TWI489059B - Led light bar - Google Patents

Description

LED light bar

The invention relates to a light-emitting diode light bar.

Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been used as a new type of illumination source. In various fields, such as street lamps, traffic lights, signal lights, spotlights and decorative lights.

The light-emitting diode light bar of the prior art generally includes a plurality of light-emitting diode light sources, a plate body and a circuit layer disposed on the upper surface of the plate body, and the plurality of light-emitting diode light sources are electrically connected to the circuit layer respectively. . However, the plate body is generally made of a plastic material, and the circuit layer is generally made of a metal material. When the metal is heated, the deformation is greater than that of the plastic. Therefore, after the light-emitting diode light bar is heated, the circuit layer is easily bent to cause the light-emitting diode light source to fall off.

In view of the above, the present invention aims to provide a light-emitting diode light bar that makes the light-emitting diode light source difficult to fall off.

A light-emitting diode light bar comprising a substrate and a plurality of light-emitting diode light sources mounted on the substrate, the substrate comprising a plate body and a circuit layer, the plate body having an opposite upper surface and a lower surface, The circuit layer is disposed on an upper surface of the board body, the light emitting diode light source is electrically connected to the circuit layer, and the substrate further comprises a metal layer disposed on a lower surface of the board body, the metal layer and the circuit layer being heated When the metal layer is subjected to The thermal stress is opposite to the direction of thermal stress experienced by the circuit layer.

The present invention provides a metal layer on the lower surface of the plate body, so that the circuit layer on the upper surface of the plate body and the metal layer on the lower surface are opposite in thermal stress when heated, and the substrate is thermally strain balanced. It is not easy to be deformed, and the light-emitting diode light source is not easily peeled off.

1, 1a‧‧‧Lighting diode light bar

10‧‧‧First substrate

11‧‧‧ board

111‧‧‧Upper surface

112‧‧‧ lower surface

113‧‧‧ side

12‧‧‧Line layer

121‧‧‧Conductor

13‧‧‧metal layer

131‧‧‧metal pieces

14‧‧‧Mesh structure

20‧‧‧Lighting diode source

21‧‧‧second substrate

22‧‧‧Electrode structure

23‧‧‧Light Emitting Diode Wafer

24‧‧‧reflective layer

25‧‧‧Encapsulation layer

1 is a cross-sectional view showing a first embodiment of a light-emitting diode strip of the present invention.

2 is a plan view of a first embodiment of a light-emitting diode light strip of the present invention.

Figure 3 is a bottom plan view of a first embodiment of a light emitting diode light strip of the present invention.

4 is a cross-sectional view showing a second embodiment of a light-emitting diode light strip of the present invention.

Figure 5 is a bottom plan view of a second embodiment of a light-emitting diode light strip of the present invention.

As shown in FIG. 1 to FIG. 3, a light-emitting diode light bar 1 according to a first embodiment of the present invention includes a first substrate 10 and a plurality of light-emitting diode light sources 20 mounted on the first substrate 10.

The first substrate 10 includes a board body 11 and a circuit layer 12 and a metal layer 13 disposed on the board body 11.

The plate body 11 has a flat shape and has an upper surface 111, a lower surface 112 and two side surfaces 113 connected between the upper surface 111 and the lower surface 112. In the present embodiment, the plate body 11 is made of a resin material.

The wiring layer 12 is made of a metal material for electrical connection with the outside. The circuit layer 12 includes a plurality of electrically conductive sheets 121 arranged at intervals, and a plurality of conductive sheets 121 are from one of them. The side faces 113 to the opposite other side faces 113 are arranged in a line. Two conductive sheets 121 adjacent to the opposite side faces 113 extend from the upper surface 111 of the plate body 11 to the side faces 113 to cover the side faces 113 and continue to extend to the lower surface 112. The width of the conductive sheet 121 in a direction perpendicular to the direction in which the wiring layer 12 extends is smaller than the width of the board body 11. In the present embodiment, when the circuit layer 12 is heated, the direction of thermal stress received by the circuit layer 12 faces away from the upper surface 111.

The metal layer 13 includes a plurality of spaced-apart metal sheets 131, and the metal sheets 131 are linearly arranged from one side 113 to the other side 113 of the board body 11, and the width thereof is perpendicular to the direction in which the metal layer 13 extends. The width of the body 11. The material of the metal layer 13 is equivalent to the thermal expansion coefficient of the material from which the wiring layer 12 is formed. When the metal layer 13 and the wiring layer 12 are heated, the thermal stress of the metal layer 13 and the heat of the wiring layer 12 are received. The stresses are the same in magnitude and in opposite directions. In the present embodiment, the direction of the thermal stress of the metal layer 13 is downward from the lower surface 112, and the material of the metal layer 13 is made the same as the material from which the wiring layer 12 is formed. Each of the metal sheets 131 has a rectangular shape, and the metal sheets 131 are spaced apart from the circuit layer 12. The thickness of the metal layer 13 is substantially the same as the thickness of the circuit layer 12. The total area of the metal layers 13 is on the upper surface 111 of the board body 11. The area of the circuit layer 12 is substantially the same such that the metal layer 13 and the circuit layer 12 are subjected to substantially the same thermal stress when heated.

The plurality of light emitting diode light sources 20 are spaced apart from the upper surface 111 of the board body 11 and electrically connected to the circuit layer 12, respectively. In this embodiment, the light emitting diode light source 20 is a light emitting diode package structure, which is disposed corresponding to the metal piece 131. The light-emitting diode light source 20 includes a second substrate 21 having an electrode structure 22, and a light-emitting diode chip 23 mounted on the electrode structure 22 and electrically connected to the electrode structure 22, and surrounding the reflection of the light-emitting diode wafer 23. Layer 24, and an encapsulation layer 25 that seals the LED substrate 23. Electrode junction The structure 22 is electrically connected to two adjacent conductive sheets 121 to supply power to the plurality of light emitting diode sources 20.

In the working process, the plurality of LED light sources 20 generate a large amount of heat. In the present invention, the metal layer 13 is disposed on the lower surface 112 of the board body 11, and the metal layer 13 is received. The direction of the thermal stress is opposite to the direction of the thermal stress experienced by the wiring layer 12, so that the first substrate 10 is offset to some extent by the thermal stress. When the area of the metal layer 13 is equal to the area and thickness of the wiring layer 12 on the upper surface 111 of the board body 11, the circuit layer 12 and the metal layer 13 on the upper surface 111 of the board body 11 are subjected to the opposite thermal stress directions. And the same size, so that the first substrate 10 reaches the thermal strain balance and is not easily bent upward or downward, and the LED light source 20 is not easy to fall off; in addition, the LED strip 1 can be fixed to other devices (such as heat dissipation). When the device is mounted, a gap is not formed between the first substrate 10 and other devices, so that a large amount of heat generated by the LED strip 1 can be quickly transmitted to other devices, which is beneficial to heat dissipation and improve the LED light. The service life of the strip 1.

Referring to FIG. 4 and FIG. 5, the LED light strip 1a according to the second embodiment of the present invention is shown in the second embodiment of the present invention. The LED strip 1 is similar except that a mesh structure 14 is disposed between the adjacent two metal sheets 131 and/or the gap between the metal sheet 131 and the conductive sheet 121 to slow down the light emission. The deformation of the first substrate 10 caused by the heat emitted by the diode light source 20. In the present embodiment, the mesh structure 14 is made of a metal material having a thickness equal to the thickness of the metal piece 131, and the thermal stress direction of the mesh structure 14 is downward from the lower surface 112, and the total area of the metal layer 13 is located at the plate. The area of the wiring layer 12 on the upper surface 111 of the body 11 is slightly smaller. It will be appreciated that the mesh structure 14 can also be made of other materials. Of course, the two conductive sheets 121 adjacent to the circuit layer 12 may also be insulated. The mesh structure is used to further slow the deformation of the first substrate 10 due to heat emitted from the light emitting diode source 20.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

1‧‧‧Lighting diode strip

10‧‧‧First substrate

11‧‧‧ board

111‧‧‧Upper surface

112‧‧‧ lower surface

113‧‧‧ side

12‧‧‧Line layer

121‧‧‧Conductor

13‧‧‧metal layer

131‧‧‧metal pieces

20‧‧‧Lighting diode source

21‧‧‧second substrate

22‧‧‧Electrode structure

23‧‧‧Light Emitting Diode Wafer

24‧‧‧reflective layer

25‧‧‧Encapsulation layer

Claims (10)

A light-emitting diode light bar comprising a substrate and a plurality of light-emitting diode light sources mounted on the substrate, the substrate comprising a resin plate body and a circuit layer, the resin plate body having an opposite upper surface and a lower surface The surface layer is disposed on the upper surface of the plate body, and the light emitting diode light source is electrically connected to the circuit layer, wherein the substrate further comprises a metal layer disposed on a lower surface of the resin plate body. When the metal layer and the circuit layer are heated, the thermal stress of the metal layer is opposite to the direction of thermal stress received by the circuit layer, wherein the metal layer includes a plurality of spaced metal sheets. The light-emitting diode light bar of claim 1, wherein when the metal layer and the circuit layer are heated, the metal layer and the circuit layer are subjected to the same thermal stress. The light-emitting diode light bar of claim 2, wherein the thickness of the metal layer is equal to the thickness of the circuit layer, the area of the metal layer and the circuit layer on the upper surface of the plate body. The area is equal. The light-emitting diode light bar of claim 2, wherein the material of the metal layer is equivalent to the thermal expansion coefficient of the material from which the circuit layer is formed. The light-emitting diode light bar of claim 4, wherein the metal layer and the circuit layer are made of the same metal material. The light-emitting diode light bar of any one of the preceding claims, wherein the circuit layer comprises a plurality of electrically conductive sheets arranged at intervals, and insulation between adjacent conductive sheets is provided. The mesh structure is used to slow the deformation of the substrate due to heat dissipation from the light emitting diode light source. The light-emitting diode light bar of any one of the preceding claims, wherein a gap between the two adjacent metal sheets is provided with a mesh structure for slowing down hair The deformation of the substrate caused by the heat of the heat dissipation of the light source. The light-emitting diode light bar of claim 7, wherein the circuit layer extends from the upper surface of the plate body to the lower surface of the plate body from the upper surface of the plate body, and the metal layer and the circuit layer of the metal layer The spacers are provided with a mesh structure in the gap between the adjacent metal sheets and the conductive sheets for slowing the deformation of the substrate due to heat dissipation from the light emitting diode light source. The light-emitting diode light bar according to any one of the preceding claims, wherein the thermal stress direction of the circuit layer faces away from the upper surface of the plate body, and the thermal stress direction of the metal layer The lower surface facing away from the plate body is downward. The light-emitting diode light bar of any one of the preceding claims, wherein the circuit layer is linearly arranged from one end to the other end of the plate body, and is perpendicular to The width of the circuit layer extending in a direction smaller than the width of the plate body is linearly arranged from one end to the other end of the plate body, and a width perpendicular to a direction perpendicular to the metal layer is smaller than a width of the plate body.