 2009-12-15 Natural Forces, Llc Reduced friction wind turbine apparatus and method
TWI253154B (en) * 2005-05-06 2006-04-11 Neobulb Technologies Inc Integrated circuit packaging and method of making the same
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
US7505275B2 (en) * 2005-11-04 2009-03-17 Graftech International Holdings Inc. LED with integral via
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7488097B2 (en) * 2006-02-21 2009-02-10 Cml Innovative Technologies, Inc. LED lamp module
US9601412B2 (en) * 2007-06-08 2017-03-21 Cyntec Co., Ltd. Three-dimensional package structure
DE102007032594B4 (de) * 2007-07-12 2009-04-09 Continental Automotive Gmbh Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung
CN101415297B (zh) * 2007-10-19 2010-07-07 华为技术有限公司 一种印制板组件及其加工方法
US7800222B2 (en) * 2007-11-29 2010-09-21 Infineon Technologies Ag Semiconductor module with switching components and driver electronics
DE202008000440U1 (de) * 2008-01-11 2008-04-03 Sma Technologie Ag Wechselrichter
CN101603636B (zh) * 2008-06-10 2012-05-23 展晶科技(深圳)有限公司 光源装置
US10321585B2 (en) 2008-07-29 2019-06-11 Hitachi, Ltd. Power conversion apparatus and electric vehicle
JP4657329B2 (ja) 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
US8076587B2 (en) * 2008-09-26 2011-12-13 Siemens Energy, Inc. Printed circuit board for harsh environments
JP5479703B2 (ja) * 2008-10-07 2014-04-23 株式会社東芝 半導体装置及びその製造方法
TWI408310B (zh) * 2009-09-29 2013-09-11 Liang Meng Plastic Share Co Ltd 照明裝置及其製造方法
DE102011121823A1 (de) * 2011-12-21 2013-07-11 Wabco Gmbh Elektronikeinheit mit einem zweiteiligen Gehäuse
US10123408B2 (en) * 2012-03-14 2018-11-06 Nvidia Corporation Circuit board, current-measuring device, and method of measuring a current of a circuit board
EP2835823B1 (fr) * 2012-04-02 2019-09-11 Fuji Electric Co., Ltd. Convertisseur de puissance
DE102013212446A1 (de) * 2013-06-27 2015-01-15 Zf Friedrichshafen Ag Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung zur Ansteuerung einer Last
US9373556B2 (en) * 2013-11-14 2016-06-21 Azurewave Technologies, Inc. Module IC package structure and method for manufacturing the same
US9536800B2 (en) 2013-12-07 2017-01-03 Fairchild Semiconductor Corporation Packaged semiconductor devices and methods of manufacturing
US9853524B2 (en) 2014-07-29 2017-12-26 Regal Beloit America, Inc. Motor and controller with isolation members between electrical components and associated method
CN104218018B (zh) * 2014-08-26 2017-08-29 深圳三星通信技术研究有限公司 一种射频功放模块及其组装方法、射频模块、基站
FR3043880B1 (fr) * 2015-11-13 2017-12-29 Valeo Systemes De Controle Moteur Boitier pour un equipement electrique
KR101821878B1 (ko) * 2016-02-24 2018-01-24 엘에스산전 주식회사 인버터
DE202016006849U1 (de) 2016-11-07 2018-02-08 Liebherr-Elektronik Gmbh Leistungselektronikmodul
DE102017214267A1 (de) * 2017-08-16 2019-02-21 Mahle International Gmbh Kühlvorrichtung und Verfahren zum Herstellen der Kühlvorrichtung
DE202017107643U1 (de) * 2017-12-15 2018-01-11 Sma Solar Technology Ag Wechselrichter
KR102554431B1 (ko) 2018-09-05 2023-07-13 삼성전자주식회사 반도체 장치 및 반도체 장치 제조 방법
DE102019204639A1 (de) * 2019-04-02 2020-10-08 Zf Friedrichshafen Ag Luftspaltbildung in einer elektrischen Kontaktierung einer Leiterplatte
EP3961697A1 (fr) * 2020-08-25 2022-03-02 Siemens Aktiengesellschaft Module semi-conducteur doté d'une cavité
DE102020216390A1 (de) 2020-12-21 2022-06-23 Vitesco Technologies Germany Gmbh Steuermodul für ein Fahrzeug mit mindestens einem Elektromotor
DE102020216395A1 (de) 2020-12-21 2022-06-23 Vitesco Technologies Germany Gmbh Fahrzeugsteuermodul mit Kunststoffumhüllung
US20220396154A1 (en) * 2021-06-14 2022-12-15 Panasonic Intellectual Property Management Co., Ltd. Vehicle mounted electric power converter

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3538933A1 (de) * 1985-11-02 1987-05-14 Bbc Brown Boveri & Cie Leistungshalbleitermodul
EP0420604A1 (fr) * 1989-09-27 1991-04-03 Motorola, Inc. Dispositif de collage conductif sélectif pour une liaison simultanée électrique et mécanique
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
EP0516149B1 (fr) * 1991-05-31 1998-09-23 Denso Corporation Dispositif électronique
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
US5583377A (en) * 1992-07-15 1996-12-10 Motorola, Inc. Pad array semiconductor device having a heat sink with die receiving cavity
DE69327666D1 (de) * 1992-07-17 2000-02-24 Vlt Corp Verpackung für elektronische Komponenten
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
JP3198796B2 (ja) * 1993-06-25 2001-08-13 富士電機株式会社 モールドモジュール
US5408128A (en) 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
JPH07263621A (ja) * 1994-03-18 1995-10-13 Toshiba Corp 半導体装置
JP3466329B2 (ja) * 1995-06-16 2003-11-10 三菱電機株式会社 半導体パワーモジュール
US5670749A (en) * 1995-09-29 1997-09-23 Allen-Bradley Company, Inc. Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
JP3322575B2 (ja) * 1996-07-31 2002-09-09 太陽誘電株式会社 ハイブリッドモジュールとその製造方法
US6081426A (en) * 1996-09-18 2000-06-27 Shinko Electric Industries Co., Ltd. Semiconductor package having a heat slug
DE19645636C1 (de) * 1996-11-06 1998-03-12 Telefunken Microelectron Leistungsmodul zur Ansteuerung von Elektromotoren
FR2758935B1 (fr) * 1997-01-28 2001-02-16 Matra Marconi Space France Boitier micro-electronique multi-niveaux
US5812387A (en) * 1997-02-21 1998-09-22 International Power Devices, Inc. Multi-deck power converter module
SE518572C2 (sv) * 1997-08-25 2002-10-22 Ericsson Telefon Ab L M Bärarelement för ett chips samt chipsmodul
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module

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DE10056832A1 (de) 2001-05-31
US6362964B1 (en) 2002-03-26
JP2007227957A (ja) 2007-09-06
FR2809231A1 (fr) 2001-11-23
JP2001210784A (ja) 2001-08-03
FR2801725A1 (fr) 2001-06-01
DE10056832B4 (de) 2009-11-26
FR2801725B1 (fr) 2007-06-29

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