PT1846949T - Aparelho termicamente e eletricamente condutor - Google Patents

Aparelho termicamente e eletricamente condutor

Info

Publication number
PT1846949T
PT1846949T PT06701369T PT06701369T PT1846949T PT 1846949 T PT1846949 T PT 1846949T PT 06701369 T PT06701369 T PT 06701369T PT 06701369 T PT06701369 T PT 06701369T PT 1846949 T PT1846949 T PT 1846949T
Authority
PT
Portugal
Prior art keywords
thermally
electrically conductive
conductive apparatus
electrically
conductive
Prior art date
Application number
PT06701369T
Other languages
English (en)
Inventor
Speier Ingo
Original Assignee
Philips Lighting Holding Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36647392&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT1846949(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Philips Lighting Holding Bv filed Critical Philips Lighting Holding Bv
Publication of PT1846949T publication Critical patent/PT1846949T/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PT06701369T 2005-01-05 2006-01-05 Aparelho termicamente e eletricamente condutor PT1846949T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64171105P 2005-01-05 2005-01-05

Publications (1)

Publication Number Publication Date
PT1846949T true PT1846949T (pt) 2018-11-29

Family

ID=36647392

Family Applications (1)

Application Number Title Priority Date Filing Date
PT06701369T PT1846949T (pt) 2005-01-05 2006-01-05 Aparelho termicamente e eletricamente condutor

Country Status (11)

Country Link
US (1) US9111822B2 (pt)
EP (2) EP3413345A1 (pt)
CA (1) CA2606687C (pt)
DK (1) DK1846949T3 (pt)
ES (1) ES2690540T3 (pt)
HU (1) HUE042450T2 (pt)
PL (1) PL1846949T3 (pt)
PT (1) PT1846949T (pt)
SI (1) SI1846949T1 (pt)
TR (1) TR201815693T4 (pt)
WO (1) WO2006072176A1 (pt)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050259424A1 (en) 2004-05-18 2005-11-24 Zampini Thomas L Ii Collimating and controlling light produced by light emitting diodes
US7743614B2 (en) 2005-04-08 2010-06-29 Bsst Llc Thermoelectric-based heating and cooling system
US20100155018A1 (en) 2008-12-19 2010-06-24 Lakhi Nandlal Goenka Hvac system for a hybrid vehicle
WO2008043206A1 (en) * 2006-10-10 2008-04-17 Jen-Shyan Chen A semiconductor light-emitting module
US7729941B2 (en) 2006-11-17 2010-06-01 Integrated Illumination Systems, Inc. Apparatus and method of using lighting systems to enhance brand recognition
US8013538B2 (en) 2007-01-26 2011-09-06 Integrated Illumination Systems, Inc. TRI-light
DE112008001425T5 (de) * 2007-05-25 2010-04-15 Molex Inc., Lisle Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet
US8742686B2 (en) 2007-09-24 2014-06-03 Integrated Illumination Systems, Inc. Systems and methods for providing an OEM level networked lighting system
US8255487B2 (en) * 2008-05-16 2012-08-28 Integrated Illumination Systems, Inc. Systems and methods for communicating in a lighting network
JP2011530190A (ja) * 2008-08-04 2011-12-15 クラスタード システムズ カンパニー 接点を冷却した電子機器匡体
US8585245B2 (en) 2009-04-23 2013-11-19 Integrated Illumination Systems, Inc. Systems and methods for sealing a lighting fixture
KR20170036119A (ko) 2009-05-18 2017-03-31 젠썸 인코포레이티드 배터리 열 관리 시스템
US20110084612A1 (en) * 2009-10-09 2011-04-14 General Led, Inc., A Delaware Corporation Hybrid chip-on-heatsink device and methods
TWI470749B (zh) * 2009-12-23 2015-01-21 Ind Tech Res Inst 導熱絕緣複合膜層及晶片堆疊結構
BR112012029068B1 (pt) 2010-05-13 2020-10-27 Quantum Dental Technologies Inc. aparelho para detectar radiação fototérmica de um objeto, e, sistema
US9144480B2 (en) * 2011-03-11 2015-09-29 Schott Corporation Light-emitting wand with electrically-conductive heat sinks
US9066381B2 (en) 2011-03-16 2015-06-23 Integrated Illumination Systems, Inc. System and method for low level dimming
DE102011016935A1 (de) * 2011-04-13 2012-10-18 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement
US9967940B2 (en) 2011-05-05 2018-05-08 Integrated Illumination Systems, Inc. Systems and methods for active thermal management
DE112012002935T5 (de) * 2011-07-11 2014-05-15 Gentherm Inc. Auf Thermoelektrik basierendes Wärmemanagement elektrischer Vorrichtungen
US9521725B2 (en) 2011-07-26 2016-12-13 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US8710770B2 (en) 2011-07-26 2014-04-29 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US9609720B2 (en) 2011-07-26 2017-03-28 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US10874003B2 (en) 2011-07-26 2020-12-22 Hunter Industries, Inc. Systems and methods for providing power and data to devices
US11917740B2 (en) 2011-07-26 2024-02-27 Hunter Industries, Inc. Systems and methods for providing power and data to devices
US20150237700A1 (en) 2011-07-26 2015-08-20 Hunter Industries, Inc. Systems and methods to control color and brightness of lighting devices
US9390998B2 (en) * 2012-02-17 2016-07-12 Invensas Corporation Heat spreading substrate
US8792226B2 (en) 2012-03-27 2014-07-29 General Electric Company Heat transfer system for use with electrical devices and method of operating the same
US8894437B2 (en) 2012-07-19 2014-11-25 Integrated Illumination Systems, Inc. Systems and methods for connector enabling vertical removal
US9379578B2 (en) 2012-11-19 2016-06-28 Integrated Illumination Systems, Inc. Systems and methods for multi-state power management
US9420665B2 (en) 2012-12-28 2016-08-16 Integration Illumination Systems, Inc. Systems and methods for continuous adjustment of reference signal to control chip
US9485814B2 (en) 2013-01-04 2016-11-01 Integrated Illumination Systems, Inc. Systems and methods for a hysteresis based driver using a LED as a voltage reference
DE112014000419T5 (de) 2013-01-14 2015-10-15 Gentherm Incorporated Auf Thermoelektrik basierendes Thermomanagement elektrischer Vorrichtungen
CN104956539B (zh) 2013-01-30 2018-06-12 詹思姆公司 基于热电的热管理系统
US9258878B2 (en) * 2013-02-13 2016-02-09 Gerald Ho Kim Isolation of thermal ground for multiple heat-generating devices on a substrate
CN205669800U (zh) * 2013-06-26 2016-11-02 皇家飞利浦有限公司 模块化热耗散组装件以及包括该组装件的照明器和筒灯
DE112014004953T5 (de) 2013-10-29 2016-07-14 Gentherm Incorporated Batteriethermomanagement mit Thermoelektrik
KR101592649B1 (ko) 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
JP6668335B2 (ja) 2014-09-12 2020-03-18 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ グラファイト熱電および／または抵抗熱管理システムならびに方法
FR3034171B1 (fr) 2015-03-23 2021-03-19 Valeo Vision Support de led avec surface de reception et connexion electrique par pontage
US10918030B2 (en) 2015-05-26 2021-02-16 Hunter Industries, Inc. Decoder systems and methods for irrigation control
US10228711B2 (en) 2015-05-26 2019-03-12 Hunter Industries, Inc. Decoder systems and methods for irrigation control
US10030844B2 (en) 2015-05-29 2018-07-24 Integrated Illumination Systems, Inc. Systems, methods and apparatus for illumination using asymmetrical optics
US10060599B2 (en) 2015-05-29 2018-08-28 Integrated Illumination Systems, Inc. Systems, methods and apparatus for programmable light fixtures
JP3203785U (ja) * 2015-06-24 2016-04-14 研晶光電股▲ふん▼有限公司 流体冷却式ランプ
DE112019005983T5 (de) 2018-11-30 2021-09-09 Gentherm Incorporated Thermoelektrisches konditionierungssystem und verfahren
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US10801714B1 (en) 2019-10-03 2020-10-13 CarJamz, Inc. Lighting device
CN112705423B (zh) * 2021-01-18 2021-11-12 济南法诺商贸有限公司 一种智能芯片制造设备及制造方法
US12096693B2 (en) * 2022-03-28 2024-09-17 International Business Machines Corporation Temperature indicator powered by thermoelectric generator
WO2024120099A1 (zh) * 2022-12-06 2024-06-13 华为技术有限公司 一种冷板组件、电子设备和液冷系统

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047198A (en) 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US4322737A (en) 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
DE69211074T2 (de) * 1991-08-26 1996-10-02 Sun Microsystems Inc Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5287619A (en) * 1992-03-09 1994-02-22 Rogers Corporation Method of manufacture multichip module substrate
KR100260347B1 (ko) * 1992-06-05 2000-07-01 나까니시 히로유끼 입체인쇄기판, 이것을 사용한 전자회로패키지 및 인쇄기판의 제조방법
US6150716A (en) 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
DE19506093C2 (de) * 1995-02-22 2000-12-07 Dilas Diodenlaser Gmbh Diodenlaserbauelement
US6159764A (en) 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
CN1276917A (zh) 1997-09-25 2000-12-13 布里斯托尔大学 光学辐照装置
US5982630A (en) * 1997-11-06 1999-11-09 Intel Corporation Printed circuit board that provides improved thermal dissipation
US6200134B1 (en) * 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
JP3667990B2 (ja) 1998-05-27 2005-07-06 富士写真フイルム株式会社 画像読取装置
US20020054480A1 (en) * 1999-05-12 2002-05-09 Ionel Jitaru Enhanced thermal coupling for electronic boards
US7059049B2 (en) * 1999-07-02 2006-06-13 International Business Machines Corporation Electronic package with optimized lamination process
US6194246B1 (en) * 1999-08-25 2001-02-27 Motorola Inc. Process for fabricating electronic devices having a thermally conductive substrate
US7320593B2 (en) 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
US6327149B1 (en) * 2000-09-06 2001-12-04 Visteon Global Technologies, Inc. Electrical circuit board and method for making the same
US20020163781A1 (en) * 2001-05-01 2002-11-07 Ericsson Inc. Integrated cooling of a printed circuit board structure
US6540525B1 (en) 2001-08-17 2003-04-01 High Connection Density, Inc. High I/O stacked modules for integrated circuits
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
JP2003332749A (ja) * 2002-01-11 2003-11-21 Denso Corp 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板
US6679315B2 (en) 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US7273987B2 (en) 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
KR20050002904A (ko) * 2002-03-26 2005-01-10 엔피스 리미티드 냉각된 발광장치
US6573536B1 (en) 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
EP1535299B1 (en) 2002-07-16 2009-11-18 odelo GmbH White led headlight
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6991356B2 (en) 2002-12-20 2006-01-31 Efraim Tsimerman LED curing light
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
TWI263008B (en) * 2004-06-30 2006-10-01 Ind Tech Res Inst LED lamp
EP1872401B1 (en) * 2005-04-05 2018-09-19 Philips Lighting Holding B.V. Electronic device package with an integrated evaporator

Also Published As

Publication number Publication date
SI1846949T1 (sl) 2018-11-30
ES2690540T3 (es) 2018-11-21
EP1846949A4 (en) 2012-11-14
TR201815693T4 (tr) 2018-11-21
WO2006072176A1 (en) 2006-07-13
PL1846949T3 (pl) 2019-01-31
EP1846949A1 (en) 2007-10-24
HUE042450T2 (hu) 2019-06-28
CA2606687C (en) 2015-08-11
EP3413345A1 (en) 2018-12-12
US20080239675A1 (en) 2008-10-02
DK1846949T3 (en) 2018-10-15
EP1846949B1 (en) 2018-08-22
US9111822B2 (en) 2015-08-18
CA2606687A1 (en) 2006-07-13

Similar Documents

Publication Publication Date Title
HUE042450T2 (hu) Hõ- és elektromosan vezetõ szerkezet
EP1879038A4 (en) CONDUCTIVE CONTACT HOLDER AND CONDUCTIVE CONTACT UNIT
IL238063B (en) Electrically conductive and semi-conductive surfaces
TWI372494B (en) Conductive contacts holder and conductive contacts unit
TWI365288B (en) Conductive contactor and conductive conductor unit
EP1899986A4 (en) ELECTRICALLY CONDUCTIVE COMPOSITE
TWI341057B (en) Conductive terminal
EP1872418A4 (en) MECHANICAL CONNECTOR
SI1610422T1 (sl) Električna vtična priprava
EP1950768A4 (en) ELECTRICALLY CONDUCTIVE SHEET
EP1946981A4 (en) ELECTRIC DIRECTION LOCKING DEVICE
TWI315940B (en) Improved tie-high and tie-low circuit
GB2431045B (en) Electrical conductor element
GB2425502B (en) Conductive ball mounting apparatus
GB0427650D0 (en) Electrical device
GB0502087D0 (en) Swivel conductive device
TWM299377U (en) Electrical contact
GB0607295D0 (en) Conductive ball mounting apparatus
PL1861908T3 (pl) Urządzenie odprowadzające prąd piorunowy
GB2435446B (en) Insulating material and methods
GB0426360D0 (en) Electrical device
GB0525512D0 (en) Electrical Contact Arrangement
GB0601022D0 (en) Thermally conductive cover
GB0406961D0 (en) Electrical apparatus and connections
TWI316315B (en) Electrical contact and electronic device using the same