KR950028581A - 전도 부재에 전기적으로 결합되는 이중 기층 패키지 어셈블리 - Google Patents

전도 부재에 전기적으로 결합되는 이중 기층 패키지 어셈블리 Download PDF

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KR950028581A
KR950028581A KR1019950004440A KR19950004440A KR950028581A KR 950028581 A KR950028581 A KR 950028581A KR 1019950004440 A KR1019950004440 A KR 1019950004440A KR 19950004440 A KR19950004440 A KR 19950004440A KR 950028581 A KR950028581 A KR 950028581A
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package assembly
electronic package
base layer
electrical pattern
density
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KR1019950004440A
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KR0156066B1 (ko
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윌리엄 드란책 데이비드
죠셉 켈레허 로버트
피터 패그너니 데이비드
로버트 집페텔리 패트릭
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윌리엄 티. 엘리스
인터내셔널 비지네스 머신즈 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

본 발명은 한 쌍의 기층을 포함하고 전도 부재(예를 들어, 인쇄 회로 기판)에 전기적으로 결합되는 전자 패키지 어셈블리에 관한 것이다. 제1기층은 대향한 회로 패턴을 포함하고, 한 표면상의 패턴이 보다 높은 밀도로 되어 있으므로 고 밀도 전자 장치가 장착되도록 구성되어 있다. 이 고밀도 패턴은 제2기층의 접점에 접속되는 보다 작은 밀도의 제2패턴에 전기적으로 결합된다. 또, 이들 접점은 보다 작은 밀도로 되어 있고, 전도 부재 상의 도체(예를 들어, 구리 회로 패드)에 결합되는 유전성 부재를 통해 연장된다. 따라서, 어셈블리의 다양한 부분들의 용이한 접속이 보장된다.

Description

전도 부재에 전기적으로 결합되는 이중 기층 패키지 어셈블리
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 따른 패키지 어셈블리의 사시도.

Claims (21)

  1. 다수의 제1도체를 갖는 전도 부재에 전기적으로 결합되는 전재 패키지 어셈블리에 있어서, 제1밀도의 전기적 패턴을 갖는 제1표면과 제1밀도보다 작은 제2밀도의 전기적 패턴을 갖는 제2표면을 구비하고 상기 제1 및 제2표면 상의 전기적 패턴이 전기적으로 상호 접속되는 제1기층과, 상기 제1표면 상의 전기적 패턴에 전기적으로 결합되는 적어도 하나의 전자 부품과, 다수의 제2도체를 갖고 상기 전도 부재 상에 위치 결정되도록 구성된 유전성 부재를 구비하는 제2기층을 포함하고, 상기 제2기층의 제2도체 중 선택된 도체는 상기 제1기층의 제2표면 상의 상기 전기적 패턴에 결합되고 제2밀도와 유사한 밀도로 되어 있으며, 상기 제2도체는 상기 제2기층이 그 위에 위치 결정될 때 상기 전도 부재의 제1도체의 각각의 도체에 전기적으로 결합되도록 구성된 것을 특징으로 하는 전자 패키지 어셈블리.
  2. 제1항에 있어서, 상기 제1밀도의 전기적 패턴을 갖는 상기 제1표면과 상기 제2밀도의 전기적 패턴을 갖는 상기 제2표면을 구비한 상기 제1기층은 대체로 제1표면과 제2표면 사이에 위치 결정된 적어도 하나의 유전체 재료의 층을 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  3. 제2항에 있어서, 상기 유전체 재료는 유리섬유 강화 에폭시 수지를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  4. 제2항에 있어서, 상기 제1기층의 제1표면 상의 상기 전기적 패턴은 금속재로 이루어진 것을 특징으로 하는 전자 패키지 어셈블리.
  5. 제4항에 있어서, 상기 금속재는 구리를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  6. 제4항에 있어서, 상기 제1표면 상의 전기적 패턴은 적어도 하나의 전도성 패드를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  7. 제2항에 있어서, 상기 제2표면 상의 전기적 패턴은 금속재로 이루어진 것을 특징으로 하는 전자 패키지 어셈블리.
  8. 제7항에 있어서, 상기 금속재는 구리를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  9. 제7항에 있어서, 상기 전기적 패턴은 적어도 하나의 전도성 패드를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  10. 제1항에 있어서, 상기 전자 부품은 납땜에 의해 상기 제1기층의 상기 제1표면 상의 상기 전기적 패턴에 전기적으로 결합되는 것을 특징으로 하는 전자 패키지 어셈블리.
  11. 제1항에 있어서, 상기 제2기층의 유전성 부재는 제1기층의 상기 유전체 재료의 층의 열 팽창 계수와 거의 유사한 열 팽창 계수를 갖는 유전체 재료로 이루어지는 절연재를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  12. 제11항에 있어서, 상기 유전체 재료는 유리 섬유 강화 에폭시 수지를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  13. 제1항에 있어서, 상기 제2기층 내의 제2도체는 금속재를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  14. 제13항에 있어서, 상기 제2도체의 금속재는 청동을 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  15. 제1항에 있어서, 상기 제2기층 내의 상기 도체는 납땜에 의해 상기 제1기층의 제2표면 상의 전기적 패턴에 결합되는 것을 특징으로 하는 전자 패키지 어셈블리.
  16. 제1항에 있어서, 전압 조절 수단도 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  17. 제16항에 있어서, 상기 전압 조절 수단은 절환 전압 조절기 회로를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  18. 제11항에 있어서, 상기 유전체 재료는 플라스틱을 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  19. 제1항에 있어서, 상기 제2기층 내의 제2도체는 금속재를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  20. 제19항에 있어서, 상기 제2도체의 금속재는 베릴륨-구리를 포함하는 것을 특징으로 하는 전자 패키지 어셈블리.
  21. 제1항에 있어서, 상기 제2기층 내의 상기 도체는 클램핑에 의해 상기 제1기층의 제2표면 상의 전기적 패턴에 결합되는 것을 특징으로 하는 전자 패키지 어셈블리.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950004440A 1994-03-07 1995-03-04 전도 부재에 전기적으로 결합되는 이중 기층 패키지 어셈블리 KR0156066B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20680794A 1994-03-07 1994-03-07
US8/206,807 1994-03-07
US08/206,807 1994-03-07

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KR950028581A true KR950028581A (ko) 1995-10-18
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MY113889A (en) 2002-06-29
CN1050705C (zh) 2000-03-22
GB2287364A (en) 1995-09-13
CN1119402A (zh) 1996-03-27
TW381328B (en) 2000-02-01
GB9502159D0 (en) 1995-03-22
KR0156066B1 (ko) 1998-12-15
US5953214A (en) 1999-09-14
US6046911A (en) 2000-04-04

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