KR960705363A - 집적회로장치(integrated circuit device) - Google Patents

집적회로장치(integrated circuit device)

Info

Publication number
KR960705363A
KR960705363A KR1019960701094A KR19960701094A KR960705363A KR 960705363 A KR960705363 A KR 960705363A KR 1019960701094 A KR1019960701094 A KR 1019960701094A KR 19960701094 A KR19960701094 A KR 19960701094A KR 960705363 A KR960705363 A KR 960705363A
Authority
KR
South Korea
Prior art keywords
integrated circuit
metal substrate
circuit device
wiring board
electrically connected
Prior art date
Application number
KR1019960701094A
Other languages
English (en)
Other versions
KR100208053B1 (ko
Inventor
다케오 야스호
마사오 이와타
료이찌 가쓰라가와
히야미 마쓰나가
요시가즈 스에히로
야스히꼬 요꼬다
Original Assignee
모리시타 요이치
마쓰시타 덴키 산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리시타 요이치, 마쓰시타 덴키 산교 가부시기가이샤 filed Critical 모리시타 요이치
Publication of KR960705363A publication Critical patent/KR960705363A/ko
Application granted granted Critical
Publication of KR100208053B1 publication Critical patent/KR100208053B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

본 발명은 전기기기, 전자기기, 통신기기 및 계측제어기기 등의 민생기기에 사용되는 집적회로장치에 관한 것으로 방열성에 뛰어난 집적회로장치를 제공함을 목적으로 한 것이다.
그리고, 이 목적을 달성하기 위하여, 금속기판 CD 위에 전원(4)과 여러개의 핀단자(5)등을 구비하였고, 다층회로 배선기판(7) 상에 캐시제어기(10) 캐시기억부(11), 데이터 버퍼 LSI 부(14), CPU 칩(8) 및 커넥터(12)로 된 탑재부품을 구비하여 전원(4)을 설치한 금속기판(1)상에 핀단자집단(5)을 개재하여 탑재부품을 설치한 다층회로 배선기판(7)의 뒷면에 장착함에 따라 집적도가 높아짐과 동시에 발열부품의 방열성이 뛰어나 집적 회로장치를 제공할 수 있다.

Description

집적회로장치(INTEGRATED CIRCUIT DEVICE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 있어서의 집적회로장치의 단면도.

Claims (10)

  1. 전원을 구비한 금속기판과, 이 금속기판위에 전원과 전기적으로 접속하는 여러개의 핀단자를 끼워넣어서 된 다층회로 배선기판과, 금속기판과 다층회로 배선기판과의 사이에 다층회로 배선기판과 전기적으로 접속되는 CPU 칩과, 다층회로 배선기판상에 설치한 CPU 칩과 상대하는 면에 다층회로 배선기판과 전기적으로 접속하는 제어부와, 다층회로 배선기판과 전기적으로 접속하는 커넥터 등으로된 것을 특징으로 하는 집적회로장치.
  2. 상면의 옆부분에 전원부를 구비하여서 된 금속기판과 이 금속기판의 중앙부분에 설치함과 동시에 측단부에 여러개의 기둥부분을 구비한 보호판과, 이 보호판의 기둥부분에 포위된 면에 설치하여서 된 CPU 칩과 금속 기판과 여러개의 핀을 개재하여 전기적으로 접속하도록 다층회로 배선기판을 설치하여서 된 것을 특징으로 하는 집적회로장치.
  3. 제1항에 있어서, 금속기판은, 금속판에 절연층을 설치하여 이 금속판의 절연층상에 도전층을 설치하여서 된 것을 특징으로 하는 집적회로장치.
  4. 제1항 ~제2항에 있어서, CPU 칩은, 이 CPU에서 도출된 TAB 배선을 구비하여 다층회로 배선기판에 전기적으로 접속되는 것을 특징으로 하는 집적회로장치.
  5. 제1항~제2항에 있어서, 금속기판의 상면 또는 금속기판상의 절연층을 개재하여 설치한 도전층의 상면등을 접착제로 CPU 칩을 굳게 부착하여서된 것을 특징으로 하는 집적회로 장치.
  6. 제1항~제2항에 있어서, 여러개의 핀은, 금속기판상에 고온납땜으로 굳게 부착하여서 된 것을 특징으로 하는 집적회로장치.
  7. 제1항~제2항에 있어서, CPU 칩을 재치한 금속기판의 이면에 절연층을 도파한 것을 특징으로 하는 집적회로장치.
  8. 제1항에 있어서, 제어부는 적어도 캐시제어기와 캐시기억장치부 및 데이터버퍼 LSI 등으로 된 것을 특징으로 하는 집적회로장치.
  9. 제2항에 있어서, 보호판과 기둥부분등을 일체화하여서 되거나 또는 보호판에 기둥부분을 조합하여서된 것을 특징으로 하는 집적회로장치.
  10. 제1항~제2항에 있어서, 여러개의 핀은 대략 +자형임을 특징으로 하는 집적회로장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960701094A 1994-07-04 1995-07-03 집적회로장치 KR100208053B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP94-152177 1994-07-04
JP15217794 1994-07-04
PCT/JP1995/001326 WO1996001498A1 (en) 1994-07-04 1995-07-03 Integrated circuit device

Publications (2)

Publication Number Publication Date
KR960705363A true KR960705363A (ko) 1996-10-09
KR100208053B1 KR100208053B1 (ko) 1999-07-15

Family

ID=15534738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960701094A KR100208053B1 (ko) 1994-07-04 1995-07-03 집적회로장치

Country Status (6)

Country Link
US (1) US6303989B1 (ko)
EP (1) EP0717443B1 (ko)
KR (1) KR100208053B1 (ko)
CN (1) CN1037134C (ko)
DE (1) DE69508046T2 (ko)
WO (1) WO1996001498A1 (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864478A (en) * 1996-06-28 1999-01-26 Intel Corporation Power pod/power delivery system
DE59713027D1 (de) 1996-09-30 2010-03-25 Infineon Technologies Ag Mikroelektronisches bauteil in sandwich-bauweise
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6556455B2 (en) 1999-07-15 2003-04-29 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US7085146B2 (en) 1999-12-20 2006-08-01 Synqor, Inc. Flanged terminal pins for DC/DC converters
US6545890B2 (en) 1999-12-20 2003-04-08 Synqor, Inc. Flanged terminal pins for dc/dc converters
US6896526B2 (en) 1999-12-20 2005-05-24 Synqor, Inc. Flanged terminal pins for DC/DC converters
AU2001266551A1 (en) * 2000-02-18 2001-09-12 Incep Technologies, Inc. Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
US6884086B1 (en) 2000-09-28 2005-04-26 Intel Corporation System and method for connecting a power converter to a land grid array socket
US6360431B1 (en) * 2000-09-29 2002-03-26 Intel Corporation Processor power delivery system
DE10107839A1 (de) * 2001-02-16 2002-09-05 Philips Corp Intellectual Pty Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung
AU2003217883A1 (en) * 2002-02-25 2003-09-09 Molex Incorporated Power delivery to base of processor
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
JP4209130B2 (ja) * 2002-04-09 2009-01-14 株式会社ザナヴィ・インフォマティクス 多層モジュール基板
AT500260A1 (de) * 2003-05-08 2005-11-15 Siemens Ag Oesterreich Anordnung von leiterplatten
JP3896112B2 (ja) 2003-12-25 2007-03-22 エルピーダメモリ株式会社 半導体集積回路装置
CN1316608C (zh) * 2004-02-13 2007-05-16 上海三思科技发展有限公司 一种改善led温升的散热针结构
KR101053587B1 (ko) * 2004-06-04 2011-08-03 엘지전자 주식회사 세탁기의 원격제어용 기판 어셈블리
US20060291180A1 (en) * 2005-06-23 2006-12-28 Inventec Corporation PCI mezzanine card
DE102006022107A1 (de) * 2006-05-11 2007-11-15 Siemens Ag Österreich Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger
JP5106460B2 (ja) * 2009-03-26 2012-12-26 新光電気工業株式会社 半導体装置及びその製造方法、並びに電子装置
JP5533787B2 (ja) * 2011-06-09 2014-06-25 株式会社豊田自動織機 放熱装置
US20140211421A1 (en) * 2013-01-29 2014-07-31 Tyco Electronics Corporation Circuit Board Assembly
US9142477B2 (en) * 2013-03-08 2015-09-22 Kabushiki Kaisha Toshiba Semiconductor module
US10031864B2 (en) * 2013-03-15 2018-07-24 Seagate Technology Llc Integrated circuit
US10331161B2 (en) * 2014-12-24 2019-06-25 Fujitsu Limited Power supply board
CN208538435U (zh) * 2018-08-01 2019-02-22 京东方科技集团股份有限公司 一种显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4120041A (en) * 1975-12-05 1978-10-10 Sharp Kabushiki Kaisha Semiconductor device for use in an electronic apparatus having a plurality of circuit boards
JPH0487361A (ja) * 1990-07-31 1992-03-19 Sanyo Electric Co Ltd 混成集積回路装置
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
JPH05102390A (ja) * 1991-10-08 1993-04-23 Nec Corp ハイブリツドｉｃ
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JP2936855B2 (ja) * 1991-12-26 1999-08-23 富士電機株式会社 電力用半導体装置
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5266912A (en) * 1992-08-19 1993-11-30 Micron Technology, Inc. Inherently impedance matched multiple integrated circuit module
JPH06151702A (ja) * 1992-11-09 1994-05-31 Nec Corp マルチチップモジュール
US5426263A (en) * 1993-12-23 1995-06-20 Motorola, Inc. Electronic assembly having a double-sided leadless component
US5469330A (en) * 1994-02-14 1995-11-21 Karabatsos; Chris Heat sink header assembly

Also Published As

Publication number Publication date
US6303989B1 (en) 2001-10-16
DE69508046T2 (de) 1999-07-15
KR100208053B1 (ko) 1999-07-15
DE69508046D1 (de) 1999-04-08
CN1037134C (zh) 1998-01-21
CN1130441A (zh) 1996-09-04
WO1996001498A1 (en) 1996-01-18
EP0717443B1 (en) 1999-03-03
EP0717443A1 (en) 1996-06-19
EP0717443A4 (en) 1997-12-17

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