CN219530784U

CN219530784U - Semiconductor light-emitting device

Info

Publication number: CN219530784U
Application number: CN202223422935.8U
Authority: CN
Inventors: 胡佳乐
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-08-15
Anticipated expiration: 2032-12-19

Abstract

The utility model discloses a semiconductor light emitting device, comprising: the LED lamp comprises a substrate, lamp beads, a first heat-conducting silica gel sheet, a heat-radiating copper sheet and heat-radiating fins; wherein, the surface of the substrate is uniformly provided with a plurality of lamp beads distributed in a rectangular array; the bottom of base plate fixed mounting has first heat conduction silica gel piece, the bottom fixed mounting of first heat conduction silica gel piece has the heat dissipation copper sheet, the equidistant fixed mounting of bottom of heat dissipation copper sheet has a plurality of fin. The utility model has the advantages that the first heat conduction silica gel piece, the heat dissipation copper sheet and the heat dissipation fins are additionally arranged on the surface of the substrate, the overall heat dissipation effect is greatly improved, meanwhile, the lamp beads are in contact with the second heat conduction silica gel piece, heat is conducted through the copper heat dissipation sheet, and the heat is further dissipated through the first heat conduction silica gel piece, the heat dissipation copper sheet and the heat dissipation fins, so that the overall heat dissipation effect is better.

Description

Semiconductor light-emitting device

Technical Field

The utility model relates to the field of semiconductor light-emitting devices, in particular to a semiconductor light-emitting device.

Background

A light emitting diode is a commonly used light emitting device, and a conventional LED is a low voltage direct current device, which is mounted on a substrate; a semiconductor light emitting device is formed.

The surface of the existing semiconductor light-emitting device emits light through the lamp beads; the heat dissipation effect of a general semiconductor light emitting device may be poor, and the heat dissipation area thereof is small, and the heat dissipation area thereof cannot be increased, and generally only heat dissipation can be performed through a substrate. Accordingly, a semiconductor light emitting device is proposed for the above-described problems.

Disclosure of Invention

The embodiment provides a semiconductor light emitting device for solving the problem of poor heat dissipation effect in the prior art.

The present utility model provides a semiconductor light emitting device including: the LED lamp comprises a substrate, lamp beads, a first heat-conducting silica gel sheet, a heat-radiating copper sheet and heat-radiating fins; wherein, the surface of the substrate is uniformly provided with a plurality of lamp beads distributed in a rectangular array; the bottom of base plate fixed mounting has first heat conduction silica gel piece, the bottom fixed mounting of first heat conduction silica gel piece has the heat dissipation copper sheet, the equidistant fixed mounting of bottom of heat dissipation copper sheet has a plurality of fin.

Further, copper radiating fins are arranged at the bottoms of the lamp beads.

Further, two pins of the lamp bead are connected with the top of the substrate.

Further, the copper radiating fin is fixedly embedded and connected with the concave hole formed on the surface of the substrate.

Further, a second heat conduction silica gel piece is arranged at the bottom of the lamp bead, and the second heat conduction silica gel piece is in contact with the top of the copper radiating fin.

Further, the copper radiating fin is in contact with the first heat conduction silica gel sheet.

Further, a fixing head is fixedly arranged at the top of the radiating copper sheet, and the head of the fixing head is positioned at the top of the substrate.

Further, the fixing head penetrates through the through holes formed in the substrate and the first heat-conducting silica gel sheet.

Further, an insulating sleeve is wrapped on the fixing head, and the insulating sleeve is in contact with the substrate.

Further, a plurality of heat dissipation holes are uniformly formed in the surface of the heat dissipation fin along the length direction.

The utility model has the advantages that: this kind of semiconductor light emitting device has improved on prior art, and it has add first heat conduction silica gel piece, heat dissipation copper sheet, fin on the face of base plate, very big improvement holistic radiating effect, simultaneously the lamp pearl is through contacting with the second heat conduction silica gel piece, heat conduction through copper fin, further dispels the heat through first heat conduction silica gel piece and heat dissipation copper sheet, fin, holistic radiating effect is better.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a mounting structure of a heat dissipating copper sheet according to an embodiment of the present utility model;

fig. 3 is a schematic view of a lamp bead mounting structure according to an embodiment of the utility model.

In the figure: 1. a substrate; 2. a lamp bead; 3. a first thermally conductive silicone sheet; 4. a heat dissipation copper sheet; 5. a heat radiation fin; 6. a fixed head; 7. an insulating sleeve; 8. a through hole; 9. pins; 10. a second thermally conductive silicone sheet; 11. copper heat sink.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

Referring to fig. 1-3, a semiconductor light emitting device includes: base plate 1, lamp pearl 2, first heat conduction silica gel piece 3, heat dissipation copper sheet 4 and fin 5 dispel the heat.

As shown in fig. 1, as a specific technical scheme, a plurality of light beads 2 distributed in a rectangular array are uniformly arranged on the surface of the substrate 1, and light is emitted through the light beads 2.

As shown in fig. 1, as a specific technical scheme, a first heat-conducting silica gel sheet 3 is fixedly installed at the bottom of the substrate 1, a heat-radiating copper sheet 4 is fixedly installed at the bottom of the first heat-conducting silica gel sheet 3, a plurality of heat-radiating fins 5 are fixedly installed at equal intervals at the bottom of the heat-radiating copper sheet 4, and a heat-radiating effect is provided, wherein the first heat-conducting silica gel sheet 3 has the heat-conducting and insulating effects, and generated heat is transferred to the heat-radiating copper sheet through the first heat-conducting silica gel sheet 3, so that the heat-radiating area is greatly improved, and the heat is conveniently radiated.

As shown in fig. 1 and fig. 3, as a specific technical solution, a copper heat sink 11 is disposed at the bottom of the lamp bead 2; the copper radiating fin 11 is fixedly embedded and connected with a concave hole formed on the surface of the substrate 1; the bottom of the lamp bead 2 is provided with a second heat conduction silica gel sheet 10, and the second heat conduction silica gel sheet 10 is contacted with the top of the copper radiating fin 11; the copper radiating fins 11 are contacted with the first heat conduction silica gel sheet 3; the heat generated by the lamp beads 2 is transferred to the copper radiating fins 11, and then transferred to the first heat conduction silica gel sheet 3 for heat conduction.

As shown in fig. 3, as a specific technical solution, two pins 9 of the lamp bead 2 are connected to the top of the substrate 1, for electrical connection of the lamp bead 2.

A fixed head 6 is fixedly arranged at the top of the radiating copper sheet 4, and the head of the fixed head 6 is positioned at the top of the substrate 1; the fixing head 6 penetrates through a through hole 8 formed in the substrate 1 and the first heat conducting silica gel sheet 3 and is used for fixedly mounting the heat radiating copper sheet 4.

The fixed head 6 is wrapped with an insulating sleeve 7, and the insulating sleeve 7 is in contact with the substrate 1 to realize insulating contact.

The surface of the radiating fin 5 is uniformly provided with a plurality of radiating holes along the length direction.

The circuit, the electronic components and the modules are all in the prior art, and can be completely realized by a person skilled in the art, and needless to say, the protection of the utility model does not relate to the improvement of software and a method.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor light emitting device characterized in that: comprising the following steps: the LED lamp comprises a substrate (1), lamp beads (2), a first heat-conducting silica gel sheet (3), a heat-radiating copper sheet (4) and heat-radiating fins (5);

wherein, the surface of the substrate (1) is uniformly provided with a plurality of lamp beads (2) distributed in a rectangular array;

the heat-conducting silicon wafer structure is characterized in that a first heat-conducting silicon wafer (3) is fixedly arranged at the bottom of the substrate (1), a heat-radiating copper sheet (4) is fixedly arranged at the bottom of the first heat-conducting silicon wafer (3), and a plurality of heat-radiating fins (5) are fixedly arranged at equal intervals at the bottom of the heat-radiating copper sheet (4).

2. A semiconductor light emitting device according to claim 1, wherein: the bottom of the lamp bead (2) is provided with a copper radiating fin (11).

3. A semiconductor light emitting device according to claim 1, wherein: two pins (9) of the lamp bead (2) are connected with the top of the substrate (1).

4. A semiconductor light emitting device according to claim 2, wherein: the copper radiating fin (11) is fixedly embedded and connected with a concave hole formed on the surface of the substrate (1).

5. A semiconductor light emitting device according to claim 1, wherein: the bottom of lamp pearl (2) is provided with second heat conduction silica gel piece (10), second heat conduction silica gel piece (10) and the top contact of copper fin (11).

6. A semiconductor light emitting device according to claim 5, wherein: the copper radiating fin (11) is contacted with the first heat conduction silica gel sheet (3).

7. A semiconductor light emitting device according to claim 1, wherein: the top of the radiating copper sheet (4) is fixedly provided with a fixing head (6), and the head of the fixing head (6) is positioned at the top of the base plate (1).

8. A semiconductor light emitting device according to claim 7, wherein: the fixing head (6) penetrates through a through hole (8) formed in the substrate (1) and the first heat-conducting silica gel sheet (3).

9. A semiconductor light emitting device according to claim 7, wherein: the fixing head (6) is wrapped with an insulating sleeve (7), and the insulating sleeve (7) is in contact with the substrate (1).

10. A semiconductor light emitting device according to claim 1, wherein: the surface of the radiating fin (5) is uniformly provided with a plurality of radiating holes along the length direction.