FI20125725L - Mekaanisella suojauksella varustettu piirikorttijärjestely - Google Patents
Mekaanisella suojauksella varustettu piirikorttijärjestely Download PDFInfo
- Publication number
- FI20125725L FI20125725L FI20125725A FI20125725A FI20125725L FI 20125725 L FI20125725 L FI 20125725L FI 20125725 A FI20125725 A FI 20125725A FI 20125725 A FI20125725 A FI 20125725A FI 20125725 L FI20125725 L FI 20125725L
- Authority
- FI
- Finland
- Prior art keywords
- circuit board
- mechanical protection
- board arrangement
- arrangement
- mechanical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125725A FI20125725L (fi) | 2012-06-26 | 2012-06-26 | Mekaanisella suojauksella varustettu piirikorttijärjestely |
EP13171339.8A EP2680679B1 (en) | 2012-06-26 | 2013-06-11 | A circuit board system with mechanical protection |
US13/915,644 US20130343008A1 (en) | 2012-06-26 | 2013-06-12 | Circuit board system with mechanical protection |
CN201320372230.1U CN203523133U (zh) | 2012-06-26 | 2013-06-26 | 具有机械保护的电路板系统 |
US14/715,627 US10201095B2 (en) | 2012-06-26 | 2015-05-19 | Method for manufacturing a circuit board system with mechanical protection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125725A FI20125725L (fi) | 2012-06-26 | 2012-06-26 | Mekaanisella suojauksella varustettu piirikorttijärjestely |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20125725L true FI20125725L (fi) | 2013-12-27 |
Family
ID=48577603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20125725A FI20125725L (fi) | 2012-06-26 | 2012-06-26 | Mekaanisella suojauksella varustettu piirikorttijärjestely |
Country Status (4)
Country | Link |
---|---|
US (2) | US20130343008A1 (fi) |
EP (1) | EP2680679B1 (fi) |
CN (1) | CN203523133U (fi) |
FI (1) | FI20125725L (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110785005B (zh) * | 2019-11-15 | 2020-08-28 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种气垫防护式电路板 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4541893A (en) * | 1984-05-15 | 1985-09-17 | Advanced Micro Devices, Inc. | Process for fabricating pedestal interconnections between conductive layers in an integrated circuit |
US5761050A (en) * | 1996-08-23 | 1998-06-02 | Cts Corporation | Deformable pin connector for multiple PC boards |
US6495406B1 (en) * | 2000-08-31 | 2002-12-17 | Micron Technology, Inc. | Method of forming lightly doped drain MOS transistor including forming spacers on gate electrode pattern before exposing gate insulator |
JP2002093811A (ja) * | 2000-09-11 | 2002-03-29 | Sony Corp | 電極および半導体装置の製造方法 |
US7023288B2 (en) * | 2001-04-18 | 2006-04-04 | Toyo Communication Equipment Co., Ltd. | Piezoelectric oscillator and its manufacturing method |
JP3687742B2 (ja) * | 2001-07-13 | 2005-08-24 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 機能拡張基板、通信用拡張基板、通信用拡張基板用の絶縁フィルム、コンピュータシステム、機能拡張基板の取り外し方法および電子回路用基板 |
JP4082285B2 (ja) * | 2003-06-13 | 2008-04-30 | 住友電装株式会社 | プリント基板の接続構造 |
FI20035178A (fi) * | 2003-10-03 | 2005-04-04 | Nokia Corp | Häiriösuojattu matkaviestin sekä vastaava menetelmä ja järjestely matkaviestimen häiriösuojauksessa |
FI119714B (fi) * | 2005-06-16 | 2009-02-13 | Imbera Electronics Oy | Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi |
JP4720827B2 (ja) * | 2005-07-11 | 2011-07-13 | パナソニック株式会社 | 基板接続部材および接続構造体 |
KR100709197B1 (ko) * | 2005-10-18 | 2007-04-18 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 및 보강 부재 |
US7262369B1 (en) * | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
TWI280097B (en) * | 2006-03-14 | 2007-04-21 | Arima Communication Corp | Metal insert molding plastic of shielding case structure for hand hold device |
JP4858541B2 (ja) * | 2006-06-27 | 2012-01-18 | パナソニック株式会社 | 中継基板および電子回路実装構造体 |
US7452213B2 (en) * | 2006-09-08 | 2008-11-18 | Seagate Technology Llc | Electrical contacts with compliant supports |
US20080179731A1 (en) | 2007-01-25 | 2008-07-31 | Powertech Technology Inc. | Anti-Impact memory module |
WO2008155957A1 (ja) * | 2007-06-19 | 2008-12-24 | Murata Manufacturing Co., Ltd. | 部品内蔵基板の製造方法および部品内蔵基板 |
US7710737B2 (en) * | 2007-09-07 | 2010-05-04 | Apple Inc. | Stiffening plate for circuit board and switch assembly |
TW200922394A (en) * | 2007-11-02 | 2009-05-16 | Delta Electronics Inc | Circuit board module and method of strengthening structure thereof |
JP2009239109A (ja) | 2008-03-27 | 2009-10-15 | Sharp Corp | 電子部品配線基板および部品実装モジュール |
US8118611B2 (en) * | 2008-10-31 | 2012-02-21 | Myoungsoo Jeon | PCB bridge connector for connecting PCB devices |
JP2010212542A (ja) | 2009-03-12 | 2010-09-24 | Panasonic Corp | 回路基板 |
US8097489B2 (en) * | 2009-03-23 | 2012-01-17 | Stats Chippac, Ltd. | Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die |
DE102009058877A1 (de) * | 2009-12-18 | 2011-06-22 | Siemens Aktiengesellschaft, 80333 | Verfahren zum Prüfen von elektrischen Komponenten in einem Stromnetz, insbesondere in einem Gebäudestromnetz |
US9119327B2 (en) * | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
-
2012
- 2012-06-26 FI FI20125725A patent/FI20125725L/fi not_active IP Right Cessation
-
2013
- 2013-06-11 EP EP13171339.8A patent/EP2680679B1/en active Active
- 2013-06-12 US US13/915,644 patent/US20130343008A1/en not_active Abandoned
- 2013-06-26 CN CN201320372230.1U patent/CN203523133U/zh not_active Expired - Lifetime
-
2015
- 2015-05-19 US US14/715,627 patent/US10201095B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20130343008A1 (en) | 2013-12-26 |
CN203523133U (zh) | 2014-04-02 |
US20150250059A1 (en) | 2015-09-03 |
EP2680679B1 (en) | 2018-01-17 |
EP2680679A1 (en) | 2014-01-01 |
US10201095B2 (en) | 2019-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |