PL1846949T3 - Urządzenie przewodzące cieplnie i elektrycznie - Google Patents

Urządzenie przewodzące cieplnie i elektrycznie

Info

Publication number
PL1846949T3
PL1846949T3 PL06701369T PL06701369T PL1846949T3 PL 1846949 T3 PL1846949 T3 PL 1846949T3 PL 06701369 T PL06701369 T PL 06701369T PL 06701369 T PL06701369 T PL 06701369T PL 1846949 T3 PL1846949 T3 PL 1846949T3
Authority
PL
Poland
Prior art keywords
heat
electric conductive
conductive device
electric
conductive
Prior art date
Application number
PL06701369T
Other languages
English (en)
Inventor
Ingo Speier
Original Assignee
Philips Lighting Holding B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36647392&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1846949(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Philips Lighting Holding B.V. filed Critical Philips Lighting Holding B.V.
Publication of PL1846949T3 publication Critical patent/PL1846949T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL06701369T 2005-01-05 2006-01-05 Urządzenie przewodzące cieplnie i elektrycznie PL1846949T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64171105P 2005-01-05 2005-01-05
EP06701369.8A EP1846949B1 (en) 2005-01-05 2006-01-05 Thermally and electrically conductive apparatus
PCT/CA2006/000011 WO2006072176A1 (en) 2005-01-05 2006-01-05 Thermally and electrically conductive apparatus

Publications (1)

Publication Number Publication Date
PL1846949T3 true PL1846949T3 (pl) 2019-01-31

Family

ID=36647392

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06701369T PL1846949T3 (pl) 2005-01-05 2006-01-05 Urządzenie przewodzące cieplnie i elektrycznie

Country Status (11)

Country Link
US (1) US9111822B2 (pl)
EP (2) EP3413345A1 (pl)
CA (1) CA2606687C (pl)
DK (1) DK1846949T3 (pl)
ES (1) ES2690540T3 (pl)
HU (1) HUE042450T2 (pl)
PL (1) PL1846949T3 (pl)
PT (1) PT1846949T (pl)
SI (1) SI1846949T1 (pl)
TR (1) TR201815693T4 (pl)
WO (1) WO2006072176A1 (pl)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050259424A1 (en) 2004-05-18 2005-11-24 Zampini Thomas L Ii Collimating and controlling light produced by light emitting diodes
US7743614B2 (en) 2005-04-08 2010-06-29 Bsst Llc Thermoelectric-based heating and cooling system
US20100155018A1 (en) 2008-12-19 2010-06-24 Lakhi Nandlal Goenka Hvac system for a hybrid vehicle
AU2006349349A1 (en) * 2006-10-10 2008-04-17 Neobulb Technologies, Inc. A semiconductor light-emitting module
US7729941B2 (en) 2006-11-17 2010-06-01 Integrated Illumination Systems, Inc. Apparatus and method of using lighting systems to enhance brand recognition
US8013538B2 (en) 2007-01-26 2011-09-06 Integrated Illumination Systems, Inc. TRI-light
DE112008001425T5 (de) * 2007-05-25 2010-04-15 Molex Inc., Lisle Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet
US8742686B2 (en) 2007-09-24 2014-06-03 Integrated Illumination Systems, Inc. Systems and methods for providing an OEM level networked lighting system
US8255487B2 (en) * 2008-05-16 2012-08-28 Integrated Illumination Systems, Inc. Systems and methods for communicating in a lighting network
US8270170B2 (en) * 2008-08-04 2012-09-18 Clustered Systems Company Contact cooled electronic enclosure
US8585245B2 (en) 2009-04-23 2013-11-19 Integrated Illumination Systems, Inc. Systems and methods for sealing a lighting fixture
WO2010135371A2 (en) 2009-05-18 2010-11-25 Bsst Llc Battery thermal management system
US20110084612A1 (en) * 2009-10-09 2011-04-14 General Led, Inc., A Delaware Corporation Hybrid chip-on-heatsink device and methods
TWI470749B (zh) * 2009-12-23 2015-01-21 財團法人工業技術研究院 導熱絕緣複合膜層及晶片堆疊結構
CA2799272A1 (en) 2010-05-13 2011-11-17 Stephen Abrams Handpiece with integrated optical system for photothermal radiometry and luminescence measurements
US9144480B2 (en) * 2011-03-11 2015-09-29 Schott Corporation Light-emitting wand with electrically-conductive heat sinks
US9066381B2 (en) 2011-03-16 2015-06-23 Integrated Illumination Systems, Inc. System and method for low level dimming
DE102011016935A1 (de) * 2011-04-13 2012-10-18 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement
US9967940B2 (en) 2011-05-05 2018-05-08 Integrated Illumination Systems, Inc. Systems and methods for active thermal management
WO2013009759A2 (en) 2011-07-11 2013-01-17 Amerigon Incorporated Thermoelectric-based thermal management of electrical devices
US9609720B2 (en) 2011-07-26 2017-03-28 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US8710770B2 (en) 2011-07-26 2014-04-29 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US20150237700A1 (en) 2011-07-26 2015-08-20 Hunter Industries, Inc. Systems and methods to control color and brightness of lighting devices
US10874003B2 (en) 2011-07-26 2020-12-22 Hunter Industries, Inc. Systems and methods for providing power and data to devices
US9521725B2 (en) 2011-07-26 2016-12-13 Hunter Industries, Inc. Systems and methods for providing power and data to lighting devices
US11917740B2 (en) 2011-07-26 2024-02-27 Hunter Industries, Inc. Systems and methods for providing power and data to devices
US9390998B2 (en) * 2012-02-17 2016-07-12 Invensas Corporation Heat spreading substrate
US8792226B2 (en) 2012-03-27 2014-07-29 General Electric Company Heat transfer system for use with electrical devices and method of operating the same
US8894437B2 (en) 2012-07-19 2014-11-25 Integrated Illumination Systems, Inc. Systems and methods for connector enabling vertical removal
US9379578B2 (en) 2012-11-19 2016-06-28 Integrated Illumination Systems, Inc. Systems and methods for multi-state power management
US9420665B2 (en) 2012-12-28 2016-08-16 Integration Illumination Systems, Inc. Systems and methods for continuous adjustment of reference signal to control chip
US9485814B2 (en) 2013-01-04 2016-11-01 Integrated Illumination Systems, Inc. Systems and methods for a hysteresis based driver using a LED as a voltage reference
WO2014110524A1 (en) 2013-01-14 2014-07-17 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
JP6637765B2 (ja) * 2013-01-30 2020-01-29 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 熱電ベースの熱管理システム
US9258878B2 (en) * 2013-02-13 2016-02-09 Gerald Ho Kim Isolation of thermal ground for multiple heat-generating devices on a substrate
WO2014207595A1 (en) * 2013-06-26 2014-12-31 Koninklijke Philips N.V. Modular heat sink
CN106030898B (zh) 2013-10-29 2019-04-05 詹思姆公司 利用热电学的电池热管理
KR101592649B1 (ko) 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
KR102226353B1 (ko) 2014-09-12 2021-03-10 젠썸 인코포레이티드 흑연 열전기적 및/또는 저항성 열 관리 시스템 및 방법
FR3034171B1 (fr) * 2015-03-23 2021-03-19 Valeo Vision Support de led avec surface de reception et connexion electrique par pontage
US10228711B2 (en) 2015-05-26 2019-03-12 Hunter Industries, Inc. Decoder systems and methods for irrigation control
US10918030B2 (en) 2015-05-26 2021-02-16 Hunter Industries, Inc. Decoder systems and methods for irrigation control
US10030844B2 (en) 2015-05-29 2018-07-24 Integrated Illumination Systems, Inc. Systems, methods and apparatus for illumination using asymmetrical optics
US10060599B2 (en) 2015-05-29 2018-08-28 Integrated Illumination Systems, Inc. Systems, methods and apparatus for programmable light fixtures
JP3203785U (ja) * 2015-06-24 2016-04-14 研晶光電股▲ふん▼有限公司 流体冷却式ランプ
US11993132B2 (en) 2018-11-30 2024-05-28 Gentherm Incorporated Thermoelectric conditioning system and methods
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US10801714B1 (en) 2019-10-03 2020-10-13 CarJamz, Inc. Lighting device
CN112705423B (zh) * 2021-01-18 2021-11-12 济南法诺商贸有限公司 一种智能芯片制造设备及制造方法
US12096693B2 (en) * 2022-03-28 2024-09-17 International Business Machines Corporation Temperature indicator powered by thermoelectric generator
CN119212299B (zh) * 2022-12-06 2025-11-14 华为技术有限公司 一种冷板组件、电子设备和液冷系统
US12416908B2 (en) 2022-12-29 2025-09-16 Integrated Illumination Systems, Inc. Systems and methods for manufacturing light fixtures
US12297996B2 (en) 2023-02-16 2025-05-13 Integrated Illumination Systems, Inc. Cove light fixture with hidden integrated air return

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047198A (en) 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US4322737A (en) * 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
DE69211074T2 (de) * 1991-08-26 1996-10-02 Sun Microsystems Inc Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5287619A (en) * 1992-03-09 1994-02-22 Rogers Corporation Method of manufacture multichip module substrate
DE69329542T2 (de) * 1992-06-05 2001-02-08 Mitsui Chemicals, Inc. Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte
US6150716A (en) * 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
DE19506093C2 (de) * 1995-02-22 2000-12-07 Dilas Diodenlaser Gmbh Diodenlaserbauelement
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
EP1019970A1 (en) 1997-09-25 2000-07-19 University of Bristol Optical irradiation device
US5982630A (en) * 1997-11-06 1999-11-09 Intel Corporation Printed circuit board that provides improved thermal dissipation
US6200134B1 (en) * 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
JP3667990B2 (ja) * 1998-05-27 2005-07-06 富士写真フイルム株式会社 画像読取装置
US20020054480A1 (en) * 1999-05-12 2002-05-09 Ionel Jitaru Enhanced thermal coupling for electronic boards
US7059049B2 (en) * 1999-07-02 2006-06-13 International Business Machines Corporation Electronic package with optimized lamination process
US6194246B1 (en) * 1999-08-25 2001-02-27 Motorola Inc. Process for fabricating electronic devices having a thermally conductive substrate
US6492725B1 (en) * 2000-02-04 2002-12-10 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package
US7320593B2 (en) * 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
US6327149B1 (en) * 2000-09-06 2001-12-04 Visteon Global Technologies, Inc. Electrical circuit board and method for making the same
US20020163781A1 (en) * 2001-05-01 2002-11-07 Ericsson Inc. Integrated cooling of a printed circuit board structure
US6540525B1 (en) * 2001-08-17 2003-04-01 High Connection Density, Inc. High I/O stacked modules for integrated circuits
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
JP2003332749A (ja) * 2002-01-11 2003-11-21 Denso Corp 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板
US6679315B2 (en) 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
WO2003081127A2 (en) 2002-03-26 2003-10-02 Enfis Limited Cooled light emitting apparatus
US6573536B1 (en) 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
EP1535299B1 (en) 2002-07-16 2009-11-18 odelo GmbH White led headlight
JP2005534201A (ja) 2002-07-25 2005-11-10 ジョナサン エス． ダーム、 発光ダイオードを硬化用に使用するための方法および装置
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6991356B2 (en) * 2002-12-20 2006-01-31 Efraim Tsimerman LED curing light
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US6976769B2 (en) * 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
TWI263008B (en) * 2004-06-30 2006-10-01 Ind Tech Res Inst LED lamp
CA2614803C (en) * 2005-04-05 2015-08-25 Tir Technology Lp Electronic device package with an integrated evaporator

Also Published As

Publication number Publication date
HUE042450T2 (hu) 2019-06-28
US20080239675A1 (en) 2008-10-02
EP1846949A4 (en) 2012-11-14
PT1846949T (pt) 2018-11-29
EP1846949B1 (en) 2018-08-22
US9111822B2 (en) 2015-08-18
ES2690540T3 (es) 2018-11-21
DK1846949T3 (en) 2018-10-15
WO2006072176A1 (en) 2006-07-13
EP3413345A1 (en) 2018-12-12
CA2606687A1 (en) 2006-07-13
SI1846949T1 (sl) 2018-11-30
TR201815693T4 (tr) 2018-11-21
CA2606687C (en) 2015-08-11
EP1846949A1 (en) 2007-10-24

Similar Documents

Publication Publication Date Title
PL1846949T3 (pl) Urządzenie przewodzące cieplnie i elektrycznie
IL238063B (en) Electrically conductive and semi-conductive surfaces
EP1852964A4 (en) POWER CONVERTER
EP1852963A4 (en) POWER CONVERTER
DE602006013458D1 (de) Elektrische servolenkvorrichtung
EP1879038A4 (en) CONDUCTOR CONTACTS SUPPORT AND CONDUCTIVE CONTACTS UNIT
ITPD20040236A1 (it) Radiatore elettrico
DE602005021338D1 (de) Elektrische dermabrasionsvorrichtung
ITMI20051723A1 (it) Struttura elettrica riscaldante
DE502006004466D1 (de) Elektrisches bauelement
DE112007003439A5 (de) Elektrisches Gerät und Geräteanordnung
MA28719B1 (fr) Mecanisme electrique encastrable et plurifonctionnel
DE602006021739D1 (de) Elektrische servolenkvorrichtung
DE112006001884A5 (de) Elektrisches Bauelement
DE502005001432D1 (de) Elektrisches feldgerät
DE602006006382D1 (de) Elektrisches Schaltgerät und Wärmeübertrager dafür
DE602005024230D1 (de) Elektrisches Gerät
DE502006004870D1 (de) Elektrisches durchführungsbauelement
DE602005003447D1 (de) Elektrische Verbindervorrichtung
UA12199S (uk) Електричний з`єднувач
FIU20050436U0 (fi) Tehoelektroniikkalaite
RU44373U8 (ru) Электроводонагреватель
NO20062419L (no) Elektrisk anordning
DE112005003817A5 (de) Elektroenergieübertragungseinrichtung
FI7284U1 (fi) Jäähdytysjärjestely sähkölaitteen yhteydessä