CN100366130C - 用于电装置的柔性互连结构以及带有该结构的光源 - Google Patents
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Abstract
一种柔性互连结构(10),其用于快速地消散包括发光元件(300)的电装置生成的热量,所述反光元件例如是发光二极管(LED)和/或激光二极管(LD)。该柔性互连结构(10)包括:(1)至少一个柔性介电膜(20),其上形成有电路迹线(40)和可选的电路元件(30、32、34、36、38),其至少一部分沿着其厚度被除去;以及(2)至少一个附连到所述介电膜(20)的一个表面上的散热件(100),该表面与所述设置有电路迹线(40)的表面相对。该柔性互连结构可以包括多个这样的柔性介电膜(20),每个都支持着电路迹线(40)和/或元件(30、32、34、36、38),并且每个都通过电绝缘层(70)彼此相连。可以利用这种柔性互连结构和发光元件(300)形成具有复杂形状的电装置或光源,其中,所述发光元件附连到散热件(100)上,以便与其热接触。
Description
技术领域
本发明涉及一种用以支持用于控制或操作电装置的电路的柔性互连结构以及一种带有该结构的光源。具体地,本发明涉及一种带有发光元件并且具有改进的热管理能力的互连结构和装置。
背景技术
发光二极管(LED)现在被广泛应用于各种标识、信息板和光源。LED受到青睐的主要原因是其具有相对较高的发光效率(以流明/瓦特为量度)。当用LED信号来替代传统的具有类似发光输出的白炽信号时,可以大量节能。LED技术中没有得到圆满解决的一方面是废热量的有效管理和消除,尤其是对于较高光功率的LED来说,其需要更大的电能。废热量导致过高的结合温度(junction temperatures),导致装置性能和寿命的下降。LED灯的光输出对温度非常敏感,可以被过高的温度永久性地破坏。例如,带有铟的LED的最高推荐操作温度为大约85℃到大约100℃之间。通常,这些装置在25℃下的寿命为50000到100000小时之间(半亮度)。但是,超过90℃时,LED的劣化非常快,因为其随着温度的上升按照一定的指数劣化。
当将LED焊接到支持和/或互连电路板上时,如果不注意,会在阵列制造的过程中导致LED的永远性温度劣化。例如,焊接温度通常会超过250℃,如果LED在这样高的温度下或附近保持一段时间,在其被使用之前会严重地影响其性能。所以,无论在正常使用或应用LED期间是否会产生这种热量,在装配或制造过程中将热量快速地从LED附近消除非常有利。
一种常见的消散安装在绝缘印刷电路板(PCB)上的LED产生的热量的方法是,在每个LED下形成多个穿过PCB厚度的通孔,所述印刷电路板例如是常见的FR-4纤维合成电路板。该通孔中填塞有具有高导热性的金属或合金,并将通与孔附连到PCB上的、与LED相对的散热件相连。但是形成这样的通孔导致制造PCB的成本增加。此外,由于通孔通常具有较小的截面,因此散热率受到通孔导热率的限制。
另一种方法是提供导热衬底,在该衬底上安装电子元件。这些导热衬底通常执行机械支持的功能,还在元件之间提供电连接,并且帮助吸收和消散电子元件生成的热量。这些衬底通常非常昂贵,并需要多步骤的制造过程。例如,衬体由导热陶瓷或金属制成,其镀覆或压制有介电材料。导热陶瓷衬底与金属相比较昂贵,因而更适用于高温应用或次要考虑价钱的装置。当使用镀覆或压制的金属衬底时,镀覆或压制层的电绝缘特性很重要。绝缘镀覆层的击穿电压和介电损耗直接依赖于膜厚,但是热消散率与膜厚反向相关。所以,不得不接受一种折衷的情况,其导致装置的整体效率低。
所以,持续需要提供一种用于LED的互连结构,其能够快速散热,成效比高并且易于制造。此外,也非常希望提供一种用于LED的互连结构,其具有机械的柔性,从而制造出具有明显曲率的装置。
发明内容
柔性互连结构包括柔性介电膜,该膜具有至少一个第一表面和第二表面,以及设置在至少一个膜表面上的电路迹线。此外,可以在介电膜的表面上设置一个或多个电路元件,并且该电路元件与至少一个电路迹线相连,从而形成电路。本发明的柔性互连结构可以快速消散在制造或使用包括这种柔性互连结构的电装置的过程中产生的热量。
根据本发明的一方面,提供一种电装置,包括:(1)柔性互连结构,包括柔性介电膜,该膜具有至少一个第一表面和第二表面,以及设置在至少一个膜表面上的电路元件和电路迹线,该柔性介电膜的至少一部分沿其厚度除去,至少一个散热件附连到一个所述膜表面上,所述散热件覆盖所述柔性膜的所述部分,该部分被除去并且与所述电路元件和所述电路迹线中的至少一个电隔离;以及(2)至少一个发光二极管(LED)或激光二极管(LD),其穿过所述柔性膜的除去部分附连到所述至少一个散热件上,从而使所述LED或LD与所述散热件热接触并且与所述电路迹线中的至少一个电连接。
根据本发明的另一方面,所述电装置是光源。
根据本发明的另一方面,提供一种制造柔性互连结构的方法,该结构能够消散在制造和使用包括这种柔性互连结构的电装置的过程中产生的热量。该方法包括:(1)设置具有第一表面和第二表面的柔性介电膜;(2)在所述表面的至少一个上设置电路元件和电路迹线;以及(3)沿着所述膜的厚度除去其至少一部分,所述部分不包括所述电路元件和所述电路迹线。
根据本发明的另一方面,该方法还包括:将至少一个散热件附连到所述柔性介电膜的一个所述表面上,所述散热件覆盖所述膜被除去的所述至少一部分。
根据本发明的另一方面,提供一种制造包括至少一个LED的电装置的方法,包括:(1)设置具有第一表面和第二表面的柔性介电膜;(2)在所述表面的至少一个上设置电路元件和电路迹线;(3)沿着所述膜的厚度除去其至少一部分,所述部分不包括所述电路元件和所述电路迹线;(4)将至少一个散热件附连到所述柔性介电膜的一个所述表面上,所述散热件覆盖所述膜被除去的所述至少一部分,并且与所述电路元件和所述电路迹线的至少一个电隔离;以及(5)通过所述膜被除去的所述部分将至少一个LED附连到所述至少一个散热件上,从而使LED与散热件热接触并且与电路迹线的至少一个电连接。
附图说明
通过以下参照附图对本发明的详细描述,本发明的其他特征和优点将会易于理解,附图中的相似标记指代相似元件:
图1简要示出本发明的柔性互连结构的剖视图;
图2示出沿着图1的A-A截取的柔性互连结构的剖视图;
图3示出本发明的柔性互连结构,其包括多层支持电路;
图4示出本发明的多层柔性互连结构的另一个实施例;
图5简要示出包括散热件的柔性互连结构;
图6示出柔性互连结构的另一个实施例,其带有穿过介电膜的除去部分延伸的散热件;以及
图7简要示出本发明的基于LED的电装置。
具体实施方式
文中,术语“柔性”的意思是能够弯曲成一定形状,该形状的曲率半径小于大约10cm,优选小于大约1cm。术语“电磁辐射”或“光”可以互换使用。术语“基本透明”的意思是指至少80%、优选90%、更优选95%的透光率。术语“散热件”的意思是一种将热量从热源传送出去或除去的结构或元件。
本发明的柔性互连结构可以等效地应用于包括LED或LD或两者的装置。所以,尽管以LED为例示出,但是LD可以与LED等效替换,视整个装置的设计和目的的情况而定。
图1简要示出本发明的柔性互连结构10的剖视图。图2示出沿着图1的A-A截取的柔性互连结构的剖视图。应该理解,附图并没有按照比例画出。柔性互连结构10包括柔性介电膜20,在该膜上设置有电路元件30、32、34、36和38以及电路迹线40。尽管图1和2仅示出了五个示例性的电路元件30、32、34、36和38,但是可以根据需要在柔性膜20上设置任意数量的电路元件。实际上,现今的微电子制造技术可以在每平方厘米上布置上百个这种元件。电路元件30、32、34、36和38可以是电阻、电容、电感、电源或甚至是集成电路,每个电路元件都包括其他多个相关的电子和电气元件。沿着柔性介电膜20的厚度将部分60、62和64从该膜除去。将每个从柔性介电膜20除去的部分60、62和64设计成能够容纳例如LED或LD的发光元件或者用于保持LED或LD的杯形。所以,根据所需的应用确定这些除去部分的数量、形状和大小。通常,除去部分或孔60、62或64的直径大约为几毫米,或者形成在没有电路元件和电路迹线的预定位置。孔60、62和64可以通过例如激光钻孔、激光切割、机械钻孔、冲孔或蚀刻的方法形成在柔性介电膜中。
尽管图1和2示出的柔性互连结构10包括仅一个膜,但是本发明的柔性互连结构可以包括多个电路层,每层包括一个支持电路迹线和/或电路元件的柔性介电膜。图3示出本发明示例性柔性介电膜的剖视图,其包括两个电路层22和24,该两层被置于其间的电绝缘分离层70分开。此外,最外电路层22最好由电绝缘材料的保护层80保护,该材料设置成覆盖所有的电路元件和电路迹线,如图4所示。不同的电路层22和24的电路通常通过导电通孔连接在一起,所述通孔例如是在适当位置穿过所述层形成的通孔90和92。当本发明的柔性互连结构包括多个电路层时,穿过电路层的所有叠层形成除去部分或孔。
介电膜20通常包括具有高介电常数的聚合体,导电材料可以粘结到该聚合体上。在下一个处理步骤之前,最好对其上形成有电路元件和电路迹线的膜表面或者膜的两个表面进行清洁,通过利用等离子对所述表面进行等离子处理加以清洁,所述等离子由气体生成,该气体从由N2、Ar、Ne、O2、CO2、CF4组成的组中选取。这种等离子处理可以有利地为膜20提供具有更好粘结特性的表面,在该表面上沉积下一层,该层可以是用于形成电路的金属层或另一种聚合体保护层。用于介电膜20的合适材料包括:例如,热塑性聚合体,丙烯酸树脂,例如Mylar(E.I.du Pont de Nemours & Co制造)的聚酯,例如Kapton H或Kapton E(du Pont制造)的聚酰亚胺,Apical AV(Kanegafugi化学工业公司制造),Upilex(UBE工业有限公司制造),以及例如Ultem(通用电气公司制造)的聚醚铣亚胺。合适的介电膜材料需要提供电绝缘,以防止电流流经介电膜的厚度。
保护层80可以由从上述公开中选取的材料制成。保护层80可以包括与柔性膜20相同或不同的材料。可以使用聚合体的引导体(precursor)和随后硬化的溶剂的混合物通过旋转镀覆、喷镀、真空化学沉积形成保护层,。分隔层70通常包括例如siloxane-polyimide-epoxy(SPIE)或氰基丙烯酸盐(cyanoacrylate)。分隔层70也可以通过旋转镀覆、喷镀、真空化学沉积并随后硬化而形成。多层柔性互连结构可以通过将不同的层压合在一起而形成。或者,可以通过顺序地一层形成在另一层上而形成。
柔性介电膜20的理想特征包括弹性模量以及热量和湿度膨胀系数,其可以在处理过程中提供最小的尺寸变化。为保持柔性,柔性介电膜20的厚度通常被最小化。与此同时,介电膜20必须具有足够的刚度(鉴于其厚度或材料组成)以支持位于其一个或两个表面上的金属化层,并且在整个顺序处理步骤中保持尺寸稳定性。通常,膜20的厚度范围在大约1微米到大约5mm之间。
例如,电路元件30、32、34、36和38以及电路迹线40通常通过微电子制造工艺形成在介电膜20的表面上。例如,通过溅射、浸渍、电镀、物理蒸汽沉积、化学蒸汽沉积或者直接粘结或压合金属首先在介电膜20上形成金属化层。然后,通过用光刻图案进行蚀刻,对金属化层进行布图。或者,可以利用例如光刻掩膜的掩膜沉积适合的材料形成电路元件和电路迹线。例如电容和集成电路的某些电路元件需要沉积不止一层,每一层都利用不同的掩膜进行布图。该互连结构还可以通过对导电油墨(conductive ink)直接印制、网格印制或者衬垫印制而形成。
在本发明如图5所示的实施例中,将散热件100附连到柔性互连结构10的一个表面上,该表面通常与设置有电路元件和电路迹线的表面相对。每个散热件100覆盖除去部分或形成在柔性互连结构10中的孔(60、64),并且通常利用例如环氧树脂的电绝缘粘结剂附连到其上。散热件100包括导热材料,例如金属或高导热性能的陶瓷;优选具有高导热性能的金属,例如银、铝或者铜。术语“高导热陶瓷”的意思是导热性能大于大约100W/m/K的陶瓷。散热件100最好具有多个从柔性互连结构40延伸的翼片,以便快速散热。或者,散热件100附连到柔性互连结构10上,以覆盖多于一个的除去部分或孔。在另一个实施例中,将导热材料板附连到柔性互连结构10上,以基本覆盖整个表面区域。散热件100的这些备选实施例提供了用于对流散热的更大的表面区域。
在本发明的一个实施例中,散热件100可以包括用于主动冷却的机构。主动冷却可以比依赖自然对流的冷却更快地消除热量。用于主动冷却的机构包括热管道、执行制冷的机构或者通过帕尔贴效应传送热量的机构。
在如图6所示的本发明另一个实施例中,散热件100具有穿过除去部分或孔60、64延伸的突起102。
在如图7所示的本发明另一个实施例中,电装置200包括柔性互连结构10和至少一个LED300。柔性互连结构10包括具有第一表面16和第二表面18的柔性介电膜20,如上所述的。柔性互连结构10支持附图标记30和34所示的电路元件和电路迹线40,其能够参与到LED300的操作。柔性介电膜20的至少一个部分(60、64)被沿着膜的厚度从膜上除去。至少一个散热件100附连到柔性互连结构10的表面18上,以覆盖被除去的部分或孔(60、64),并且该散热件与电路元件30和34以及电路迹线40电隔离。LED300附连到散热件100上,并且通过例如焊接或导线接合的、LED封装技术领域中的传统方法与包括所述电路元件和电路迹线中的至少一部分的电路电连接。需要指出,图7未示出这种电连接。通常,LED300设置在例如铝的反射金属的反射杯310中,并通过电绝缘的导热粘结剂附连到该反射杯上。通常利用一薄层的导热粘结剂将反射杯310附连到散热件100上,所述粘结剂例如环氧树脂和金属颗粒的混合物,所述金属颗粒例如是铜、银或镍颗粒。最好将整个电装置200设置在保护外壳中,该保护外壳包括透光的盖子,使得LED300发出的光可以穿透该盖子,并且通过该盖子设置电源引线。本发明的电装置可以使用的LED发出的电磁(EM)辐射有很宽的范围,从紫外(UV)到可见光。在本发明的一个实施例中,从LED发出的EM辐射通过设置在LED300附近的光致发光材料被转换成具有其他波长的EM辐射。例如,反射杯310可以填充有透光聚合物树脂和颗粒形式的光致发光材料的混合物。或者,LED300可以涂有这种混合物,并且反射杯310填充有透光聚合物树脂。
本发明的柔性互连结构具有快速散热的能力,因此基于LED的电装置的结构可以具有复杂的形状,例如具有尖锐边缘或较小曲率半径的形状,难以用安装在刚性印刷电路板上的LED形成上述装置。例如,以具有一定形状的导热材料的形式出现的散热件可以和本发明的柔性互连结构一起使用,从由LED和LD组成的组中选取的发光元件设置成与散热件接触,从而在所有方向上提供光。这种形状的结构能够具有弯曲表面或者具有尖锐边缘或角部的表面。实际上,本发明的柔性互连结构非常适于设置在这种形状的结构上。这种形状的散热件可以是中空结构,其能够促进有效的散热。而且,用于主动冷却的机构,例如以上公开的机构中的一种,可以设置在该中空散热件中,以便进一步提高消除发光元件的热量的能力。根据本发明的柔性互连结构的设计,可以有效的散热,从而可用于LED具有更高电能输入的应用场合,因此具有更高的亮度和可靠性,并且在许多情况下可以减少一个系统所需的LED的总数。
根据本发明的一方面,提供了一种制造基于LED的电装置的方法,该电装置具有快速消散LED产生的热量的能力。该方法包括:设置具有第一表面和第二表面的柔性介电膜;在所述表面的至少一个上设置电路元件和电路迹线;沿着所述膜的厚度除去其至少一部分,所述部分不包括所述电路元件和所述电路迹线;将至少一个散热件附连到所述柔性介电膜的一个所述表面上,所述散热件基本覆盖所述膜被除去的所述至少一部分,并且与所述电路元件和所述电路迹线的至少一个电隔离;以及通过所述膜被除去的所述部分将至少一个LED附连到所述至少一个散热件上,从而使LED与散热件热接触并且与电路迹线的至少一个电连接。上文中已经介绍了包括电路元件和电路迹线的柔性互连结构的各种元件的材料选取和制造方法。
根据本发明的另一个实施例,用于制造基于LED的电装置的方法包括在多层柔性互连结构上设置至少一个LED的步骤,该多层互连结构包括多个支持电路的层和覆盖所述柔性互连部分的一部分的散热件,所述部分被去除,从而形成除去的部分或者孔,通过该除去的部分或孔将至少一个LED附连到散热件上。该多层柔性互连结构通过如下步骤形成:设置多个柔性介电膜,每个都具有两个相对表面;在每个柔性介电膜的至少一个表面上形成至少一个电路,每个电路包括互连的电路元件和电路迹线;将其上形成有电路的介电膜与电绝缘材料形成的分隔层附连在一起,每个分隔层设置在两个介电膜之间,位于不同介电膜上的电路通过金属通孔连接在一起;沿着多层柔性互连结构的厚度除去该柔性互连结构的部分,从而形成除去的部分或孔;将散热件附连到多层柔性互连结构的外表面上;以及,通过除去的部分将至少一个LED附连到散热件上,从而在LED和散热件之间形成热接触。
根据本发明的另一个实施例,该方法包括如下步骤。(a)通过以下步骤形成多层叠板:(1)设置柔性介电膜;(2)在柔性介电膜的一个表面上形成第一电路;(3)在该电路上沉积电绝缘材料形成的分隔层;(4)在所述分隔层的露出表面上形成第二电路;(5)可选地重复步骤(3)和(4),重复次数根据需要而定,以形成多层叠板。(b)沿着多层叠板的整个厚度除去其至少一部分,该部分不包括电路的电元件,从而形成除去部分或孔。(c)将散热件附连到多层叠板的外表面上,基本覆盖所述除去部分或孔。(d)将至少一个LED附连到散热件上,以便通过除去部分在两者之间形成热接触。
本发明的方法的电路可以通过如下步骤形成:在下置层上沉积至少一种金属化层,然后蚀刻该金属化层,以形成不同的电元件。可以将不止一层形成在另一层的顶部之上,从而形成某些例如电容或集成电路的电元件。或者,可通过利用设置在下置层上的掩膜对材料进行沉积来形成。
根据本发明的另一方面,LED设置在反射杯中,该反射杯附连到散热件上,两者热接触。
根据本发明的另一方面,该反射杯填充有基本透明的聚合体树脂和至少一种光致发光的材料的混合物。
本发明的另一方面,用来制造本发明的基于LED的电装置的方法还包括将基于LED的电装置设置在保护外壳中的步骤,该外壳包括设置在LED发出的光的光路上的基本透明的盖子。该基于LED的电装置被用作汽车、交通信号灯、信息板或显示器的光源。
尽管已经参照各种实施例对本发明进行了描述,但是应该理解,本领域技术人员可以通过阅读说明书在不脱离本发明权利要求限定范围的条件下对元件进行各种组合、对本发明的实施方式做出改变、等效修改或改进。.
Claims (57)
1.一种柔性互连结构(10),包括:
柔性介电膜(20),该膜具有两个相对的表面,所述介电膜(20)的至少一部分被沿其厚度除去,形成至少一个没有电路迹线的除去部分(60、62、64);
设置在至少一个所述表面上的电路迹线(40);以及
至少一个附连到所述介电膜(20)的表面上的散热件(100),所述至少一个散热件(100)覆盖所述至少一个除去部分(60、62、64),
所述柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状。
2.如权利要求1所述的柔性互连结构(10),其中,所述介电膜(20)包括柔性材料,该材料穿过所述介电膜的厚度提供电隔离,所述材料是从由热塑性聚合体、丙烯酸树脂、聚酯、聚酰亚胺和聚醚铣亚胺组成的组中选取的。
3.如权利要求1所述的柔性互连结构(10),其中,所述介电膜(20)的厚度在1微米到5毫米的范围内。
4.如权利要求1所述的柔性互连结构(10),还包括从由电阻、电容、电感、集成电路和电源组成的组中选取的至少一种电路元件(30、32、34、36、38)。
5.如权利要求4所述的柔性互连结构(10),还包括介电保护层,其设置成覆盖所述电路元件(30、32、34、36、38)和电路迹线(40)。
6.如权利要求1所述的柔性互连结构(10),其中,所述至少一个散热件(100)包括导热材料。
7.如权利要求6所述的柔性互连结构(10),其中,所述导热材料是从由金属和陶瓷组成的组中选取的。
8.如权利要求1所述的柔性互连结构(10),其中,所述至少一个散热件(100)具有远离所述介电膜延伸的翼片。
9.如权利要求1所述的柔性互连结构(10),其中,所述散热件(100)包括用以将热量从设置于散热件上的电元件带走的导热管。
10.如权利要求1所述的柔性互连结构(10),其中,所述散热件(100)包括用于主动冷却的机构。
11.如权利要求10所述的柔性互连结构(10),其中,所述主动冷却通过一种机构执行,该机构是从强制冷却、制冷和通过帕尔贴效应进行热传递的机构中选取的。
12.如权利要求1所述的柔性互连结构(10),其中,所述至少一个散热件(100)覆盖多个所述除去部分(60、62、64)。
13.如权利要求1所述的柔性互连结构(10),其中,所述至少一个散热件(100)包括由从金属和陶瓷组成的组中选取的材料制成的主体,所述主体基本覆盖所述介电膜(20)的一个整个表面,该表面与其上设置有电路迹线(40)的表面相对。
14.一种柔性互连结构(10),包括:
(a)多层叠板,包括:
(1)多个柔性介电膜(20),每个都具有两个相对表面,并且在每个所述多个介电膜(20)的至少一个表面上支持至少一个电路,所述电路包括电路迹线(40),被支持在所述多个柔性介电膜(20)上的电路通过多个通孔(90、92)互连,所述柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;以及
(2)设置在一对所述柔性介电膜(20)之间的电绝缘层(70),用以将支持在所述介电膜上的电路分隔开;
其中,沿着所述多层叠板的整个厚度除去所述多层叠板的至少一部分,从而形成至少一个没有电路迹线(40)的除去部分(60、62、64);
(b)至少一个散热件(100),其附连到所述多层叠板的外表面上,所述至少一个散热件(100)覆盖所述至少一个除去部分(60、62、64)。
15.如权利要求14所述的柔性互连结构(10),其中,每个所述多个柔性介电膜(20)都包括柔性材料,该材料穿过所述介电膜(20)的厚度提供电隔离,所述材料是从由热塑性聚合体、丙烯酸树脂、聚酯、聚酰亚胺和聚醚铣亚胺组成的组中选取的。
16.如权利要求14所述的柔性互连结构(10),其中,每个所述介电膜(20)的厚度在大约1微米到大约5毫米的范围内。
17.如权利要求14所述的柔性互连结构(10),还包括从由电阻、电容、电感、集成电路和电源组成的组中选取的至少一种电路元件(30、32、34、36、38),其设置在所述介电膜(20)的至少一个上。
18.如权利要求14所述的柔性互连结构(10),还包括介电保护层(80),其设置成覆盖露出的电路元件和电路迹线(40)。
19.如权利要求14所述的柔性互连结构(10),其中,所述至少一个散热件(100)包括导热材料。
20.如权利要求19所述的柔性互连结构(10),其中,所述导热材料是从由金属和陶瓷组成的组中选取的。
21.如权利要求14所述的柔性互连结构(10),其中,所述至少一个散热件(100)具有从所述介电膜延伸的翼片。
22.如权利要求14所述的柔性互连结构(10),其中,所述散热件(100)包括用以将热量从设置于散热件上的电元件带走的导热管。
23.如权利要求14所述的柔性互连结构(10),其中,所述散热件(100)包括用于主动冷却的机构。
24.如权利要求23所述的柔性互连结构(10),其中,所述主动冷却通过一种机构执行,该机构是从强制冷却、制冷和通过帕尔贴效应进行热传递的机构中选取的。
25.如权利要求14所述的柔性互连结构(10),其中,所述至少一个散热件(100)覆盖所述多层叠板的多个所述除去部分(60、62、64)。
26.如权利要求14所述的柔性互连结构(10),其中,所述至少一个散热件(100)包括由从金属和陶瓷组成的组中选取的材料制成的主体,所述主体基本覆盖所述多层的一个整个表面。
27.一种电装置,包括:
(a)柔性互连结构(10),该结构包括:
(1)柔性介电膜(20),该膜具有两个相对的表面,所述介电膜的至少一部分被沿其厚度除去,形成至少一个没有电路迹线除去部分(60、62、64),且所述柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;
(2)设置在所述表面的至少一个上的电路迹线(40);和
(3)至少一个附连到所述介电膜(20)的表面上的散热件(100),所述至少一个散热件(100)覆盖所述至少一个除去部分(60、62、64),并且与所述电路迹线(40)的至少一个电隔离;以及
(b)至少一个发光元件(300),其从由发光二极管、激光二极管和两者的组合组成的组中选取,所述至少一个发光元件附连到所述至少一个散热件上,并通过所述除去部分(60、62、64)与该散热件热接触,所述至少一个发光元件与所述电路迹线(40)电连接。
28.如权利要求27所述的电装置,其中,所述至少一个发光元件设置在反射杯(310)中,该反射杯附连到所述至少一个散热件(100)上,并通过所述除去部分与该散热件(100)热接触。
29.如权利要求28所述的电装置,其中,所述反射杯(310)包括基本透明的树脂和至少一种光致发光材料的混合物,该光致发光材料能够吸收所述LED发出的第一电磁辐射的一部分,并将所述第一电磁辐射的所述部分转变为具有不同波长范围的第二电磁辐射。
30.如权利要求27所述的电装置,还包括至少一个被支持在所述柔性介电膜(20)上的电路元件(30、32、34、36、38),所述电路元件(30、32、34、36、38)是从由电阻、电容、电感、集成电路和电源组成的组中选取的。
31.如权利要求30所述的电装置,其中,所述介电膜(20)包括柔性材料,该材料在所述介电膜(20)的厚度两侧提供电隔离,所述材料是从由热塑性聚合体、丙烯酸树脂、聚酯、聚酰亚胺和聚醚铣亚胺组成的组中选取的。
32.如权利要求27所述的电装置,其中,所述介电膜(20)的厚度在1微米到5毫米的范围内。
33.如权利要求27所述的电装置,还包括介电保护层,其设置成覆盖所述电路元件和电路迹线(40)。
34.如权利要求27所述的电装置,其中,所述至少一个散热件(100)包括导热材料。
35.如权利要求34所述的电装置,其中,所述导热材料是从由金属和陶瓷组成的组中选取的。
36.如权利要求27所述的电装置,其中,所述至少一个散热件(100)具有翼片,该翼片远离所述介电膜(20)延伸。
37.如权利要求27所述的电装置,其中,所述散热件(100)包括用以将热量从设置于散热件上的电元件带走的导热管。
38.如权利要求27所述的电装置,其中,所述散热件(100)包括用于主动冷却的机构。
39.如权利要求38所述的电装置,其中,所述主动冷却通过一种机构执行,该机构是从强制冷却、制冷和通过帕尔贴效应进行热传递的机构中选取的。
40.如权利要求27所述的电装置,其中,所述至少一个散热件(100)覆盖多个所述除去部分(60、62、64)。
41.如权利要求27所述的电装置,其中,所述至少一个散热件(100)包括由从金属和陶瓷组成的组中选取的材料制成的主体,所述主体基本覆盖所述介电膜(20)的一个整个表面,该表面与其上设置有电路迹线(40)的表面相对。
42.一种电装置,包括:
(a)多层叠板,包括:
(1)多个柔性介电膜(20),每个都具有两个相对表面,并且在每个所述多个介电膜(20)的至少一个表面上支持至少一个电路,所述电路包括电路迹线(40),被支持在所述多个柔性介电膜(20)上的电路通过多个通孔(90、92)互连,且所述多个柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;以及
(2)设置在一对所述柔性介电膜(20)之间的电绝缘层(70),用以将支持在所述介电膜上的电路分隔开;
其中,沿着所述多层叠板的整个厚度除去所述多层叠板的至少一部分,从而形成没有电路迹线(40)的除去部分(60、62、64);
(b)至少一个散热件(100),其附连到所述多层叠板的外表面上,所述至少一个散热件(100)覆盖所述至少一个除去部分(60、62、64);以及
(c)至少一个发光元件(300),其从由发光二极管(LDE)、激光二极管(LD)和两者的组合组成的组中选取,所述至少一个发光元件(300)附连到所述至少一个散热件(100)上,并通过所述至少一个除去部分与该散热件热接触,所述至少一个发光元件(300)与所述电路迹线(40)电连接。
43.如权利要求42所述的电装置,其中,所述至少一个发光元件(300)设置在反射杯(310)中,该反射杯附连到所述至少一个散热件(100)上,并通过所述至少一个除去部分(60、62、64)与该散热件热接触。
44.如权利要求43所述的电装置,其中,所述反射杯(310)包括基本透明的树脂和至少一种光致发光材料的混合物,该光致发光材料能够吸收所述发光元件(300)发出的第一电磁(EM)辐射的一部分,并将所述第一电磁辐射的所述部分转变为具有不同波长范围的第二电磁辐射。
45.一种制造包括至少一种从由LED和LD组成的组中选取的发光元件(300)的电装置的方法,所述方法包括:
(a)在具有两个相对表面的柔性介电膜(20)的至少一个表面上设置电路迹线(40),该柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;
(b)沿着所述介电膜(20)的厚度除去该介电膜的至少一部分,从而形成不带有所述电路迹线(40)的除去部分(60、62、64);
(c)将至少一个散热件(100)附连到所述柔性介电膜(20)的一个所述表面上,所述散热件(100)覆盖所述至少一个除去部分(60、62、64),并且与所述电路迹线(40)的至少一个电隔离;以及
(d)通过所述除去部分(60、62、64)将所述至少一个发光元件(300)附连到所述至少一个散热件(100)上,从而使所述至少一个发光元件(300)与所述散热件(100)热接触。
46.如权利要求45所述的用于制造电装置的方法,其中,所述附连所述至少一个发光元件(300)的步骤包括将所述至少一个发光元件(300)设置在反射杯(310)中并将所述杯附连到所述至少一个散热件(100)上。
47.如权利要求45所述的用于制造电装置的方法,还包括在所述至少一个发光元件(300)和所述电路迹线(40)中的至少一个之间形成电连接。
48.如权利要求46所述的用于制造电装置的方法,还包括用基本透明的树脂和至少一种光致发光材料的混合物填充所述反射杯(310),该光致发光材料能够吸收所述发光元件(300)发出的第一电磁(EM)辐射的一部分,并将所述第一电磁辐射的所述部分转变为具有不同波长范围的第二电磁辐射。
49.一种制造包括至少一种从由LED和LD组成的组中选取的发光元件(300)的电装置的方法,所述方法包括:
(a)形成多层叠板,包括如下步骤
(1)设置多个柔性介电膜(20),每个都具有两个相对表面,该柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;
(2)在所述多个柔性介电膜(20)的每一个的至少一个表面上形成至少一个电路,该电路包括电路迹线(40);
(3)将所述多个柔性介电膜(20)与电绝缘层(70)附连到一起,每个所述电绝缘层(70)设置在两个所述柔性介电膜(20)之间,将支持在所述柔性介电膜上的电路分开;以及
(4)形成多个金属通孔(90、92),其将被支持在所述多个柔性介电膜(20)上的至少两个电路电连接;
(c)沿着所述多层叠板的整个厚度除去所述多层叠板的至少一部分,以形成至少一个不带有电路迹线(40)的除去部分(60、62、64);
(d)将至少一个散热件(100)附连到所述多层叠板的外表面上,所述至少一个散热件(100)覆盖所述至少一个除去部分(60、62、64);以及
(e)将所述至少一个发光元件(300)附连到所述至少一个散热件(100)上,使该发光元件与散热件热接触,并且与所述电路迹线(40)中的至少一个电接触。
50.如权利要求49所述的用于制造电装置的方法,其中,所述将所述至少一个发光元件(300)附连到所述至少一个散热件(100)上的步骤包括将所述至少一个发光元件(300)设置在反射金属杯(310)中,并将所述杯(310)附连到所述至少一个散热件(100)上。
51.一种制造包括至少一种从由LED和LD组成的组中选取的发光元件(300)的电装置的方法,所述方法包括:
(a)形成多层叠板,包括如下步骤
(1)设置柔性介电膜(20),其具有两个相对的第一和第二表面,该柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;
(2)在所述柔性介电膜(20)的所述第一表面上形成第一电路;
(3)在所述第一电路上沉积包括电绝缘材料的分隔层(70);
(4)在所述分隔层(70)的露出表面上形成第二电路;
(b)沿着所述多层叠板的厚度除去其至少一部分,从而形成至少一个没有电路迹线的除去部分(60、62、64);
(c)将散热件(100)附连到所述柔性介电膜(20)的所述第二表面上,以覆盖所述至少一个除去部分(60、62、64);以及
(d)将至少一个发光元件(300)附连到所述散热件(100)上,从而通过所述至少一个除去部分(60、62、64)在两者之间形成热接触。
52.如权利要求27所述的用于制造电装置的方法,还包括在步骤(b)之前至少重复一次步骤(3)和(4)。
53.一种光源,包括:
(a)具有一定形状的结构,该结构由导热材料形成,并具有有一定形状的表面;
(b)柔性互连结构(10),其包围所述具有一定形状的结构,并基本与所述具有一定形状的表面接触,其中,所述柔性互连结构(10)包括:
(1)柔性介电膜(20),其具有两个相对的膜表面,所述介电膜(20)的至少一部分被沿其厚度除去,形成至少一个没有电路迹线除去部分(60、62、64),所述柔性介电膜被构造成保持柔性,使得该介电膜可弯曲为曲率半径小于10cm的形状;和
(2)设置在至少一个所述膜表面上的电路迹线(40);以及
(c)至少一种从由LED和LD组成的组中选取的发光元件(300),其通过所述介电膜(20)的所述至少一个除去部分附连到所述具有一定形状的表面上,从而与所述具有一定形状的结构热接触,所述至少一个发光元件(300)与所述电路迹线(40)中的至少一个电连接。
54.如权利要求53所述的光源,其中,所述具有一定形状的结构具有从由如下表面组成的组中选取的表面:曲面,具有至少一个尖锐角部或尖锐边缘的表面。
55.如权利要求53所述的光源,其中,所述至少一个发光元件(300)设置在具有反射表面的杯(310)中,所述杯(310)通过所述介电膜(20)的所述至少一个除去部分(60、62、64)附连到所述具有一定形状的结构上。
56.如权利要求55所述的光源,其中,所述具有一定形状的结构是中空的。
57.如权利要求56所述的光源,还包括用于主动冷却的机构,所述机构设置在所述具有一定形状的结构的空腔中。
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Families Citing this family (306)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002225863A1 (en) * | 2000-10-25 | 2002-05-06 | Velcro Industries B.V. | Securing electrical conductors |
US7247516B1 (en) * | 2000-11-15 | 2007-07-24 | Skyworks Solutions, Inc. | Method for fabricating a leadless chip carrier |
US7273987B2 (en) | 2002-03-21 | 2007-09-25 | General Electric Company | Flexible interconnect structures for electrical devices and light sources incorporating the same |
TWI286832B (en) * | 2002-11-05 | 2007-09-11 | Advanced Semiconductor Eng | Thermal enhance semiconductor package |
US7128442B2 (en) * | 2003-05-09 | 2006-10-31 | Kian Shin Lee | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
US20050018435A1 (en) * | 2003-06-11 | 2005-01-27 | Selkee Tom V. | Portable utility light |
US7777430B2 (en) | 2003-09-12 | 2010-08-17 | Terralux, Inc. | Light emitting diode replacement lamp |
US7300173B2 (en) | 2004-04-08 | 2007-11-27 | Technology Assessment Group, Inc. | Replacement illumination device for a miniature flashlight bulb |
US8746930B2 (en) | 2003-11-04 | 2014-06-10 | Terralux, Inc. | Methods of forming direct and decorative illumination |
US8702275B2 (en) | 2003-11-04 | 2014-04-22 | Terralux, Inc. | Light-emitting diode replacement lamp |
US8632215B2 (en) | 2003-11-04 | 2014-01-21 | Terralux, Inc. | Light emitting diode replacement lamp |
DE102004009284A1 (de) * | 2004-02-26 | 2005-09-15 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung |
US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7316509B2 (en) * | 2004-06-30 | 2008-01-08 | Intel Corporation | Apparatus for electrical and optical interconnection |
PT1846949T (pt) * | 2005-01-05 | 2018-11-29 | Philips Lighting Holding Bv | Aparelho termicamente e eletricamente condutor |
WO2007000037A1 (en) * | 2005-06-29 | 2007-01-04 | Mitchell, Richard, J. | Bendable high flux led array |
EP1908339B1 (en) * | 2005-07-28 | 2010-10-06 | Velcro Industries B.V. | Mounting electrical components |
US8465175B2 (en) | 2005-11-29 | 2013-06-18 | GE Lighting Solutions, LLC | LED lighting assemblies with thermal overmolding |
JP5038398B2 (ja) | 2006-04-25 | 2012-10-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Ledアレイグリッド、前記ledグリッド、及び前記において使用するledコンポーネントを作製する方法並びに装置 |
US20070258190A1 (en) * | 2006-05-05 | 2007-11-08 | Irwin Patricia C | High temperature capacitors and method of manufacturing the same |
JP2008034622A (ja) * | 2006-07-28 | 2008-02-14 | Sharp Corp | 半導体発光素子アセンブリ |
KR101453419B1 (ko) * | 2006-09-06 | 2014-10-23 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 2차원 인장 가능하고 구부릴 수 있는 장치 |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
US7952262B2 (en) * | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
EP1906084B1 (en) * | 2006-09-30 | 2010-03-03 | Ruud Lighting, Inc. | Modular LED units |
US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US20080122364A1 (en) * | 2006-11-27 | 2008-05-29 | Mcclellan Thomas | Light device having LED illumination and an electronic circuit board |
US7824056B2 (en) * | 2006-12-29 | 2010-11-02 | Hussmann Corporation | Refrigerated merchandiser with LED lighting |
EP2136400A4 (en) * | 2007-03-12 | 2011-12-21 | Toyo Tanso Co | RADIANT ELEMENT, CIRCUIT BOARD USING THE ELEMENT, ELECTRONIC PART MODULE, AND METHOD OF MANUFACTURING THE MODULE |
DE102007023651A1 (de) * | 2007-05-22 | 2008-11-27 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungseinrichtung, Hinterleuchtungsvorrichtung und Anzeigevorrichtung |
EP1998101B2 (en) * | 2007-05-30 | 2019-09-25 | OSRAM GmbH | Lighting device |
EP1998214B1 (en) * | 2007-05-30 | 2012-10-10 | Osram AG | Lighting device |
US20120037886A1 (en) * | 2007-11-13 | 2012-02-16 | Epistar Corporation | Light-emitting diode device |
DE102007057240A1 (de) * | 2007-11-28 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Anordnung mit einem Licht emittierendem Modul und einem flexiblen Leitungsträger |
US7864506B2 (en) * | 2007-11-30 | 2011-01-04 | Hamilton Sundstrand Corporation | System and method of film capacitor cooling |
DE102008006536B4 (de) * | 2008-01-29 | 2011-02-17 | Med Licht Gmbh | Kühlsystem für auf einer Trägerplatine angeordnete Leistungshalbleiter |
US8061886B1 (en) | 2008-04-30 | 2011-11-22 | Velcro Industries B.V. | Securing electrical devices |
US8297796B2 (en) * | 2008-08-01 | 2012-10-30 | Terralux, Inc. | Adjustable beam portable light |
US8049097B2 (en) * | 2008-08-11 | 2011-11-01 | General Electric Company | Solar cell including cooling channels and method for fabrication |
US20100046221A1 (en) * | 2008-08-19 | 2010-02-25 | Jason Loomis Posselt | LED Source Adapted for Light Bulbs and the Like |
US8220980B2 (en) * | 2008-09-23 | 2012-07-17 | Tyco Electronics Corporation | Socket assembly for light-emitting devices |
TW201022327A (en) * | 2008-10-30 | 2010-06-16 | Solvay Advanced Polymers Llc | Hydroquinone-containing polyesters having improved whiteness |
US7892022B2 (en) * | 2009-02-06 | 2011-02-22 | Tyco Electronics Corporation | Jumper connector for a lighting assembly |
US20110085304A1 (en) * | 2009-10-14 | 2011-04-14 | Irvine Sensors Corporation | Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias |
CN101778539B (zh) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | 一种pcb加工工艺方法 |
US8319247B2 (en) * | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
US8486761B2 (en) | 2010-03-25 | 2013-07-16 | Koninklijke Philips Electronics N.V. | Hybrid combination of substrate and carrier mounted light emitting devices |
CN102214772B (zh) * | 2010-04-12 | 2013-04-24 | 一诠精密电子工业(中国)有限公司 | 高功率发光二极管支架 |
CN101944561B (zh) * | 2010-08-23 | 2012-09-26 | 深圳市海达威工业自动化设备有限公司 | Led灌胶方法 |
JP2012084628A (ja) * | 2010-10-08 | 2012-04-26 | Sumitomo Electric Ind Ltd | 白色反射フレキシブルプリント回路基板 |
US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
WO2012112310A1 (en) * | 2011-02-18 | 2012-08-23 | 3M Innovative Properties Company | Flexible light emitting semiconductor device having thin dielectric substrate |
DE102011017790A1 (de) * | 2011-04-29 | 2012-10-31 | Osram Ag | Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung |
WO2012158339A1 (en) | 2011-05-13 | 2012-11-22 | 3M Innovative Properties Company | Flexible lighting assembly |
US9066443B2 (en) | 2011-09-13 | 2015-06-23 | General Electric Company | Overlay circuit structure for interconnecting light emitting semiconductors |
CN103827893A (zh) * | 2011-09-28 | 2014-05-28 | 金雅拓技术亚洲有限公司 | 制造具有微电路的数据载体的方法 |
CN104024723B (zh) * | 2011-11-23 | 2016-08-24 | 3M创新有限公司 | 具有三维结构的柔性发光半导体器件 |
JP2015514001A (ja) * | 2012-03-21 | 2015-05-18 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 紫外線ledを用いた浄水システム |
JP6166104B2 (ja) * | 2012-06-08 | 2017-07-19 | エルジー イノテック カンパニー リミテッド | ランプユニット及びそれを用いた車両 |
JP6060578B2 (ja) | 2012-09-14 | 2017-01-18 | 日亜化学工業株式会社 | 発光装置 |
CN103715330B (zh) * | 2012-09-28 | 2018-04-20 | 通用电气公司 | 用于互连发光半导体的覆盖式电路结构 |
WO2014113045A1 (en) * | 2013-01-16 | 2014-07-24 | 3M Innovative Properties Company | Light emitting semiconductor device and substrate therefore |
FI20135113L (fi) * | 2013-02-05 | 2014-08-06 | Tellabs Oy | Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä |
JP6083253B2 (ja) * | 2013-02-21 | 2017-02-22 | 日亜化学工業株式会社 | 発光装置の積層体 |
EP2790474B1 (en) | 2013-04-09 | 2016-03-16 | Harman Becker Automotive Systems GmbH | Thermoelectric cooler/heater integrated in printed circuit board |
CN203279336U (zh) * | 2013-04-27 | 2013-11-06 | 中兴通讯股份有限公司 | 一种内散热的终端 |
US9587800B2 (en) | 2013-11-21 | 2017-03-07 | Ford Global Technologies, Llc | Luminescent vehicle molding |
US9782504B2 (en) | 2013-11-21 | 2017-10-10 | Ford Global Technologies, Inc. | Self-disinfecting surface with printed LEDs for a surface of a vehicle |
US9625115B2 (en) | 2013-11-21 | 2017-04-18 | Ford Global Technologies, Llc | Photoluminescent vehicle graphics |
US9989216B2 (en) | 2013-11-21 | 2018-06-05 | Ford Global Technologies, Llc | Interior exterior moving designs |
US9492575B2 (en) | 2013-11-21 | 2016-11-15 | Ford Global Technologies, Llc | Color changing and disinfecting surfaces |
US9376058B2 (en) | 2013-11-21 | 2016-06-28 | Ford Global Technologies, Llc | Fluid level indicator using photoluminescent illumination |
US9809160B2 (en) | 2013-11-21 | 2017-11-07 | Ford Global Technologies, Llc | Tailgate illumination system |
US9950658B2 (en) | 2013-11-21 | 2018-04-24 | Ford Global Technologies, Llc | Privacy window system |
US9961745B2 (en) | 2013-11-21 | 2018-05-01 | Ford Global Technologies, Llc | Printed LED rylene dye welcome/farewell lighting |
US9868387B2 (en) | 2013-11-21 | 2018-01-16 | Ford Global Technologies, Llc | Photoluminescent printed LED molding |
US9682649B2 (en) | 2013-11-21 | 2017-06-20 | Ford Global Technologies, Inc. | Photoluminescent winch apparatus |
US9688186B2 (en) | 2013-11-21 | 2017-06-27 | Ford Global Technologies, Llc | Illuminating decal for a vehicle |
US9493113B2 (en) | 2013-11-21 | 2016-11-15 | Ford Global Technologies, Llc | Photoluminescent cargo area illumination |
US9533613B2 (en) | 2013-11-21 | 2017-01-03 | Ford Global Technologies, Llc | Photoluminescent fuel filler door |
US9434302B2 (en) | 2013-11-21 | 2016-09-06 | Ford Global Technologies,Llc | Photoluminescent bin lamp |
US9464887B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Illuminated hitch angle detection component |
US9586518B2 (en) | 2013-11-21 | 2017-03-07 | Ford Global Technologies, Llc | Luminescent grille bar assembly |
US9440583B2 (en) | 2013-11-21 | 2016-09-13 | Ford Global Technologies, Llc | Vehicle dome lighting system with photoluminescent structure |
US9613549B2 (en) | 2013-11-21 | 2017-04-04 | Ford Global Technologies, Llc | Illuminating badge for a vehicle |
US9487136B2 (en) | 2013-11-21 | 2016-11-08 | Ford Global Technologies, Llc | System and method to locate vehicle equipment |
US9463737B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Illuminated seatbelt assembly |
US9499090B2 (en) | 2013-11-21 | 2016-11-22 | Ford Global Technologies, Llc | Spoiler using photoluminescent illumination |
US9393903B2 (en) | 2013-11-21 | 2016-07-19 | Ford Global Technologies, Llc | Photoluminescent engine compartment lighting |
US9399427B2 (en) | 2013-11-21 | 2016-07-26 | Ford Global Technologies, Llc | Photoluminescent device holder |
US9796304B2 (en) | 2013-11-21 | 2017-10-24 | Ford Global Technologies, Llc | Vehicle floor lighting system having a pivotable base with light-producing assembly coupled to base |
US9586523B2 (en) | 2013-11-21 | 2017-03-07 | Ford Global Technologies, Llc | Vehicle lighting assembly |
US9796325B2 (en) | 2013-11-21 | 2017-10-24 | Ford Global Technologies, Llc | Exterior light system for a vehicle |
US9771019B2 (en) | 2013-11-21 | 2017-09-26 | Ford Global Technologies, Inc. | Photoluminescent vehicle illumination |
US9797575B2 (en) | 2013-11-21 | 2017-10-24 | Ford Global Technologies, Llc | Light-producing assembly for a vehicle |
US9440584B2 (en) | 2013-11-21 | 2016-09-13 | Ford Global Technologies, Llc | Photoluminescent vehicle console |
US9649877B2 (en) | 2013-11-21 | 2017-05-16 | Ford Global Technologies, Llc | Vehicle light system with illuminating wheel assembly |
US9539941B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Photoluminescent cupholder illumination |
US9849831B2 (en) | 2013-11-21 | 2017-12-26 | Ford Global Technologies, Llc | Printed LED storage compartment |
US9212809B2 (en) | 2013-11-21 | 2015-12-15 | Ford Global Technologies, Llc | Photoluminescent dynamic lighting |
US9315145B2 (en) | 2013-11-21 | 2016-04-19 | Ford Global Technologies, Llc | Photoluminescent tailgate and step |
US9457712B2 (en) | 2013-11-21 | 2016-10-04 | Ford Global Technologies, Llc | Vehicle sun visor providing luminescent lighting |
US9446709B2 (en) | 2013-11-21 | 2016-09-20 | Ford Global Technologies, Llc | Vehicle backlit assembly with photoluminescent structure |
US10363867B2 (en) | 2013-11-21 | 2019-07-30 | Ford Global Technologies, Llc | Printed LED trim panel lamp |
US9694743B2 (en) | 2013-11-21 | 2017-07-04 | Ford Global Technologies, Llc | Dual purpose lighting assembly |
US9573516B2 (en) | 2013-11-21 | 2017-02-21 | Ford Global Technologies, Llc | Rear vehicle lighting system |
US9495040B2 (en) | 2013-11-21 | 2016-11-15 | Ford Global Technologies, Llc | Selectively visible user interface |
US9764686B2 (en) | 2013-11-21 | 2017-09-19 | Ford Global Technologies, Llc | Light-producing assembly for a vehicle |
US9434304B2 (en) | 2013-11-21 | 2016-09-06 | Ford Global Technologies, Llc | Illuminated vehicle compartment |
US9487127B2 (en) | 2013-11-21 | 2016-11-08 | Ford Global Technologies, Llc | Photoluminescent vehicle step lamp |
US9464886B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Luminescent hitch angle detection component |
US9789810B2 (en) | 2013-11-21 | 2017-10-17 | Ford Global Technologies, Llc | Photoluminescent vehicle panel |
US9905743B2 (en) | 2013-11-21 | 2018-02-27 | Ford Global Technologies, Llc | Printed LED heat sink double lock |
US9487126B2 (en) | 2013-11-21 | 2016-11-08 | Ford Global Technologies, Llc | Photoluminescent puddle lamp |
US9434294B2 (en) | 2013-11-21 | 2016-09-06 | Ford Global Technologies, Llc | Photoluminescent vehicle badge |
US9598632B2 (en) | 2013-11-21 | 2017-03-21 | Ford Global Technologies, Llc | Method for depositing photoluminescent material |
US9487128B2 (en) | 2013-11-21 | 2016-11-08 | Ford Global Technologies, Llc | Illuminating running board |
US9538874B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Photoluminescent cupholder illumination |
US9931991B2 (en) | 2013-11-21 | 2018-04-03 | Ford Global Technologies, Llc | Rotating garment hook |
US9434301B2 (en) | 2013-11-21 | 2016-09-06 | Ford Global Technologies, Llc | Hidden photoluminescent vehicle user interface |
US9469244B2 (en) | 2013-11-21 | 2016-10-18 | Ford Global Technologies, Llc | Luminescent vehicle seal |
US9464776B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Vehicle light system with illuminating exhaust |
US9499096B2 (en) | 2013-11-21 | 2016-11-22 | Ford Global Technologies, Llc | Photoluminescent vehicle reading lamp |
US9539937B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Vehicle step lamp |
US9440579B2 (en) | 2013-11-21 | 2016-09-13 | Ford Global Technologies, Llc | Photoluminescent step handle |
US9463739B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Sun visor with photoluminescent structure |
US9902320B2 (en) | 2013-11-21 | 2018-02-27 | Ford Global Technologies, Llc | Photoluminescent color changing dome map lamp |
US9821708B2 (en) | 2013-11-21 | 2017-11-21 | Ford Global Technologies, Llc | Illuminated exterior strip |
US9969323B2 (en) | 2013-11-21 | 2018-05-15 | Ford Global Technologies, Llc | Vehicle lighting system employing a light strip |
US9776557B2 (en) | 2013-11-21 | 2017-10-03 | Ford Global Technologies, Llc | Dual direction light producing assembly |
US9810401B2 (en) | 2013-11-21 | 2017-11-07 | Ford Global Technologies, Llc | Luminescent trim light assembly |
US9539940B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Illuminated indicator |
US9393904B2 (en) | 2013-11-21 | 2016-07-19 | Ford Global Technologies, Llc | Photoluminescent engine compartment lighting |
US9290123B2 (en) | 2013-11-21 | 2016-03-22 | Ford Global Technologies, Llc | Vehicle light system with illuminating roof rack |
US9463734B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Illuminated seatbelt assembly |
US9463736B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Illuminated steering assembly |
US9682651B2 (en) | 2013-11-21 | 2017-06-20 | Ford Global Technologies, Llc | Vehicle lighting system with improved substrate |
US10041650B2 (en) | 2013-11-21 | 2018-08-07 | Ford Global Technologies, Llc | Illuminated instrument panel storage compartment |
US9434297B2 (en) | 2013-11-21 | 2016-09-06 | Ford Global Technologies, Llc | Photoluminescent vehicle graphics |
US9371033B2 (en) | 2013-11-21 | 2016-06-21 | Ford Global Technologies, Llc | Vehicle sunshade assembly |
US9839098B2 (en) | 2013-11-21 | 2017-12-05 | Ford Global Technologies, Llc | Light assembly operable as a dome lamp |
US9459453B2 (en) | 2013-11-21 | 2016-10-04 | Ford Global Technologies, Llc | Windshield display system |
US9327643B2 (en) | 2013-11-21 | 2016-05-03 | Ford Global Technologies, Llc | Photoluminescent lift gate lamp |
US9452708B2 (en) | 2013-11-21 | 2016-09-27 | Ford Global Technologies, Llc | Vehicle badge |
US9409515B2 (en) | 2013-11-21 | 2016-08-09 | Ford Global Technologies, Llc | Luminescent seating assembly |
US9387802B2 (en) | 2013-11-21 | 2016-07-12 | Ford Global Technologies, Llc | Photoluminescent power distribution box |
US9607534B2 (en) | 2013-11-21 | 2017-03-28 | Ford Global Technologies, Llc | Illuminating prismatic badge for a vehicle |
US9499113B2 (en) | 2013-11-21 | 2016-11-22 | Ford Global Technologies, Llc | Luminescent grille bar assembly |
US10400978B2 (en) | 2013-11-21 | 2019-09-03 | Ford Global Technologies, Llc | Photoluminescent lighting apparatus for vehicles |
US9487135B2 (en) | 2013-11-21 | 2016-11-08 | Ford Global Technologies, Llc | Dome light assembly |
US10064256B2 (en) | 2013-11-21 | 2018-08-28 | Ford Global Technologies, Llc | System and method for remote activation of vehicle lighting |
US9573517B2 (en) | 2013-11-21 | 2017-02-21 | Ford Global Technologies, Llc | Door illumination and warning system |
US9688192B2 (en) | 2013-11-21 | 2017-06-27 | Ford Global Technologies, Llc | Vehicle having interior and exterior lighting on tailgate |
US9393905B2 (en) | 2013-11-21 | 2016-07-19 | Ford Global Technologies, Llc | Photoluminescent vehicle compartment light |
US9539939B2 (en) | 2013-11-21 | 2017-01-10 | Ford Global Technologies, Llc | Photoluminescent logo for vehicle trim and fabric |
US9499092B2 (en) | 2013-11-21 | 2016-11-22 | Ford Global Technologies, Llc | Illuminating molding for a vehicle |
US9583968B2 (en) | 2013-11-21 | 2017-02-28 | Ford Global Technologies, Llc | Photoluminescent disinfecting and charging bin |
US9481297B2 (en) | 2013-11-21 | 2016-11-01 | Ford Global Technologies, Llc | Illuminated steering assembly |
US9527438B2 (en) | 2013-11-21 | 2016-12-27 | Ford Global Technologies, Llc | Photoluminescent blind spot warning indicator |
US9464803B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Illuminated speaker |
US9463738B2 (en) | 2013-11-21 | 2016-10-11 | Ford Global Technologies, Llc | Seatbelt lighting system |
US9302616B2 (en) | 2014-04-21 | 2016-04-05 | Ford Global Technologies, Llc | Vehicle lighting apparatus with multizone proximity control |
US9736907B2 (en) * | 2014-05-15 | 2017-08-15 | City University Of Hong Kong | Facilitating improved luminance uniformity in organic light emitting diode device panels |
JP6519311B2 (ja) * | 2014-06-27 | 2019-05-29 | 日亜化学工業株式会社 | 発光装置 |
DE102014112673A1 (de) * | 2014-09-03 | 2016-03-03 | Epcos Ag | Leuchtdiodenvorrichtung |
JP6001694B2 (ja) * | 2015-01-09 | 2016-10-05 | シャープ株式会社 | 照明装置の製造方法 |
KR102501463B1 (ko) | 2015-05-21 | 2023-02-20 | 삼성전자주식회사 | 이차원 물질을 사용한 플렉서블 인터커넥트 레이어를 포함하는 유연소자 |
US9823691B2 (en) * | 2015-07-23 | 2017-11-21 | Toshiba Memory Corporation | Semiconductor storage device |
US10168039B2 (en) | 2015-08-10 | 2019-01-01 | Ford Global Technologies, Llc | Illuminated badge for a vehicle |
CN106488686B (zh) * | 2015-08-31 | 2020-09-29 | 上海伯乐电子有限公司 | 照明器件、电气组件、柔性电路及热传递方法 |
US9663967B2 (en) | 2015-09-11 | 2017-05-30 | Ford Global Technologies, Llc | Illuminated latch system |
US9463735B1 (en) | 2015-10-06 | 2016-10-11 | Ford Global Technologies, Llc | Vehicle visor assembly with illuminating check assembly |
US10081295B2 (en) | 2015-10-13 | 2018-09-25 | Ford Global Technologies, Llc | Illuminated badge for a vehicle |
US9694739B2 (en) | 2015-11-10 | 2017-07-04 | Ford Global Technologies, Llc | Disinfecting handle |
US9889791B2 (en) | 2015-12-01 | 2018-02-13 | Ford Global Technologies, Llc | Illuminated badge for a vehicle |
US10023100B2 (en) | 2015-12-14 | 2018-07-17 | Ford Global Technologies, Llc | Illuminated trim assembly |
US9500333B1 (en) | 2015-12-18 | 2016-11-22 | Ford Global Technologies, Llc | Phosphorescent lighting assembly |
US10501007B2 (en) | 2016-01-12 | 2019-12-10 | Ford Global Technologies, Llc | Fuel port illumination device |
US10300843B2 (en) | 2016-01-12 | 2019-05-28 | Ford Global Technologies, Llc | Vehicle illumination assembly |
US9855799B2 (en) | 2016-02-09 | 2018-01-02 | Ford Global Technologies, Llc | Fuel level indicator |
US10235911B2 (en) | 2016-01-12 | 2019-03-19 | Ford Global Technologies, Llc | Illuminating badge for a vehicle |
US10011219B2 (en) | 2016-01-18 | 2018-07-03 | Ford Global Technologies, Llc | Illuminated badge |
US9517723B1 (en) | 2016-01-21 | 2016-12-13 | Ford Global Technologies, Llc | Illuminated tie-down cleat |
US9927114B2 (en) | 2016-01-21 | 2018-03-27 | Ford Global Technologies, Llc | Illumination apparatus utilizing conductive polymers |
US9586519B1 (en) | 2016-01-27 | 2017-03-07 | Ford Global Technologies, Llc | Vehicle rear illumination |
US9623797B1 (en) | 2016-02-04 | 2017-04-18 | Ford Global Technologies, Llc | Lift gate lamp |
US9499094B1 (en) | 2016-02-08 | 2016-11-22 | Ford Global Technologies, Llc | Retractable running board with long-persistence phosphor lighting |
US9499093B1 (en) | 2016-02-08 | 2016-11-22 | Ford Global Technologies, Llc | Retractable running board with long-persistance phosphor lighting |
US10189401B2 (en) | 2016-02-09 | 2019-01-29 | Ford Global Technologies, Llc | Vehicle light strip with optical element |
US9664354B1 (en) | 2016-02-11 | 2017-05-30 | Ford Global Technologies, Llc | Illumination assembly |
US9656598B1 (en) | 2016-02-23 | 2017-05-23 | Ford Global Technologies, Llc | Vehicle badge |
US9751458B1 (en) | 2016-02-26 | 2017-09-05 | Ford Global Technologies, Llc | Vehicle illumination system |
US10501025B2 (en) | 2016-03-04 | 2019-12-10 | Ford Global Technologies, Llc | Vehicle badge |
US9688189B1 (en) | 2016-03-09 | 2017-06-27 | Ford Global Technologies, Llc | Illuminated license plate |
US10118568B2 (en) | 2016-03-09 | 2018-11-06 | Ford Global Technologies, Llc | Vehicle badge having discretely illuminated portions |
US9656592B1 (en) | 2016-03-11 | 2017-05-23 | Ford Global Technologies, Llc | System and method of calibrating a vehicle badge having a number of light sources |
US9688190B1 (en) | 2016-03-15 | 2017-06-27 | Ford Global Technologies, Llc | License plate illumination system |
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US10081296B2 (en) | 2016-04-06 | 2018-09-25 | Ford Global Technologies, Llc | Illuminated exterior strip with photoluminescent structure and retroreflective layer |
DE102016108427A1 (de) * | 2016-05-06 | 2017-11-09 | Epcos Ag | Multi-LED System |
US9758088B1 (en) | 2016-05-10 | 2017-09-12 | Ford Global Technologies, Llc | Auxiliary lighting roof rack |
US9714749B1 (en) | 2016-05-10 | 2017-07-25 | Ford Global Technologies, Llc | Illuminated vehicle grille assembly |
US9738219B1 (en) | 2016-05-11 | 2017-08-22 | Ford Global Technologies, Llc | Illuminated vehicle trim |
US10064259B2 (en) | 2016-05-11 | 2018-08-28 | Ford Global Technologies, Llc | Illuminated vehicle badge |
US10420189B2 (en) | 2016-05-11 | 2019-09-17 | Ford Global Technologies, Llc | Vehicle lighting assembly |
US9688215B1 (en) | 2016-05-11 | 2017-06-27 | Ford Global Technologies, Llc | Iridescent vehicle applique |
US10631373B2 (en) | 2016-05-12 | 2020-04-21 | Ford Global Technologies, Llc | Heated windshield indicator |
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US9586527B1 (en) | 2016-05-18 | 2017-03-07 | Ford Global Technologies, Llc | Wheel well step assembly of vehicle |
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US9994144B2 (en) | 2016-05-23 | 2018-06-12 | Ford Global Technologies, Llc | Illuminated automotive glazings |
US9896020B2 (en) | 2016-05-23 | 2018-02-20 | Ford Global Technologies, Llc | Vehicle lighting assembly |
US9925917B2 (en) | 2016-05-26 | 2018-03-27 | Ford Global Technologies, Llc | Concealed lighting for vehicles |
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US9803822B1 (en) | 2016-06-03 | 2017-10-31 | Ford Global Technologies, Llc | Vehicle illumination assembly |
US10343622B2 (en) | 2016-06-09 | 2019-07-09 | Ford Global Technologies, Llc | Interior and exterior iridescent vehicle appliques |
US10205338B2 (en) | 2016-06-13 | 2019-02-12 | Ford Global Technologies, Llc | Illuminated vehicle charging assembly |
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US10131237B2 (en) | 2016-06-22 | 2018-11-20 | Ford Global Technologies, Llc | Illuminated vehicle charging system |
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US9840191B1 (en) | 2016-07-12 | 2017-12-12 | Ford Global Technologies, Llc | Vehicle lamp assembly |
US9855797B1 (en) | 2016-07-13 | 2018-01-02 | Ford Global Technologies, Llc | Illuminated system for a vehicle |
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US9840193B1 (en) | 2016-07-15 | 2017-12-12 | Ford Global Technologies, Llc | Vehicle lighting assembly |
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US9604569B1 (en) | 2016-07-19 | 2017-03-28 | Ford Global Technologies, Llc | Window lighting system of a vehicle |
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US9573519B1 (en) | 2016-08-08 | 2017-02-21 | Ford Global Technologies, Llc | Engine compartment lighting to moving parts |
US9845047B1 (en) | 2016-08-08 | 2017-12-19 | Ford Global Technologies, Llc | Light system |
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US10043396B2 (en) | 2016-09-13 | 2018-08-07 | Ford Global Technologies, Llc | Passenger pickup system and method using autonomous shuttle vehicle |
US9863171B1 (en) | 2016-09-28 | 2018-01-09 | Ford Global Technologies, Llc | Vehicle compartment |
US9593820B1 (en) | 2016-09-28 | 2017-03-14 | Ford Global Technologies, Llc | Vehicle illumination system |
US10046688B2 (en) | 2016-10-06 | 2018-08-14 | Ford Global Technologies, Llc | Vehicle containing sales bins |
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WO2018065604A1 (en) * | 2016-10-07 | 2018-04-12 | Jaguar Land Rover Limited | Control unit |
US9707887B1 (en) | 2016-10-19 | 2017-07-18 | Ford Global Technologies, Llc | Vehicle mirror assembly |
US9914390B1 (en) | 2016-10-19 | 2018-03-13 | Ford Global Technologies, Llc | Vehicle shade assembly |
US10086700B2 (en) | 2016-10-20 | 2018-10-02 | Ford Global Technologies, Llc | Illuminated switch |
US9802534B1 (en) | 2016-10-21 | 2017-10-31 | Ford Global Technologies, Llc | Illuminated vehicle compartment |
US10035473B2 (en) | 2016-11-04 | 2018-07-31 | Ford Global Technologies, Llc | Vehicle trim components |
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US10118538B2 (en) | 2016-12-07 | 2018-11-06 | Ford Global Technologies, Llc | Illuminated rack |
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US10144365B2 (en) | 2017-01-10 | 2018-12-04 | Ford Global Technologies, Llc | Vehicle badge |
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US10173582B2 (en) | 2017-01-26 | 2019-01-08 | Ford Global Technologies, Llc | Light system |
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US10427593B2 (en) | 2017-02-09 | 2019-10-01 | Ford Global Technologies, Llc | Vehicle light assembly |
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US10240737B2 (en) | 2017-03-06 | 2019-03-26 | Ford Global Technologies, Llc | Vehicle light assembly |
US10150396B2 (en) | 2017-03-08 | 2018-12-11 | Ford Global Technologies, Llc | Vehicle cup holder assembly with photoluminescent accessory for increasing the number of available cup holders |
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US10399483B2 (en) | 2017-03-08 | 2019-09-03 | Ford Global Technologies, Llc | Vehicle illumination assembly |
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US20180265043A1 (en) * | 2017-03-14 | 2018-09-20 | Ford Global Technologies, Llc | Proximity switch and humidity sensor assembly |
US10166913B2 (en) | 2017-03-15 | 2019-01-01 | Ford Global Technologies, Llc | Side marker illumination |
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US10483678B2 (en) | 2017-03-29 | 2019-11-19 | Ford Global Technologies, Llc | Vehicle electrical connector |
US10569696B2 (en) | 2017-04-03 | 2020-02-25 | Ford Global Technologies, Llc | Vehicle illuminated airflow control device |
US10023110B1 (en) | 2017-04-21 | 2018-07-17 | Ford Global Technologies, Llc | Vehicle badge sensor assembly |
US10035463B1 (en) | 2017-05-10 | 2018-07-31 | Ford Global Technologies, Llc | Door retention system |
US10399486B2 (en) | 2017-05-10 | 2019-09-03 | Ford Global Technologies, Llc | Vehicle door removal and storage |
US9963066B1 (en) | 2017-05-15 | 2018-05-08 | Ford Global Technologies, Llc | Vehicle running board that provides light excitation |
US10059238B1 (en) | 2017-05-30 | 2018-08-28 | Ford Global Technologies, Llc | Vehicle seating assembly |
US10144337B1 (en) | 2017-06-02 | 2018-12-04 | Ford Global Technologies, Llc | Vehicle light assembly |
CN107195755A (zh) * | 2017-06-30 | 2017-09-22 | 深圳市联建光电股份有限公司 | 一种柔性透明led显示屏及其加工方法 |
US10493904B2 (en) | 2017-07-17 | 2019-12-03 | Ford Global Technologies, Llc | Vehicle light assembly |
US10502690B2 (en) | 2017-07-18 | 2019-12-10 | Ford Global Technologies, Llc | Indicator system for vehicle wear components |
US10137831B1 (en) | 2017-07-19 | 2018-11-27 | Ford Global Technologies, Llc | Vehicle seal assembly |
US10160405B1 (en) | 2017-08-22 | 2018-12-25 | Ford Global Technologies, Llc | Vehicle decal assembly |
US10186177B1 (en) | 2017-09-13 | 2019-01-22 | Ford Global Technologies, Llc | Vehicle windshield lighting assembly |
US10137825B1 (en) | 2017-10-02 | 2018-11-27 | Ford Global Technologies, Llc | Vehicle lamp assembly |
US10391943B2 (en) | 2017-10-09 | 2019-08-27 | Ford Global Technologies, Llc | Vehicle lamp assembly |
US10207636B1 (en) | 2017-10-18 | 2019-02-19 | Ford Global Technologies, Llc | Seatbelt stowage assembly |
US10189414B1 (en) | 2017-10-26 | 2019-01-29 | Ford Global Technologies, Llc | Vehicle storage assembly |
US10723258B2 (en) | 2018-01-04 | 2020-07-28 | Ford Global Technologies, Llc | Vehicle lamp assembly |
US10723257B2 (en) | 2018-02-14 | 2020-07-28 | Ford Global Technologies, Llc | Multi-color luminescent grille for a vehicle |
US10627092B2 (en) | 2018-03-05 | 2020-04-21 | Ford Global Technologies, Llc | Vehicle grille assembly |
US10281113B1 (en) | 2018-03-05 | 2019-05-07 | Ford Global Technologies, Llc | Vehicle grille |
US10457196B1 (en) | 2018-04-11 | 2019-10-29 | Ford Global Technologies, Llc | Vehicle light assembly |
US10703263B2 (en) | 2018-04-11 | 2020-07-07 | Ford Global Technologies, Llc | Vehicle light system |
US10778223B2 (en) | 2018-04-23 | 2020-09-15 | Ford Global Technologies, Llc | Hidden switch assembly |
US10576893B1 (en) | 2018-10-08 | 2020-03-03 | Ford Global Technologies, Llc | Vehicle light assembly |
US10720551B1 (en) | 2019-01-03 | 2020-07-21 | Ford Global Technologies, Llc | Vehicle lamps |
CN110056827B (zh) * | 2019-04-26 | 2024-03-26 | 华域视觉科技(上海)有限公司 | 用于led光源安装的安装件及包含其的led电路板 |
US10795068B1 (en) | 2019-06-19 | 2020-10-06 | Ford Global Technologies, Llc | Vehicle badge |
US11665856B2 (en) | 2021-10-26 | 2023-05-30 | Eagle Technology, Llc | Electronic device having flexible, heat conductive layer and associated methods |
US11503701B1 (en) | 2021-10-26 | 2022-11-15 | Eagle Technology, Llc | Electronic device having heat transfer clamp and associated methods |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
CN1093861A (zh) * | 1993-04-12 | 1994-10-19 | 株式会社三协精机制作所 | 电路基板 |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
US5896271A (en) * | 1997-07-21 | 1999-04-20 | Packard Hughes Interconnect Company | Integrated circuit with a chip on dot and a heat sink |
US5920458A (en) * | 1997-05-28 | 1999-07-06 | Lucent Technologies Inc. | Enhanced cooling of a heat dissipating circuit element |
EP1139019A1 (en) * | 2000-03-31 | 2001-10-04 | Relume Corporation | L.E.D. thermal management |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
US5095404A (en) * | 1990-02-26 | 1992-03-10 | Data General Corporation | Arrangement for mounting and cooling high density tab IC chips |
US5291064A (en) * | 1991-04-16 | 1994-03-01 | Nec Corporation | Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5367434A (en) * | 1993-05-06 | 1994-11-22 | Motorola, Inc. | Electrical module assembly |
US5506756A (en) * | 1994-01-25 | 1996-04-09 | Intel Corporation | Tape BGA package die-up/die down |
US5527741A (en) * | 1994-10-11 | 1996-06-18 | Martin Marietta Corporation | Fabrication and structures of circuit modules with flexible interconnect layers |
JP3540471B2 (ja) * | 1995-11-30 | 2004-07-07 | 三菱電機株式会社 | 半導体モジュール |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
US6259713B1 (en) * | 1997-12-15 | 2001-07-10 | The University Of Utah Research Foundation | Laser beam coupler, shaper and collimator device |
DE19806801C2 (de) * | 1998-02-18 | 2001-06-21 | Siemens Ag | Elektrische Schaltunganordnung |
TW430959B (en) * | 1998-04-22 | 2001-04-21 | World Wiser Electronics Inc | Thermal enhanced structure of printed circuit board |
JP2000012723A (ja) * | 1998-06-23 | 2000-01-14 | Nitto Denko Corp | 回路基板の実装構造体およびそれに用いる多層回路基板 |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6394626B1 (en) * | 2000-04-11 | 2002-05-28 | Lumileds Lighting, U.S., Llc | Flexible light track for signage |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
TW472850U (en) * | 2001-06-21 | 2002-01-11 | Star Reach Corp | High-efficiency cylindrical illuminating tube |
US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US7273987B2 (en) | 2002-03-21 | 2007-09-25 | General Electric Company | Flexible interconnect structures for electrical devices and light sources incorporating the same |
-
2002
- 2002-03-21 US US10/063,104 patent/US7273987B2/en not_active Expired - Fee Related
-
2003
- 2003-03-10 AU AU2003222266A patent/AU2003222266A1/en not_active Abandoned
- 2003-03-10 WO PCT/US2003/007375 patent/WO2003081967A1/en active IP Right Grant
- 2003-03-10 EP EP03717949A patent/EP1498013B1/en not_active Expired - Lifetime
- 2003-03-10 AT AT03717949T patent/ATE381248T1/de not_active IP Right Cessation
- 2003-03-10 CN CNB038116413A patent/CN100366130C/zh not_active Expired - Fee Related
- 2003-03-10 DE DE60318031T patent/DE60318031T2/de not_active Expired - Fee Related
- 2003-03-18 TW TW092105918A patent/TWI294672B/zh active
-
2006
- 2006-08-30 US US11/468,709 patent/US20060292722A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
US5452182A (en) * | 1990-04-05 | 1995-09-19 | Martin Marietta Corporation | Flexible high density interconnect structure and flexibly interconnected system |
CN1093861A (zh) * | 1993-04-12 | 1994-10-19 | 株式会社三协精机制作所 | 电路基板 |
US5920458A (en) * | 1997-05-28 | 1999-07-06 | Lucent Technologies Inc. | Enhanced cooling of a heat dissipating circuit element |
US5896271A (en) * | 1997-07-21 | 1999-04-20 | Packard Hughes Interconnect Company | Integrated circuit with a chip on dot and a heat sink |
EP1139019A1 (en) * | 2000-03-31 | 2001-10-04 | Relume Corporation | L.E.D. thermal management |
Also Published As
Publication number | Publication date |
---|---|
EP1498013A1 (en) | 2005-01-19 |
DE60318031T2 (de) | 2008-11-13 |
AU2003222266A1 (en) | 2003-10-08 |
WO2003081967A1 (en) | 2003-10-02 |
TW200307357A (en) | 2003-12-01 |
US7273987B2 (en) | 2007-09-25 |
ATE381248T1 (de) | 2007-12-15 |
CN1656860A (zh) | 2005-08-17 |
EP1498013B1 (en) | 2007-12-12 |
DE60318031D1 (de) | 2008-01-24 |
US20030179548A1 (en) | 2003-09-25 |
TWI294672B (en) | 2008-03-11 |
US20060292722A1 (en) | 2006-12-28 |
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