CN101924098A - 发光二极管模组 - Google Patents

发光二极管模组 Download PDF

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Publication number
CN101924098A
CN101924098A CN2009103030972A CN200910303097A CN101924098A CN 101924098 A CN101924098 A CN 101924098A CN 2009103030972 A CN2009103030972 A CN 2009103030972A CN 200910303097 A CN200910303097 A CN 200910303097A CN 101924098 A CN101924098 A CN 101924098A
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China
Prior art keywords
emitting diode
light
diode module
heat
heat abstractor
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CN2009103030972A
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English (en)
Inventor
古金龙
阮青海
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN2009103030972A priority Critical patent/CN101924098A/zh
Priority to US12/534,804 priority patent/US20100308707A1/en
Publication of CN101924098A publication Critical patent/CN101924098A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种发光二极管模组，包括一散热装置及设置于该散热装置上的至少一发光二极管，该散热装置包括承载所述至少一发光二极管的一安装面，所述安装面上涂附有一绝缘层，所述绝缘层上设置有线路，该至少一发光二极管与所述线路电连接并通过该散热装置进行散热。与传统的发光二极管模组相比，本发明发光二极管模组于散热装置的绝缘层上直接形成线路，发光二极管直接与散热装置上的线路相连接，省去了传统的PCB板，避免了PCB板与散热装置之间接触热阻的产生，发光二极管所产生的热量可快速的由高导热性能的散热装置予以散发，保证发光二极管模组的正常工作，提升其使用性能及使用寿命。

Description

发光二极管模组
技术领域
本发明涉及光源模组，特别是关于一种发光二极管模组。
背景技术
发光二极管(LED，Light-emitting Diode)的寿命比一般灯泡要高出50～100倍，而LED本身耗费的电量仅为一般灯泡的1/3～1/5，可望在二十一世纪取代钨丝灯和水银灯，成为兼具省电和环保概念的新照明光源。
作为固体光源本身的一个特点，LED发光源在工作时也将发出热量，目前所使用的LED模组大都将多个LED以高密度阵列的形式连接于一印刷电路板(PCB)上，并将该PCB置于一金属散热器上对其进行散热，散热器与PCB之间一般填充有导热胶等热界面材料以弥补二者之间的空隙而减小两者之间的接触热阻。但是PCB的材料一般为FR-4(由环氧树脂与玻璃纤维含浸压覆而成)，其热传导性能不佳，而PCB与散热器之间虽然填充有导热胶，但导热胶的导热系数远远小于金属，因而PCB与散热器之间仍然会产生较大的接触热阻，使LED所产生的热量无法有效的经由PCB传导至散热器予以散发而导致其温度的升高，致使芯片本身及封装树脂性能的恶化，引起LED发光效率的下降，严重影响其发光亮度及缩短其使用寿命，因此如何将LED光源所产生的热量快速有效的导出或散发出去，已成为影响LED发光品质与寿命的关键因素。
发明内容
有鉴于此，有必要提供一种具有高散热效率的发光二极管模组。
一种发光二极管模组，包括一散热装置及设置于该散热装置上的至少一发光二极管，该散热装置包括承载所述至少一发光二极管的一安装面，所述安装面上涂附有一绝缘层，所述绝缘层上设置有线路，该至少一发光二极管与所述线路电连接并通过该散热装置进行散热。
与传统的发光二极管模组相比，本发明发光二极管模组于散热装置的绝缘层上直接形成线路，发光二极管直接与散热装置上的线路相连接，省去了传统的PCB板，避免了PCB板与散热装置之间接触热阻的产生，发光二极管所产生的热量可快速的由高导热性能的散热装置予以散发，保证发光二极管模组的正常工作，提升其使用性能及使用寿命。
附图说明
图1为本发明发光二极管模组的侧向示意图。
图2为本发明发光二极管模组沿散热器纵长方向的俯视示意图。
图3为图1中散热装器上所形成的线路示意图。
具体实施方式
如图1至图2所示为本发明发光二极管模组的一实施例，其包括若干发光二极管10及一用以承载这些发光二极管10并对其散热的一散热器30。
请同时参阅图3，每一发光二极管10包括二正负极引脚15，用于与散热器30电性连接。
该散热器30由导热性能良好的材料如铝、铜或者合金材料制成，其包括一纵长的基板31及位于基板31一侧的若干间隔设置的散热片32，用以散发基板31吸收的热量。该基板31具有一纵长的安装面33。该安装面33的表面涂附有一层绝缘材料，以形成一绝缘层34。该绝缘层34的表面通过蚀刻或粘贴等方式设置有与发光二极管10电性连接的正负极线路20。这些线路20上形成有若干导电接点22，用以与发光二极管10的引脚15电性连接。此线路20可随发光源的样式及数量而改变，并不限于图中所示的形式。
如此排布的发光二极管10直接与基板31接触。如此，每一发光二极管10在工作时产生的热量可直接由散热器30的基座31吸收，并进一步通过散热鳍片32散布至环境中。如此，避免了发光二极管10与散热器30之间因较大的热阻而导致其产生的热量无法有效地传递至散热器30散发的问题，大大提升了发光二极管10与散热器30之间热量的传导效率，保证发光二极管模组的正常工作，提升其使用性能及使用寿命。
可以理解的，本发明中用于承载发光二极管10的散热装置可以为热管、均温板及其他导热性能良好的材料，只要这些散热装置的一侧形成有安装面即可。

Claims (5)

1.一种发光二极管模组，包括一散热装置及设置于该散热装置上的至少一发光二极管，其特征在于：该散热装置包括承载所述至少一发光二极管的一安装面，所述安装面上涂附有一绝缘层，所述绝缘层上设置有线路，该至少一发光二极管与所述线路电连接并通过该散热装置进行散热。
2.如权利要求1所述的发光二极管模组，其特征在于：所述线路上形成有若干导电接点，所述发光二极管包括向外延伸的引脚，所述引脚与所述导电接点电性连接。
3.如权利要求1所述的发光二极管模组，其特征在于：所述散热装置为一散热器，其包括一基板及自基板一侧向外延伸的若干散热片，所述安装面形成于所述基板的另一侧。
4.如权利要求1所述的发光二极管模组，其特征在于：所述散热装置为一热管，所述安装面形成于所述热管的一侧面。
5.如权利要求1所述的发光二极管模组，其特征在于：所述散热装置为一均温板，其一侧面为所述安装面。
CN2009103030972A 2009-06-09 2009-06-09 发光二极管模组 Pending CN101924098A (zh)

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US12/534,804 US20100308707A1 (en) 2009-06-09 2009-08-03 Led module and method of fabrication thereof

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184915A (zh) * 2011-04-06 2011-09-14 周波 线路板与散热器高效整合的大功率基板及其制作方法
CN102931151A (zh) * 2012-11-09 2013-02-13 无锡市锡容电力电器有限公司 一种用于无功补偿装置的散热器

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775428B1 (ko) * 2010-12-28 2017-09-06 삼성전자 주식회사 발광 소자 패키지 및 그 제조 방법
FR2984679B1 (fr) * 2011-12-15 2015-03-06 Valeo Sys Controle Moteur Sas Liaison thermiquement conductrice et electriquement isolante entre au moins un composant electronique et un radiateur en tout ou partie metallique
DE102012104779A1 (de) * 2012-06-01 2013-12-05 Sumolight Gmbh Beleuchtungsvorrichtung und Scheinwerfer
GB2510865B (en) * 2013-02-15 2016-08-03 Collingwood Lighting Ltd Method for manufacturing a lighting unit and lighting unit

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US20030189829A1 (en) * 2001-08-09 2003-10-09 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
US20080175008A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication

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US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6864513B2 (en) * 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
WO2006049086A1 (en) * 2004-11-01 2006-05-11 Matsushita Electric Industrial Co., Ltd. Light emitting module, lighting device, and display device

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20030189829A1 (en) * 2001-08-09 2003-10-09 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
US20080175008A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184915A (zh) * 2011-04-06 2011-09-14 周波 线路板与散热器高效整合的大功率基板及其制作方法
CN102931151A (zh) * 2012-11-09 2013-02-13 无锡市锡容电力电器有限公司 一种用于无功补偿装置的散热器

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Application publication date: 20101222