KR20080093284A - An apparatus for radiating heat of led light - Google Patents

An apparatus for radiating heat of led light Download PDF

Info

Publication number
KR20080093284A
KR20080093284A KR1020070037020A KR20070037020A KR20080093284A KR 20080093284 A KR20080093284 A KR 20080093284A KR 1020070037020 A KR1020070037020 A KR 1020070037020A KR 20070037020 A KR20070037020 A KR 20070037020A KR 20080093284 A KR20080093284 A KR 20080093284A
Authority
KR
South Korea
Prior art keywords
heat
heat sink
pipe
heat pipe
heat dissipation
Prior art date
Application number
KR1020070037020A
Other languages
Korean (ko)
Other versions
KR100891433B1 (en
Inventor
김민영
박태문
유형열
Original Assignee
주식회사 남영전구
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 남영전구 filed Critical 주식회사 남영전구
Priority to KR1020070037020A priority Critical patent/KR100891433B1/en
Publication of KR20080093284A publication Critical patent/KR20080093284A/en
Application granted granted Critical
Publication of KR100891433B1 publication Critical patent/KR100891433B1/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/272Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

An apparatus for discharging heat from an LED(Light Emitting Diode) is provided to increase heat transfer effect by discharging heat with first and second heat sinks receiving heat from a heat pipe. An apparatus for discharging heat from an LED includes a U-type heat pipe(5), a first heat sink(7), and second heat sinks(9). The U-type heat pipe has blades(3) and is directly connected to an electronic device. The blades are formed on both sides of the U-type heat pipe. The first heat sink is composed of vertical pins and is installed between the blades inside the U-type heat pipe. The second heat sinks are cylindrical and are installed on outer sides of both blades respectively. The first and second heat sinks form a space(11) for enlarging an air contacting surface.

Description

LED heat dissipation device {AN APPARATUS FOR RADIATING HEAT OF LED LIGHT}

1 is a side view showing the principle of a heat dissipation device of an electronic component using a heat pipe according to the present invention;

2 is a plan view of a heat dissipation device of an electronic component according to the present invention;

3 is an exploded perspective view of a heat dissipation device of an electronic component according to the present invention;

4 is an assembled perspective view of a heat dissipation device of an electronic component according to the present invention;

5 is a side view illustrating a concept of a conventional electronic component heat dissipation apparatus using a heat pipe.

* Explanation of symbols on the main parts of the drawings

1-Electronic parts 3-Wings

5-Heat Pipe 7-Primary Heat Sink

9-secondary heat sink 11-space

The present invention relates to a heat dissipation device for an electronic component using a heat pipe, and in particular, a heat pipe is directly installed on a lower surface of a printed circuit board, and a heat dissipation plate connected to the heat pipe has a double structure to effectively dissipate heat. It relates to a heat dissipation device.

In general, light emitting diodes (LEDs), which are widely used as billboards, signs, lights, and other optical materials, have been used in general lighting because of improved optical efficiency.

However, high power / high efficiency LED exhibits a property of deteriorating optical characteristics at high temperatures according to heat generation characteristics. Therefore, in order to maintain constant optical characteristics, the heat generated from the LED must be sufficiently radiated. Insufficient heat dissipation may result in deterioration of optical output characteristics, long term life span and efficiency degradation.

In order to solve this problem, a heat radiator is used to radiate heat generated from semiconductor components such as LEDs to the atmosphere as described above. As a conventional radiator, a heat radiator is used to radiate heat using copper or aluminum having good thermal conductivity. In addition, there is a structure using a heat pipe in which a heat transfer liquid is built in and heat transfer liquid efficiently transfers heat while repeatedly circulating vaporization and liquefaction.

On the other hand, as described above, since the heat dissipator using a medium such as copper and aluminum having excellent thermal conductivity depends on the heat conductivity of the material itself, the heat dissipation property is used in proportion to the area of the heat dissipation body. The radiator should be made to use a radiator or improve the ventilation structure.The radiator, which has a large area of radiator using materials such as copper or aluminum, has a low heat transfer rate, so the temperature of the radiator is On the other hand, in the heat dissipation technology using heat pipes, heat can be transferred to other structures by using heat conduction properties of the built-in heat transfer liquid to dissipate heat, thereby effectively conducting heat and thereby reducing the temperature of the heat dissipation source. It is possible to dissipate the heat within a short time.

However, in the existing heat dissipation device using the heat pipe, there is a problem that the heat of the electronic component is not sufficiently cooled because the effect of the heat pipe is not sufficiently used.

On the other hand, in the heat dissipation technology using a heat pipe for cooling the CPU in the computer field, the heat is conducted using a circular heat pipe, and then cooled by a heat sink having a size larger than that of the heat dissipation source or an additional fan is attached. It is intended to improve the cooling performance.

However, in a product that must be designed in a small area, it is difficult to attach such a large heat sink even when using a heat pipe, and it is difficult to expect effective cooling performance when the fan cannot be used.

For example, as shown in FIG. 5, in the heat dissipation structure of a light emitting diode printed circuit board using a conventional heat pipe, a copper or aluminum conductor 103 is bonded to a heat generating source 101 such as a printed circuit board, and the conductor ( The heat pipe 105 is attached to the 103, and the heat sink 107 is connected to the upper end of the heat pipe 105.

In the conventional heat dissipation device having the structure as described above, the heat transfer property of the heat pipe 105 is excellent in effect, but the transferred heat is conducted again through the copper or aluminum conductor 103, the medium conduction There is a problem that the heat dissipation effect is reduced because the heat dissipation is made by the surface area of the air.

In addition, in the conventional heat dissipation device technology, although the heat dissipation plate 107 for dissipating heat transferred through the heat pipe 105 to the atmosphere has a plurality of heat dissipation fins, the air dissipation device is formed of a single structure composed of one body. The heat dissipation effect was low because the efficiency of heat transfer to the air was not low due to insufficient contact.

Accordingly, the present invention can effectively dissipate heat generated by semiconductor components such as LEDs that generate a lot of heat using heat pipes and heat sinks, so that a heat dissipation device having a structure that can be effectively used in a product such as an LED bulb is used. The purpose is to provide.

The apparatus of the present invention for achieving the above object, the horizontal portion of the U-shaped heat pipe having both wings on the lower surface of the electronic component of the heat generating source is directly connected, between the two wings of the U-shaped heat pipe A primary heat sink having a vertical fin shape is installed, and a secondary heat sink having a cylindrical shape is installed outside the wings of both ends of the heat pipe, and the primary heat sink and the secondary heat sink are disposed at predetermined intervals. A space portion is formed between the secondary heat sink and the secondary heat sink.

The secondary heat sink has a circular shape, and the outer surface has a concave-convex shape to increase the heat dissipation efficiency by increasing the surface area in contact with the air, and also has a concave-convex shape on the inner surface to further improve heat dissipation characteristics.

Since the heat conduction to the heat generating source and the primary and secondary heat sinks is performed by the heat pipe, the conduction area is widened by using a planar heat pipe.

Since the heat pipe of the present invention having such a structure is directly in contact with a semiconductor component such as an LED that generates heat, the heat pipe can effectively receive heat from the electronic component, and receives heat through the heat pipe, Heat can be transferred and distributed to the 1/2 heat sink dissipating in the middle. In addition, since the heat dissipation fins formed on the 1/2 heat dissipation plate are formed in different directions in the 1/2 heat dissipation plate, the heat dissipation fins are not only effectively dissipated heat of the heat pipe, The temperature can be lowered effectively.

Hereinafter, with reference to the accompanying drawings, the present invention will be described in detail.

1 is a conceptual side view showing the principle of the heat dissipation device of the electronic component using the heat pipe according to the present invention, as shown in the conceptual diagram, the heat dissipation device of the electronic component according to the present invention is an electronic component (1) forming a heat source U-shaped heat pipes 5 having both wing parts 3 are directly connected to each other, and between the wing parts 3 of the U-shaped heat pipe 5, a primary heat sink 7 having a vertical fin shape is provided. It is provided, and the secondary heat sink 9 made of a cylindrical shape is installed on the outer side of the wing portion 3 of the heat pipe (5).

The primary heat sink 7 and the secondary heat sink 9 are disposed at predetermined intervals, and a space 11 is formed between the primary heat sink 7 and the secondary heat sink 9.

The heat pipe 5 is generally used as it is well known in the art as a structure in which a liquid such as a refrigerant is embedded therein, inside the heat pipe 5 of the portion in direct contact with the electronic component (1) The heat generated from the electronic component 1 removes heat of vaporization while the refrigerant vaporizes, thereby cooling the electronic component 1, and the vaporized refrigerant cools by exchanging heat with the primary heat sink 7 and the secondary heat sink 9. It is condensed (condensed) and circulated as it is being formed, and it continuously cools by dissipating heat of the electronic component (1).

As described above, in the present invention, since the heat pipe 5 is in direct contact with the electronic component 1 that generates heat, the heat of the electronic component 1 is sufficiently transferred to the primary and secondary heat sinks 7 and 9. Because it can be transferred to, the heat transfer effect will be that much.

In addition, since the heat dissipation device according to the present invention has a structure in which the vertical heat dissipation fins 7a are formed in the vertical heat dissipation plate 7 in the vertical direction, and the second heat dissipation plate 9 is formed in the horizontal heat dissipation fins 9a, The heat of the heat pipe (5) can be effectively transferred to the atmosphere.

In the heat dissipation device according to the present invention, since the primary heat dissipation plate 7 and the secondary heat dissipation plate 9 are arranged with the space portion 11 interposed therebetween, air is sufficiently supplied through the space portion 11. While communicating, the heat from the primary heat sink 7 and the secondary heat sink 9 can be sufficiently delivered to the atmosphere, thereby increasing the heat dissipation effect.

2 is a plan view of the heat dissipation device of the electronic component according to the present invention, and shows the arrangement structure of the heat pipe 5, the primary heat sink 7, and the secondary heat sink 9.

As shown in FIG. 2, the secondary heat sink 9 has a structure in which the primary heat sink 7 is rounded from the outside, and a sufficient space portion between the primary heat sink 7 and the secondary heat sink 9 ( 11) is formed to have a structure that can smoothly communicate air.

3 is an exploded perspective view of the heat dissipation device according to the present invention, in which a heat pipe 5 is directly attached to an electronic component 1 such as a printed circuit board of a light emitting diode, and both wing portions 3 of the heat pipe 5 are attached. The primary heat sink (7) is built between the vertical fin-shaped, and the secondary heat sink (9) made of a circular shape is disposed on the outer sides of the wings (3).

Here, the attachment of the heat pipe 5 and the electronic component 1 may be attached by curing by applying a thermally conductive adhesive, or may be attached by screws in addition to this method, or other methods may be used. It may be.

Figure 4 is a perspective view of the heat dissipation device of the present invention coupled by the method of Figure 3, as shown in this figure by opening both sides of the secondary heat sink (9) heat pipe (5) and the primary heat sink ( 7) may be inserted from the side, or a hole may be drilled in the center of the secondary heat sink 9 and the heat pipe 5 and the primary heat sink 7 may be inserted into the hole from above.

Then, by forming grooves 13 having a predetermined size on both side surfaces of the secondary heat sink 9, the air is radiated by making sufficient air contact the inside of the secondary heat sink 9 of air through the groove 13. The effect can be increased.

In addition, the secondary heat sink 9 according to the present invention can further increase the heat dissipation effect by allowing air to communicate through a plurality of through holes 15 penetrating from the outer side to the inner side.

On the other hand, in the heat dissipation device according to the present invention, by forming the outer surface of the secondary heat sink 9 in an uneven shape, it is possible to increase the skin area in contact with air to increase the cooling effect.

As described above, since the heat dissipation device of the LED bulb according to the present invention is installed in close contact with the electronic component 1 in which the heat pipe 5 generates heat, the heat of the electronic component 1 is transferred to the heat pipe 5. It can transmit effectively, and the primary heat sink 7 is mounted between both wing portions 3 of the U-shaped heat pipe 5, and the secondary heat sink 9 is mounted on the outside of both wing portions 3. While having a structure in which a predetermined space 11 is formed between the primary heat sink 7 and the secondary heat sink 9, the primary and secondary heat sinks 7 and 9 are heat pipes 5. The heat can be effectively transferred to the atmosphere with sufficient heat in contact with the air, thereby increasing the heat transfer effect.

Claims (3)

  1. The horizontal portion of the U-shaped heat pipe having both wings is directly connected to the electronic component of the heat generating source, and a primary heat sink having a vertical fin shape is installed between both wings of the U-shaped heat pipe, and both wings of the heat pipe are installed. A secondary heat sink made of a cylindrical shape is installed on the outer side of the outer portion, while the primary heat sink and the second heat sink are disposed at a predetermined interval so that the heat dissipation of the LED bulb is formed in a space formed between the primary heat sink and the second heat sink. Device
  2. The heat dissipation device of claim 1, wherein a plurality of air communication through holes are formed on the side surfaces of the secondary heat sink.
  3. The heat dissipation device of claim 1, wherein grooves for air communication are formed at upper and lower ends of the secondary heat sink.
KR1020070037020A 2007-04-16 2007-04-16 An apparatus for radiating heat of led light KR100891433B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070037020A KR100891433B1 (en) 2007-04-16 2007-04-16 An apparatus for radiating heat of led light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070037020A KR100891433B1 (en) 2007-04-16 2007-04-16 An apparatus for radiating heat of led light

Publications (2)

Publication Number Publication Date
KR20080093284A true KR20080093284A (en) 2008-10-21
KR100891433B1 KR100891433B1 (en) 2009-04-06

Family

ID=40153887

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070037020A KR100891433B1 (en) 2007-04-16 2007-04-16 An apparatus for radiating heat of led light

Country Status (1)

Country Link
KR (1) KR100891433B1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100902631B1 (en) * 2008-10-24 2009-06-12 현대통신 주식회사 Circle type led lighting flood lamp using nano spreader
KR100948955B1 (en) * 2009-08-31 2010-03-19 박창수 Lighting device
US7891843B2 (en) 2008-11-10 2011-02-22 Hyundai Telecommunication Co., Ltd. LED lighting device
WO2011040671A1 (en) * 2009-10-01 2011-04-07 주식회사 렌즈 Light emitting diode lighting apparatus
KR101048454B1 (en) * 2009-03-24 2011-07-12 주식회사 엠티티 Cooling device for LED lighting using heat pipe
KR101052605B1 (en) * 2009-03-20 2011-07-29 박창수 LED Heat Sink
CN102221153A (en) * 2011-06-09 2011-10-19 中山伟强科技有限公司 High-power light-emitting diode (LED) lamp
KR101101256B1 (en) * 2009-11-27 2012-01-04 (주)파트라 light of LED
KR101126072B1 (en) * 2010-04-26 2012-03-16 주식회사 세명알엔지 LED light
KR101130706B1 (en) * 2009-04-15 2012-03-23 김혜경 radiant heat apparatus of LED lighting
KR200460223Y1 (en) * 2011-10-04 2012-05-10 새빛테크 주식회사 Radiating apparatus for LED illumination device
WO2012064131A2 (en) * 2010-11-11 2012-05-18 소닉스자펜 주식회사 Heat sink for a high-power led, and led light comprising same
WO2013089465A1 (en) * 2011-12-14 2013-06-20 김명희 Heat sink with coolant circulation
KR101303662B1 (en) * 2012-12-03 2013-09-04 정철우 High power led lighting for fire prevention
TWI414718B (en) * 2011-06-09 2013-11-11
US8602594B2 (en) 2010-06-23 2013-12-10 Lg Electronics Inc. Lighting device
US8764244B2 (en) 2010-06-23 2014-07-01 Lg Electronics Inc. Light module and module type lighting device
US8884501B2 (en) 2010-06-30 2014-11-11 Lg Electronics Inc. LED based lamp and method for manufacturing the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100925527B1 (en) * 2009-04-07 2009-11-06 지엘레페주식회사 Heat spreader piece, heat spreader for led lamp and tube type led lamp having the same
KR100953499B1 (en) 2009-08-27 2010-04-16 윤인숙 Heat-sink for led lamp
KR100947499B1 (en) 2009-09-17 2010-03-17 (주)레프코리아 An one body-radiator and manufacturing method of it
KR101229545B1 (en) 2010-10-26 2013-02-05 심현섭 Heat sink for led lamp and led lamp using the same
CN102767724A (en) * 2012-07-26 2012-11-07 中山伟强科技有限公司 Ceramic substrate LED (light emitting diode) module and high-power LED lamp

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200336197Y1 (en) * 2003-10-02 2003-12-12 주식회사 대진디엠피 Front irradiating Light using by LED
KR100496525B1 (en) * 2005-03-23 2005-06-22 주식회사 누리플랜 Led illumination lamp
KR200410556Y1 (en) 2005-11-24 2006-03-14 장인성 Floodlight
KR100657869B1 (en) 2005-12-16 2006-12-14 양경호 Led lighting device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7950826B2 (en) 2008-10-24 2011-05-31 Hyundai Telecommunication Co., Ltd. Circle type LED lighting flood lamp using nano spreader
KR100902631B1 (en) * 2008-10-24 2009-06-12 현대통신 주식회사 Circle type led lighting flood lamp using nano spreader
US7891843B2 (en) 2008-11-10 2011-02-22 Hyundai Telecommunication Co., Ltd. LED lighting device
KR101052605B1 (en) * 2009-03-20 2011-07-29 박창수 LED Heat Sink
KR101048454B1 (en) * 2009-03-24 2011-07-12 주식회사 엠티티 Cooling device for LED lighting using heat pipe
KR101130706B1 (en) * 2009-04-15 2012-03-23 김혜경 radiant heat apparatus of LED lighting
KR100948955B1 (en) * 2009-08-31 2010-03-19 박창수 Lighting device
KR101032091B1 (en) * 2009-10-01 2011-05-02 (주) 엠에스피 Illuminator using light-emitting diode
WO2011040671A1 (en) * 2009-10-01 2011-04-07 주식회사 렌즈 Light emitting diode lighting apparatus
KR101101256B1 (en) * 2009-11-27 2012-01-04 (주)파트라 light of LED
KR101126072B1 (en) * 2010-04-26 2012-03-16 주식회사 세명알엔지 LED light
US8764244B2 (en) 2010-06-23 2014-07-01 Lg Electronics Inc. Light module and module type lighting device
US8602594B2 (en) 2010-06-23 2013-12-10 Lg Electronics Inc. Lighting device
US8884501B2 (en) 2010-06-30 2014-11-11 Lg Electronics Inc. LED based lamp and method for manufacturing the same
WO2012064131A2 (en) * 2010-11-11 2012-05-18 소닉스자펜 주식회사 Heat sink for a high-power led, and led light comprising same
WO2012064131A3 (en) * 2010-11-11 2012-08-30 소닉스자펜 주식회사 Heat sink for a high-power led, and led light comprising same
CN102221153A (en) * 2011-06-09 2011-10-19 中山伟强科技有限公司 High-power light-emitting diode (LED) lamp
CN102221153B (en) * 2011-06-09 2013-08-14 中山伟强科技有限公司 High-power light-emitting diode (LED) lamp
TWI414718B (en) * 2011-06-09 2013-11-11
KR200460223Y1 (en) * 2011-10-04 2012-05-10 새빛테크 주식회사 Radiating apparatus for LED illumination device
WO2013051812A1 (en) * 2011-10-04 2013-04-11 새빛테크 주식회사 Heat sink device for an led lighting apparatus
WO2013089465A1 (en) * 2011-12-14 2013-06-20 김명희 Heat sink with coolant circulation
KR101303662B1 (en) * 2012-12-03 2013-09-04 정철우 High power led lighting for fire prevention

Also Published As

Publication number Publication date
KR100891433B1 (en) 2009-04-06

Similar Documents

Publication Publication Date Title
JP6001705B2 (en) Lighting assembly and system
US7847471B2 (en) LED lamp
US7766514B2 (en) Light emitting diode lamp with high heat-dissipation capacity
US8740415B2 (en) Partitioned heatsink for improved cooling of an LED bulb
US8334640B2 (en) Turbulent flow cooling for electronic ballast
JP6325685B2 (en) lighting equipment
US8665597B2 (en) Tube
KR200438525Y1 (en) Cooling device for led light source using non-conductive liquid
CN101451697B (en) LED lamp
US20140043815A1 (en) Light emitting diode bulb structure for enhancing heat dissipation efficiency
JP2004096074A (en) Heat sink with integrally formed fin and method of manufacturing the same
KR100972975B1 (en) LED Illumination Device
US20090103294A1 (en) Led lamp with a heat sink
US6906922B2 (en) Integrated heat-dissipating module
US9379039B2 (en) Heat transfer for electronic equipment
KR100818745B1 (en) LED module having cooling apparatus
US8556448B2 (en) Airfield lighting device
US8004842B2 (en) Heat dissipation device for communication chassis
US8011809B2 (en) Light-emitting diode module with heat dissipating structure and lamp with light-emitting diode module
JP3116108U (en) Light emitting diode set
US7794116B2 (en) LED lamp with a heat dissipation device
US20110026264A1 (en) Electrically isolated heat sink for solid-state light
KR101605666B1 (en) Cooling apparatus and cooling apparatus-attached power module using same
JP2012155904A (en) Led lighting system
WO2011096218A1 (en) Heat radiation device and electronic equipment using the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130228

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20140228

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20150216

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee