CN1316608C - 一种改善led温升的散热针结构 - Google Patents

一种改善led温升的散热针结构 Download PDF

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CN1316608C
CN1316608C CNB2004100162727A CN200410016272A CN1316608C CN 1316608 C CN1316608 C CN 1316608C CN B2004100162727 A CNB2004100162727 A CN B2004100162727A CN 200410016272 A CN200410016272 A CN 200410016272A CN 1316608 C CN1316608 C CN 1316608C
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led
heat radiation
heat
temperature rise
pin
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CN1655346A (zh
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陈必寿
李晟
李乐科
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Jiashan Sansi Photoelectric Technology Co Ltd
Pujiang Sansi Optoelectronics Technology Co Ltd
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Shanghai Sansi Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种改善LED温升的散热针结构，其特征在于：在将要安装LED芯片或表面贴装式LED灯或发光单管的印制线路板上与LED芯片结面连接的金属箔线或箔面上设有若干垂直穿透的小孔，小孔中插入间隙配合、具有导热性能的散热针，散热针尾端为可使散热针垂直铆固或直接焊连在印制线路板上的结构，穿过小孔的针身固定并置立于印制线路板背面。本发明利用热传导原理，使LED发出的热量沿着金属箔线或箔面，通过上述散热针，因传导截面积的增加而迅速传递，又由于散热针表面积的增加而将热量向周围空气中迅速辐射扩散，从而有效实现了热量的快速发散，抑制了LED工作环境的温升现象，保证了LED的显示质量，保障了LED的正常工作寿命。

Description

一种改善LED温升的散热针结构
技术领域
本发明涉及LED应用领域，特别涉及LED应用中的散热技术。
背景技术
LED发光二极管通电点亮后会出现发热升温现象，当使用大LED芯片或LED高度密集使用时，其温升变化尤为严重，轻则削弱发光亮度、改变LED的发光波长，影响LED的工作寿命，重则造成LED的永久损坏。
随着LED应用范围的不断拓展，超高亮度大面积的全彩显示屏、LED照明装置等高密集使用LED引起大幅度温升的场合越来越多。如何实现LED良好散热就显得格外重要。已有的散热方法多体现在LED发光单元的成型工艺中，如将LED发光二极管的金属引脚改为宽金属片。在LED所在的印制板上通常也会尽量扩大铜箔表面积以改善散热效果，但多受印制板布线密度过高的限制，使散热效果严重受制，以致至今未见特别理想的基于LED所在线路板的散热方案。
发明内容
本发明的目的在于克服目前LED密集使用中热量不易散发的缺陷，提供一种改善LED温升的散热针结构，从而有效提高密集排布LED芯片或发光管的印制线路板的散热能力，使LED工作在相对适宜的环境温度下，保证LED的显示质量，保障LED的正常工作寿命。
本发明所提供的一种改善LED温升的散热针结构，其特征在于：在将要安装LED芯片或表面贴装式LED灯或发光单管的印制线路板上与LED芯片结面连接的金属箔线或箔面上设有若干垂直穿透的小孔，小孔中插入间隙配合、具有导热性能的散热针，散热针尾端为可使散热针垂直铆固或直接焊连在印制线路板上的结构，穿过小孔的针身固定并置立于印制线路板背面。
上述的一种改善LED温升的散热针结构，在印制线路板上设有的小孔疏密度与LED发热部位分布的疏密度相一致。
上述的一种改善LED温升的散热针结构，其中，小孔和该小孔内插入的散热针的断截面可以是圆形或矩形或三角形。
上述的一种改善LED温升的散热针结构，其中，散热针彼此不搭连。
上述的一种改善LED温升的散热针结构，当含散热针的印制线路板用环氧树脂材料固化封装时，其散热针身是裸露在外的。
本发明利用热传导原理，使LED发出的热量沿着金属箔线或箔面，通过上述散热针，因传导截面积的增加而迅速传递，又由于散热针表面积的增加而将热量向周围空气中迅速辐射扩散，从而有效实现了热量的快速发散，抑制了LED工作环境的温升现象，保证了LED的显示质量，保障了LED的正常工作寿命。
附图说明
图1是本发明实施例之一，一个具有6个LED芯片、直径为5mm的LED发光灯印制板平面布置图；
图2是本发明实施例之二，一种点间距为10mm的有8×8个像素的LED双基色点阵显示模块前视图(反射腔套件面)；
图3是图2的后视图(印制板面)；
图4是图2的侧视图。
具体实施方式
本发明是根据LED发热部位的分布，在将要安装LED芯片或表面贴装式LED灯或发光单管的印制线路板上与LED芯片结面连接的金属箔线或箔面上预设若干垂直穿透的小孔，小孔中插入间隙配合、导热性能优良的金属针，称为散热针。小孔和散热针的断截面根据散热和工艺需要，可以是圆、矩形、三角形等各种形状。散热针尾端设计成可使散热针垂直铆固或直接焊连在线路板上的结构，使穿过小孔的针身得到固定并置立于线路板背面。含散热针的线路板无论是否用环氧树脂等材料进行固化封装，均要求散热针身全部或大部裸露在外。散热针可以彼此呈大致平行状态，两两互不搭连；如果不会导致电气短路或错误连接，裸露在外的散热针身也允许彼此呈接触或连接状态。当线路板(或含线路板的显示模块)与附着固定物实行物理固定和电气连接时。针身前端与附着固定物可不相接触，从而使散热针完全裸露在线路板与附着固定物之间的中空地带，以防电气短路。如有电气连接需要或无电气短路之虞，散热针身与附着固定物的金属或非金属表面也可呈紧密连接或半紧密接触状态，从而充当电气引脚完成电气连接或进一步提高散热效果。
下面结合两个实例对本发明做进一步描述：
实施例1：
图1是一个具有6个LED芯片、直径为5mm的LED发光灯印制板平面布置图，6个LED芯片为并联连接。孔1-孔8分别用φ0.46×10.24mm的金属针引出，其中1-2作为LED的两根同端引出脚，3-8作为LED的6根另一同端引出脚。9-14孔为环氧封装导流孔，没有金属针引出。15和16为线路板的铜箔表面，金属针与铜箔表面呈垂直铆固连接，17为定位口。在该实施例中，上述8根散热针同时充当电气引脚，而且6粒LED芯片直接固晶在3-8的6根散热针的顶部截面上，通过压焊工艺将每个LED芯片顶部与15铜箔表面实现电路连接，以1-2作为其电气引脚。该LED灯点亮后产生的热量即通过散热针迅速传递扩散，使其温度不会过高。如此结构的多管芯LED发光灯可作为独立元件直接焊连在LED驱动电路板上被点亮。
实施例2：
图2是一种点间距为10mm的有8×8个像素的LED双基色点阵显示模块前视图(反射腔套件面)，其后视图(印制板面)和侧视图分别如图3和图4所示，在图3中1和2为两排电气引脚(每排12根)，其余为4排共16列散热针的布局，其中右侧最边缘一列散热针排列的错位是由印制线路板布线局限所致。根据布线规律和散热需要，本实施例中同一列的散热针均属电路上的同点连接，不同列之间的散热针则不应接触，以防短路。
从图4可以看出所有散热针均比电气引脚要短，当该显示模块的电气引脚焊接在对应的驱动线路板上时，所有散热针均处裸露状态，且不和驱动线路板接触，这样既保证了散热的需要，又避免电气短路的发生。
在实际使用中，散热针的数量设置和布局安排应兼顾散热需要和布线可能作统筹考虑。散热针的断截面形状则主要取决于生产加工工艺的要求考虑，散热针的长短既要满足散热需要，也要适应固定LED或所在线路板的具体环境。使散热针兼具电气引脚的功能，或电气引脚兼具散热功能，也是一种值得推荐的设计选择。

Claims (5)

1.一种改善LED温升的散热针结构，其特征在于：在将要安装LED芯片或表面贴装式LED灯或发光单管的印制线路板上与LED芯片结面连接的金属箔线或箔面上设有若干垂直穿透的小孔，小孔中插入间隙配合、具有导热性能的散热针，散热针尾端为可使散热针垂直铆固或直接焊连在印制线路板上的结构，穿过小孔的针身固定并置立于印制线路板背面。
2.根据权利要求1所述的一种改善LED温升的散热针结构，其特征在于：在所述印制线路板上设有的小孔疏密度与LED发热部位分布的疏密度相一致。
3.根据权利要求1所述的一种改善LED温升的散热针结构，其特征在于：所述小孔和该小孔内插入的散热针的断截面可以是圆形或矩形或三角形。
4.根据权利要求1所述的一种改善LED温升的散热针结构，其特征在于：所述散热针彼此不搭连。
5.根据权利要求1所述的一种改善LED温升的散热针结构，其特征在于：当含散热针的印制线路板用环氧树脂材料固化封装时，其散热针身是裸露在外的。
CNB2004100162727A 2004-02-13 2004-02-13 一种改善led温升的散热针结构 Expired - Lifetime CN1316608C (zh)

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US11/057,274 US7227750B2 (en) 2004-02-13 2005-02-11 Heat dissipating pin structure for mitigation of LED temperature rise

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