1330897 九、發明說明： 【發明所屬之技術領域】 本發明涉及發光源模組，特別是關於一種具有散熱裝 置以對發光源進行散熱的發光二極體模組及其製造方法。、 【先前技術】 發光二極體(LED，Light-emitting Diode)的壽命比—般 燈泡高出5〇〜100倍，而LED本身耗費的電量僅爲一般燈泡 的1/3〜1/5 ’可望在二十-世紀取代鶴絲燈和水銀燈，成爲 兼具省電和環保概念的新照明光源。 作爲固體光源本身的一個特點，LED發光源在工作時 也將發出熱量，目如所使用的LED模組大都將多個以 尚密度陣列的方式連接於一印刷電路板(pCB)上，並將該 PCB板置於-金屬散熱ϋ上對其進行散熱，散熱器與pcB 板之間一般填充有導熱膠等熱介面材料以彌補二者之間的 空隙而減小兩者之間的接觸熱阻。但是pCB板的材料一般 爲FR-4(由環氧樹脂與玻璃纖維含浸壓覆而成），其熱傳導 性能不佳，而PCB板與散熱器之間雖然填充有導熱膠，但 導熱膠的導熱係數遠遠小於金屬’因而pCB板與散熱器之 間仍會産生較大的接觸熱阻，使LED所産生的熱量無法有 效的經由PCB板傳導至散熱器予以散發而導致其溫度的升 南，致使晶片本身及封裝樹脂性能的惡化，引起LED發光 效率的下降，嚴重影響其發光亮度及縮短其使用壽命，因 此如何將LED光源所産生的熱量快速有效的導出及散發， 已成爲影響LED發光品質與壽命的關鍵因素。 【發明内容】 種具有高散熱效率的發光二 有鑒於此，有必要提供 極體模組及其製造方法。 熱心-散熱裝置及設置於該散 少-發光二極體接觸的:::面該 與所述至少-料L 該'^面上直接形成有 極體愈至所、^ 電連接的線路，該至少一發光二 所魏路電連接並通過該絲裝置進行散熱。 種發光二極體模組之势生 先提供一散熱裝置，該散敎括以下步驟：首 政…裝置具有一用於安裝發光二極 理；其讀對概熱裝置时裝面進行絕緣處 光-絕緣處理的安裝面上鋪銅線路;最後將發 先一極體電連接至上述銅線路。 與習知的發光二極體模組相比，本發明發光二極體模 ^於散熱裝置上直接形成線路，發光二極體直接與散熱裝 f的線路相連接，省去了習知的PCB板，避免了PCB板 :散熱裝置之間接觸熱阻的産生，發光二極體所産生的熱 里可直接由散熱裝置予以快速散發’保證發光二極體模組 的正常工作’提升其使驗能及使用壽命。 【實施方式】 下面參照附圖，結合實施例對本發明作進一步說明。 如圖1至2所示爲本發明發光二極體模組第一實施例， 其包括複數發光二極及一用於對所述LEDi〇I 熱的散熱裝置。該實施例中散熱裝置爲—則式散熱器 1330897 30,包括一基座31及自該基座31的底面一體向上延伸形成 的複數散熱鰭片32，所述散熱鰭片32爲多行多列排布的若 干細柱。顯然，所述散熱鰭片32是爲增加散熱器3〇的散熱 面積，亦可呈相互平行排列的薄片狀結構，而所述散熱鰭 片32與基座31亦可分別成型，然後通過焊接等方式組裝而 成。 請同時參閱圖3，基座31的底面形成一安裝面33，該安 裝面33上开〉成有與LED10電性連接的正負極線路2〇。此線 路20可隨發光源的樣式及數量而改變，並不限於圖中所示 形式。每一LED10包括一與所述正負極線路2〇連結的LED a曰片14及一將LED晶片14罩設於其内的透光封裝層(圖 2)。所述LED晶片14通過打線方式(wire b〇nding)或者覆晶 方式(flip chip)與線路20實現電性連接，本實施例揭示爲使 用打線方式進行連接，即利用金線16wLED晶片14連接至 線路20的導電接點22上，以形成電連接。該透光封裝層12 一般採用矽膠或者環氧樹脂，用以保護LED晶片14不受外 界影響及破壞，同時亦具有將該LED晶片14穩固連接至散 熱态30上的功效。據此，每一led晶片14在工作時産生的 熱量可直接經由散熱器30的基座31吸收，並進一步通過散 熱鰭片32散佈至環境中，此種散熱方式中，線路2〇一體形 成於散熱器30上，LED晶片14産生的熱量可直接傳導至散 熱器30上，從而避免了線路2〇與散熱器3〇之間接觸熱阻的 産生而導致LED晶片14所産生的熱量無法有效地傳遞至散 熱器30散發的問題，大大提升了LED晶片14與散熱器兕之 1330897 間熱量的傳導效率，從而能快速的將LED晶片14所産生的 熱量散佈至環境中，保證發光二極體模組正常工作，提升 其使用性能及使用壽命。 如第4圖及圖5所示爲本發明發光二極體模組第二實施 例示意圖，與上述第一實施例的不同之處在於：該散熱裝 置還包括一扁平狀熱管40，其爲一呈真空狀的封閉腔體， 腔體的一側形成一安裝LED10的平面狀的安裝面43，同樣 該安裝面43上直接設有與LED10電性連接的線路2〇(請參 圖3)。該熱管40的腔體内填充有低沸點的工作液體。據此， 當LED10在工作時産生的熱量可直接經由該熱管的腔體 吸收，熱管40内的工作液體吸熱達到其沸點後快速汽化產 生蒸汽，由於蒸氣在腔内的傳播阻力幾乎可以忽略，産生 的蒸氣將迅速充滿整個腔體，而當碰到熱管4〇的冷卻面（即 熱g'40與散熱|§30a的接觸面）時將再次冷卻成液體，爲促 使冷卻後的工作液體回流，腔體的内壁設有用以產生毛細 作用力的毛細結構42，從而通過工作液體的相變化而快速 的將LED10所産生的熱量均布于整個熱管4〇，爲加強熱管 40熱量的散發，散熱器3〇a可通過焊接或導熱介質直接連接 于熱管40的冷卻面上。爲增加熱管4〇與散熱器3〇a之間的傳 熱面積，所述散熱器3〇a於基座31a上形成凹槽311而將熱管 40收容於其内。實際上，該散熱器3〇a的基座31&可設置多 個凹槽311而同時收谷多根熱管4〇，從而可供更多ledi〇同 時使用。 相變傳熱具有快速輸送大量熱能、溫度分佈均勻、低 1330897 熱阻、遂轉輸等條，可制快速且充分傳導熱量的目 的，從而可更一步確保這些LED1〇i常工作並維持最大發 光亮度。 如圖6及圖7所示爲本發明第三及第四實施例，該兩實 粑例中散熱裝置均包括一熱管4〇c、4〇d及連接于該熱管的 散熱器3Ge、3Gd，與前述實施例的不同之處在於：該兩實 施例中散熱器30c、30d由複數散熱鰭片32c、32(1堆疊設置 而成。如圖6所示，散熱器3此的每一散熱鰭片3以於其中一 側邊的中央位置處形成凹槽37，所述凹槽37共同構成一空 間用於收容熱管4Gc，熱管4〇c的兩端分別形成蒸發端41與 冷凝端42，並於蒸發端41的上、下兩侧分別形成安裝LEDl〇 的女裝面43c，每一安裝面43C上直接形成線路2〇(請參圖3) 與LED10電性相連。從而通過熱管4〇c的快速導熱的特性以 將分別置於蒸發端41兩側的LED χ 〇所産生的熱量有效地導 出，並進一步通過設置于熱管4〇c的冷凝端的42的散熱器 30c散發。 如圖7所示爲本發明第四實施例，與上述第三實施例相 同，該實施例中熱管40d同樣爲扁平熱管，熱管4〇d兩端分 別形成洛發端41與冷凝端42 ’熱管40d的蒸發端41連接於一 由南導熱材料，如銅荨製成的均熱板5〇。該均熱板％的上 表面形成安裝LED10的平面狀的安裝面53d，該安裝面53d 上直接形成線路20(清參圖3)與LED10電性相連。所述散熱 器30d的散熱鰭片32d穿設于熱管40的冷凝端42上，每一散 熱鰭片32d於其大致中央位置處形成穿孔％供熱管斗㈤的冷 10 凝端42穿设其中’從而可將熱管4〇d_LED1〇所吸收的熱量 更爲均勻地分佈至散熱鰭片32d，更有利於熱量的散發。 如圖8所示，爲本發明的第五實施例，其同樣利用工作 流體的相變傳熱達到快速傳熱的目的，該實施例中散熱裝 置爲蒸發腔式散熱器30b，其基座3ib爲一填充有工作液 體的蒸發腔(vapor chamber)，同樣該蒸發腔3lb的一側形成 一平面狀的安裝面313，該安裝面313上直接形成線路2〇(請 參圖3)與LED10電性相連。蒸發腔31b的另一侧設有複數散 熱鰭片32b以辅助散熱。與熱管4〇、4〇c、4〇d不同的是，該 ?备發腔31b具有更大的接觸面積，蒸發腔31b内的工作液體 吸收LED10産生的熱量並蒸發産生蒸汽，並通過設於蒸發 腔31b上的散熱鰭片32而將熱量及時散發出去。該蒸發腔 31b具有比上述熱管4〇、4〇c、40d更大的裸露表面，可提供 更多的LED晶片14的安裝空間，圖中揭示爲三排LED1〇& 列設置於一個蒸發腔31b的安裝面313上。 圖9揭示爲本發明發光二極體封裝結構的第六實施 例’爲達均熱及移除熱量之目的’本實施例利用工作流體 直接流經一冷卻板7〇的液冷方式對LED10所産生的熱量進 行移除’該冷卻板7〇包括一腔體71及與該腔體71密閉的— 蓋板73 ’該冷卻板70的蓋板73的頂面72形成線路2〇(請參圖 3)直接與LED10電性連接，該冷卻板7〇的腔體71内開設有 彎曲流道201，供冷卻工作液通過，從而，LED1〇i作時産 生的熱量即可通過該冷卻板7〇直接傳遞至冷卻板7〇内的工 作液體’並通過工作液體在流道内201的循環流動而均布於 1330897 該冷卻板70上，吸收熱量後的高溫液體在外界泵體21〇的驅 動下在液冷系統中作熱交換，比如經由設置在外界管道220 上、由複數散熱鰭片組成的熱交換器230將熱量帶走，冷卻 • 後的液體即再次進入冷卻板内70，如此使工作流體在液冷 系統中循環流動，達到移除LED10熱量的目的。 本發明的上述實施例中，於散熱器30的基座31、熱管 40(40c、40d)、蒸發腔3〇b及冷卻板70等散熱裝置上直接形 成線路20 ’而將LED10直接連接於散熱裝置的線路2〇上， 無需設置額外的PCB板，避免了 PCB板與散熱裝置之間由 於接觸熱阻而導致LED10産生的熱量無法有效地傳遞至散 熱裝置上，有效地提升了散熱效率，同時省去了pCB板， 節省材料，降低成本。另外，本發明第二至六實施例中， 所述散熱裝置形成有腔體，並通過腔體内工作流體的相變 化或者循環流動而達到迅速將1^1)1〇所産生的熱量均布於 所述均熱裝置上，並隨之通過外部設置的散熱鰭片或者熱 • 錄器而將熱量從均熱裝置上移除，還達到防止局部熱點 (hotspot)的出現，有效解決高發熱量發光源的散熱問題。 如上所述，本發明發光二極體模組通過於散熱裝置上 形f線路*直接與LED爾性連接’崎健職阻而達 到提升散熱效率的目的。下面參閱第1〇圖，介紹本發明發 光二極體模組的製造方法。 。首先提供一散熱裝置，該散熱裝置可爲一鰭片式散熱 器，或爲熱管、蒸發腔、冷卻板等具有工作液體的散熱裝 置以下以散熱器3〇爲例，說明本發明發光二極體模組的 12 1330897 製造方法，該散熱器30可通過清洗、鹼洗（caustic scrubbing)、去毛刺(burring)等方式形成光滑平整的安裝面 33。然後對該安裝面33進行絕緣處理，於該安裝面33形成 ' 一絕緣層。所述絕緣處理可通過真空濺鍍、蒸鍍或陽極處 理等方式，於該安裝面形成一層非常薄的絕緣層，上述絕 緣處理方式均爲習知技藝而於此不贅述。 然後於該散熱器30的絕緣層上鋪銅箔，即於該絕緣層 上形成一銅箔層，可通過藏鍍(SpUtterjng)、高熱熱壓上銅 箔、化學鍍銅、電鍍等方式形成。 其中錢鍍是利用輝光放電(gl〇 W(jis_charge)將氬氣(Ar) 離子撞擊靶(tar-get)表面’靶材的原子被彈出而堆積在基板 表面形成薄膜。濺鍍設備一般通過強力磁鐵將電子成螺旋 狀運動以加速靶材周圍的氬氣離子化，造成靶與氬氣離子 間的撞擊機率增加，提高濺鑛速率。銅濺鍵大都採用直流 賤鍵即在真空令利用輝光放電(gl〇wdischarge)將氬氣(A^) • 離子撞擊靶材(tar_get)表面，電漿中的陽離子會加速沖向作 爲被濺鍍材的負電極表面，這個衝擊將使靶材的物質（即爲 銅）飛出而沈積在基板(即散熱器30的基座31的安裝面33)上 形成銅薄膜。 一實際上由於絕緣層的表面不容易附著其他物質，在通 過同熱熱壓或電鍍等方式鋪銅落之前可先通過表面活化處 理(如表面喷銀、表面噴沙、表面粗化、表面活化等）、去皮 膜處理活化散熱裝置的安裝面33。然後通過化學錄銅或電 錄的方式於、緣層表面均勻覆蓋一銅荡層。電鑛指借助外 13 沈二全屈 '用’在溶液中進行電解反應，使基材的表面 、邦或°金層。電鍍常用的工藝種類有驗性氰化物 二5 1雜鋼、㈣酸鹽軸、檸檬酸賊銅等。例 硫酸鹽鑛銅，細社要含有魏銅、魏和水’甚至 添加劑。硫酸銅是銅離子(cu2+)的來源，當溶解于 /離解出娜子’銅離子會在陰極(即散熱裝置的安裝 面)還原沉積成金屬銅。此過程會受鑛浴的狀況如銅離子濃 度、酸驗度㈣、溫度、獅、電流、添加劑等影響。在 電鑛過程冷中’可通過在浴中添加硫酸銅或用銅作陽極來 避免銅離子,辰度㈣耗而下降。化學職則無需外加電 緣，其是利用溶液中的離子進行氧化還原反應，由甲搭氧 化釋放電子，供給周_離子，使其發生還原崎鐘在具 有催化活f生纪活性點上，而此析鍍出的銅，又繼續進行催 化^映’使反應持續進行。另外也可於縣層上首先形成 一環氧樹脂層，然後通過朗纖維含浸壓覆而形成-層 FR-4 ’再進行高熱熱壓上銅箔。 然後即形成銅線路2〇，該步驟中通過上光阻、曝光、 侧的方式戦銅線路2G，另外也可通過圖雜移、曝光 顯影等方式形成線路2G。制的，在鋪層厚度較大的情 況下，可通過衝壓直接形成銅線路2〇。 最後是將LED1G·接至散熱裝置安裝面所形成的線 路20上。其中一種方式是將已經封裴好的1£1)1〇的導電接 腳通過打線方式或者以覆晶安裝方式連接至線路2〇上，另 外也可將LED W14首先置於散熱裝置絲面删相應位 置上’然麵過打金屬線的方式或者以覆晶安裝方式將 >1 14與線路20電連接，最後通過縣將LED晶片14 雄封没置讀絲裝層咖，㈣賴l 界影響及破壞。 卜 $上所述’本發㈣合發明專利要件，紐法提出專 ，申-月It ’以上所述者僅為本發明之較佳實施例，舉凡 本案技☆之人士 H依本發明精神所作之等效修飾 2化’自b>t涵蓋於以下之巾請專利範圍内。 【圖式簡單說明】 土圖1係本發明發光二極體模組第一實施例立體分解示 模組沿散熱裝置縱長方向 圖2係爲本發明發光二極體 的組裝剖視示意圖。 圖3係爲圖1中散熱裝置上所形成的線路示意圖。 意圖 圖4係爲本發明發光二極體模組的第二實關分解示 圖5係爲圖4沿橫向的組裝剖視示意圖。 立圖6係爲本發明發光二極體模組的第三實施例組裝示 忍圖。 土圖7係爲本發明發光二極體模組的第四實施例組裝示 忍圖。 、圖8係爲本發明發光二極體模組的第五實施例組裝剖 視示意圖。 圖9係爲本發明發光二極體模_第六實施例立體分1330897 IX. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a light emitting diode module having a heat dissipating device for dissipating heat from a light source and a method of manufacturing the same. [Prior Art] The life of a light-emitting diode (LED) is 5〇~100 times higher than that of a general-purpose bulb, and the power consumed by the LED itself is only 1/3~1/5 of the average bulb. It is expected to replace the crane lamp and the mercury lamp in the 20th century, and become a new lighting source with both power saving and environmental protection concepts. As a feature of the solid-state light source itself, the LED light source will also generate heat during operation. For example, most of the LED modules used are connected to a printed circuit board (pCB) in a density array. The PCB board is placed on a metal heat sink to dissipate heat. The heat sink and the PCB board are generally filled with a thermal interface material such as a thermal conductive adhesive to compensate for the gap between the two and reduce the contact thermal resistance between the two. . However, the material of the pCB board is generally FR-4 (impregnated by epoxy resin and glass fiber), and its heat conduction performance is not good, while the thermal conductivity of the thermal conductive adhesive is filled between the PCB board and the heat sink. The coefficient is much smaller than that of the metal'. Therefore, a large contact thermal resistance is still generated between the pCB board and the heat sink, so that the heat generated by the LED cannot be effectively transmitted to the heat sink through the PCB board to be emitted, thereby causing the temperature to rise. The deterioration of the performance of the wafer itself and the encapsulating resin causes a decrease in the luminous efficiency of the LED, which seriously affects the luminance of the LED and shortens its service life. Therefore, how to quickly and effectively derive and dissipate the heat generated by the LED light source has become an influence on the LED illumination quality. A key factor with longevity. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a polar body module and a method of manufacturing the same. The enthalpy-heat dissipating device and the ::: surface disposed on the surface of the scatter-light-emitting diode and the at least the material L are directly formed with a circuit connecting the polar body to the electrical connection. At least one of the two light-emitting devices is electrically connected and dissipated through the wire device. The illuminating diode module first provides a heat dissipating device, and the dispersing method includes the following steps: the first ruling device has a device for mounting the illuminating diode; and the reading is performed on the insulating surface of the thermal device. - copper-plated lines on the insulating-treated mounting surface; finally, the first-pole body is electrically connected to the copper line. Compared with the conventional light-emitting diode module, the light-emitting diode module of the present invention directly forms a line on the heat-dissipating device, and the light-emitting diode is directly connected with the line of the heat-dissipating device f, thereby eliminating the conventional PCB. The board avoids the PCB board: the contact heat resistance between the heat sinks, the heat generated by the light-emitting diodes can be quickly dissipated directly by the heat sink device to ensure the normal operation of the light-emitting diode module. Energy and service life. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings. 1 to 2 show a first embodiment of a light-emitting diode module according to the present invention, which includes a plurality of light-emitting diodes and a heat sink for heating the LEDs. In this embodiment, the heat sink is a heat sink 1330897 30, and includes a base 31 and a plurality of heat dissipation fins 32 extending integrally from the bottom surface of the base 31. The heat dissipation fins 32 are multi-row and multi-row. A number of thin columns arranged. Obviously, the heat dissipating fins 32 are formed in a sheet-like structure in which the heat dissipating fins 32 are arranged in parallel with each other, and the heat dissipating fins 32 and the susceptor 31 may be respectively formed by soldering, etc. The way it is assembled. Referring to FIG. 3 at the same time, the bottom surface of the base 31 forms a mounting surface 33, and the mounting surface 33 is opened to have positive and negative lines 2〇 electrically connected to the LED 10. This line 20 may vary depending on the style and number of illumination sources and is not limited to the form shown in the figures. Each of the LEDs 10 includes an LED a chip 14 coupled to the positive and negative lines 2A and a light transmissive encapsulation layer (FIG. 2) in which the LED chip 14 is housed. The LED chip 14 is electrically connected to the line 20 by wire bonding or flip chip. This embodiment discloses that the wire bonding method is used for connection, that is, the gold wire 16w LED chip 14 is connected to The conductive contacts 22 of the line 20 are formed to form an electrical connection. The light-transmissive encapsulating layer 12 is generally made of silicone or epoxy to protect the LED chip 14 from external influences and damage, and also has the effect of firmly connecting the LED chip 14 to the heat-dissipating state 30. Accordingly, the heat generated by each of the LED chips 14 during operation can be directly absorbed by the base 31 of the heat sink 30 and further dispersed into the environment through the heat dissipation fins 32. In this heat dissipation mode, the wires 2 are integrally formed. On the heat sink 30, the heat generated by the LED chip 14 can be directly conducted to the heat sink 30, thereby avoiding the occurrence of contact thermal resistance between the line 2 and the heat sink 3, and the heat generated by the LED chip 14 cannot be effectively effective. The problem of transmitting to the heat sink 30 is greatly improved, and the heat transfer efficiency between the LED chip 14 and the heat sink 1330897 is greatly improved, so that the heat generated by the LED chip 14 can be quickly dispersed into the environment to ensure the light-emitting diode. The module works normally to improve its performance and service life. FIG. 4 is a schematic view showing a second embodiment of the LED module according to the present invention, which is different from the first embodiment in that the heat dissipating device further includes a flat heat pipe 40, which is a A vacuum-shaped closed cavity is formed on one side of the cavity to form a planar mounting surface 43 on which the LED 10 is mounted. Similarly, the mounting surface 43 is provided with a line 2 electrically connected to the LED 10 (see FIG. 3). The cavity of the heat pipe 40 is filled with a working fluid having a low boiling point. Accordingly, when the heat generated by the LED 10 during operation can be directly absorbed through the cavity of the heat pipe, the working liquid in the heat pipe 40 absorbs heat to reach its boiling point and rapidly vaporizes to generate steam, and the propagation resistance of the vapor in the cavity is almost negligible. The vapor will quickly fill the entire cavity, and when it encounters the cooling surface of the heat pipe 4 (ie, the contact surface of the heat g'40 and the heat dissipation|§30a), it will be cooled again into a liquid, in order to promote the return of the working liquid after cooling. The inner wall of the cavity is provided with a capillary structure 42 for generating capillary force, so that the heat generated by the LED 10 is evenly distributed to the entire heat pipe 4 through the phase change of the working liquid, so as to enhance the heat dissipation of the heat pipe 40, the radiator 3〇a can be directly connected to the cooling surface of the heat pipe 40 by welding or a heat transfer medium. In order to increase the heat transfer area between the heat pipe 4A and the heat sink 3A, the heat sink 3A forms a groove 311 on the base 31a to house the heat pipe 40 therein. In fact, the base 31& of the heat sink 3〇a can be provided with a plurality of grooves 311 while receiving a plurality of heat pipes 4〇, so that more LEDs can be used at the same time. Phase-change heat transfer has the advantages of quickly transporting a large amount of heat energy, uniform temperature distribution, low 1330897 thermal resistance, and enthalpy transfer, which can quickly and fully conduct heat, so as to ensure that these LEDs work frequently and maintain maximum illumination. brightness. 6 and FIG. 7 show the third and fourth embodiments of the present invention. The heat dissipating devices of the two embodiments include a heat pipe 4〇c, 4〇d and a heat sink 3Ge, 3Gd connected to the heat pipe. The difference from the foregoing embodiment is that the heat sinks 30c, 30d in the two embodiments are formed by stacking a plurality of heat dissipation fins 32c, 32 (as shown in FIG. 6, each heat sink fin of the heat sink 3). The sheet 3 is formed with a groove 37 at a central position of one side thereof, and the groove 37 collectively constitutes a space for accommodating the heat pipe 4Gc, and the two ends of the heat pipe 4〇c respectively form an evaporation end 41 and a condensation end 42, and A female face 43c for mounting the LEDs 形成 is formed on the upper and lower sides of the evaporation end 41, and a line 2〇 (see FIG. 3) is directly formed on each mounting surface 43C to be electrically connected to the LED 10. Thus, the heat pipe 4〇c The rapid thermal conductivity characteristic is effective to conduct heat generated by the LEDs 分别 分别 respectively placed on both sides of the evaporation end 41, and is further radiated through the heat sink 30c disposed at the condensation end 42 of the heat pipe 4〇c. Shown as a fourth embodiment of the present invention, which is the same as the third embodiment described above, the heat pipe 40 in this embodiment d is also a flat heat pipe, and the two ends of the heat pipe 4〇d respectively form a hair-emitting end 41 and a condensation end 42. The evaporation end 41 of the heat pipe 40d is connected to a soaking plate 5 made of a south heat-conducting material such as copper enamel. The upper surface of the hot plate % forms a planar mounting surface 53d on which the LED 10 is mounted. The mounting surface 53d directly forms a line 20 (see FIG. 3) electrically connected to the LED 10. The heat sink fin 32d of the heat sink 30d is disposed. On the condensation end 42 of the heat pipe 40, each of the heat dissipation fins 32d forms a perforation at a substantially central position thereof. The cold 10 condensation end 42 of the heat supply pipe (5) is inserted therein to thereby absorb heat absorbed by the heat pipe 4〇d_LED1〇. More evenly distributed to the heat dissipating fins 32d, which is more favorable for heat dissipation. As shown in FIG. 8, which is a fifth embodiment of the present invention, the same uses the phase change heat transfer of the working fluid to achieve rapid heat transfer. In this embodiment, the heat dissipating device is an evaporation chamber type heat sink 30b, and the base 3ib is a vapor chamber filled with a working liquid, and the side of the evaporation chamber 31b also forms a planar mounting surface 313. Line 2 is formed directly on the mounting surface 313 (please refer to 3) electrically connected to the LED 10. The other side of the evaporation chamber 31b is provided with a plurality of heat dissipation fins 32b to assist heat dissipation. Unlike the heat pipes 4〇, 4〇c, 4〇d, the preparation chamber 31b has more The large contact area, the working liquid in the evaporation chamber 31b absorbs the heat generated by the LED 10 and evaporates to generate steam, and the heat is dissipated in time through the heat dissipation fins 32 provided on the evaporation chamber 31b. The evaporation chamber 31b has a heat pipe The larger exposed surfaces of 4〇, 4〇c, and 40d provide more installation space for the LED chips 14, and the three rows of LEDs 1 & columns are disposed on the mounting surface 313 of the evaporation chamber 31b. FIG. 9 is a view showing a sixth embodiment of the light-emitting diode package structure of the present invention for the purpose of achieving heat absorption and heat removal. The liquid cooling method of the present embodiment uses a working fluid to directly flow through a cooling plate 7〇 to the LED 10 The generated heat is removed. The cooling plate 7 includes a cavity 71 and a cover 73 that is sealed with the cavity 71. The top surface 72 of the cover plate 73 of the cooling plate 70 forms a line 2 (refer to the figure). 3) directly connected to the LED 10, the cavity 71 of the cooling plate 7 is provided with a curved flow channel 201 for the cooling working fluid to pass through, so that the heat generated by the LED1〇i can pass through the cooling plate 7〇 The working liquid directly transferred to the cooling plate 7〇 is uniformly distributed on the cooling plate 70 by the circulating flow of the working liquid in the flow channel 201, and the high-temperature liquid absorbed by the heat is driven by the external pump body 21〇. The heat is exchanged in the liquid cooling system, for example, by the heat exchanger 230 disposed on the external pipe 220 and composed of a plurality of heat radiating fins, and the liquid after cooling is re-entered into the cooling plate 70, so that the working fluid Circulating flow in a liquid cooling system LED10 achieve the purpose of removing heat. In the above embodiment of the present invention, the line 20' is directly formed on the heat sink of the base 31, the heat pipe 40 (40c, 40d), the evaporation chamber 3〇b, and the cooling plate 70 of the heat sink 30, and the LED 10 is directly connected to the heat sink. On the line 2 of the device, there is no need to provide an additional PCB board, which avoids the heat generated by the LED 10 due to the contact thermal resistance between the PCB board and the heat sink, which cannot be effectively transmitted to the heat sink, thereby effectively improving the heat dissipation efficiency. The pCB board is omitted, saving materials and reducing costs. In addition, in the second to sixth embodiments of the present invention, the heat dissipating device is formed with a cavity, and the heat generated by the 1^1)1〇 is uniformly distributed by the phase change or the circulating flow of the working fluid in the cavity. The heat is removed from the heat equalizing device by externally disposed heat sink fins or heat registers, thereby preventing the occurrence of local hotspots and effectively solving high heat radiation. The heat problem of the source. As described above, the light-emitting diode module of the present invention achieves the purpose of improving heat dissipation efficiency by directly connecting the f-line* to the LED on the heat sink device. Referring to Fig. 1 below, a method of manufacturing the light-emitting diode module of the present invention will be described. . Firstly, a heat dissipating device is provided. The heat dissipating device can be a finned heat sink, or a heat dissipating device having a working liquid such as a heat pipe, an evaporation chamber, a cooling plate, etc., and the heat sink 3 is taken as an example to illustrate the light emitting diode of the present invention. The manufacturing method of the module 12 1330897, the heat sink 30 can form a smooth and flat mounting surface 33 by washing, caustic scrubbing, burring or the like. Then, the mounting surface 33 is insulated to form an insulating layer on the mounting surface 33. The insulating treatment may form a very thin insulating layer on the mounting surface by means of vacuum sputtering, evaporation or anodic treatment, and the above-mentioned insulating treatment methods are all well-known techniques and will not be described herein. Then, a copper foil is laid on the insulating layer of the heat sink 30, that is, a copper foil layer is formed on the insulating layer, and can be formed by deposit plating, high heat hot pressing copper foil, electroless copper plating, electroplating or the like. Among them, the gold plating is performed by using a glow discharge (glsW (jis_charge) to argon (Ar) ions hit the surface of the target (tar-get). The atoms of the target are ejected and deposited on the surface of the substrate to form a thin film. The sputtering device generally passes the force. The magnet moves the electrons in a spiral shape to accelerate the ionization of argon around the target, which increases the probability of collision between the target and the argon ions, and increases the rate of splashing. Most of the copper splash keys use a DC 贱 bond to discharge the glow in a vacuum. (gl〇wdischarge) argon (A^) • ions hit the surface of the target (tar_get), the cations in the plasma will accelerate toward the surface of the negative electrode as the sputtered material, this impact will make the target material ( That is, copper is blown out and deposited on the substrate (ie, the mounting surface 33 of the base 31 of the heat sink 30) to form a copper film. Actually, since the surface of the insulating layer is not easily attached to other substances, it is passed through the same hot heat or Before plating copper or the like, the surface of the heat sink may be activated by surface activation treatment (such as surface spray, surface sandblasting, surface roughening, surface activation, etc.), and the surface of the heat sink may be activated by chemical etching. The method is to uniformly cover a copper-plated layer on the surface of the edge layer. The electro-mineral refers to the surface, the state or the gold layer of the substrate by means of the external 13-thickness and the use of the electrolytic reaction in the solution. Authentic cyanide 251 heterochromium, (iv) acid salt, citric acid copper, etc. For example, sulphate ore copper, fine society should contain Wei copper, Wei and water 'even additives. Copper sulphate is the source of copper ions (cu2+), When dissolved/dissociated, Nazi' copper ions will be reduced to metal copper at the cathode (ie, the mounting surface of the heat sink). This process will be affected by the condition of the mineral bath such as copper ion concentration, acidity (four), temperature, lion, The influence of current, additives, etc. In the cold process of the electric ore process, copper ions can be avoided by adding copper sulfate in the bath or using copper as the anode, and the consumption of the copper (I) is decreased. The chemical job does not need an external electric edge, which is a solution. The ions in the redox reaction are carried out, and the electrons are released by the oxidative oxidation of the metal, and the ions are supplied to the ionic ions to cause the reduction of the singular clock to have a catalytic activity, and the copper which is deposited is further catalyzed. Ying's response Alternatively, an epoxy resin layer may be first formed on the county layer, and then the layer FR-4' is formed by immersion molding of the lan fiber, and the copper foil is further hot-pressed. Then, a copper line is formed. In the step, the copper line 2G is formed by the upper photoresist, the exposure, and the side, and the line 2G can also be formed by patterning, exposure and development, etc., in the case where the thickness of the layer is large, the stamping can be directly The copper line 2 is formed. Finally, the LED 1G· is connected to the line 20 formed by the mounting surface of the heat sink. One way is to pass the already-sealed 1£1) 1〇 conductive pin through the wire or over the wire. The crystal mounting method is connected to the line 2 ,, and the LED W14 can be first placed on the heat-dissipating device wire surface to delete the corresponding position, or the metal wire can be over-typed or flip-chip mounted to be >1 14 and the line 20 Electrical connection, and finally through the county to the LED chip 14 male seal did not read the silk layer of coffee, (four) the impact and damage. The above-mentioned 'Beifa (4) and the invention patent requirements, Newfa's proposal, Shen-Yi It' is only the preferred embodiment of the present invention, and the person H of the present invention is made according to the spirit of the present invention. The equivalent modification 2 'from b> t is covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the assembly of a light-emitting diode according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the light-emitting diode of the present invention. Figure 3 is a schematic view of the circuit formed on the heat sink of Figure 1. 4 is a second embodiment of the light-emitting diode module of the present invention. FIG. 5 is a schematic cross-sectional view of the assembly of FIG. Figure 6 is an assembly diagram of a third embodiment of the light-emitting diode module of the present invention. The soil map 7 is an assembly diagram of the fourth embodiment of the light-emitting diode module of the present invention. FIG. 8 is a schematic cross-sectional view showing the fifth embodiment of the light emitting diode module of the present invention. 9 is a light-emitting diode model of the present invention.