CN1037134C - 集成电路装置 - Google Patents

集成电路装置 Download PDF

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CN1037134C
CN1037134C CN95190605A CN95190605A CN1037134C CN 1037134 C CN1037134 C CN 1037134C CN 95190605 A CN95190605 A CN 95190605A CN 95190605 A CN95190605 A CN 95190605A CN 1037134 C CN1037134 C CN 1037134C
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integrated circuit
metallic plate
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cpu chip
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CN1130441A (zh
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安保武雄
岩田雅男
葛川良一
松永速
末广芳和
横田康彦
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Panasonic Holdings Corp
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Abstract

本发明为一种集成电路装置，它在金属板1上面，装上了电源4和若干针形端子5，在多层电路布线板7上装有高速缓存控制器10、高速缓冲存储器11、数据缓冲器LSI14、CPU板8和端子12等搭载零部件；金属板1上装上了电源4并通过针形端子群5，将搭载零部件装到多层电路布线板7里面。以此来提高集成度，同时也提高了发热零部件的散热性。本发明可以提供上述优良性能的集成电路装置。

Description

集成电路装置
本发明涉及一种用于电子设备、电气设备、通讯设备及仪表控制设备等民用生产设备的集成电路装置。
下面先就以往的集成电路装置做个说明。
以往的集成电路装置，是在单面或双面的一块多层电路布线板上装上电源、CPU芯片、高速缓存控制器、高速缓冲存储器、数据缓冲器LSI及接插件等结构零部件，并按要求使这些结构零部件实现电连接。同时，还装有使结构零部件单独放热的散热板以及使散热板冷却的风扇。
在上述以往的集成电路装置的结构中，在一块多层电路布线板上装上结构零部件，并且因装上了为使其分别放热的散热板，布线板的面积就会很大。而且如果不用冷却风扇，就会存在无法充分散热这样的问题。
为解决这个长期存在的问题，本发明的目的在于提供一种能提高集成度和散热性的集成电路装置。
为了解决上述问题，本发明的集成电路装置具有：带电源的金属板；在这块金属板上插上若干针形端子把上述电源接通而构成的多层电路布线板；设在这块金属板和分层回路布线板之间的、带有可与上述的分层回路布线板实现电连接的TAB配线的CPU芯片；设在与这块多层电路布线板上的CPU芯片相对应的一面上的、与上述多层电路布线板进行电连接的电子存储器及数据缓冲器LSI和能够与上述多层电路布线板进行电连接的端子。
图1为本发明一实施例中集成电路装置的截面图；
图2为本发明另一实施例中集成电路的解体斜视图；
图3为针形端子的截面图；
图4为表示金属板、保护板CPU芯片和多层电路布线板之间关系的截面图。
1，21……金属板
2……绝缘层
3……导电层
4……电源
5，26……针形端子
6……焊锡
7，25……多层电路布线板
8，24……CPU芯片
9，24a……TAB导线
10……电子控制器
11……电子存储器系统
12……连接器
22……电源系统
23……保护板
23A……立柱
(实施例1)
以下，就本发明一实施案例中的集成电路装置，参阅附图作如下的说明：
图1为本发明一实施例中的集成电路装置的剖面图。在图1中，1为由铝板或硅钢板等制成的金属板。2为金属板1的一个面上涂复上至少是环氧树脂或是陶瓷中的一种绝缘层。3为设在涂复了绝缘层2的金属板1的绝缘面上的、由印有所需配线图的铜箔等构成的导电层，4为装在导电层3的上端面上的、并与导电层3通电联接的DC/DC转换器、AC/DC转换器等电源。5为在导电层3上通过高温锡焊6把金属板结合起来而构成的、呈十字型的若干针形端子，这些端子构成通过导电层3和电源4实现电连接的阳极端子和阴极端子。7为插入了针形端子5的多层电路布线板，在与金属板1相反的面上，至少装有数据总线、地址总线、控制总线、电源线及接地线(图中未示出)，并且至少电源线及接地线与端子5实现电连接。8为与装有TAB导线9的多层电路布线板7实现电连接的CPU芯片，它与多层电路布线板7相对的一面固定在金属板1上的导电层3上。10为在与CPU芯片8相对的一面的多层电路布线板7的简易CPU片8的上面装设的一个高速缓冲控制器，它通过多层电路布线板7与CPU芯片8实现电联接。11为与高速缓存控制器10接装在同一表面上的高速缓存器部分，它通过多层电路布线板7与电子控制器10通电连接。14为与电子控制器10在同一侧面安装的数据缓冲器LSI部分，它通过多层电路布线板与高速缓存控制器10、高速缓冲存储器11及CPU芯片8实现电连接。12为与高速缓存控制器10安装在同一表面上的连接端子，它与电子控制器10实现电连接。
上面阐述了本发明的一个实施例的集成电路装置的构成。以下就其动作(原理)进行说明。
首先，电源4输出的3.3V电压通过针形端子群5向CPU芯片8输出。
然后，通过高速缓存控制器10和数据缓冲器LSI部分14的操作，通过连接端子12连接起来的主存储器(图未表示)会将所需的数据及命令符号(以下简称命令)提供给高速缓冲存储器11，CPU芯片8将根据高速缓冲存储器11的数据和命令，进行各种演算处理。
最后，由CPU芯片8进行过的各种演算处理的数据从多层电路布线板7传送至高速缓存控制器10和高速缓冲存储器11，并通过多层电路布线板7传输给连接端子12，再向外部输出。
在此，发热元件CPU芯片8及电源4通过金属板1向安装有CPU芯片8及电源4的面相对的整个面以传导或辐射放热方式放热，使热量通过金属板1散发出来。
进而，与CPU芯片8相对的金属板1的表面上由于涂复上了陶瓷等无机材料的绝缘层，可进一步提高其散热性能。
(实施例2)
以下，参照附图纸说明本发明的另一实施例。
图2为本发明另一实施例中的集成电路装置的解剖斜视图。图2中，21为一块由铝板或硅钢板等构成的金属板，板上在印制配线图形的同时，侧面上设有与这些配线图形进行电连接的DC/DC转换器、AC/DC转换器等电源部分22。23是通过焊接安装在金属板21的中央部位的一块由铜或铝板等构成的保护板，它在与金属板21相连接的背面边角部位，由数根小立柱23a构成。下面将说明，它会保护CPU芯片24，并将CPU芯片24的热量散发出去。24是一块带有TAB配线24a的CPU芯片，用硅系或环氧树脂制成的粘接剂固定在安装在保护板23上的数根立柱23A的周围平面上的。25是如图3所示的四周由若干根简易十字形针形端子26插入或锡焊方式连接起来的多层电路布线板。这数根针形端子26与金属板21之间通过焊锡(图中未表示)而实现电连接。
图4是表示关键部位的多层电路布线板、保护板和金属板之间的连接关系的截面图。图中，针形端子26被插入金属板21上，同时与金属板21上面印制的配线图形21a实现电连接。另外，在保护板23和多层电路布线板25之间，先在立柱23A面上涂复了锡，再用锡焊连接起来。进而，CPU芯片24和多层电路布线板25的内部配线(图中未表示)之间也实现电连接。
对于结构如上所述的、本发明的实施例的一个集成电路装置，下面说明其工作情况。
首先，由电源22输出的3.3V电压，通过针形端子群26向CPU芯片24输出。
然后，由外部通过端子将所需的数据及命令提供给CPU芯片24，再由该CPU芯片24根据数据及命令，进行各种演算处理。
最后，由CPU芯片24进行过的各种演算处理的数据通过多层电路布线板传导给端子，再向外部输出。
在此，作为发热元件的CPU芯片24通过保护板、金属板进而电源部分22也通过金属板21向设有CPU芯片24和电源部分22的面相对的整个面以传导并辐射的形式散发热量，通过金属板21释放。
进而，由于这块保护板23的存在，使容易受通过金属板21传递来的外力损坏的CPU芯片24得到了保护。
诚然，保护板23和立柱23A，无论是一体连接，还是组装上去，当然都可以。
如上所述，利用本发明制作的集成电路装置，通过多个针形端子群将多层电路布线板与金属板之间形成三维立体结构，从而提高了集成度。同时，金属板的表面积扩大，以这块板的所有部位，可将电源、CPU等的发热元件的热量散发出去。
并且，金属板上装有电源，再把众多端子通过高温锡焊固定在金属板上。这种结构使得针形端子从很近的地方得到电源供给，形成了低阻抗的导电层的集成电路装置。
再者，本集成电路装置中，由CPU引出TAB配线，使之与多层电路布线板实现电连接。而且通过金属板上面或金属板的绝缘层上附着的导电层上，将CPU芯片用粘接剂固定住。该结构的形成，更加提高了集成度。
况且，架载CPU芯片的金属板里面，由于涂复了绝缘层，此种结构的集成电路装置，具有非常好的散热性能。

Claims (7)

1.一种集成电路装置，包括侧面装有电源的金属基板；安装在该金属基板中央的、沿板四周具有多个小立柱的保护板；设在由上述的小主柱所包围的保护板的面上的CPU芯片；
其特征在于：通过多个针形端子与上述金属板实现电连接的多层电路布线板。
2.如权利要求1所述的集成电路装置，其中装有CPU板引出有TAB导线，并与多层电路布线板通电连接。
3.如权利要求1所述的集成电路装置，其中通过金属板的上面或金属板上的绝缘层，上面涂复了导电层，导电层上面又用粘合剂固定了CPU板。
4.如权利要求1所述的集成电路装置，其中上述的多个针形端子被用高温焊接固定在金属板上。
5.如权利要求1所述的集成电路装置，其中装载CPU板的金属板的里面涂有绝缘层。
6.如权利要求1所述的集成电路装置，其中所述的保护板与立柱以一体化形式构成，或在保护板上安装上所述的立柱。
7.如权利要求1所述的集成电路装置，其中所述的多个针形端子采用的是简易十字形结构。
CN95190605A 1994-07-04 1995-07-03 集成电路装置 Expired - Fee Related CN1037134C (zh)

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EP0717443B1 (en) 1999-03-03
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CN1130441A (zh) 1996-09-04
EP0717443A4 (en) 1997-12-17
EP0717443A1 (en) 1996-06-19
KR960705363A (ko) 1996-10-09
DE69508046D1 (de) 1999-04-08
US6303989B1 (en) 2001-10-16

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