FI10540U1 - Nestejäähdytysjärjestely - Google Patents

Nestejäähdytysjärjestely

Info

Publication number
FI10540U1
FI10540U1 FIU20134090U FIU20134090U FI10540U1 FI 10540 U1 FI10540 U1 FI 10540U1 FI U20134090 U FIU20134090 U FI U20134090U FI U20134090 U FIU20134090 U FI U20134090U FI 10540 U1 FI10540 U1 FI 10540U1
Authority
FI
Finland
Prior art keywords
liquid cooling
cooling arrangement
arrangement
liquid
cooling
Prior art date
Application number
FIU20134090U
Other languages
English (en)
Swedish (sv)
Inventor
Jukka Jaskari
Osmo Miettinen
Stefan Strandberg
Original Assignee
Vacon Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacon Oyj filed Critical Vacon Oyj
Priority to FIU20134090U priority Critical patent/FI10540U1/fi
Priority to EP14161003.0A priority patent/EP2790480B1/en
Priority to US14/244,098 priority patent/US10123455B2/en
Application granted granted Critical
Publication of FI10540U1 publication Critical patent/FI10540U1/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
FIU20134090U 2013-04-11 2013-04-11 Nestejäähdytysjärjestely FI10540U1 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FIU20134090U FI10540U1 (fi) 2013-04-11 2013-04-11 Nestejäähdytysjärjestely
EP14161003.0A EP2790480B1 (en) 2013-04-11 2014-03-21 Liquid cooling arrangement
US14/244,098 US10123455B2 (en) 2013-04-11 2014-04-03 Liquid cooling arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FIU20134090U FI10540U1 (fi) 2013-04-11 2013-04-11 Nestejäähdytysjärjestely

Publications (1)

Publication Number Publication Date
FI10540U1 true FI10540U1 (fi) 2014-07-11

Family

ID=50729345

Family Applications (1)

Application Number Title Priority Date Filing Date
FIU20134090U FI10540U1 (fi) 2013-04-11 2013-04-11 Nestejäähdytysjärjestely

Country Status (3)

Country Link
US (1) US10123455B2 (fi)
EP (1) EP2790480B1 (fi)
FI (1) FI10540U1 (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI10540U1 (fi) * 2013-04-11 2014-07-11 Vacon Oyj Nestejäähdytysjärjestely
CN104039117B (zh) * 2014-06-03 2017-01-04 华为技术有限公司 一种散热装置、散热控制方法以及控制器
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
CN104590959A (zh) * 2015-01-05 2015-05-06 洛阳中重自动化工程有限责任公司 一种集成化的移动式凿井提升机变频电控系统
CN109315080B (zh) * 2016-06-01 2020-04-28 Abb瑞士股份有限公司 液体冷却系统和方法
CN109005659B (zh) * 2018-09-05 2019-12-03 厦门巨创科技有限公司 便于变频器散热的控制机柜及散热方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4698728A (en) * 1986-10-14 1987-10-06 Unisys Corporation Leak tolerant liquid cooling system
US5115225A (en) * 1990-11-13 1992-05-19 Compaq Computer Corporation Disk drive unit overheating warning system
US5278495A (en) * 1991-11-08 1994-01-11 Ncr Corporation Memory and apparatus for a thermally accelerated reliability testing
US5435379A (en) * 1992-08-14 1995-07-25 Texas Instruments Incorporated Method and apparatus for low-temperature semiconductor processing
WO2000017927A1 (en) * 1998-09-18 2000-03-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor power converter and application device of the same
DE10027002B4 (de) * 1999-06-02 2005-02-17 Advantest Corp. Kühlsystem
US6748759B2 (en) * 2001-08-02 2004-06-15 Ho-Hsin Wu High efficiency heat exchanger
TW563805U (en) * 2002-11-18 2003-11-21 Air Tech Co Ltd Condenser with refrigerant coil made of copper tube having streamlined cross-section
SE0400269L (sv) * 2003-08-01 2005-02-02 Michael Abrahamsson Förfarande och anordning för värmning medelst ett gasformigt medium.
KR100607204B1 (ko) * 2004-06-18 2006-08-01 (주) 위젠글로벌 냉각유체의 증발 냉각방법 및 그 장치
US8387249B2 (en) * 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US7958738B2 (en) * 2008-06-06 2011-06-14 Colmac Coil Mfg., Inc. Direct expansion ammonia refrigeration system and a method of direct expansion ammonia refrigeration
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
AT511228B1 (de) * 2011-03-23 2013-01-15 Solarfrost Forschung Gmbh Solarkühlung mit einer ammoniak-wasser-absorptionskältemaschine
US8564952B2 (en) * 2011-07-25 2013-10-22 International Business Machines Corporation Flow boiling heat sink structure with vapor venting and condensing
US9061382B2 (en) * 2011-07-25 2015-06-23 International Business Machines Corporation Heat sink structure with a vapor-permeable membrane for two-phase cooling
US9069532B2 (en) * 2011-07-25 2015-06-30 International Business Machines Corporation Valve controlled, node-level vapor condensation for two-phase heat sink(s)
US8937810B2 (en) * 2012-09-14 2015-01-20 International Business Machines Corporation Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
FI10540U1 (fi) * 2013-04-11 2014-07-11 Vacon Oyj Nestejäähdytysjärjestely
US20160341453A1 (en) * 2014-03-17 2016-11-24 Mitsubishi Electric Corporation Refrigeration cycle apparatus
US20170105313A1 (en) * 2015-10-10 2017-04-13 Ebullient, Llc Multi-chamber heat sink module
US9861013B2 (en) * 2015-02-12 2018-01-02 International Business Machines Corporation Cooling system with integrated fill and drain pump

Also Published As

Publication number Publication date
EP2790480A2 (en) 2014-10-15
EP2790480A3 (en) 2015-03-04
US20140305611A1 (en) 2014-10-16
US10123455B2 (en) 2018-11-06
EP2790480B1 (en) 2019-05-22

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