KR900017449A - 전자 어셈블리 및 전자 어셈블리를 형성하는 공정 - Google Patents
전자 어셈블리 및 전자 어셈블리를 형성하는 공정 Download PDFInfo
- Publication number
- KR900017449A KR900017449A KR1019900004542A KR900004542A KR900017449A KR 900017449 A KR900017449 A KR 900017449A KR 1019900004542 A KR1019900004542 A KR 1019900004542A KR 900004542 A KR900004542 A KR 900004542A KR 900017449 A KR900017449 A KR 900017449A
- Authority
- KR
- South Korea
- Prior art keywords
- region
- metal
- layer
- circuit board
- printed circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 금속층이 제1도의 회로의 이행을 허용하기 위해 에칭되어진 PCB의 단순화된 평면도,
제6도는 금속층 이 제1도의 회로의 이행을 허용하기 위해 에칭되어졌으나 본 발명에 따라 PCB가 열 분로 성분을 수용하도록 개작 되어진 제2도와 유사한 PCB의 단순화된 평면도,
제8도는 제1도의 회로를 이행하는 어셈블리를 형성하기 위해 부착된 전자 성분을 가지며 본 발명에 따른 하나 이상의 열 분로 성분을 포함한 제6도와 동일한 PCB의 단순화된 평면도.
Claims (3)
- 제1및 제2대향면상의 제1및 제2금속층을 각기 가진 절연 기판과, 상기 제1층의 제1부분에 부착된 제1영역과 상기 제1층의 제2부분에 결합된 제2영역을 가진 전원 소실 성분 및, 상기 제2층과 열 접촉하여 상기 제1층의 제1부분으로 부터 상기 제1츠의 제3부분으로 확장하는 전기적으로 절연하고 열적으로 도전하는 열 분로 성분을 포함해서 이루어진 전자 어셈블리.
- 제1면상의 제1및 제2금속 영역과 대향된 제2면상의 제2여역과 겹치는 제3금속 영역을 가진 인쇄 회로판과, 상기 제1영역에 열적으로 연결된 전원 소실 성분 및, 상기 제1영역으로부터 상기 제2영역으로 연결된 전기적으로 절연하고 열적으로 도전하는 성분을 포함해서 이루어진 전자 어셈블리.
- 전원 소실 성분으로부터 열 연결부를 수신하는 제1금속 영역과, 인쇄 회로판의 동일면상에 있고 상기 제1금속층으로부터 이격된 제2금속 영역 및 인쇄 회로판의 대향면상에 있고 상기 제2금속 영역에 열적으로 결합된 제3금속 영역을 가진 인쇄 회로판을 제공하는 단계와, 또한 차례로 상기 제1금속 영역와 열 접촉하는 전원 소실 성분을 매치시키는 단계 및, 상기 제1및 제2금속 영역과 열적으로 결합되고 상기 제1및 제2금속 영역간에 열적으로 전도하고 전기적윽로 절연하는 성분을 배치시키는 단계를 포함하는 전자 어셈블리를 형성하는 공정.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/334,409 US4941067A (en) | 1989-04-07 | 1989-04-07 | Thermal shunt for electronic circuits |
US334,409 | 1989-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900017449A true KR900017449A (ko) | 1990-11-16 |
Family
ID=23307070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900004542A KR900017449A (ko) | 1989-04-07 | 1990-04-03 | 전자 어셈블리 및 전자 어셈블리를 형성하는 공정 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4941067A (ko) |
EP (1) | EP0391057A3 (ko) |
JP (1) | JPH033290A (ko) |
KR (1) | KR900017449A (ko) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2505065B2 (ja) * | 1990-10-04 | 1996-06-05 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
EP0558712B2 (de) * | 1991-09-21 | 2010-04-07 | Robert Bosch Gmbh | Elektrisches gerät, insbesondere schalt- und steuergerät für kraftfahrzeuge |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5289337A (en) * | 1992-02-21 | 1994-02-22 | Intel Corporation | Heatspreader for cavity down multi-chip module with flip chip |
WO1993026146A1 (de) * | 1992-06-15 | 1993-12-23 | Dyconex Patente Ag | Thermo-layout mit thermokonduktoren |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
DE4231828C2 (de) * | 1992-09-23 | 1996-05-30 | Rohde & Schwarz | Transistor-Leistungsverstärker-Anordnung |
DE4232575A1 (de) * | 1992-09-29 | 1994-03-31 | Bosch Gmbh Robert | Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper |
DE4302917C1 (de) * | 1993-02-03 | 1994-07-07 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen |
JPH06252285A (ja) * | 1993-02-24 | 1994-09-09 | Fuji Xerox Co Ltd | 回路基板 |
US5397917A (en) * | 1993-04-26 | 1995-03-14 | Motorola, Inc. | Semiconductor package capable of spreading heat |
FR2706730B1 (fr) * | 1993-06-18 | 1995-08-25 | Sagem | Module électronique de puissance ayant un support d'évacuation de la chaleur. |
DE4332115B4 (de) * | 1993-09-22 | 2004-06-03 | Philips Intellectual Property & Standards Gmbh | Anordnung zur Kühlung mindestens einen Kühlkörper aufweisenden Leiterplatte |
EP0646971B1 (de) * | 1993-09-30 | 1997-03-12 | Siemens Aktiengesellschaft | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
US5514327A (en) * | 1993-12-14 | 1996-05-07 | Lsi Logic Corporation | Powder metal heat sink for integrated circuit devices |
US5693981A (en) * | 1993-12-14 | 1997-12-02 | Lsi Logic Corporation | Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system |
US5646373A (en) * | 1994-09-02 | 1997-07-08 | Caterpillar Inc. | Apparatus for improving the power dissipation of a semiconductor device |
US5616958A (en) * | 1995-01-25 | 1997-04-01 | International Business Machines Corporation | Electronic package |
KR970011127A (ko) * | 1995-08-28 | 1997-03-27 | 김광호 | 세탁기의 밸런스 |
JP3476612B2 (ja) * | 1995-12-21 | 2003-12-10 | 三菱電機株式会社 | 半導体装置 |
SE506348C2 (sv) * | 1996-04-01 | 1997-12-08 | Tetra Laval Holdings & Finance | Förpackningsmaterialbana för en självbärande förpackningsbehållarvägg jämte av banan tillverkad förpackningsbehållare |
US5945746A (en) * | 1997-08-21 | 1999-08-31 | Tracewell Power, Inc. | Power supply and power supply/backplane assembly and system |
US6705388B1 (en) | 1997-11-10 | 2004-03-16 | Parker-Hannifin Corporation | Non-electrically conductive thermal dissipator for electronic components |
US6073684A (en) * | 1998-02-23 | 2000-06-13 | Applied Thermal Technology | Clad casting for laptop computers and the like |
US5939783A (en) * | 1998-05-05 | 1999-08-17 | International Business Machines Corporation | Electronic package |
US6284574B1 (en) | 1999-01-04 | 2001-09-04 | International Business Machines Corporation | Method of producing heat dissipating structure for semiconductor devices |
CN1336094A (zh) * | 1999-11-02 | 2002-02-13 | 皇家菲利浦电子有限公司 | 印刷电路板 |
JP2002133144A (ja) | 2000-10-25 | 2002-05-10 | Nec Corp | 大容量データ販売/仲介/購入方法、システム、サーバ、端末、およびこのプログラムを記録した記録媒体 |
JP2002170739A (ja) * | 2000-11-29 | 2002-06-14 | Murata Mfg Co Ltd | 積層セラミックコンデンサモジュール |
US6377462B1 (en) | 2001-01-09 | 2002-04-23 | Deere & Company | Circuit board assembly with heat sinking |
JP3816380B2 (ja) * | 2001-12-14 | 2006-08-30 | 富士通株式会社 | 吸熱用ダミー部品を備えた基板ユニット及びその製造方法 |
JP3804861B2 (ja) * | 2002-08-29 | 2006-08-02 | 株式会社デンソー | 電気装置および配線基板 |
US6781360B1 (en) * | 2003-02-10 | 2004-08-24 | Siemens Vdo Automotive Inc. | Jump bar shunt structure for power components |
JP4999050B2 (ja) * | 2006-06-01 | 2012-08-15 | 古河電気工業株式会社 | 車両用電源切替装置及びその設計方法 |
US7561430B2 (en) * | 2007-04-30 | 2009-07-14 | Watlow Electric Manufacturing Company | Heat management system for a power switching device |
JP2011165903A (ja) * | 2010-02-10 | 2011-08-25 | Rohm Co Ltd | 半導体モジュールおよび半導体モジュールの製造方法 |
US10392959B2 (en) * | 2012-06-05 | 2019-08-27 | General Electric Company | High temperature flame sensor |
US9111915B1 (en) | 2014-02-24 | 2015-08-18 | Honeywell International Inc. | Thermal conduction cooling |
JP6737634B2 (ja) * | 2016-05-12 | 2020-08-12 | イリソ電子工業株式会社 | 放熱チップ及び放熱構造 |
EP3310140B1 (en) | 2016-10-14 | 2021-07-14 | Vitesco Technologies GmbH | Mounting assembly with a heatsink |
US20180341281A1 (en) * | 2017-05-23 | 2018-11-29 | Texas Instruments Incorporated | Temperature control of components on a substrate |
FR3080501B1 (fr) * | 2018-04-23 | 2021-10-08 | Valeo Systemes Thermiques | Groupe moto-ventilateur pour vehicule automobile comprenant une carte electronique de commande d’un moteur electrique |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US3061760A (en) * | 1959-12-10 | 1962-10-30 | Philco Corp | Electrical apparatus |
US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
DE3305167C2 (de) * | 1983-02-15 | 1994-05-05 | Bosch Gmbh Robert | Elektrische Schaltungsanordnung mit einer Leiterplatte |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
-
1989
- 1989-04-07 US US07/334,409 patent/US4941067A/en not_active Expired - Fee Related
-
1990
- 1990-02-22 EP EP19900103424 patent/EP0391057A3/en not_active Withdrawn
- 1990-04-03 KR KR1019900004542A patent/KR900017449A/ko not_active Application Discontinuation
- 1990-04-04 JP JP2090078A patent/JPH033290A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4941067A (en) | 1990-07-10 |
JPH033290A (ja) | 1991-01-09 |
EP0391057A2 (en) | 1990-10-10 |
EP0391057A3 (en) | 1992-04-15 |
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Legal Events
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |