KR20100027249A - Liquid cooling light source and led package - Google Patents

Liquid cooling light source and led package Download PDF

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Publication number
KR20100027249A
KR20100027249A KR1020080086076A KR20080086076A KR20100027249A KR 20100027249 A KR20100027249 A KR 20100027249A KR 1020080086076 A KR1020080086076 A KR 1020080086076A KR 20080086076 A KR20080086076 A KR 20080086076A KR 20100027249 A KR20100027249 A KR 20100027249A
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KR
South Korea
Prior art keywords
cooling
light emitting
led
liquid
emitting layer
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KR1020080086076A
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Korean (ko)
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KR101518508B1 (en
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이형곤
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이형곤
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Priority to KR1020080086076A priority Critical patent/KR101518508B1/en
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Abstract

PURPOSE: A liquid cooling light emitting device and an LED package are provided to maintain optimum light emitting efficiency by preventing the temperature of the LED package from increasing using a liquid as a cooling medium. CONSTITUTION: At least one LED package(P) is mounted on a PCB(503). A liquid for cooling absorbs a heat energy generated from an LED chip(1) and transmits the heat energy. The LED package includes a non-adhesive region and an adhesive region on a part of the surface. A central cooling section is located on a part of the surface of the non-adhesive region. The surface of the central cooling section(CC) contacts a cooling liquid or an wick. An electrode(713) or the LED chip which contact to the cooling liquid are covered with an insulation material.

Description

LIQUID COOLING LIGHT SOURCE AND LED PACKAGE}
The present invention relates to a light emitting device including an LED element, and a liquid cooling light emitting device comprising a structure and a combination of maximizing cooling efficiency in a liquid cooling light emitting device configured to increase cooling efficiency using a cooling liquid and the same. It is about LED package that is specially manufactured for the purpose.
In the era of high oil prices, products related to energy saving have recently been attracting attention. Among them, LED lighting is drawing explosive interest, and the world's leading companies are making bold investments to lead the technology and market in this field. In addition, the LED light emitting device is used in the electronics, the electric field, and the advertising field in that it has a long life and can save power consumption, and in recent years, it has been used for indoor / outdoor lighting, street lamps, vehicle lamps, and advertisement lighting. Its use is increasing day by day. In order to utilize the LED in such a field, a high output high power LED is required. Such high-power LEDs generate heat and increase their own temperature. However, since the performance of the LED has a problem that is rapidly lowered as the temperature rises, the cooling means of the LED appears to be a very important problem. In general, high-power LED light emitting devices include a plurality of LED chips, and include a heat sink used as a means for cooling heat emitted therefrom and a circuit board used as a power supply and control means. . The most common high power LED light emitting device has a structure in which a plurality of LED chips are bonded to the heat sink to transfer heat emitted from the LED chip to the heat sink through the circuit board and to be discharged from the heat sink. It is a model. Recently, in order to improve the cooling efficiency, a heat pipe is introduced as a cooling means. The heat pipe is composed of a body of a heat pipe in which the inside is maintained in vacuum and a working fluid injected into the inside vacuum, and forms a cycle for absorbing heat energy as the working fluid is evaporated from a heat generating unit to release heat energy from the condensing unit. Is a very good heat transfer medium. In the case of using a heat pipe-cooling device as described above, the most important aspect is how efficiently the heat generated from the LED chip is transferred to the heat pipe. More precisely, how efficiently will the heat generated from the LED chip be transferred to the working fluid in the vacuum space inside the heat pipe? In other words, the same heat transfer rate is applied as if the heat pipe is not used until the generated heat energy is transferred to the working fluid.
In conclusion, the present invention starts from the above point of view to transfer the heat generated from the LED chip to the working fluid present in the inner space of the heat pipe, by providing a means of significantly improved heat transfer efficiency of the high power LED chip The purpose is to maintain the optimum luminous efficiency by preventing the temperature rise, as well as to provide the effect of extending the service life and reliability.
In order to achieve the above object as in the first aspect of the present invention, at least one LED package (led package) comprising a light emitting layer of the LED chip (led chip) and a pcb which can be mounted at least one LED package, from the LED chip A light emitting device comprising a cooling liquid for absorbing and transferring generated thermal energy, and a container having at least the LED package and a cooling liquid therein, wherein the LED package includes a non-adhesive portion on a portion of a surface thereof. NC) and an adhesive part, and a centralized cooling part (CC) is present on at least a portion of the non-adhesive part (NC) surface, and the centralized cooling part surface is in contact with a cooling liquid and / or a wick. And the concentrated cooling part CC includes at least one surface of the non-adhesive part NC facing the LED chip emitting layer. Will made, the integrated cooling unit (CC) the thermal resistance to the light-emitting layer from the surface (O C / W) was the bonding portion (AC) surface in the sub site will less than the thermal resistance value an average value of up to the light-emitting layer, the concentrate from the light-emitting layer The number of conductive adhesive resin layers present in the space up to the surface of the cooling part is 0 or 1 layer or less, and the total thickness of the conductive adhesive resin layer is 0 or 200 microns or less, and the centralized cooling part in contact with the cooling liquid ( The total area of CC) is at least 5% of the area of the led light emitting layer, and the average distance from the surface of the concentrated cooling part CC to the led chip (first) light emitting layer is 350 microns or less. A liquid cooling light emitting device is provided which has a structure in which the thickness of the cooling liquid layer in contact with the surface of the concentrated cooling part is at least 0.1 micron or more.
It is the most preferable structure that the adhesive resin layer does not exist in the space from the above to the surface of the concentrated cooling part. However, if unavoidable, it is limited to the first floor or less. In addition, the total thickness of the adhesive resin layer is limited to 200 microns or less. When it exceeds 200 microns, the heat resistance due to the adhesive resin layer becomes too large, which causes problems in driving, performance, and lifespan of the light emitting layer, and it is difficult to expect excellent performance when compared with a conventional LED structure. . In such a structure in which the concentrated cooling unit and the cooling liquid are combined, an excellent effect is expected. As described above, the area of the concentrated cooling unit is 5% or less of the area of the LED light emitting layer or the LED from the surface of the concentrated cooling unit (CC). If the average distance to the led (light emitting) light emitting layer is 350 microns or more, the cooling effect may be superior to that of the conventional one, but it is meaningless because it is difficult to expect a sufficient price for cost increase. When the thickness of the cooling liquid layer is 0.1 micron or less, sufficient cooling is performed because the amount of the cooling liquid returned from the condensation part (heat radiating part) is too small compared to the amount of the cooling liquid evaporated in the heat absorbing part by the heat generated from the LED. It's hard to expect functionality. The cooling liquid may be in the form of returning from the condensation part to the endothermic part by gravity, or may be in the form of returning by capillary force by the wick, which can be selected in consideration of use or production cost to be. The reason for forming the concentrated cooling part of the LED package on some surfaces of the non-contact parts is to allow the cooling liquid to directly contact and absorb heat. The non-bonded portion refers to a portion that is not bonded to the pcb substrate or other accessories, and the bonded portion refers to a portion bonded to the pcb substrate or other accessories in any form. The function of the wick may be replaced by a capillary force generated in the gap between the concentrated cooling unit and the pcb or (and) the gap between the inner surface of the container and the surface of the concentrated cooling unit of the LED package. In addition, the centralized cooling unit CC may be formed on at least one surface selected from an upper surface (light emitting portion) and a lower surface of an LED chip. The aspect formed on both sides is the most excellent in thermal conductivity, but can be selectively configured according to the purpose and purpose of use, and the structure, characteristics and shape of each part. As described above, the non-bonded portion refers to the part that is not bonded to the printed circuit board (PCB) or other accessories, which is also the place where the cooling liquid and / or the wick are in contact. .
In the simplest form of cooling the centralized cooling unit CC as a liquid, the centralized cooling unit CC surface is intensively cooled by circulating the inside of the light emitting device including the LED package and the container with a cooling liquid. However, for more certainty and effective cooling, it is desirable to use the principle of a heat pipe that allows the cooling liquid to act as working oil while maintaining the interior of the container in a vacuum, for which the container is in accordance with another aspect of the present invention. The inside of the is maintained in a vacuum state, the liquid medium is present in the vacuum atmosphere is provided with a liquid cooling light emitting device, characterized in that the operating oil of the heat pipe. In this form, the vessel is responsible for the housing function of the heat pipe.
The light emitting devices may be directly exposed in a form in which at least a portion of the surface of the LED package or the LED chip of the LED package is in contact with the liquid. It is preferable. In this configuration, as another embodiment of the present invention, the electrode or (and) the LED chip exposed to the surface of the LED package and in contact with the cooling liquid is coated with an insulating material, and the process for coating the insulating material is a dry plating method. And a liquid cooling light emitting device, which is selected from a coating hardening method. This is especially true when the distance between the electrodes is short. In order to minimize the thermal resistance, the thickness of the insulating material coating layer is advantageous in terms of cooling efficiency as thin and dense thin film is preferred, so dry plating method (PVD-physical vapor deposition) may be preferred as a method for forming the insulating film, but is not limited thereto. The resin coating method may also be used depending on the purpose and purpose. Even when the LED chip itself is exposed as the intensive cooling unit, it is preferable to coat with an insulating film as necessary. The non-adhesive surface may also be configured to have a wick or heatsink function.
An LED package used as an essential component of the liquid-cooled light emitting device, wherein the LED package includes at least one LED chip according to another aspect of the present invention, wherein the LED package includes a surface of the LED package. A portion of the non-adhesive portion NC and the adhesive portion is provided, at least a portion of the non-adhesive portion (NC) surface of the centralized cooling unit (CC), the surface of the centralized cooling portion is a cooling liquid or (and) The intensive cooling part CC includes a surface which faces at least the LED chip light emitting layer among the non-adhesive part NC surfaces, and the luminescent layer is formed from the surface of the intensive cooling part CC. heat resistance (C O / W) to the bonding portion (AC) will from the surface is smaller than the average value of the thermal resistance value to the light-emitting layer, the concentrate from the light-emitting layer The number of conductive adhesive resin layers present in the space up to the surface of each part is 0 or 1 layer or less, and the total thickness of the conductive adhesive resin layer is 0 or 200 microns or less, and the concentrated cooling part (CC) in contact with the cooling liquid. ) Is a total area of at least 5% of the area of the led light emitting layer, and the average distance from the surface of the concentrated cooling unit (CC) to the LED chip (first) light emitting layer is 350 microns or less, characterized in that Package is provided. As the term "first light emitting layer" of the LED chip is assumed in the above, the LED chip may include two or more light emitting layers.
According to another aspect of the present invention, in order to maximize the heat dissipation characteristics of the LED package described above, the LED package is characterized in that the structure is provided with the centralized cooling unit CC on both sides (top and bottom) Package is provided. As described above, in such a structure, a reflective layer may be formed on at least a portion of the central cooling unit and / or the LED chip of the upper surface (light emitting surface).
As described above, according to the present invention, the light emitting device, particularly the LED light emitting device, exhibits an effect of quickly removing heat energy generated from the light emitting layer by using a cooling liquid, and thus, an element used as a light emitting device of the light emitting device. In addition to improving the lifespan and reliability of the LEDs, the number of packages to obtain the same amount of light can be reduced by increasing the allowable power amount per unit LED package, thereby achieving a variety of effects such as a reduction in production cost.
Example 1; LED chip 1 of US c company was mounted on the submount and reflector 3 using the conductive paste 901. The LED package P was manufactured in a form in which the bottom surface of the reflective material 3 was exposed (see FIG. 3), and then mounted on the pcb 501 using solder 201 and 202 to configure the light emitting device of FIG. 3.
Example 2; LED chip 1 of US c company was mounted using conductive paste 801 on the electrode and heat dissipation surface 814 of the LED package. The light emitting device of FIG. 7 was constructed by fabricating an LED package P such that the electrode was a non-contact portion (see FIG. 7) and mounting the solder package 201 and 202 on the pcb 501.
Example 3; A pcb 503 having a through-hole was formed to include a portion of the pcb substrate facing the centralized cooling unit CC of the LED package, and the others were configured as in Example 1 to configure the light emitting device of FIG. 4.
Example 4; Of the reflectors 3 exposed to the centralized cooling unit CC, a reflector 93 formed with a through hole was formed to include an area facing the LED chip 1, and the conductive paste 901 was positioned with the conductive paste 911 bonded around the edge of the LED chip. The light emitting device of FIG. 5 was constructed in the same manner as in Example 3 except for changing.
Example 5; In Example 4, the centralized cooling unit CC was further formed on the front surface of the LED package to configure the light emitting device as shown in FIG.
Example 6; A pcb 503 having a through-hole was formed to include a portion of the pcb substrate facing the centralized cooling unit CC of the LED package, and the others were configured as in Example 2 to configure the light emitting device of FIG. 8.
Example 7; To fabricate an electrode 713 having a through hole formed to include an area facing the LED chip 1 among the electrodes exposed to the concentrated cooling unit CC, and to change the position of the conductive paste to the conductive paste 701 bonded around the edge of the LED chip. Except that, the light emitting device of FIG. 9 was constructed in the same manner as in Example 6.
Example 8; In Example 7, the concentrated cooling unit CC was further formed on the front surface of the LED package to configure the light emitting device of FIG. 10. In this structure, a reflective layer may be formed or provided on at least a portion of the concentrated cooling unit CC and / or the LED chip formed on the front surface.
The above embodiments and drawings simply represent the spirit and principle underlying the present invention, and it is apparent that a light emitting device of considerable form can be provided by a method of diversifying functions and changing combinations.
1; LED C cross-section structure of US C company with 4 layers of heat barriers
2; LED cross-section structure of S company having three layers of thermal barriers (the heat dissipation surface is part of the electrode)
3; LED cross-section with reflector and submount in direct contact with the cooling liquid and / or wick
4; Cross-sectional structure with through-holes in the part of the PCB substrate facing the reflector surface for easy access to the cooling liquid and / or wick to the reflector surface
5; A cross-sectional structure configured to form a through hole in a portion of the reflector such that the cooling liquid and / or wick pass through the reflector and directly contact the surface of the LED chip.
6; Cross-sectional structure of LED with centralized cooling part CC formed on the front side of the LED package (If the wick is added to the front side, it may be made of transparent material)
Figure 7; LED cross-section structure with LED package electrode and heat dissipation surface in direct contact with cooling liquid and / or wick
8; Cross-sectional structure with through-holes formed on the part of the PCB substrate facing the reflector surface for easy access to the cooling liquid and / or wick by the electrode and heat dissipation surface
Figure 9; A cross-sectional structure configured to form a through hole in a portion of the electrode and heat dissipation surface so that the cooling liquid and / or wick pass through the electrode and heat dissipation surface to directly contact the surface of the LED chip.
Figure 10; Cross-sectional structure of LED with centralized cooling part CC formed on the front side of the LED package (If the wick is added to the front side, it may be made of transparent material)
1; LED chip (including light emitting layer) 3; Reflector (submount)
5; LED package heat dissipation surface 7; heat dissipation on PCB
9,10; electrode 11 on PCB; metal core 13,14 on MCPCB; electrode on LED package
93; Reflector with through hole formed in part
111,112; electrode connection wire in LED
201,202; Soldering solder joint (adhesive layer AC) for electrode connection
Insulation layer of metal core (MC) PCB
501; PCB
503; PCB with through holes formed in at least part
701,911; Adhesive layer formed around the edge
713; electrode of the LED package with a through hole formed in part
801; adhesive layer (heat barrier) between the LED chip and the electrode
813, LED package electrode
814; electrode and heat dissipation surface of LED package
901; Adhesive layer (heat barrier) between LED chip and submount
903; Adhesive layer (heat barrier) between submount and LED package heat dissipation surface
905; Adhesive layer (heat barrier) between LED package heat dissipation surface and MCPCB junction
907 heat barrier due to the insulating layer between the MCPCB junction and the metal core
P; ELD PACKAGE
CC; Concentrated cooling section where the liquid for cooling and / or wick comes into contact (access)

Claims (5)

  1. An LED package including at least an LED chip emitting layer, a pcb capable of mounting one or more LED packages, a cooling liquid for absorbing and transferring thermal energy generated from the LED chip, and A light emitting device comprising a container having at least the LED package and a cooling liquid therein, wherein the LED package is provided with a non-adhesive portion (NC) and an adhesive portion at a portion of a surface thereof. At least a portion of the surface of the NC exists in the centralized cooling unit (CC), the surface of the centralized cooling unit is in contact with the cooling liquid or (and) WICK, the centralized cooling unit (CC) is the non- At least the surface facing the LED chip light-emitting layer of the adhesive portion (NC) surface, and from the surface of the concentrated cooling portion (CC) The heat resistance value (Fig. C / W) to the layer is smaller than the average value of the heat resistance value from the surface of the adhesive portion AC to the light emitting layer, and the conductive adhesive resin layer exists in the space from the light emitting layer to the surface of the concentrated cooling portion. The number is 0 or 1 layer or less, the total thickness of the conductive adhesive resin layer is 0 or 200 microns or less, and the total area of the centralized cooling part CC in contact with the cooling liquid is at least the LED. 5% or more of the light emitting layer area, wherein the average distance from the surface of the concentrated cooling unit (CC) to the led chip (first) light emitting layer is 350 microns or less, and the cooling in contact with the surface of the centralized cooling unit. Liquid-cooled light emitting device, characterized in that the thickness of the liquid layer is at least 0.1 micron or more
  2. In an LED package comprising at least a light emitting layer of the LED chip (LED chip), the LED package is provided with a non-adhesive portion (NC) and the adhesive portion on a portion of the surface, at least a portion of the non-adhesive portion (NC) surface There is a concentrated cooling unit CC, wherein the surface of the concentrated cooling unit is a surface in contact with the cooling liquid and / or the wick, and the concentrated cooling unit CC is at least one of the non-adhesive portions NC surface. It comprises a surface facing the LED chip light emitting layer, the heat resistance value (Fig. C / W) from the surface of the concentrated cooling portion (CC) to the light emitting layer is higher than the average value of the heat resistance from the surface of the adhesive portion (AC) to the light emitting layer It is small and the number of the conductive adhesive resin layers present in the space from the light emitting layer to the surface of the intensive cooling part is 0 or 1 layer or less, and the total thickness of the conductive adhesive resin layer 0 or 200 microns or less, and the total area of the centralized cooling unit (CC) in contact with the cooling liquid is at least 5% of the area of the LED light emitting layer, and from the surface of the centralized cooling unit (CC) LED package for liquid cooling, characterized in that the average distance to the LED chip (first) light emitting layer is less than 350 microns
  3. The liquid cooling device of claim 1, wherein the inside of the container is maintained in a vacuum state, and the liquid medium is a working oil of a heat pipe as present in a vacuum atmosphere.
  4. The electrode or (and) the LED chip exposed to the surface of the LED package and in contact with the cooling liquid is coated with an insulating material, and the process for coating with the insulating material is selected from a dry plating method and a coating hardening method. Liquid cooling light emitting device
  5. The LED package of claim 2, wherein the centralized cooling unit CC is provided on both surfaces (upper and lower surface).
KR1020080086076A 2008-09-01 2008-09-01 Liquid cooling light source and led package KR101518508B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587010B2 (en) 2010-12-24 2013-11-19 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
JP2017168790A (en) * 2016-03-18 2017-09-21 日亜化学工業株式会社 Light source device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4345507B2 (en) 2004-02-04 2009-10-14 セイコーエプソン株式会社 Light source device and projector
JP2007287981A (en) 2006-04-18 2007-11-01 Konica Minolta Opto Inc Light emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587010B2 (en) 2010-12-24 2013-11-19 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
US8722435B2 (en) 2010-12-24 2014-05-13 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
JP2017168790A (en) * 2016-03-18 2017-09-21 日亜化学工業株式会社 Light source device

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