JP3168522U - Light-emitting diode heat dissipation device - Google Patents

Light-emitting diode heat dissipation device Download PDF

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JP3168522U
JP3168522U JP2011001846U JP2011001846U JP3168522U JP 3168522 U JP3168522 U JP 3168522U JP 2011001846 U JP2011001846 U JP 2011001846U JP 2011001846 U JP2011001846 U JP 2011001846U JP 3168522 U JP3168522 U JP 3168522U
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emitting diode
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陳全福
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【課題】快速な散熱效果を達成する発光ダイオード散熱装置を提供する。【解決手段】発光ダイオード散熱装置は回路板を含み、回路板は、正面と背面を有する絶縁基板であり、絶縁基板の正面には導電層を設置し、背面には散熱層を設置する。導電層上に、正、負極のボンディングパッドを設置し、隔離層により導電層を包み、ボンディングパッドだけを露出して、発光ダイオードを装着する。又、回路板上に導通部を設置して、ボンディングパッドと散熱層を導通させる。これにより、発光ダイオード作動時に生成される高温は、直接、ボンディングパッド、導通部により、回路板背面の散熱層に伝達されて散熱され、散熱面積が増加させる。【選択図】図１A light-emitting diode heat-dissipating device that achieves a rapid heat-dissipating effect is provided. A light-emitting diode heat dissipation device includes a circuit board, and the circuit board is an insulating substrate having a front surface and a back surface, and a conductive layer is provided on the front surface of the insulating substrate, and a heat dissipation layer is provided on the back surface. A positive and negative bonding pad is placed on the conductive layer, the conductive layer is covered with an isolation layer, only the bonding pad is exposed, and a light emitting diode is mounted. In addition, a conductive portion is installed on the circuit board to conduct the bonding pad and the heat dissipation layer. As a result, the high temperature generated when the light emitting diode is operated is directly transferred to the heat dissipation layer on the back surface of the circuit board by the bonding pad and the conductive portion to be dissipated, thereby increasing the heat dissipation area. [Selection] Figure 1

Description

本考案は、散熱装置に関するものであって、特に、散熱面積を増加することにより、高い散熱効果を提供する発光ダイオード散熱装置に関するものである。   The present invention relates to a heat dissipation device, and more particularly, to a light-emitting diode heat dissipation device that provides a high heat dissipation effect by increasing a heat dissipation area.

発光ダイオード（Light
Emitting Diode）は小さな固体光源で、公知の白熱電球と蛍光灯と比べると、発光ダイオードは複数、多種の組み合わせで、且つ、単一の発光ダイオードの光転換効率が高く、消耗電力が小さく、耐震性が高く、損毀後の廃棄物が回收でき、エコ特性がある。この他、発光ダイオードは平面パッケージが可能で、並びに、薄くて軽い製品を開発することができる。
以上のような長所により、近年、発光ダイオードは幅広く応用され、尺寸がますます小さくなるだけでなく、使用も、発光ダイオードをアレイ分布形態にし、単一素子上で発光ダイオードを装着する数量が大幅に増加するが、発熱量も高くなり、熱源が、発光ダイオードの発光効率、及び、使用寿命に大きい影響を生じるので、発光ダイオード操作時の散熱問題は妥当に解決されるべきである。
発光ダイオードを適当な操作温度下で操作させるために、通常、適当な散熱構造を設置して、発光ダイオード散熱を補助し、散熱エネルギー力を増加する必要がある。現有の発光ダイオードの散熱構造は、発光ダイオードを回路板のボンディングパッド上に設置し、コネクタにより、熱い空気を外面に導き、散熱效果を高めているが、発光ダイオードの散熱面積は小さく、コネクタにより、熱エネルギーを外面に導いても、大部分の熱エネルギーは、発光ダイオードと回路板内に残り、熱エネルギーを直ちに導出することができないので、温度が依然として上昇し続け、発光ダイオード功能が悪くなり、使用寿命が短縮する。この他、特殊な散熱回路板により散熱面積を増加すると、製作コストが増加するだけでなく、且つ、特殊な散熱回路板の散熱效果は限りがあり、発光ダイオード散熱需要が過大時、特殊な散熱回路板は、発光ダイオードが生成する熱エネルギーを円滑に発散することができない。 Light-emitting diode (Light
Emitting Diode) is a small solid-state light source. Compared with known incandescent bulbs and fluorescent lamps, the light-emitting diodes are a combination of multiple and various types, and the light conversion efficiency of single light-emitting diodes is high, power consumption is low, and they are earthquake resistant. It is highly ecological, can recover waste after damage, and is eco-friendly. In addition, the light emitting diode can be planar packaged, and a thin and light product can be developed.
Due to the advantages described above, in recent years, light emitting diodes have been widely applied, and not only the scale is getting smaller and smaller, but also the use of light emitting diodes in an array distribution form and the number of light emitting diodes mounted on a single element is greatly increased. However, since the heat generation amount is increased and the heat source has a great influence on the light emitting efficiency and the service life of the light emitting diode, the heat dissipation problem during the operation of the light emitting diode should be properly solved.
In order to operate the light emitting diode at an appropriate operating temperature, it is usually necessary to install an appropriate heat dissipation structure to assist the light emitting diode heat dissipation and increase the heat dissipation energy power. The current heat-dissipating structure of light-emitting diodes is that the light-emitting diodes are installed on the bonding pads of the circuit board, and hot air is guided to the outside surface by the connector to enhance the heat-dissipating effect. Even if the heat energy is guided to the outside surface, most of the heat energy remains in the light emitting diode and the circuit board, and the heat energy cannot be derived immediately, so the temperature continues to rise and the efficiency of the light emitting diode deteriorates , Shorten the service life. In addition, increasing the heat dissipation area with a special heat dissipation circuit board not only increases the manufacturing cost, but also the heat dissipation effect of the special heat dissipation circuit board is limited. The circuit board cannot smoothly dissipate the heat energy generated by the light emitting diode.

公知技術中の発光ダイオード散熱装置の欠点を改善するため、本考案は、散熱效果がよい発光ダイオード散熱装置を提供することを目的とする。 The present invention aims to provide a light-emitting diode heat-dissipating device having a good heat-dissipating effect in order to improve the drawbacks of the light-emitting diode heat-dissipating device in the prior art.

本考案の発光ダイオード散熱装置は、回路板を含む。前記回路板は、正面と背面を有する絶縁基板で、前記絶縁基板正面は導電層を設置し、背面は、少なくとも一つの散熱層を設置し、導電層上に、正、負極のボンディングパッドを設置し、隔離層により導電層を包み、ボンディングパッドだけを隔離層外側に露出させ、発光ダイオードを装着する。又、回路板上に導通部を設置し、前記導通部により、直接、ボンディングパッドと散熱層を導通させ、発光ダイオード操作時、発光ダイオードが生成する熱エネルギーを、直接、導通部から回路板背面の散熱層に伝導して、散熱し、散熱面積を増加させ、発光ダイオードが生成する熱エネルギーを散熱する。
また、回路板背面と正面上に、更に、散熱フィンを結合して、更に優れた散熱效果を達成する。 The light-emitting diode heat dissipation device of the present invention includes a circuit board. The circuit board is an insulating substrate having a front surface and a back surface, the front surface of the insulating substrate is provided with a conductive layer, the back surface is provided with at least one heat dissipation layer, and positive and negative bonding pads are provided on the conductive layer. Then, the conductive layer is wrapped with the isolation layer, only the bonding pad is exposed to the outside of the isolation layer, and the light emitting diode is mounted. In addition, a conductive part is installed on the circuit board, and the conductive part directly connects the bonding pad and the heat dissipating layer. When the light emitting diode is operated, the heat energy generated by the light emitting diode is directly transmitted from the conductive part to the back of the circuit board. The heat is transferred to the heat dissipation layer to dissipate heat, increase the heat dissipation area, and dissipate the heat energy generated by the light emitting diode.
In addition, heat dissipation fins are further connected to the back and front of the circuit board to achieve a further excellent heat dissipation effect.

本考案は、以下のような技術效果がある。発光ダイオード操作時により生成される熱エネルギーは、直接、回路板背面の散熱層に伝導されて、散熱され、散熱面積を増加させて、快速な散熱効果を達成し、発光ダイオードの発光功能と使用寿命を効果的に維持することができる。
この他、本考案の回路板背面は散熱層を設置し、導通部により、回路板正面の発光ダイオードと直接導通するので、構造が簡潔、製作コストが低い、製品の競争力を向上させる。 The present invention has the following technical effects. The heat energy generated by the operation of the light-emitting diode is directly conducted to the heat-dissipating layer on the back of the circuit board and is dissipated to increase the heat-dissipating area, achieving a rapid heat-dissipating effect, and the light-emitting diode's light-emitting function and use The lifetime can be effectively maintained.
In addition, the back surface of the circuit board of the present invention is provided with a heat dissipating layer, and is directly connected to the light emitting diode in front of the circuit board by the conductive part, so that the structure is simple, the manufacturing cost is low, and the competitiveness of the product is improved.

本考案の第一実施例による立体分解図である。1 is an exploded view according to a first embodiment of the present invention. 本考案の第一実施例による立体組み合わせ図である。It is a three-dimensional combination diagram according to the first embodiment of the present invention. 本考案の第一実施例による組み合わせ断面図である。1 is a combined sectional view according to a first embodiment of the present invention. 本考案の第二実施例による立体分解図である。FIG. 3 is an exploded view according to a second embodiment of the present invention. 本考案の第二実施例による立体組み合わせ図である。It is a three-dimensional combination diagram according to the second embodiment of the present invention. 本考案の第二実施例による組み合わせ断面図である。FIG. 6 is a cross-sectional view of a combination according to a second embodiment of the present invention. 本考案の第三実施例による立体組み合わせ図である。It is a three-dimensional combination diagram according to the third embodiment of the present invention. 本考案の第三実施例による組み合わせ断面図である。FIG. 6 is a cross-sectional view of a combination according to a third embodiment of the present invention. 本考案の第四実施例による立体組み合わせ図である。It is a three-dimensional combination diagram according to the fourth embodiment of the present invention. 本考案の第四実施例による組み合わせ断面図である。FIG. 6 is a sectional view in combination according to a fourth embodiment of the present invention. 本考案の第五実施例による組み合わせ断面図である。FIG. 6 is a sectional view in combination according to a fifth embodiment of the present invention. 本考案の第六実施例による組み合わせ断面図である。It is combination sectional drawing by 6th Example of this invention. 本考案の第七実施例による立体図である。It is a three-dimensional view according to a seventh embodiment of the present invention. 本考案の第七実施例による側視図である。It is a side view by 7th Example of this invention.

図1〜図3は、本考案の第一実施例を示す図である。図で示されるように、本考案は回路板1を含み、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は散熱層13を設置する。導電層12上に、正、負極ボンディングパッド14を設置し、隔離層15により導電層12を包み、正、負極ボンディングパッド14だけを隔離層15外側で露出させて、発光ダイオード2を装着する。散熱層13は、高熱伝導、高散熱效率の片体で、粘着方式により、回路板1背面に固定されるか、又は、直接、回路板1背面から、一層の高熱伝導、高散熱效率の材料を噴霧、塗布、電気めっきしてなり、又、回路板1の正、負極ボンディングパッド14の一極のボンディングパッド14箇所で、下向きに、導熱功能を有し、且つ、散熱層13と直接導通する中空孔状の導通部16を設置する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、ボンディングパッド14、導通部16を経て、直接、回路板1背面の散熱層13に伝達され、散熱面積を増加し、快速に散熱效果を達成し、発光ダイオード2が生成する熱エネルギーが発散される。
図4〜図6は、本考案の第二実施例を示す図である。図で示されるように、本考案は、回路板1を有し、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は散熱層13を設置し、導電層12上に、正、負極ボンディングパッド14を設置し、隔離層15により導電層12を包み、正、負極ボンディングパッド14だけを隔離層15外側に露出して、発光ダイオード2を装着する。散熱層13は、高熱伝導、高散熱效率の片体で、粘着方式で、回路板1背面に固定されるか、又は、直接、回路板1背面に、一層の高熱伝導、高散熱效率の材料を噴霧、塗布、電気めっきしてなる。又、回路板1の正、負極ボンディングパッド14箇所に、それぞれ、下向けに、導熱功能を有する中空孔状の導通部16を設置すると共に、一導通部16と散熱層13だけが導通する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、ボンディングパッド14、導通部16を経て、直接、回路板1背面の散熱層13に伝達して、散熱面積を増加させ、快速な散熱效果を達成し、発光ダイオード2が生成する熱エネルギーを散熱する。
図7と図8は、本考案の第三実施例を示す図である。図で示されるように、本考案は、回路板1を含み、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は散熱層13を設置し、導電層12上に、正、負極ボンディングパッド14を有し、隔離層15により、導電層12を包み、正、負極ボンディングパッド14だけを隔離層15の外側に露出させて、発光ダイオード2を装着する。散熱層13は、高熱伝導、高散熱效率の片体で、粘着方式により、回路板1背面を固定すると共に、散熱層13は、回路板1側板に沿って、上に導通部131を湾曲し、正、負極ボンディングパッド14の一極とボンディングパッド14が直接導通する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、ボンディングパッド14、導通部131を経て、直接、回路板1背面の散熱層13に伝達し、散熱面積を増加させて、快速な散熱効果を達成し、発光ダイオード2が生成する熱エネルギーを散熱する。
図9と図10は、本考案の第四実施例を示す図である。図で示されるように、本考案は、回路板1を含み、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は、分かれた二散熱層13を設置し、導電層12上に、正、負極ボンディングパッド14を設置し、隔離層15により導電層12を包み、正、負極ボンディングパッド14だけを隔離層15外側に露出して、発光ダイオード2を装着し、二散熱層13は、高熱伝導、高散熱効率の片体で、粘着方式により、回路板1背面に固定されると共に、二散熱層13は、それぞれ、回路板1側辺に沿って、上に導通部131を湾曲して、正、負極ボンディングパッド14と直接導通する。又、回路板1の正、負極ボンディングパッド14箇所で、それぞれ、下向けに、導熱功能を有する中空孔状の導通部16を設置し、二導通部16は、それぞれ、両散熱層13と導通する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、正、負極ボンディングパッド14、導通部131、導通部16を経て、直接、回路板1背面の両散熱層13に伝達され、散熱面積を増加させ、快速な散熱効果を達成し、発光ダイオード2が生成する熱エネルギーを散熱する。
図11は、本考案の第五実施例を示す図である。本考案は、回路板1を含み、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は散熱層13を設置し、導電層12上に、正、負極ボンディングパッド14を設置し、隔離層15により導電層12を包み、正、負極ボンディングパッド14だけを隔離層15外側に露出させて、発光ダイオード2を装着し、散熱層13は、高熱伝導、高散熱効率の片体で、粘着方式により、回路板1背面に固定されるか、又は、直接、回路板1背面に、一層の高熱伝導、高散熱効率の材料を噴霧、塗布、電気めっきしてなり、発光ダイオード2は二導電ピン21を有し、一導電ピン21が回路板1を通過して、導通部となり、散熱層13と直接導通する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、導電ピン21により形成される導通部により、直接、回路板1背面の散熱層13に伝達され、散熱面積を増加し、快速な散熱効果を達成し、発光ダイオード2が生成する熱エネルギーを散熱する。
図12は、本考案の第六実施例を示す図である。本考案は回路板1を有し、前記回路板1は、正面と背面を有する絶縁基板11で、前記絶縁基板11正面は導電層12を設置し、背面は、分かれた二散熱層13を設置し、導電層12上に、正、負極ボンディングパッド14を設置し、隔離層15により、導電層12を包み、正、負極ボンディングパッド14だけを隔離層15外側に露出させて、発光ダイオード2を装着し、散熱層13は、高熱伝導、高散熱効率の片体で、粘着方式により、回路板1背面に固定されるか、又は、直接、回路板1背面に、一層の高熱伝導、高散熱効率の材料を噴霧、塗布、電気めっきしてなり、発光ダイオード2は二導電ピン21を有し、二導電ピン21は、それぞれ、回路板1を経て導通部となり、二散熱層13と直接導通する。
発光ダイオード2操作時、発光ダイオード2により生成される熱エネルギーは、二導電ピン21により形成される導通部を経て、直接、回路板1背面の二散熱層13に伝達され、散熱面積を増加させ、快速な散熱効果を達成し、発光ダイオード2が生成する熱エネルギーを散熱する。
この他、上述の回路板1背面は、散熱層13を設置する以外に、図13と図14で示されるように、散熱層13上に、更に、散熱フィン3を設置するか、又は、回路板1背面と正面に、それぞれ、散熱フィン3を設置して、散熱フィン3は、発光ダイオード2に更に好ましい散熱效果を達成させることができる。
上述の実施例の構造により、本考案は以下のような効果が達成される。
1．発光ダイオード2操作時に生成される高温は、直接、導通部16、131を経て、回路板1背面の散熱層13に伝達されて散熱させ、散熱面積を増加させ、快速な散熱効果を達成し、発光ダイオード2の発光功能と使用寿命を効果的に維持する。
2．直接、回路板1背面に散熱層13を設置し、導通部16、131により、回路板1正面の発光ダイオード2と直接導通し、快速な散熱効果を達成し、また、構造全体が簡潔で、製作コストが低く、経済的で、製品の競争力を向上させる。
本考案では好ましい実施例を前述の通り開示したが、これらは決して本考案に限定するものではなく、当該技術を熟知する者なら誰でも、本考案の精神と領域を脱しない範囲内で各種の変動や潤色を加えることができ、従って本考案の保護範囲は、実用新案請求の範囲で指定した内容を基準とする。 1 to 3 are views showing a first embodiment of the present invention. As shown in the figure, the present invention includes a circuit board 1, and the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, and the front surface of the insulating substrate 11 is provided with a conductive layer 12, and the back surface is a heat dissipation layer 13. Is installed. The positive and negative electrode bonding pads 14 are installed on the conductive layer 12, and the conductive layer 12 is covered with the isolation layer 15. Only the positive and negative electrode bonding pads 14 are exposed outside the isolation layer 15, and the light emitting diode 2 is mounted. The heat dissipating layer 13 is a single piece with high heat conduction and high heat dissipation efficiency, and is fixed to the back surface of the circuit board 1 by an adhesive method, or directly from the back surface of the circuit board 1 with a material having high heat conduction and high heat dissipation efficiency. Spraying, coating, electroplating, and 14 conductive bonding pads on the positive and negative electrode bonding pads 14 on the circuit board 1 have downward heat conduction and direct conduction to the heat dissipation layer 13 A hollow hole-shaped conduction part 16 is installed.
When operating the light-emitting diode 2, the heat energy generated by the light-emitting diode 2 is directly transmitted to the heat-dissipating layer 13 on the back of the circuit board 1 through the bonding pad 14 and the conduction part 16, increasing the heat-dissipating area and quickly dissipating heat. The effect is achieved and the heat energy generated by the light emitting diode 2 is dissipated.
4 to 6 are views showing a second embodiment of the present invention. As shown in the figure, the present invention has a circuit board 1, the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, the conductive substrate 12 is installed on the front surface of the insulating substrate 11, and the heat is dissipated on the back surface. Layer 13 is installed, positive and negative electrode bonding pads 14 are installed on conductive layer 12, conductive layer 12 is wrapped by isolation layer 15, and only positive and negative electrode bonding pads 14 are exposed outside isolation layer 15 to emit light. Install diode 2. The heat dissipating layer 13 is a single piece with high heat conduction and high heat dissipation efficiency, and is fixed to the back of the circuit board 1 by an adhesive method, or directly on the back of the circuit board 1 with a material having high heat conduction and high heat dissipation efficiency. Is sprayed, applied and electroplated. In addition, a hollow hole-like conduction part 16 having heat conduction performance is installed downward at each of the positive and negative electrode bonding pads 14 on the circuit board 1, and only one conduction part 16 and the heat dissipation layer 13 are conducted.
When operating the light-emitting diode 2, the heat energy generated by the light-emitting diode 2 is directly transmitted to the heat-dissipating layer 13 on the back of the circuit board 1 through the bonding pad 14 and the conduction part 16, thereby increasing the heat-dissipating area and increasing the speed. The heat dissipation effect is achieved, and the heat energy generated by the light emitting diode 2 is dissipated.
7 and 8 are views showing a third embodiment of the present invention. As shown in the figure, the present invention includes a circuit board 1, and the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, the front surface of the insulating substrate 11 is provided with a conductive layer 12, and the back surface is a heat dissipation layer. 13 has positive and negative electrode bonding pads 14 on the conductive layer 12, encloses the conductive layer 12 with the isolation layer 15, and only the positive and negative electrode bonding pads 14 are exposed to the outside of the isolation layer 15, Install light-emitting diode 2. The heat-dissipating layer 13 is a single piece with high heat conduction and high heat-dissipating efficiency, and the back surface of the circuit board 1 is fixed by an adhesive method. The heat-dissipating layer 13 bends the conductive portion 131 along the side plate of the circuit board 1. The positive electrode and the negative electrode bonding pad 14 are directly connected to the bonding pad 14.
When operating the light-emitting diode 2, the heat energy generated by the light-emitting diode 2 is transmitted directly to the heat-dissipating layer 13 on the back of the circuit board 1 through the bonding pad 14 and the conducting part 131, increasing the heat-dissipating area and increasing the speed. A heat dissipating effect is achieved, and the heat energy generated by the light emitting diode 2 is dissipated.
9 and 10 are views showing a fourth embodiment of the present invention. As shown in the figure, the present invention includes a circuit board 1, the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, the front surface of the insulating substrate 11 is provided with a conductive layer 12, and the back surface is divided. Two heat dissipating layers 13 are installed, positive and negative electrode bonding pads 14 are installed on the conductive layer 12, and the conductive layer 12 is wrapped by the isolation layer 15, and only the positive and negative electrode bonding pads 14 are exposed outside the isolation layer 15. The light-emitting diode 2 is mounted, and the two heat dissipating layer 13 is a single piece of high heat conduction and high heat dissipating efficiency, and is fixed to the back surface of the circuit board 1 by an adhesive method. The conductive portion 131 is curved upward along one side, and is directly connected to the positive and negative electrode bonding pads 14. In addition, at the 14 positive and negative electrode bonding pads on the circuit board 1, a conductive part 16 having a hollow hole shape having heat conduction performance is installed downward, respectively, and the two conductive parts 16 are electrically connected to the two heat dissipation layers 13, respectively. To do.
When the light emitting diode 2 is operated, the heat energy generated by the light emitting diode 2 is directly transmitted to the heat dissipating layers 13 on the back of the circuit board 1 through the positive and negative electrode bonding pads 14, the conductive portion 131, and the conductive portion 16, and the heat is dissipated. The area is increased, a rapid heat dissipation effect is achieved, and the heat energy generated by the light emitting diode 2 is dissipated.
FIG. 11 is a diagram showing a fifth embodiment of the present invention. The present invention includes a circuit board 1, the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, the insulating substrate 11 front surface is provided with a conductive layer 12, the back surface is provided with a heat dissipation layer 13, and the conductive layer The positive and negative electrode bonding pads 14 are installed on the conductive layer 12, and the positive and negative electrode bonding pads 14 are exposed to the outside of the isolation layer 15, and the light emitting diode 2 is attached to the heat dissipation layer. 13 is a single piece with high heat conduction and high heat dissipation efficiency, and is fixed to the back of the circuit board 1 by an adhesive method, or directly sprays a material with higher heat conduction and high heat dissipation efficiency directly on the back of the circuit board 1. The light-emitting diode 2 has two conductive pins 21, and the one conductive pin 21 passes through the circuit board 1 to become a conductive portion and is directly connected to the heat dissipation layer 13.
When the light emitting diode 2 is operated, the heat energy generated by the light emitting diode 2 is directly transmitted to the heat dissipating layer 13 on the back surface of the circuit board 1 by the conducting portion formed by the conductive pins 21, increasing the heat dissipating area and fast. A heat dissipating effect is achieved, and the heat energy generated by the light emitting diode 2 is dissipated.
FIG. 12 is a diagram showing a sixth embodiment of the present invention. The present invention has a circuit board 1, the circuit board 1 is an insulating substrate 11 having a front surface and a back surface, the conductive substrate 12 is installed on the front surface of the insulating substrate 11, and the separated two heat dissipation layers 13 are installed on the back surface. Then, positive and negative electrode bonding pads 14 are installed on the conductive layer 12, and the isolation layer 15 wraps the conductive layer 12, and only the positive and negative electrode bonding pads 14 are exposed to the outside of the isolation layer 15, and the light emitting diode 2 is formed. Installed, heat dissipation layer 13 is a single piece with high heat conduction and high heat dissipation efficiency, and is fixed to the back of the circuit board 1 by an adhesive method, or directly on the back of the circuit board 1 with one layer of high heat conduction and high heat dissipation. Efficient material is sprayed, applied, electroplated, the light emitting diode 2 has two conductive pins 21, each of which is a conductive part through the circuit board 1, and is directly connected to the two heat dissipation layers 13 To do.
When the light emitting diode 2 is operated, the heat energy generated by the light emitting diode 2 is directly transmitted to the two heat dissipating layers 13 on the back surface of the circuit board 1 through the conducting portion formed by the two conductive pins 21, thereby increasing the heat dissipating area. It achieves a rapid heat dissipation effect and dissipates the heat energy generated by the light emitting diode 2.
In addition to the above, the back side of the circuit board 1 is provided with the heat dissipating fins 3 on the heat dissipating layer 13 as shown in FIG. 13 and FIG. Heat dissipating fins 3 are installed on the back surface and the front surface of the plate 1, respectively, so that the heat dissipating fins 3 can make the light emitting diode 2 achieve a more preferable heat dissipating effect.
With the structure of the above-described embodiment, the present invention achieves the following effects.
1． The high temperature generated during the operation of the light emitting diode 2 is directly transmitted to the heat dissipating layer 13 on the back of the circuit board 1 through the conduction parts 16 and 131 to dissipate heat, increase the heat dissipating area, and achieve a rapid heat dissipating effect, Effectively maintain the light emission performance and service life of the light emitting diode 2.
2． Directly connected to the light-emitting diode 2 on the front of the circuit board 1 through the conduction parts 16 and 131 by installing the heat dissipation layer 13 directly on the back of the circuit board 1, achieving a rapid heat dissipation effect, and the whole structure is simple, Production cost is low, economic and product competitiveness is improved.
In the present invention, preferred embodiments have been disclosed as described above. However, these are not intended to limit the present invention, and any person who is familiar with the technology can use various methods within the spirit and scope of the present invention. Therefore, the protection scope of the present invention is based on the contents specified in the claims of the utility model.

1回路板
11絶縁基板
12導電層
13散熱層
131導通部
14ボンディングパッド
15隔離層
16導通部
2発光ダイオード
21導電ピン
3散熱フィン 1 circuit board
11 Insulation board
12 conductive layer
13 Heat dissipation layer
131 conduction part
14 bonding pads
15 isolation layers
16 conduction part
2 light emitting diode
21 conductive pin
3 heat dissipation fins

Claims (8)

発光ダイオード散熱装置であって、回路板を含み、前記回路板は、正面と背面を有する絶縁基板で、前記絶縁基板正面は導電層を設置し、前記導電層上に、正、負極のボンディングパッドを設置し、隔離層により、前記導電層を包み、前記ボンディングパッドだけを前記隔離層外側に露出させて、発光ダイオードを装着し、その特徴は、
前記絶縁基板背面は、少なくとも一つの散熱層を設置し、前記回路板上に導通部を設置し、前記導通部により、直接、前記ボンディングパッドと前記散熱層を導通させて、前記発光ダイオードの散熱面積を増加させることを特徴とする発光ダイオード散熱装置。 A light-emitting diode heat dissipation device, including a circuit board, wherein the circuit board is an insulating substrate having a front surface and a back surface, and a conductive layer is disposed on the front surface of the insulating substrate, and positive and negative bonding pads are provided on the conductive layer. And mounting the light emitting diode with the isolation layer wrapping the conductive layer, exposing only the bonding pad to the outside of the isolation layer,
The back surface of the insulating substrate is provided with at least one heat dissipating layer, a conductive part is provided on the circuit board, and the conductive part directly connects the bonding pad and the heat dissipating layer to dissipate heat from the light emitting diode. A light-emitting diode heat dissipating device characterized in that the area is increased. 前記散熱層は、前記回路板背面に粘着固定された高熱伝導、高散熱効率の片体であることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat-dissipating device according to claim 1, wherein the heat-dissipating layer is a single body with high heat conduction and high heat-dissipating efficiency that is adhesively fixed to the back surface of the circuit board. 前記散熱層は、回路板背面に噴霧、塗布、又は、電気めっきされた高熱伝導、高散熱效率の材料からなることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat-dissipating device according to claim 1, wherein the heat-dissipating layer is made of a material having high heat conductivity and high heat dissipation efficiency that is sprayed, applied, or electroplated on the back surface of the circuit board. 前記導通部は、前記回路板の正、負極ボンディングパッドの一極のボンディングパッドが、下向けに、導熱功能を有する中空孔を設置してなることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light emitting diode according to claim 1, wherein the conductive portion is formed by setting a hollow hole having a heat conduction effect downward on one of the positive and negative electrode bonding pads of the circuit board. Heat dissipation device. 前記導通部は、前記回路板の正、負極ボンディングパッドにより、それぞれ下向けに、導熱功能を有する中空孔を設置してなることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat dissipating device according to claim 1, wherein the conduction part is formed by providing a hollow hole having heat conduction performance downward by positive and negative electrode bonding pads of the circuit board. 前記導通部は、前記散熱層が回路板側板に沿って、上向けに延伸、湾曲してなることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat dissipation device according to claim 1, wherein the conduction part is formed by the heat dissipation layer extending upward and curved along the circuit board side plate. 前記導通部は、発光ダイオードの導電ピンを回路板に通過させてなることを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat dissipation device according to claim 1, wherein the conductive portion is formed by passing a conductive pin of the light-emitting diode through a circuit board. 前記回路板背面と正面上に、更に、散熱フィンを設置することを特徴とする請求項1に記載の発光ダイオード散熱装置。 2. The light-emitting diode heat dissipating device according to claim 1, further comprising heat dissipating fins on the back surface and the front surface of the circuit board.
JP2011001846U 2010-04-19 2011-04-04 Light-emitting diode heat dissipation device Expired - Fee Related JP3168522U (en)

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