FI20135113L - Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä - Google Patents

Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä Download PDF

Info

Publication number
FI20135113L
FI20135113L FI20135113A FI20135113A FI20135113L FI 20135113 L FI20135113 L FI 20135113L FI 20135113 A FI20135113 A FI 20135113A FI 20135113 A FI20135113 A FI 20135113A FI 20135113 L FI20135113 L FI 20135113L
Authority
FI
Finland
Prior art keywords
circuit board
board system
cooling arrangement
cooling
arrangement
Prior art date
Application number
FI20135113A
Other languages
English (en)
Swedish (sv)
Inventor
Antti Holma
Petri Kohonen
Original Assignee
Tellabs Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tellabs Oy filed Critical Tellabs Oy
Priority to FI20135113A priority Critical patent/FI20135113L/fi
Priority to EP14153241.6A priority patent/EP2763512B1/en
Priority to US14/172,039 priority patent/US9226384B2/en
Priority to CN201410045081.7A priority patent/CN103974524A/zh
Publication of FI20135113L publication Critical patent/FI20135113L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20135113A 2013-02-05 2013-02-05 Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä FI20135113L (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20135113A FI20135113L (fi) 2013-02-05 2013-02-05 Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä
EP14153241.6A EP2763512B1 (en) 2013-02-05 2014-01-30 A circuit board system comprising a cooling arrangement
US14/172,039 US9226384B2 (en) 2013-02-05 2014-02-04 Circuit board system comprising a cooling arrangement
CN201410045081.7A CN103974524A (zh) 2013-02-05 2014-02-07 包括冷却装置的电路板系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20135113A FI20135113L (fi) 2013-02-05 2013-02-05 Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä

Publications (1)

Publication Number Publication Date
FI20135113L true FI20135113L (fi) 2014-08-06

Family

ID=50002633

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20135113A FI20135113L (fi) 2013-02-05 2013-02-05 Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä

Country Status (4)

Country Link
US (1) US9226384B2 (fi)
EP (1) EP2763512B1 (fi)
CN (1) CN103974524A (fi)
FI (1) FI20135113L (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11171070B2 (en) 2018-06-21 2021-11-09 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated thermally conductive cooling structures
CN110290635A (zh) * 2019-07-26 2019-09-27 中国科学院半导体研究所 一种低热阻电路板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014892B2 (ja) * 1993-04-28 2000-02-28 イビデン株式会社 電子部品搭載用基板
JPH0832183A (ja) * 1994-05-12 1996-02-02 Furukawa Electric Co Ltd:The 半導体素子パッケージ
JPH07321471A (ja) * 1994-05-25 1995-12-08 Oki Electric Ind Co Ltd 多層基板
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
JP3266505B2 (ja) * 1996-05-20 2002-03-18 京セラ株式会社 多層回路基板
US6744135B2 (en) * 2001-05-22 2004-06-01 Hitachi, Ltd. Electronic apparatus
US20030066679A1 (en) * 2001-10-09 2003-04-10 Castro Abram M. Electrical circuit and method of formation
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US20050168941A1 (en) * 2003-10-22 2005-08-04 Sokol John L. System and apparatus for heat removal
JP2007157835A (ja) * 2005-12-01 2007-06-21 Matsushita Electric Ind Co Ltd 実装基板
TWI449137B (zh) * 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
JP2010080572A (ja) * 2008-09-25 2010-04-08 Denso Corp 電子装置
US7960827B1 (en) * 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
US8913390B2 (en) * 2012-06-28 2014-12-16 Apple Inc. Thermally conductive printed circuit board bumpers

Also Published As

Publication number Publication date
US9226384B2 (en) 2015-12-29
EP2763512B1 (en) 2019-07-24
US20140218868A1 (en) 2014-08-07
CN103974524A (zh) 2014-08-06
EP2763512A1 (en) 2014-08-06

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