JP4870426B2 - 熱伝導効率の高い回路板 - Google Patents
熱伝導効率の高い回路板 Download PDFInfo
- Publication number
- JP4870426B2 JP4870426B2 JP2005379899A JP2005379899A JP4870426B2 JP 4870426 B2 JP4870426 B2 JP 4870426B2 JP 2005379899 A JP2005379899 A JP 2005379899A JP 2005379899 A JP2005379899 A JP 2005379899A JP 4870426 B2 JP4870426 B2 JP 4870426B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- circuit board
- circuit
- heat
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
前記熱伝導絶縁層内におけるダイヤモンド粉末の体積比は5vol%〜95vol%の間である
前記絶縁層はエポキシ樹脂で製造されている。
(11)絶縁層
(12)回路
(14)ハンダ
(17)熱伝導絶縁層
(20)発光ダイオード
(90)金属基板
(91)絶縁層
(92)回路
(93)ハンダマスク層
(94)ハンダ
(98)発光ダイオード
Claims (3)
- 主に基板上を絶縁層が被覆しており、絶縁層上に回路が設置され、回路箇所は半導体チップの設置に利用され、回路の外部露出表面上はダイヤモンド粉末を含有する熱伝導絶縁層が被覆しており、当該熱伝導絶縁層は直接的には回路の熱を、間接的に半導体チップの熱を伝導しながら、熱を外界に排除することによって、当該回路板の正常な作用温度を維持する熱伝導効率の高い回路板であって、
前記熱伝導絶縁層はダイヤモンド粉末とポリイミドとを混合して製造されている、熱伝導効率の高い回路板。 - 熱伝導絶縁層内におけるダイヤモンド粉末の体積比は5vol%以上95vol%以下である請求項1記載の熱伝導効率の高い回路板。
- 当該絶縁層はエポキシ樹脂で製造されている請求項2記載の熱伝導効率の高い回路板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005379899A JP4870426B2 (ja) | 2005-12-28 | 2005-12-28 | 熱伝導効率の高い回路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005379899A JP4870426B2 (ja) | 2005-12-28 | 2005-12-28 | 熱伝導効率の高い回路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007180441A JP2007180441A (ja) | 2007-07-12 |
JP4870426B2 true JP4870426B2 (ja) | 2012-02-08 |
Family
ID=38305300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005379899A Expired - Fee Related JP4870426B2 (ja) | 2005-12-28 | 2005-12-28 | 熱伝導効率の高い回路板 |
Country Status (1)
Country | Link |
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JP (1) | JP4870426B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8907473B2 (en) * | 2009-02-02 | 2014-12-09 | Estivation Properties Llc | Semiconductor device having a diamond substrate heat spreader |
KR101131288B1 (ko) | 2010-12-06 | 2012-03-30 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP6469435B2 (ja) * | 2014-10-30 | 2019-02-13 | 太陽誘電ケミカルテクノロジー株式会社 | 構造体及び構造体製造方法 |
WO2024070439A1 (ja) * | 2022-09-29 | 2024-04-04 | ローム株式会社 | 電子素子、および電子素子の搬送体 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4665701A (en) * | 1985-10-30 | 1987-05-19 | Allied Corporation | Hydraulic brake booster with quick take-up and reduced stroke |
JPH0780720B2 (ja) * | 1987-06-04 | 1995-08-30 | 富士通株式会社 | 気相合成ダイヤモンド膜のパタ−ニング方法 |
JPH05326743A (ja) * | 1992-05-19 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体素子搭載用絶縁放熱基板 |
JP3309492B2 (ja) * | 1993-05-28 | 2002-07-29 | 住友電気工業株式会社 | 半導体装置用基板 |
JP2856192B2 (ja) * | 1997-04-10 | 1999-02-10 | 日本電気株式会社 | 半導体装置 |
JP2000174166A (ja) * | 1998-10-02 | 2000-06-23 | Sumitomo Electric Ind Ltd | 半導体搭載パッケ―ジ |
JP2004179257A (ja) * | 2002-11-25 | 2004-06-24 | Alps Electric Co Ltd | 放熱構造を備えた半導体装置 |
JP2004363400A (ja) * | 2003-06-05 | 2004-12-24 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP2007157835A (ja) * | 2005-12-01 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 実装基板 |
-
2005
- 2005-12-28 JP JP2005379899A patent/JP4870426B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007180441A (ja) | 2007-07-12 |
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