TWI489059B - Led light bar - Google Patents
Led light bar Download PDFInfo
- Publication number
- TWI489059B TWI489059B TW101112586A TW101112586A TWI489059B TW I489059 B TWI489059 B TW I489059B TW 101112586 A TW101112586 A TW 101112586A TW 101112586 A TW101112586 A TW 101112586A TW I489059 B TWI489059 B TW I489059B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- light
- plate body
- circuit layer
- metal layer
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Description
本發明涉及一種發光二極體燈條。 The invention relates to a light-emitting diode light bar.
相比於傳統的發光源,發光二極體(Light Emitting Diode,LED)具有重量輕、體積小、污染低、壽命長等優點,其作為一種新型的發光源,已經被越來越多地應用到各領域當中,如路燈、交通燈、信號燈、射燈及裝飾燈等。 Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been used as a new type of illumination source. In various fields, such as street lamps, traffic lights, signal lights, spotlights and decorative lights.
現有技術中發光二極體燈條通常包括有複數個發光二極體光源、一板體和設置在該板體上表面的線路層,該複數個發光二極體光源分別與線路層電性連接。然,該板體一般為塑膠材質,線路層一般為金屬材質,金屬受熱時的形變大於塑膠,因此,發光二極體燈條受熱後,線路層容易發生彎翹使得發光二極體光源脫落。 The light-emitting diode light bar of the prior art generally includes a plurality of light-emitting diode light sources, a plate body and a circuit layer disposed on the upper surface of the plate body, and the plurality of light-emitting diode light sources are electrically connected to the circuit layer respectively. . However, the plate body is generally made of a plastic material, and the circuit layer is generally made of a metal material. When the metal is heated, the deformation is greater than that of the plastic. Therefore, after the light-emitting diode light bar is heated, the circuit layer is easily bent to cause the light-emitting diode light source to fall off.
有鑒於此,本發明旨在提供一種使發光二極體光源不易脫落的發光二極體燈條。 In view of the above, the present invention aims to provide a light-emitting diode light bar that makes the light-emitting diode light source difficult to fall off.
一種發光二極體燈條,包括基板及複數個裝設於該基板上的發光二極體光源,該基板包括一板體和一線路層,該板體具有相對的一上表面和一下表面,該線路層設置在該板體的上表面上,該發光二極體光源與線路層形成電連接,該基板還包括設置於該板體的下表面上的金屬層,該金屬層與線路層受熱時,該金屬層所受 的熱應力與該線路層所受的熱應力方向相反。 A light-emitting diode light bar comprising a substrate and a plurality of light-emitting diode light sources mounted on the substrate, the substrate comprising a plate body and a circuit layer, the plate body having an opposite upper surface and a lower surface, The circuit layer is disposed on an upper surface of the board body, the light emitting diode light source is electrically connected to the circuit layer, and the substrate further comprises a metal layer disposed on a lower surface of the board body, the metal layer and the circuit layer being heated When the metal layer is subjected to The thermal stress is opposite to the direction of thermal stress experienced by the circuit layer.
本發明藉由在板體的下表面上設置有金屬層,從而使板體的上表面上的線路層和下表面上的金屬層在受熱時受到的熱應力方向相反,基板達到熱應變平衡從而不易變形,進而使得發光二極體光源不易脫落。 The present invention provides a metal layer on the lower surface of the plate body, so that the circuit layer on the upper surface of the plate body and the metal layer on the lower surface are opposite in thermal stress when heated, and the substrate is thermally strain balanced. It is not easy to be deformed, and the light-emitting diode light source is not easily peeled off.
1、1a‧‧‧發光二極體燈條 1, 1a‧‧‧Lighting diode light bar
10‧‧‧第一基板 10‧‧‧First substrate
11‧‧‧板體 11‧‧‧ board
111‧‧‧上表面 111‧‧‧Upper surface
112‧‧‧下表面 112‧‧‧ lower surface
113‧‧‧側面 113‧‧‧ side
12‧‧‧線路層 12‧‧‧Line layer
121‧‧‧導電片 121‧‧‧Conductor
13‧‧‧金屬層 13‧‧‧metal layer
131‧‧‧金屬片 131‧‧‧metal pieces
14‧‧‧網狀結構 14‧‧‧Mesh structure
20‧‧‧發光二極體光源 20‧‧‧Lighting diode source
21‧‧‧第二基板 21‧‧‧second substrate
22‧‧‧電極結構 22‧‧‧Electrode structure
23‧‧‧發光二極體晶片 23‧‧‧Light Emitting Diode Wafer
24‧‧‧反射層 24‧‧‧reflective layer
25‧‧‧封裝層 25‧‧‧Encapsulation layer
圖1為本發明的發光二極體燈條的第一實施例的剖面示意圖。 1 is a cross-sectional view showing a first embodiment of a light-emitting diode strip of the present invention.
圖2為本發明的發光二極體燈條的第一實施例的俯視圖。 2 is a plan view of a first embodiment of a light-emitting diode light strip of the present invention.
圖3為本發明的發光二極體燈條的第一實施例的仰視圖。 Figure 3 is a bottom plan view of a first embodiment of a light emitting diode light strip of the present invention.
圖4為本發明的發光二極體燈條的第二實施例的剖面示意圖。 4 is a cross-sectional view showing a second embodiment of a light-emitting diode light strip of the present invention.
圖5為本發明的發光二極體燈條的第二實施例的仰視圖。 Figure 5 is a bottom plan view of a second embodiment of a light-emitting diode light strip of the present invention.
如圖1至圖3所示,本發明第一實施例提供的發光二極體燈條1,其包括第一基板10與裝設於第一基板10上的複數個發光二極體光源20。 As shown in FIG. 1 to FIG. 3, a light-emitting diode light bar 1 according to a first embodiment of the present invention includes a first substrate 10 and a plurality of light-emitting diode light sources 20 mounted on the first substrate 10.
第一基板10包括一板體11、設置於板體11上的線路層12與金屬層13。 The first substrate 10 includes a board body 11 and a circuit layer 12 and a metal layer 13 disposed on the board body 11.
板體11呈平板狀,其具有一上表面111、一下表面112及兩個連接在該上表面111與下表面112之間的側面113。於本實施例中,板體11由樹脂材料製成。 The plate body 11 has a flat shape and has an upper surface 111, a lower surface 112 and two side surfaces 113 connected between the upper surface 111 and the lower surface 112. In the present embodiment, the plate body 11 is made of a resin material.
線路層12由金屬材料製成,用於與外部進行電性連接。線路層12包括複數個間隔設置的導電片121,且複數個導電片121從其中一 側面113至相對的另一側面113呈線狀排列。靠近該相對的兩側面113的兩個導電片121從板體11的上表面111延伸至側面113將該側面113包覆,並繼續延伸至下表面112。該導電片121沿垂直於線路層12延伸方向上的寬度小於板體11的寬度。於本實施方式中,當該線路層12受熱時,該線路層12所受的熱應力方向背離上表面111而向上。 The wiring layer 12 is made of a metal material for electrical connection with the outside. The circuit layer 12 includes a plurality of electrically conductive sheets 121 arranged at intervals, and a plurality of conductive sheets 121 are from one of them. The side faces 113 to the opposite other side faces 113 are arranged in a line. Two conductive sheets 121 adjacent to the opposite side faces 113 extend from the upper surface 111 of the plate body 11 to the side faces 113 to cover the side faces 113 and continue to extend to the lower surface 112. The width of the conductive sheet 121 in a direction perpendicular to the direction in which the wiring layer 12 extends is smaller than the width of the board body 11. In the present embodiment, when the circuit layer 12 is heated, the direction of thermal stress received by the circuit layer 12 faces away from the upper surface 111.
金屬層13包括複數個間隔設置的金屬片131,且該金屬片131從板體11的其中一側面113至另一側面113呈線狀排列,其沿垂直於金屬層13延伸方向的寬度小於板體11的寬度。製成金屬層13的材料與製成線路層12的材料的熱膨脹係數相當,當該金屬層13與線路層12受熱時,該金屬層13所受的熱應力與該線路層12所受的熱應力大小相同,方向相反。於本實施方式中,金屬層13的熱應力方向背離下表面112而向下,製成金屬層13的材料與製成線路層12的材料相同。每個金屬片131均呈矩形,且金屬片131與線路層12間隔設置,金屬層13的厚度與線路層12的厚度大致相同,金屬層13的總面積與位於板體11的上表面111上的線路層12的面積大致相同,以使該金屬層13與線路層12受熱時所受的熱應力大小大致相同。 The metal layer 13 includes a plurality of spaced-apart metal sheets 131, and the metal sheets 131 are linearly arranged from one side 113 to the other side 113 of the board body 11, and the width thereof is perpendicular to the direction in which the metal layer 13 extends. The width of the body 11. The material of the metal layer 13 is equivalent to the thermal expansion coefficient of the material from which the wiring layer 12 is formed. When the metal layer 13 and the wiring layer 12 are heated, the thermal stress of the metal layer 13 and the heat of the wiring layer 12 are received. The stresses are the same in magnitude and in opposite directions. In the present embodiment, the direction of the thermal stress of the metal layer 13 is downward from the lower surface 112, and the material of the metal layer 13 is made the same as the material from which the wiring layer 12 is formed. Each of the metal sheets 131 has a rectangular shape, and the metal sheets 131 are spaced apart from the circuit layer 12. The thickness of the metal layer 13 is substantially the same as the thickness of the circuit layer 12. The total area of the metal layers 13 is on the upper surface 111 of the board body 11. The area of the circuit layer 12 is substantially the same such that the metal layer 13 and the circuit layer 12 are subjected to substantially the same thermal stress when heated.
該多個發光二極體光源20間隔設置於板體11的上表面111上且分別與線路層12形成電連接。於本實施例中,發光二極體光源20為發光二極體封裝結構,其對應金屬片131設置。發光二極體光源20包括具有電極結構22的第二基板21,裝設於電極結構22上且與電極結構22電性連接的發光二極體晶片23,圍設發光二極體晶片23的反射層24,以及密封發光二極體晶片23的封裝層25。電極結 構22與兩相鄰的導電片121形成電連接,從而為該多個發光二極體光源20供電。 The plurality of light emitting diode light sources 20 are spaced apart from the upper surface 111 of the board body 11 and electrically connected to the circuit layer 12, respectively. In this embodiment, the light emitting diode light source 20 is a light emitting diode package structure, which is disposed corresponding to the metal piece 131. The light-emitting diode light source 20 includes a second substrate 21 having an electrode structure 22, and a light-emitting diode chip 23 mounted on the electrode structure 22 and electrically connected to the electrode structure 22, and surrounding the reflection of the light-emitting diode wafer 23. Layer 24, and an encapsulation layer 25 that seals the LED substrate 23. Electrode junction The structure 22 is electrically connected to two adjacent conductive sheets 121 to supply power to the plurality of light emitting diode sources 20.
發光二極體燈條1在工作過程中,該多個發光二極體光源20會產生大量的熱量,本發明藉由在板體11的下表面112上設置金屬層13,且金屬層13受到的熱應力方向與線路層12受到的熱應力方向相反,從而使得第一基板10在一定程度上熱應力相抵消。當金屬層13的面積與位於板體11的上表面111的線路層12的面積和厚度均相等時,板體11的上表面111上的線路層12和金屬層13受到的熱應力方向相反,且大小相同,進而使第一基板10達到熱應變平衡而不易向上或向下彎曲變形,發光二極體光源20不易脫落;另外,可使發光二極體燈條1固定於其他裝置(如散熱裝置)上時,第一基板10與其他裝置之間不易形成間隙,使發光二極體燈條1產生的大量熱量可快速傳導至其他裝置上,有利於熱量的散發,提高發光二極體燈條1的使用壽命。 In the working process, the plurality of LED light sources 20 generate a large amount of heat. In the present invention, the metal layer 13 is disposed on the lower surface 112 of the board body 11, and the metal layer 13 is received. The direction of the thermal stress is opposite to the direction of the thermal stress experienced by the wiring layer 12, so that the first substrate 10 is offset to some extent by the thermal stress. When the area of the metal layer 13 is equal to the area and thickness of the wiring layer 12 on the upper surface 111 of the board body 11, the circuit layer 12 and the metal layer 13 on the upper surface 111 of the board body 11 are subjected to the opposite thermal stress directions. And the same size, so that the first substrate 10 reaches the thermal strain balance and is not easily bent upward or downward, and the LED light source 20 is not easy to fall off; in addition, the LED strip 1 can be fixed to other devices (such as heat dissipation). When the device is mounted, a gap is not formed between the first substrate 10 and other devices, so that a large amount of heat generated by the LED strip 1 can be quickly transmitted to other devices, which is beneficial to heat dissipation and improve the LED light. The service life of the strip 1.
請同時參閱圖4和圖5,其所示為本發明第二實施例提供的發光二極體燈條1a,本發明第二實施例中的發光二極體燈條1a與第一實施例中發光二極體燈條1相似,其區別僅在於:在相鄰的兩金屬片131之間和/或金屬片131與導電片121之間的間隙中設置網狀結構14,用以減緩由於發光二極體光源20散發的熱量造成的第一基板10的形變。於本實施例中,網狀結構14為金屬材質,其厚度與金屬片131的厚度相同,且網狀結構14的熱應力方向背離下表面112向下,且金屬層13的總面積較位於板體11的上表面111上的線路層12的面積略小。可以理解地,網狀結構14也可由其他材質製成。當然,該線路層12相鄰的兩導電片121之間也可設置絕緣的 網狀結構,用以進一步減緩由於發光二極體光源20散發的熱量造成的第一基板10的形變。 Referring to FIG. 4 and FIG. 5, the LED light strip 1a according to the second embodiment of the present invention is shown in the second embodiment of the present invention. The LED strip 1 is similar except that a mesh structure 14 is disposed between the adjacent two metal sheets 131 and/or the gap between the metal sheet 131 and the conductive sheet 121 to slow down the light emission. The deformation of the first substrate 10 caused by the heat emitted by the diode light source 20. In the present embodiment, the mesh structure 14 is made of a metal material having a thickness equal to the thickness of the metal piece 131, and the thermal stress direction of the mesh structure 14 is downward from the lower surface 112, and the total area of the metal layer 13 is located at the plate. The area of the wiring layer 12 on the upper surface 111 of the body 11 is slightly smaller. It will be appreciated that the mesh structure 14 can also be made of other materials. Of course, the two conductive sheets 121 adjacent to the circuit layer 12 may also be insulated. The mesh structure is used to further slow the deformation of the first substrate 10 due to heat emitted from the light emitting diode source 20.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
1‧‧‧發光二極體燈條 1‧‧‧Lighting diode strip
10‧‧‧第一基板 10‧‧‧First substrate
11‧‧‧板體 11‧‧‧ board
111‧‧‧上表面 111‧‧‧Upper surface
112‧‧‧下表面 112‧‧‧ lower surface
113‧‧‧側面 113‧‧‧ side
12‧‧‧線路層 12‧‧‧Line layer
121‧‧‧導電片 121‧‧‧Conductor
13‧‧‧金屬層 13‧‧‧metal layer
131‧‧‧金屬片 131‧‧‧metal pieces
20‧‧‧發光二極體光源 20‧‧‧Lighting diode source
21‧‧‧第二基板 21‧‧‧second substrate
22‧‧‧電極結構 22‧‧‧Electrode structure
23‧‧‧發光二極體晶片 23‧‧‧Light Emitting Diode Wafer
24‧‧‧反射層 24‧‧‧reflective layer
25‧‧‧封裝層 25‧‧‧Encapsulation layer
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210089720.0A CN103363363B (en) | 2012-03-30 | 2012-03-30 | Light-emitting diode light bar |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201339490A TW201339490A (en) | 2013-10-01 |
TWI489059B true TWI489059B (en) | 2015-06-21 |
Family
ID=49365321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101112586A TWI489059B (en) | 2012-03-30 | 2012-04-10 | Led light bar |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103363363B (en) |
TW (1) | TWI489059B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104235661B (en) * | 2013-06-19 | 2018-05-29 | 瑞轩科技股份有限公司 | Lamp bar and direct type backlight module |
CN111983849A (en) * | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | LED backlight module |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200505050A (en) * | 2003-03-10 | 2005-02-01 | Toyoda Gosei Kk | Solid-state component device and manufacturing method thereof |
CN101268561A (en) * | 2005-09-20 | 2008-09-17 | 松下电工株式会社 | Led lighting equipment |
TW200843053A (en) * | 2007-04-25 | 2008-11-01 | Ind Tech Res Inst | Composite substrate structure for high heat dissipation |
TWM394409U (en) * | 2010-08-04 | 2010-12-11 | Advanced Optoelectronic Tech | Light-emitting diode light bar |
TW201105222A (en) * | 2009-07-17 | 2011-02-01 | Kinik Co | Highly thermal conductive circuit board |
TW201108904A (en) * | 2009-08-27 | 2011-03-01 | Taiflex Scient Co Ltd | Thermally conductive substrate with low thermal resistance, low thermal expansion coefficient and high electrical reliability for electronic components and manufacturing methods thereof |
CN102308144A (en) * | 2009-02-04 | 2012-01-04 | 欧司朗有限公司 | Lighting module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100391017C (en) * | 2003-05-26 | 2008-05-28 | 松下电工株式会社 | Light-emitting device |
JP2005277137A (en) * | 2004-03-25 | 2005-10-06 | Feng Chia Univ | High efficiency heat conducting circuit board and its manufacturing method |
CN101110408A (en) * | 2006-07-18 | 2008-01-23 | 启萌科技有限公司 | Light emitting diode module group |
CN102155634A (en) * | 2010-02-11 | 2011-08-17 | 佰鸿工业股份有限公司 | LED (light emitting diode) lighting module and method for manufacturing LED lighting module |
-
2012
- 2012-03-30 CN CN201210089720.0A patent/CN103363363B/en active Active
- 2012-04-10 TW TW101112586A patent/TWI489059B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200505050A (en) * | 2003-03-10 | 2005-02-01 | Toyoda Gosei Kk | Solid-state component device and manufacturing method thereof |
CN101268561A (en) * | 2005-09-20 | 2008-09-17 | 松下电工株式会社 | Led lighting equipment |
TW200843053A (en) * | 2007-04-25 | 2008-11-01 | Ind Tech Res Inst | Composite substrate structure for high heat dissipation |
CN102308144A (en) * | 2009-02-04 | 2012-01-04 | 欧司朗有限公司 | Lighting module |
TW201105222A (en) * | 2009-07-17 | 2011-02-01 | Kinik Co | Highly thermal conductive circuit board |
TW201108904A (en) * | 2009-08-27 | 2011-03-01 | Taiflex Scient Co Ltd | Thermally conductive substrate with low thermal resistance, low thermal expansion coefficient and high electrical reliability for electronic components and manufacturing methods thereof |
TWM394409U (en) * | 2010-08-04 | 2010-12-11 | Advanced Optoelectronic Tech | Light-emitting diode light bar |
Also Published As
Publication number | Publication date |
---|---|
CN103363363A (en) | 2013-10-23 |
TW201339490A (en) | 2013-10-01 |
CN103363363B (en) | 2016-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011014890A5 (en) | ||
JP2006245032A5 (en) | ||
TW200623450A (en) | Package structure of light emitting diode and its manufacture method | |
US9349930B2 (en) | LED module and lighting assembly | |
TWI462342B (en) | Light-emitting diode package and method for manufacturing the same | |
JP2007510297A5 (en) | ||
CN101334155A (en) | High radiation led lamp radiating module | |
WO2009000106A1 (en) | Led lighting device | |
TW201003991A (en) | Package structure of LED and light bar using the same | |
CN101252157A (en) | Encapsulation structure of LED light source | |
JP3168522U (en) | Light-emitting diode heat dissipation device | |
JP6360180B2 (en) | LED lighting device | |
US9748462B2 (en) | Floating heat sink support with conductive sheets and LED package assembly for LED flip chip package | |
TWI489059B (en) | Led light bar | |
CN201215303Y (en) | Radiating module of high heat radiation LED lamp | |
JP2018508115A (en) | Flexible circuit board assembly for LED lamp | |
KR200471587Y1 (en) | LED Luminaires With Spiral PCB | |
TWI449226B (en) | Thermal structure for led device | |
CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
JP3133586U (en) | LED lamp heat dissipation structure | |
TWI412164B (en) | Led module | |
CN203656875U (en) | LED (light emitting diode) lamp based on flexible circuit | |
CN203052387U (en) | Lighting device | |
TWI550920B (en) | Light-emitting diode | |
CN202165849U (en) | Embedded LED (light-emitting diode) lamp with metal heat dissipation base |