WO2014127594A1 - 具有发光二极管的发光装置 - Google Patents
具有发光二极管的发光装置 Download PDFInfo
- Publication number
- WO2014127594A1 WO2014127594A1 PCT/CN2013/076791 CN2013076791W WO2014127594A1 WO 2014127594 A1 WO2014127594 A1 WO 2014127594A1 CN 2013076791 W CN2013076791 W CN 2013076791W WO 2014127594 A1 WO2014127594 A1 WO 2014127594A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- circuit board
- emitting device
- board base
- Prior art date
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 25
- 239000010439 graphite Substances 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002918 waste heat Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the present invention relates to the design of a light emitting device, and more particularly to a light emitting device having a light emitting diode of a heat dissipating component. Background technique
- a Light-Emitting Diode is a luminescent semiconductor electronic component that emits light by converting it into light energy.
- the light-emitting device that emits light by using the light-emitting diode has the advantages of high luminous efficiency, long life, no breakage, and fast reaction speed, and thus gradually replaces the conventional tungsten filament lamp, the fluorescent lamp, and the power-saving bulb.
- the circuit of the light-emitting diode generates a lot of waste heat when the light is activated. However, at high temperatures, the light-emitting diode is drastically lowered by the high temperature, and thus a lot of power is consumed. The accumulation of waste heat will cause the temperature to rise further, forming a vicious circle, which will further shorten the service life of the LED. Therefore, it is important to effectively dissipate waste heat, so that a light-emitting device that uses a light-emitting diode to emit light is provided with a heat dissipating component to discharge waste heat.
- the thermally conductive layer between each component layer in the illumination device is typically coated with a layer of thermal paste to aid in thermal conduction to enhance the heat dissipation efficiency of the discrete components.
- the properties of the thermal paste gradually deteriorate, harden and deteriorate with the use time, so the heat conduction effect thereof is also deteriorated, so that the effect of the waste heat discharge is deteriorated, and the luminous efficiency of the light emitting diode of the light-emitting device is further lowered.
- Luminous Decay may even cause damage to the illuminating device.
- the object of the present invention is to overcome the above-mentioned shortcomings in the prior art, and to provide a light-emitting diode capable of effectively extending the service life of the light-emitting device, effectively conducting waste heat, and having a practical structure, stable and reliable working performance, and wide application range.
- Light-emitting device capable of effectively extending the service life of the light-emitting device, effectively conducting waste heat, and having a practical structure, stable and reliable working performance, and wide application range.
- a light-emitting device having a light-emitting diode of the present invention has the following constitution:
- the light emitting device with the light emitting diode comprises an LED module, a circuit board base, a lamp cup and a heat dissipating component.
- the light emitting diode module has a light emitting diode.
- the LED module is disposed on one side of the circuit board base.
- One side of the lamp cup is adjacent to the other side of the circuit board base.
- the heat dissipating component is disposed adjacent to the other side of the lamp cup, wherein a first tin layer is disposed between the LED module and the circuit board base, and a second tin layer or a first layer is disposed between the circuit board base and the lamp cup
- a graphite layer is disposed between the graphite layer and the lamp cup and the heat dissipating component.
- the first tin layer and the second tin layer are applied by printing.
- the first tin layer and the second tin layer are disposed by reflow soldering.
- the circuit board base is a metal core printed circuit board.
- the heat dissipating component is a metal heat sink.
- the surface of the heat dissipating component has heat sinking fins.
- the metal fins are attached to the second graphite layer.
- the circuit board base, the lamp cup and the heat dissipating component are screwed by a first screw member. In an embodiment of the invention, the lamp cup and the heat dissipating component are screwed by a second screw member.
- the light-emitting device with the light-emitting diode of the invention is used to make the combination of the light-emitting diode and the circuit board base more tightly through the tin layer, and the tin layer and the graphite have the characteristics of low thermal resistance and high thermal conductivity, and do not change with time. It deteriorates and maintains good heat dissipation efficiency to effectively conduct waste heat and prolong the service life of the light-emitting device.
- FIG. 1 shows a cross-sectional view of a light emitting device having a light emitting diode according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a light-emitting device having a light emitting diode according to a second embodiment of the present invention.
- Figure 3 is a cross-sectional view showing a light-emitting device having a light emitting diode according to a third embodiment of the present invention.
- a light emitting device 100 having a light emitting diode according to a first embodiment of the present invention includes an LED module 1, a circuit board base 2, a lamp cup 3, a heat dissipating component 4, a first tin layer 5a, and a first graphite layer 6a. And a second graphite layer 6b.
- the LED module 1 has a light emitting diode 11 and two pins 12.
- the two pins 12 are electrically connected to the positive and negative contacts 21 of the circuit board base 2 to electrically illuminate the LED 11.
- the circuit board base 2 is a metal core printed circuit board (MCPCB).
- the structure of the metal core printed circuit board is composed of a circuit layer and a dielectric layer.
- the base layer (Base Layer).
- the insulating layer is a layer of insulating material with low thermal resistance and high thermal conductivity
- the base layer is a metal substrate, usually aluminum or copper. Therefore, in addition to the very good thermal conductivity, the metal core printed circuit board itself can dissipate heat.
- the circuit board base 2 may also be a conventional printed circuit board.
- the light emitting diode 11 is bonded to one side of the circuit board base 2 through the first tin layer 5a.
- the first tin layer 5a is applied between the light-emitting diode 11 and the contact surface of the circuit board base 2 by printing coating.
- the solder paste 11 is printed on the entire contact surface of the LED 11 and the circuit board base 2, and the LED 11 is soldered to the circuit board base 2 by means of reflow soldering. Together, since the entire contact surface is soldered, the combination of the light emitting diode 11 and the circuit board base 2 is more secure.
- the heat conduction effect of the first tin layer 5a is quite good and does not deteriorate and harden with time.
- the other side of the circuit board base 2 is adjacent to one side of the lamp cup 3.
- the lamp cup 3 is used to fix and protect the LED module 1 and the circuit board base 2.
- the lamp cup 3 is made of a material having good heat conduction and good heat dissipation, such as aluminum metal or ceramic, to assist heat dissipation.
- a light cover is also placed over the LED 11 to increase the protection.
- the first graphite layer 6a is disposed between the circuit board base 2 and the lamp cup 3.
- the first graphite layer 6a is made of graphite.
- the graphite is a material with low thermal resistance, high thermal conductivity, and poor electrical conductivity.
- a graphite layer 6a can effectively conduct heat from the circuit board base 2 to the lamp cup 3 while protecting the circuit board base 2 from the charge transmitted from the lamp cup 3. Furthermore, graphite does not deteriorate and harden over time.
- the heat dissipating component 4 is a metal fin.
- the second graphite layer 6b is disposed between the lamp cup 3 and the heat dissipating component 4, and the second graphite layer 6b is made of graphite, so that the heat of the lamp cup 3 can be efficiently conducted to the heat dissipating component 4.
- the circuit board base 2, the lamp cup 3 and the heat dissipating component 4 are locked and screwed by a first screwing member 7a, thereby making electricity
- the road plate base 2, the first graphite layer 6a, the lamp cup 3, the second graphite layer 6b, and the heat dissipating component 4 can be closely adhered to enhance the heat conduction effect.
- the first screw member 7a includes a screw and a nut.
- the heat-dissipating component can use a small heat-dissipating component, such as a metal heat sink, so Can save material or tubular structure.
- FIG. 2 there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a second embodiment of the present invention.
- the light-emitting device 100a having the light-emitting diode of the second embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that a second tin layer 5b is disposed between the circuit board base 2 and the lamp cup 3. Instead of the first graphite layer.
- the second tin layer 5b is disposed in the same manner as the first tin layer 5a, and will not be described again.
- the circuit board base 2 and the lamp cup 3 can be tightly combined, and in addition to the better heat conduction effect, the first screw member 7a is not required to be screwed, so only one pass is required.
- the second screw member 7b can lock the lamp cup 3 and the heat dissipating component 4, and the welding effect is even better than that of the screw.
- FIG. 3 there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a third embodiment of the present invention.
- the light-emitting device 100b having the light-emitting diode of the third embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that the surface of the heat-dissipating component 4 of the present embodiment has the heat-dissipating fins 41 through the heat-dissipating fins. 41 Increase the area of contact with air to increase the rate of heat dissipation, effectively reducing the temperature of the illuminator.
- the light-emitting device with the light-emitting diode of the present invention provides a long service life and a better heat dissipation effect, and is more suitable for various situations.
Abstract
一种具有发光二极管（11）的发光装置（100，100a，100b），包括一发光二极管模块（1）、一电路板基座（2）、一灯杯（3）、及一散热组件（4），发光二极管模块（1）具有一发光二极管（11），电路板基座（2）的一侧设置有发光二极管模块（1），灯杯（3）的一侧邻设于电路板基座（2）的另一侧，散热组件（4）邻设于灯杯（3）的另一侧，其中，发光二极管模块（1）及电路板基座（2）之间设置有一第一锡层（5a），电路板基座（2）及灯杯（3）之间设置有一第二锡层（5b）或一第一石墨层（6a），以及灯杯（3）及散热组件（4）之间设置有一第二石墨层（6b）。该发光装置（100，100a，100b）的废热将有效地被传导排出，使得该发光装置（100，100a，100b）的使用寿命得以延长。
Description
具有发光二极管的发光装置 技术领域
本发明涉及一种发光装置的设计， 特别是涉及一种具有散热组件的发光二极管的发光装 置。 背景技术
发光二极管（Light-Emitting Diode, LED )是一种可发光的半导体电子组件， 其利用电能 转成光能的方式发光。 利用发光二极管来发光的发光装置具有发光效率高、 寿命长、 不易破 损、 及反应速度快等优点， 所以逐渐取代传统的钨丝灯、 荧光灯、 及省电灯泡。
发光二极管的电路在发光作动时会产生许多废热， 然而发光二极管在高温情况下， 发光 效率会受高温影响而急剧下降， 因此会耗费许多电力。 而产生的废热聚集， 会让温度进一步 上升， 形成恶性循环， 而进一步会缩短发光二极管的使用寿命。 因此， 有效将废热散出是很 重要的， 所以习知使用发光二极管来发光的发光装置都会设置有一散热组件以将废热排出。
发光装置中每个组件层之间的导热层通常涂布一层导热膏以辅助导热而提升散组件的散 热效率。 然而， 导热膏的性质会随使用时间而逐渐干透、 硬化而变质， 因此其导热效果也随 之变差而使得废热排出的效果变差， 并进一步造成发光装置的发光二极管的发光效率降低， 例如光衰 （Luminous Decay ), 甚至可能造成发光装置损坏。 发明内容
本发明的目的即是克服了上述现有技术中的缺点， 提供一种能够有效延长发光装置的使 用寿命、 有效传导废热、 结构筒单实用、 工作性能稳定可靠、 适用范围较为广泛的具有发光 二极管的发光装置。
为了实现上述的目的， 本发明的具有发光二极管的发光装置具有如下构成：
该具有发光二极管的发光装置， 包括一发光二极管模块、 一电路板基座、 一灯杯以及一 散热组件。发光二极管模块具有一发光二极管。该发光二极管模块设置于电路板基座的一侧。 灯杯的一侧邻设于电路板基座的另一侧。 散热组件邻设于灯杯的另一侧， 其中， 发光二极管 模块及电路板基座之间设置有一第一锡层， 电路板基座及灯杯之间设置有一第二锡层或一第 一石墨层， 以及灯杯及散热组件之间设置有一第二石墨层。
在本发明的一实施例中， 第一锡层及第二锡层以印刷涂布方式涂布。
在本发明的一实施例中， 第一锡层及第二锡层以回流焊的方式设置。
在本发明的-一实施例中， 电路板基座为一金属核心印刷电路板。
在本发明的-一实施例中， 散热组件为一金属散热片。
在本发明的-一实施例中， 散热组件的表面具有散热鳍片。
在本发明的-一实施例中， 金属散热片贴合于第二石墨层。
在本发明的-一实施例中， 电路板基座、 灯杯与散热组件以一第一螺固构件而螺固。 在本发明的-一实施例中， 灯杯与散热组件以一第二螺固构件而螺固。
釆用了本发明的具有发光二极管的发光装置， 通过锡层使发光二极管与电路板基座的结 合更为紧固， 且锡层及石墨具有低热阻、 高导热的特征， 并且不会随时间而变质， 而能维持 良好的散热效率， 以有效传导废热， 使发光装置的使用寿命得以延长。
本发明所釆用的具体实施例， 将藉由以下的实施例及附图作进一步的说明。。 附图说明
图 1显示依据本发明的第一实施例的具有发光二极管的发光装置的剖面图。
图 2显示依据本发明的第二实施例的具有发光二极管的发光装置的剖面图。
图 3显示依据本发明的第三实施例的具有发光二极管的发光装置的剖面图。
主要组件符号说明如下：
100、 100a, 100b 具有发光二极管的发光装置
1 发光二极管模块
11 发光二极管
12 接脚
2 电路板基座
21 接点
3 灯杯
4 散热组件
41 散热鳍片
5a 第一锡层
5b 第二锡层
6a 第一石墨层
6b 第二石墨层
7a 第一螺固构件
7b 第二螺固构件 具体实施方式
为了能够更清楚地理解本发明的技术内容， 特举以下实施例详细说明。
请参阅图 1 , 其显示依据本发明的第一实施例的具有发光二极管的发光装置的剖面图。 本发明的第一实施例的具有发光二极管的发光装置 100 包括一发光二极管模块 1、 一电路板 基座 2、 一灯杯 3、 一散热组件 4、 第一锡层 5a、 第一石墨层 6a、 及一第二石墨层 6b。
发光二极管模块 1具有一发光二极管 11及二个接脚 12。 二个接脚 12分别电性连接电路 板基座 2的正、 负极接点 21以使发光二极管 11通电发光。 电路板基座 2在本实施例中是一 种金属核心印刷电路板（ Metal Core Printed Circuit Board , MCPCB ) , 金属核心的印刷电路板 的结构由线路层 ( Circuit Layer )、 绝缘层 ( Dielectric Layer )、 及基层 ( Base Layer )所组成。 其中绝缘层为一层低热阻且高导热的绝缘材料， 而基层为金属基板， 通常是铝或铜。 因此金 属核心的印刷电路板除了导热效果非常好之外， 其本身亦能散热。 当然， 本发明不限于此， 电路板基座 2也可以是传统的印刷电路板。 发光二极管 11通过第一锡层 5a与电路板基座 2 的一侧贴合。 在本实施例中， 第一锡层 5a是以印刷涂布方式涂布在发光二极管 11与电路板 基座 2的接触面之间。较佳地， 是以发光二极管 11与电路板基座 2的整个接触面都印刷涂布 上锡膏， 再通过回流焊（ Reflow Soldering )的方式将发光二极管 11与电路板基座 2焊合在一 起，因为是釆用整个接触面都焊合的方式，所以发光二极管 11与电路板基座 2的结合更紧固。 且第一锡层 5a的导热效果相当良好也不会随时间而变质及硬化。
电路板基座 2的另一侧邻设于灯杯 3的一侧。 灯杯 3是用来固定且保护发光二极管模块 1及电路板基座 2。 较佳地， 灯杯 3釆用导热良好及散热良好的材质， 例如铝金属或陶瓷等， 以辅助散热。 在较佳实施例中， 发光二极管 11的上方还会覆盖一层灯罩以增加保护效果。 第 一石墨层 6a设置于电路板基座 2与灯杯 3之间， 第一石墨层 6a是石墨所制成， 石墨是一种 低热阻、 高导热、 以及导电较金属差的材料， 因此第一石墨层 6a可以有效将电路板基座 2的 热传导至灯杯 3 , 并同时保护电路板基座 2不被灯杯 3传来的电荷所影响。 再者， 石墨不会 随着时间而变质及硬化。
灯杯 3的另一侧邻接散热组件 4, 在本实施例中， 散热组件 4是一金属散热片。 第二石 墨层 6b贴合设置在灯杯 3与散热组件 4之间， 第二石墨层 6b是石墨所制成， 因此也可有效 地将灯杯 3的热传导至散热组件 4。
再者， 电路板基座 2、 灯杯 3及散热组件 4通过一第一螺固构件 7a锁紧螺固， 藉此使电
路板基座 2、 第一石墨层 6a、 灯杯 3、 第二石墨层 6b、 及散热组件 4能紧密贴合而提升导热 效果。 在本实施例中， 第一螺固构件 7a包括一螺丝及螺帽。
通过上述的技术手段， 废热将有效地被传导及排出， 使得发光装置的使用寿命得以延长， 而且因为导热及散热效果的提升， 所以散热组件可以使用较小的散热组件， 例如金属散热片， 所以能节省材料或筒化结构。
请参阅图 2所示， 其显示本发明的第二实施例的具有发光二极管的发光装置的剖面图。 本发明的第二实施例的具有发光二极管的发光装置 100a 与第一实施例的具有发光二极管的 发光装置 100的差异在于电路板基座 2与灯杯 3之间为设置有一第二锡层 5b而不是第一石墨 层。 第二锡层 5b的设置方式与第一锡层 5a相同， 不再赘述。 借助第二锡层 5b的焊合， 使得 电路板基座 2与灯杯 3能结合紧密， 除了导热效果较好外， 也不需要借助第一螺固构件 7a来 螺固， 所以仅需通过一第二螺固构件 7b来将灯杯 3及散热组件 4锁固即可， 而且焊合的效果 甚至比螺固更好。
请参阅图 3所示， 其显示本发明的第三实施例的具有发光二极管的发光装置的剖面图。 本发明的第三实施例的具有发光二极管的发光装置 100b 与第一实施例的具有发光二极管的 发光装置 100的差异在于本实施例的散热组件 4的表面具有散热鳍片 41 , 通过散热鳍片 41 增加与空气接触的面积而提升散热的速率， 有效降低发光装置的温度。
综上所述，本发明的具有发光二极管的发光装置提供较长的使用寿命及较佳的散热效果， 更能适用于各种情况。
在此说明书中， 本发明已参照其特定的实施例作了描述。 但是， 很显然仍可以作出各种 修改和变换而不背离本发明的精神和范围。 因此， 说明书和附图应被认为是说明性的而非限 制性的。
Claims
1、 一种具有发光二极管之发光装置， 包含：
一发光二极管模块， 具有一发光二极管；
一电路板基座， 该发光二极管模块设置于该电路板基座的一侧；
一灯杯， 其一侧邻设于该电路板基座的另一侧； 以及
一散热组件， 邻设于该灯杯的另一侧，
其特征在于，
该发光二极管模块及该电路板基座之间设置有一第一锡层，
该电路板基座及该灯杯之间设置有一第二锡层或一第一石墨层， 以及
该灯杯及该散热组件之间设置有一第二石墨层。
2、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该第一锡层及该第 二锡层以印刷涂布方式涂布。
3、 根据权利要求 2所述的具有发光二极管的发光装置， 其特征在于， 该第一锡层及该第 二锡层以回流焊的方式设置。
4、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该电路板基座为一 金属核心印刷电路板。
5、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该散热组件为一金 属散热片。
6、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该散热组件的表面 具有散热鳍片。
7、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该金属散热片贴合 于该第二石墨层。
8、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该电路板基座、 该 灯杯、 与该散热组件以一第一螺固构件而螺固。
9、 根据权利要求 1所述的具有发光二极管的发光装置， 其特征在于， 该灯杯与该散热组 件以一第二螺固构件而螺固。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102103358A TW201430278A (zh) | 2013-01-29 | 2013-01-29 | 具有發光二極體之發光裝置 |
| CN201310053019.8 | 2013-02-19 | ||
| CN201310053019.8A CN103972379A (zh) | 2013-01-29 | 2013-02-19 | 具有发光二极管的发光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019226438A1 (en) * | 2018-05-20 | 2019-11-28 | Abeyatech, Llc | Light emitting diode for low temperature applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104501120A (zh) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | 一种新led灯具散热结构 |
| TWI587270B (zh) * | 2015-11-20 | 2017-06-11 | 友達光電股份有限公司 | 顯示器及其熱電傳導元件 |
| CN106972096A (zh) * | 2016-10-26 | 2017-07-21 | 湾城公司 | 一种散热构造体及应用 |
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| CN101740712A (zh) * | 2009-12-17 | 2010-06-16 | 上海靖耕照明电器有限公司 | 一种led的固晶方法 |
| CN102333986A (zh) * | 2009-06-10 | 2012-01-25 | 史瑞许·D·戴许庞德 | 可定制、持久、高热效率、环保的固态照明装置 |
| CN202308069U (zh) * | 2011-11-04 | 2012-07-04 | 汪荃 | 一种大功率led模组 |
| CN102644866A (zh) * | 2012-03-07 | 2012-08-22 | 厦门天力源光电科技有限公司 | 一种具有良好散热的led灯泡 |
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| CN102234410B (zh) * | 2010-04-28 | 2013-12-25 | 上海合复新材料科技有限公司 | 导热型热固性模塑复合材料及其用途 |
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- 2013-01-29 TW TW102103358A patent/TW201430278A/zh unknown
- 2013-02-19 CN CN201310053019.8A patent/CN103972379A/zh active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102333986A (zh) * | 2009-06-10 | 2012-01-25 | 史瑞许·D·戴许庞德 | 可定制、持久、高热效率、环保的固态照明装置 |
| CN101740712A (zh) * | 2009-12-17 | 2010-06-16 | 上海靖耕照明电器有限公司 | 一种led的固晶方法 |
| CN202308069U (zh) * | 2011-11-04 | 2012-07-04 | 汪荃 | 一种大功率led模组 |
| CN102644866A (zh) * | 2012-03-07 | 2012-08-22 | 厦门天力源光电科技有限公司 | 一种具有良好散热的led灯泡 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019226438A1 (en) * | 2018-05-20 | 2019-11-28 | Abeyatech, Llc | Light emitting diode for low temperature applications |
| EA039238B1 (ru) * | 2018-05-20 | 2021-12-21 | Абеятек, Ллс | Светоизлучающий диод для применения при низких температурах |
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| CN103972379A (zh) | 2014-08-06 |
| TW201430278A (zh) | 2014-08-01 |
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