TWI449226B - Thermal structure for led device - Google Patents

Description

Heat dissipation structure for light emitting diode device

The present invention relates to a heat dissipating structure, and more particularly to a heat dissipating structure for a light emitting diode device.

A Light-Emitting Diode (LED) is a semiconductor component. When a forward voltage is applied, the LED can emit monochromatic, discontinuous light, which is one of the electroluminescence effects. By changing the chemical composition of the semiconductor material used, the LED can emit a different color.

In the early days, the light-emitting diodes were mainly used as indicator lights or mounted on an advertisement display panel. In recent years, with the rapid development of technology, the application range of light-emitting diodes has become wider and wider, and has been widely used in backlight modules and lighting.

However, at high temperatures, the energy conversion efficiency of the light-emitting diodes drops rapidly, and more heat is generated in addition to wasting power. In addition, if the temperature rises further, the service life of the light-emitting diode is greatly shortened. Therefore, in the field of light-emitting diodes, heat dissipation has been a matter of great concern to those of ordinary skill in the art.

The main object of the present invention is to provide a heat dissipation structure for a light-emitting diode, and the heat dissipation structure can make the screw originally used for locking function as a heat dissipation effect.

According to the above and other objects, the present invention provides a heat dissipation structure for at least one light emitting diode device, the light emitting diode device including a positive conductive region, a negative conductive region, and a heat conducting region, wherein The thermally conductive region is isolated from the positive and negative conductive regions. The heat dissipation structure includes a heat dissipation plate, a circuit board, and at least one screw. Wherein, the circuit board is disposed on the heat dissipation plate, and the light emitting diode device is mounted on the circuit board. In addition, the bottom of the screw is locked to the heat sink, and the screw is used to lock the board together with the heat sink. Additionally, the circuit board includes at least one first line that is coupled to the thermally conductive region and the screw is in contact with the first line.

In the above heat dissipation structure, the screw includes a screw head and a screw, and the screw head is pressed against the first line.

In the above heat dissipation structure, the heat dissipation plate includes a substrate and a plurality of fins, wherein the screws are locked to one side of the substrate, and the fins are disposed on the other side of the substrate.

In the above heat dissipation structure, the heat dissipation structure is mounted on a lamp, wherein the heat dissipation plate is a part of the lamp housing of the lamp.

In the above heat dissipation structure, the heat dissipation plate is made of metal, such as copper or aluminum.

In the above heat dissipation structure, the circuit board is a metal-based printed circuit board, a printed circuit board, a ceramic substrate, or a germanium substrate.

In the above heat dissipation structure, the screw is made of metal.

Since the first line on the circuit board is connected to the heat conduction area of the light emitting diode device, and the screw is pressed against the first line, the heat generated by the light emitting diode die passes through the heat conduction area and the first line. It is passed to the screw and passed to the heat sink via the screw. As a result, the overall heat dissipation efficiency of the light-emitting diode device can be improved.

The above described objects, features, and advantages of the present invention will become more apparent from the following description.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a heat dissipation structure according to a first embodiment of the present invention. The heat dissipation structure 100 includes a heat dissipation plate 110, a circuit board 120, and at least one screw 130. The circuit board 120 is locked to the heat dissipation plate 110 by screws 130. In addition, a plurality of light emitting diode devices 20 are mounted on the circuit board 120. The screw 130 is made of metal and includes a screw head 131 and a screw 132. The diameter of the screw head 131 is larger than the diameter of the screw 132. The screw 132 is provided with an external thread and is locked on the heat dissipation plate 110. The heat sink 110 is mainly made of a metal material (for example, aluminum or copper) or other materials having a high thermal conductivity.

Please refer to FIG. 2 , which is a structural diagram of the LED device 20 . The light emitting diode device 20 includes a die 21, a positive conductive region 22, a substrate 23, a negative conductive region 24, a plurality of insulating film patterns 25, and a heat conducting region 26, wherein the positive conductive region 22 and the negative conductive region 24. Both of the heat transfer regions 26 are metal thin films, which are mainly composed of copper. The insulating film pattern 25 is distributed between the positive conductive region 22 and the substrate 23 and between the negative conductive region 24 and the substrate 23. The heat conductive region 26 is directly disposed on the substrate 23 and has the die 21 disposed thereon, and the main layer of the substrate 23 The material is copper. Moreover, the positive conductive region 22, the negative conductive region 24, and the heat conductive region 26 do not contact each other. In addition, a first wire 27 and a second wire 29 are connected to the die 21, the first wire 27 is connected between the die 21 and the positive conductive region 22, and the second wire 29 is connected to the die 21 and negative. Conductive zone 24. In addition, the LED device 20 is electrically connected to the circuit board 120 by soldering 28. When the light-emitting diode device 20 is activated, the crystal grains 21 emit colored light.

Please refer to FIG. 2 and FIG. 3 simultaneously. FIG. 3 is a top view of the heat dissipation structure 100. A plurality of first lines 122 are disposed on the circuit board 120. The first lines 122 are thermally conductive regions 26 connected to the LED device 20. In the present embodiment, there are four screws 130, which are respectively locked at four corners of the circuit board 120. However, those skilled in the art can also set different numbers of screws depending on the situation, for example: only one screw is provided, and the screw is locked in the center of the circuit board. Further, in the present embodiment, the material of the screw is metal, but other materials having a high thermal conductivity, such as ceramic materials, may also be used.

Referring to FIG. 2, FIG. 3 and FIG. 4 together, FIG. 4 is an enlarged view showing the structure of the circuit board, which shows the relationship between the screw 130, the circuit board 120 and the heat dissipation plate 110. The circuit board 120 is a metal-based printed circuit board including a first line 122, an insulating layer 124 and an aluminum substrate 126. A solder mask layer 128 may be disposed on the circuit board 120. The function of the solder resist layer 128 is to prevent short circuit caused by wave soldering and save the amount of solder. The insulating layer 124 is disposed on the aluminum substrate 126. The first line 122 is disposed on the insulating layer 124, and the screw head 131 is directly pressed against the first line 122. Since the first line 122 is connected to the heat transfer region 26, the heat generated by the die 21 is conducted to the heat transfer region 26, is transferred to the screw 130 via the first line 122, and then transferred to the heat sink 110. In this way, in addition to fixing the circuit board 120 to the heat dissipation plate 110, the screw 130 can also have the effect of dissipating heat. Therefore, the overall heat dissipation efficiency of the light-emitting diode device 20 can be effectively improved.

Referring to FIG. 5, FIG. 5 is a schematic diagram of a heat dissipation structure according to a second embodiment of the present invention. The same components as those in the first embodiment will be denoted by the same reference numerals and will not be described again. The heat sink 210 of the heat dissipation structure 200 includes a substrate 212 and a plurality of fins 214 which are located on the other side of the substrate 212 as compared to the screws 130. Due to the arrangement of the fins 214, the area of the convection between the heat sink 210 and the air can be increased, thereby improving the heat dissipation efficiency. The fins 214 are integrally formed with the substrate 212, for example, or the fins 214 may be soldered to one side of the substrate 212.

In the first embodiment, the heat sink is a separate flat plate structure, and in the second embodiment, the heat sink is a separate heat sink. However, the heat sink can also be part of other components, such as a part of the lamp envelope of the luminaire. Further, in the above embodiment, the circuit board is a metal-based printed circuit board, but those skilled in the art may also change it to a printed circuit board, a ceramic substrate, or a germanium substrate.

The screws in the above embodiments all have a screw head, and the screw head is exposed outside the circuit board, but those skilled in the art can also choose to use the countersunk head screw. Please refer to FIG. 6. FIG. 6 is a schematic diagram showing the relationship between the circuit board and the countersunk screw of another embodiment. In the present embodiment, unlike the screw 130 of the first embodiment, the screw 330 is a countersunk screw, that is, the upper surface of the screw 330 is flush with the upper surface of the circuit board 320. Additionally, the end of the first line 322 on the circuit board 320 surrounds and contacts the top of the screw 330.

The present invention has been described above by way of examples, and is not intended to limit the scope of the claims. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Modifications or modifications made by those skilled in the art, without departing from the spirit or scope of the invention, are equivalent to the equivalents or modifications made in the spirit of the invention and should be included in the following claims. Inside.

20. . . Light-emitting diode device

twenty one. . . Grain

27. . . First wire

29. . . Second wire

twenty one. . . Grain

twenty two. . . Positive conduction zone

twenty three. . . Substrate

twenty four. . . Negative conductive zone

25. . . Insulating film pattern

26. . . Thermal conduction zone

28. . . Solder

100. . . Heat dissipation structure

110. . . Radiating plate

120. . . Circuit board

122. . . First line

124. . . Insulation

126. . . Aluminum plate

128. . . Solder mask

130. . . Screw

131. . . Screw head

132. . . Screw

200. . . Heat dissipation structure

210. . . Radiating plate

212. . . Base

214. . . Fin

320. . . Circuit board

322. . . First line

330. . . Screw

FIG. 1 is a schematic view showing a heat dissipation structure according to a first embodiment of the present invention.

FIG. 2 is a structural diagram of a light emitting diode device.

FIG. 3 is a top view of the heat dissipation structure.

FIG. 4 is an enlarged view showing the structure of the circuit board.

FIG. 5 is a schematic view showing a heat dissipation structure according to a second embodiment of the present invention.

FIG. 6 is a schematic diagram showing the relationship between a circuit board and a countersunk screw of another embodiment.

20. . . Light-emitting diode device

100. . . Heat dissipation structure

120. . . Circuit board

122. . . First line

130. . . Screw

Claims (9)

A heat dissipation structure is applied to at least one light emitting diode device, the light emitting diode device includes a positive conductive region, a negative conductive region, and a heat conducting region, and the heat conducting region is opposite to the positive conductive region and the negative conductive region The heat dissipation structure includes: a heat dissipation plate; a circuit board, the circuit board is disposed on the heat dissipation plate, and the light emitting diode device is mounted on the circuit board; and at least one screw, the bottom of the screw is Locked on the heat dissipation plate, and the screw is locked to the circuit board and the heat dissipation plate; wherein the circuit board includes at least one first line, the first line is connected to the heat conduction area, and the screw is The first line is in contact. The heat dissipation structure according to claim 1, wherein the screw comprises a screw head and a screw, and the screw head is pressed against the first line. The heat dissipation structure of claim 1, wherein the heat dissipation plate comprises a base and a plurality of fins, the screw is locked on one side of the base, and the fin is another one disposed on the base side. The heat dissipation structure according to claim 1, wherein the heat dissipation structure is mounted on a lamp, wherein the heat dissipation plate is a part of a lamp housing of the lamp. The heat dissipation structure according to claim 1, wherein the heat dissipation plate is made of metal. The heat dissipation structure according to claim 5, wherein the heat dissipation plate is made of copper or aluminum. The heat dissipation structure according to claim 1, wherein the circuit board is a metal-based printed circuit board, a printed circuit board, a ceramic substrate, or a germanium substrate. The heat dissipation structure according to claim 1, wherein the screw is made of metal. The heat dissipation structure according to claim 1, wherein the screw is a countersunk screw.