201248947 六、發明說明： 【發明所屬之技術領域】 特別是關於一種用於發光二極 本發明是關於一種散熱結構， 體裝置的散熱結構。 【先前技術】 發光二滅 aight.Emitting DiGde，_LED)是 體元件，當施加正向電辦，發光二_能發出單色、不連2 光’运是電致發級應的-種。改變所採㈣半導體材料的化^ 組成成分’便可使發光二極體發出不一樣的色光。 + ^也 作為指示燈絲設在廣告顯示板 上^年來，隨著技術的日新月異，發光二極體的朗範圍也命 來愈廣，在背光模減照财領_有廣泛賴用。 〜 然而’在高溫下發光二極體的能量轉換效率會急速下降，在 浪費電力之餘也會產生更多的熱。另外，若溫度進—步上升，也 會讓發光二極體的使財命大幅驗。因此，在發光二極體這個 領域散熱直疋很受本領域具有通常知識者關注的事項。 【發明内容】 ^發明的主要目的在於提供—種用於發光二極體的散熱結 構’本散熱結構可使縣用於鎖合_絲發揮散熱功效。 ^康上述目的與其他目的’本發明提供一種散熱結構， 此散‘，，、結構制於至少—發光二極體裝置，該發光二極體裝置包 括-正導電區、一負導電區、與一導熱區，其中導熱區與正導電 區及f導電區相隔離。上述之散熱結構包括：—散熱板、一電路 板、、至少。其中’電路板是設置於散熱板上，而發光二 4 201248947 ，體裝置是安餘魏板上。此外，螺絲的麵 上，且螺絲是將電路板與散熱板鎖合在 I散…板 且螺絲是與第一 線路相接觸 至少一第—鱗，該第-線路是連接料無科’電路板包括 該螺頭是 抵壓=^結構中，螺絲包括·'螺頭與-螺样， 螺絲構"：’脑_多個則，其中 鎖°在基底的—側，而則則是設置在該基底的另外一側。 之散舰射，散熱、轉是絲在—燈具上，其中散 *，、、板為該燈具之燈殼的一部分。 、 4列如：鋼或鋁。 電路板、印刷電 於上述之散熱結構中，散熱板的材質為金屬 於上述之散熱結構中，電路板為金屬基印刷 路板、陶瓷基板、或矽基板。 於上述之散熱結構中，螺絲的材質為金屬。 由於電路板上的第一線路是連接於發光二極 ΐ舍抵壓在第—線路上，故發光二極體晶粒所發出^ ^丄導‘、、'區與第-線路而傳遞到螺絲，再經由螺絲傳遞到散 …、如此來’發光二極體裝置的整體散熱效率便能提高。 【實施方式】 為讓本發明之上述目的、㈣和優點更能明顯n 下文將以實施例並get合所附圖式，作^細說明如下。 立4照ffl 1’圖1所_為本發明的第—實施例之散熱結構的 不思圖。此散熱結構100包括-散熱板110、-電路板120、與至 201248947 少一螺絲130，其中電路板120是藉由螺絲13〇而鎖合在散熱板 110上。此外，電路板120上則安裝有多個發光二極體裝置&。 螺絲130是由金屬所構成’其包括一螺頭131與一螺桿132，螺 131的直徑是大於螺桿132的直徑，螺桿132上設置有外螺紋並鎖 合在散熱板11G上。散熱板11G主要是由金屬材質（例如： 銅）或者其他導熱係數較高的材質所構成。 請參照圖2 ’圖2所繪示為發光二極體裝置2〇的結構圖。發 光一極體裝置20包括一晶粒21、一正導電區22、一基板23、一 負導電區24、多個絕緣薄膜圖案25、與—導熱區％^中正導; 區22、負導電區24、與導熱區26冑為金屬薄膜，其主要是由銅 所構成。絕緣溥膜圖案25是分佈在正導電區22盘基板23 g 導電區24與基板23間，輸26則是直接設置 其上方設置有晶粒21，而基板23的主要材質為銅。而且，正導電 區22、負導電區24、與導熱區26彼此間並不互相接觸。另外， 晶粒21上則連接有-第―導線27與_第二導線四，第—導線u 是連接於晶粒21與正導 22間，㈣二轉29職接於晶粒 21與負導電區24。此外，發光二極體裝置2G趙由焊錫28而與 電路板120電性連接。當發光二極體裝置2〇被啟動後，晶粒 便會發出色光。 請同時參照圖2與圖3，圖3所繪示為散熱結構的俯視 圖。於電路板120上設置有多條第一線路122，此第一線路 是連接到發光二極體裝置2〇的導熱區％。在本實施例中，螺絲 130共有四個’其分別是鎖合在電路板12()的四個祕。細本 領域具有通f知識者也可依狀況設置不·量的獅，例如：只 設置-個螺絲，並將此職鎖合在電路板的中央。此外，在本^ 施例中，螺絲的材質為金屬，但也可使用其他導熱絲較高的材 6 201248947 質，例如：陶質材料。 清，參照圖2、圖3、與圖4，圖4所繪示為電路板結構的 放大圖’其顯不出螺絲130、電路板12〇與散熱板ιι〇間的關係。 此電路板120為金屬基印刷電路板，其包括一第一線路122、一絕 =124與一紹基板126。電路板12〇上可設置-防焊層⑶，防 ^層128的功用在於j止波焊時所造成驗路並節省焊錫之用 祕a絕緣層124配置於紹基板126上，第一線路122是設置於絕 緣層124上，而螺頭131収直接抵壓 第-線路⑽連接到導熱區26，因此晶粒J = ，熱區26後，會經由第—線路122而傳送到螺絲i3G: 散驗ii〇m職13G除了可將電路板12〇固定 ,、、、板110外’還可兼具散熱的功效。也因此發光二極體裝 置20的整體散熱效率能有效提高。 示立:參5’圖5崎示為本發明的第二實關之散熱結構的 ^敦、+. 5中與第"實施例相同的元件將標以姻的符號並 f。此散熱結構細的散熱板2⑴包括一基底212與多個 丨/相較於螺絲130 ’這些韓片214是位於基底212的另外 的而接Γ韓片214的設置，故能增加散熱板210與空氣間對流 從^散熱效率提高。這些鰭片214與基底212例如是 的一侧。，或者也可使用烊接的方式將鰭片214焊接在基底212 似由實施例中散熱板為獨立的平板結構，而在第二實施 -部八:、、^為獨立的散熱片。然而，散熱板也可為其它元件的 例/電二具之燈殼的—部分。另外’在上述的實施 可將其為屬基印刷電路板’但本領域具有通常知識者也 T將其改為印刷電路板、 201248947 冰ΐ述之實施例中的螺絲皆有一螺頭，且螺頭是外露在電路板 卜:然而本領域具有通常知識者也可選擇使瓶頭螺絲。請參照 =6^會示為另一實施例的電路板與沉頭螺絲間的關係示意 例中，與第一實施例之螺絲130不同的是：螺絲330 …絲’也就是說螺絲33〇的上表面與電路板32()的上表面 螺絲;二卜頂:路板320上之第-線路322的末端則包圍並接觸 之直ΐϊΓ"!實施舰明如上，絲並義嫌定本發明所主張 裳彳範圍。其專利保護範圍當視後附之申請專利範圍及其 岭。凡本領域具有通f知識者，在不脫離本專利精神 1、\，所作之找或獅，均屬於树明所揭示精神下所完 之等效改變或設計，且應包含在下述之申請專職圍内。 【圖式簡單說明】 圖1所繪示為本發明的第—實施例之散熱結構的示意圖。 圖2所％示為發光二極體裝置的結構圖。 ®3所緣示為散熱結構的俯視圖。 圖4所繪示為電路板結構的放大圖。 圖斤、會示為本發明的第二實施例之散熱結構的示意圖。 。圖6所緣示為另一實施例的電路板與沉頭螺絲間的關係示意 【主要元轉號說明】 20 ·發光二極體裝置 21 :晶粒 8 201248947 27 :第一導線 29 :第二導線 21 .晶粒 22 :正導電區 23 :基板 24 ··負導電區 25 :絕緣薄膜圖案 26 .導熱區 28 :焊錫 100 :散熱結構 110 :散熱板 120 :電路板 122 :第一線路 124 :絕緣層 126 :鋁基板 128 :防焊層 130 :螺絲 131 :螺頭 132 :螺桿 200 :散熱結構 201248947 210 :散熱板 212 :基底 214 :鰭片 320 :電路板 322 :第一線路 330 :螺絲201248947 VI. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipating structure, and relates to a heat dissipating structure, a heat dissipating structure of a body device. [Prior Art] Aluminium.Emitting DiGde, _LED) is a body component. When a positive power is applied, the illuminating _ can emit a single color, not a 2-light light. By changing the chemical composition of the semiconductor material (4), the light-emitting diode emits a different color light. + ^ Also as the indicator light is set on the advertising display board. Over the years, with the rapid development of technology, the range of the light-emitting diodes has become wider and wider, and the backlight mode has been widely used. ~ However, the energy conversion efficiency of a light-emitting diode at a high temperature will drop rapidly, and more heat will be generated in addition to wasting power. In addition, if the temperature rises further, it will cause the LED to make a big test. Therefore, the field of heat dissipation in the field of light-emitting diodes is highly concerned by those of ordinary skill in the art. SUMMARY OF THE INVENTION The main object of the invention is to provide a heat dissipation structure for a light-emitting diode. The heat dissipation structure allows the county to use the lock-wire to exert heat dissipation. The above objects and other objects are provided by the present invention. The present invention provides a heat dissipating structure, which is formed in at least a light emitting diode device, the light emitting diode device including a positive conductive region, a negative conductive region, and A thermally conductive region, wherein the thermally conductive region is isolated from the positive conductive region and the f conductive region. The heat dissipation structure described above includes: a heat sink, a circuit board, and at least. Among them, 'the circuit board is set on the heat sink, and the light is 2 201248947, and the body device is the Wei Wei board. In addition, on the surface of the screw, and the screw is to lock the circuit board and the heat dissipation plate to the I-distribution board, and the screw is in contact with the first line at least one first scale, the first line is the connection material without the 'board' Including the screw head is pressed = ^ structure, the screw includes · 'nail head and - screw type, screw structure ": 'brain _ multiple, where the lock ° on the side of the base, and then is set in The other side of the substrate. The scattered ship launches, heats and turns the wire on the luminaire, where the scatter *, , and board are part of the lamp envelope of the luminaire. 4 columns such as steel or aluminum. The circuit board and the printed circuit are electrically heated. The heat sink is made of metal in the heat dissipation structure, and the circuit board is a metal-based printed circuit board, a ceramic substrate, or a germanium substrate. In the above heat dissipation structure, the screw is made of metal. Since the first line on the circuit board is connected to the light-emitting diode, the first line is pressed against the first line, so that the light-emitting diode die emits the ^, the 'area' and the first line to the screw. Then, the screw is transferred to the bulk... so that the overall heat dissipation efficiency of the 'light-emitting diode device can be improved. [Embodiment] The above object, (four) and advantages of the present invention are more apparent. The following is a detailed description of the embodiments and the accompanying drawings. Fig. 1 is a schematic view of the heat dissipation structure of the first embodiment of the present invention. The heat dissipation structure 100 includes a heat dissipation plate 110, a circuit board 120, and a screw 130 that is less than 201248947, wherein the circuit board 120 is locked to the heat dissipation plate 110 by screws 13A. In addition, a plurality of light emitting diode devices & The screw 130 is made of metal. It includes a screw head 131 and a screw 132. The diameter of the screw 131 is larger than the diameter of the screw 132. The screw 132 is provided with an external thread and is locked to the heat dissipation plate 11G. The heat sink 11G is mainly made of a metal material (for example, copper) or other materials having a high thermal conductivity. Referring to FIG. 2, FIG. 2 is a structural diagram of a light-emitting diode device 2A. The light-emitting diode device 20 includes a die 21, a positive conductive region 22, a substrate 23, a negative conductive region 24, a plurality of insulating film patterns 25, and a positive conduction region in the heat conduction region; a region 22, a negative conductive region 24. The heat transfer region 26 is a metal film which is mainly composed of copper. The insulating ruthenium pattern 25 is distributed between the conductive region 24 of the positive conductive region 22 of the disk substrate 23g and the substrate 23. The input 26 is directly disposed with the die 21 disposed thereon, and the main material of the substrate 23 is copper. Moreover, the positive conductive region 22, the negative conductive region 24, and the heat conductive region 26 do not contact each other. In addition, the first wire 27 and the second wire 4 are connected to the die 21, and the first wire u is connected between the die 21 and the positive guide 22, and (4) the second turn 29 is connected to the die 21 and the negative conductive. District 24. Further, the light-emitting diode device 2G is electrically connected to the circuit board 120 by solder 28. When the light-emitting diode device 2 is activated, the crystal grains emit a color light. Please refer to FIG. 2 and FIG. 3 at the same time. FIG. 3 is a top view of the heat dissipation structure. A plurality of first lines 122 are disposed on the circuit board 120, and the first lines are connected to the heat transfer area % of the light emitting diode device 2''. In the present embodiment, the screws 130 have a total of four 'four secrets' which are respectively locked to the circuit board 12 (). The lion who has the knowledge of the field can also set the lion according to the situation. For example, only set a screw and lock the job in the center of the board. Further, in the present embodiment, the material of the screw is metal, but other materials having a higher heat conducting wire may be used. For example, ceramic material. Referring to Figures 2, 3, and 4, Figure 4 is an enlarged view of the structure of the circuit board. It shows no relationship between the screw 130, the circuit board 12A, and the heat sink ιι. The circuit board 120 is a metal-based printed circuit board comprising a first line 122, a cathode 124 and a substrate 126. The circuit board 12 can be provided with a solder resist layer (3). The function of the anti-layer layer 128 is to prevent the solder from being used for soldering and to save the solder. The insulating layer 124 is disposed on the substrate 126. The first line 122 It is disposed on the insulating layer 124, and the screw head 131 directly presses the first line (10) to the heat conducting region 26, so the die J=, after the hot region 26, is transmitted to the screw i3G via the first line 122: In addition to the 13G of the ii〇m job, the circuit board 12〇 can be fixed, and the board 110 can also have the effect of dissipating heat. Therefore, the overall heat dissipation efficiency of the light-emitting diode device 20 can be effectively improved.立立: 参5' Figure 5 shows that the same components of the heat-dissipating structure of the second embodiment of the present invention will be marked with the symbol of marriage and f. The heat dissipating structure of the heat dissipating plate 2 (1) includes a substrate 212 and a plurality of crucibles/corresponding to the screws 130'. The Korean sheets 214 are disposed on the substrate 212 and are connected to the Korean sheets 214, so that the heat dissipating plates 210 and the heat dissipating plates 210 can be added. The air convection is improved from the heat dissipation efficiency. These fins 214 and substrate 212 are, for example, one side. Alternatively, the fins 214 may be soldered to the substrate 212 using a splicing manner, as in the embodiment, wherein the heat sink is a separate flat structure, and in the second embodiment - the eighth is a separate heat sink. However, the heat sink can also be part of the lamp housing of the other component/electrical device. In addition, 'the above-mentioned implementation can be a subordinate printed circuit board', but those skilled in the art have also changed it to a printed circuit board, and the screws in the embodiment of 201248947 Iced Description have a screw head and a screw. The head is exposed on the board: however, those of ordinary skill in the art can also choose to make the bottle head screws. Please refer to the description of the relationship between the circuit board and the countersunk screw of another embodiment, which is different from the screw 130 of the first embodiment: the screw 330 ... the wire 'that is the screw 33 〇 The upper surface and the upper surface of the circuit board 32 (); the second top: the end of the first line 322 on the road board 320 is surrounded and in contact with the direct ΐϊΓ ! ! ! ! ! ! ! ! ! ! ! ! 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上The range of dresses. The scope of patent protection is attached to the scope of the patent application and its ridge. Those who have knowledge in this field, without seeking to leave the spirit of this patent, \, the search or the lion, are all equivalent changes or designs under the spirit revealed by Shuming, and should be included in the following application full-time application Inside. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a heat dissipation structure according to a first embodiment of the present invention. Figure 2 is a block diagram showing the structure of the light-emitting diode device. The ®3 is shown as a top view of the heat dissipation structure. FIG. 4 is an enlarged view showing the structure of the circuit board. Figure 2 is a schematic view showing a heat dissipation structure of a second embodiment of the present invention. . Figure 6 is a schematic diagram showing the relationship between the circuit board and the countersunk head screw of another embodiment. [Main element number description] 20 · Light-emitting diode device 21: Die 8 201248947 27: First wire 29: second Conductor 21. Grain 22: positive conductive region 23: substrate 24 · negative conductive region 25: insulating film pattern 26. thermal conductive region 28: solder 100: heat dissipation structure 110: heat sink 120: circuit board 122: first line 124: Insulation layer 126: aluminum substrate 128: solder resist layer 130: screw 131: screw head 132: screw 200: heat dissipation structure 201248947 210: heat dissipation plate 212: substrate 214: fin 320: circuit board 322: first line 330: screw