-九、發明說明： 【發明所屬之技術領域】 本發明係關於-種發光二極體照明裝置，並且特別地，本發 明係關於一種具有微形透鏡組之發光二極體照明裝置。 【先前技術】 、岸ίίΐί體f雷光元件發展’發光二極體已為一種新興的光 二ΐ 適合量產等等’許多優點。因此， …亦已漸成趨勢。為提供足夠的照明，== 做為光源的照明裝置纽用高功率的發光二極體。另外，在許多 用不！之發生係由於光線不夠集中，以致於-般 ?二:ίΓίί，功率的發光二極體來獲取所需的亮度，除 了浪費此源也導致其他的問題，例如散熱。 古4由^光Τ極體發射出的光線未經調制’則光線將朝四面八 光線稍針。在f知技射，通常將一透鏡 ’以聚集由該發光二赌發射出之光線。此透 f極體晶粒時，同時形成。或是單純將單一凸 婉二二丄Xfe 體上以聚集光線。無論制上述何種方式， “ΐί線以提巧、ί其ί束角度仍可能高達約145度，並不足 以汆杲无線以美歼売度而符合照明用途的需求。 f此有岛要&供一種具有微形透鏡組之發光二極體昭明裝 置，該卿透餘可有效地㈣光線贿決上财題。， 【發明内容】 本發明之-鱗在於提供-歸光二極親明装置。 本發明之另—射在於提供—種使賴形透鏡組之發光二極 1324671 體照明裝置 本發明之發光二極體照明裝置包含、 ❿战弟一凹陷部，該葡於兮戍矣品 文陷部，該第一凹陷部與該第二上“2 ί 基板係欣人抑—凹㈣。該發光二 上。該微形透鏡組設置於該第—凹崎上。n置在《板 置於含ί:個突出，該複數個突出以二維分佈設 置於3亥微开/透鏡組之一表面上。每一突出一 或-角錐微透鏡。該等突出亦可為複數朗:並二 ;:ίί=ί Τ 一三角形或-梯形。此外，該:形= ΐ 區域以及一第二區域，該等突出位於該 ^-&域之⑨度大於該等突出位於該第二區域之密度。亦即 以ί均分佈於該表面上為必要。於—具體實施例，經該微 形透鏡組發射出來的光線其光束角度可限縮至20度以下。 此外，賴台係-低溫共燒m —印刷電路板或一金屬 核心電路板。於該基板與該第二凹陷部之間可填充一黏膠，以加 強固定該基板於該第二凹陷部。該基板為―梦、金屬或低溫共燒 陶瓷。該發光一極體晶粒係一半導體發光二極體或一半導體雷 射。本發明之發光二極體照明裝置可進一步包含一封裝材料，二 封裝材料位於該發光二極體晶粒與該微形透鏡纟且之間， ^ 該發光二極體晶粒。 另外，於一具體實施例中，該第一凹陷部之一直徑小於該第 二凹陷部之一直徑，致使該第二凹陷部具有一頂部，該基板與該 頂部電性連接。於另一具體實施例中，該基板上設有電路接點， 並且該頂部上亦對應設有電路接點，當該基板與該頂部連接時， 該基板上的電路接點即與該頂部上的電路接點電性連接。於另一 具體實施例中，該基板包含一第三凹陷部以及一反射層，該反射 6 層位於„亥第二凹陷部上，该發光二極體晶粒係設置於該第三凹陷 部中且於該反射層上。 一 本發明之發光二極體照明裝置可進一步包含一導熱元件以及 一支撐體。該導熱元件具有一平坦部，該基板係設置在該平坦部 上。該支撐體與該導熱元件銜接。該載台固定於該支撐體上。該 導熱元件為一熱導管或一熱導柱。一導熱相變材料可設置於該平 坦部與該基板之H具體實施财，該基板具有—絲面， ϊίίίϊίί面與該載台找絲面大致共平面，可使該導熱 才目變材枓可確實填充於該平坦部與絲板之間，以減少氣孔的發 生0 ，美熱ΐ變材料具有黏性’因此該導熱相變材料可將 =。當該導熱相變材料產生相變時，其流動性有： 部之間’進而避免氣室的產生，有效將該 f程中所產生之熱傳導至導熱元件並散逸 ΐί ㈣。此外， 4.〇W/mKW。 等…係數5亥導熱係數在3.6·ηΚ至 由，=丄極體照明她用微形透鏡組以調制 鏡組之光線之鍋度桃透該微形透 式得點與精神可以藉由以下的發明詳述及所附圖 f實施方式】 請參閱圖一 A及B，圖一 A在洽-j 實施例之發光二極_職置本翻之-較佳具體 衣置1之局部剖面圖；圖一 B係繪示該 1324671 發光二極體照明裝置1之却八 裝置1包含一載台12、-炸圖。本發明之發光二極體照明 微形透餘18、-支撐!14=數鑛光二㈣晶粒16、-料24。 趙20、一導熱元件22以及一導熱相變材 頂表ϋ Π成面122和一底表面124 ’該載台12於該 上形成-第二“部f28凹兮陷第部一1^該載台12於該底表面124 相連接。該基板Μ係嵌入^一一凹==6與該第二凹陷部128 - ηη^Λβ 149 λ- °Χ第—凹陷。卩128。該基板14包含複數 m 母一個第三凹陷部“2上形成有一反射層 μΛ 光二極體晶粒16設置於該等第三凹陷部 128相連接之i徑小於^且’該第一凹陷部126與該第二凹陷部 接之直ΐ 第—凹陷部128與該第一凹陷部126相連 Ϊίί Π0 5 128 130 〇 14 ^ “λ板部130具有卡止該基板14之功能，亦可增 二，128附著面積，亦即增加該基板Μ ϋ哀亦一叙狀，“的附著。若於該基板14與該第二凹陷部128 此二#其;^二’ ί·°更加強固定該基板14於該第二凹陷部128。 ^外，該基板14上可設有電路接點148 ，有電路接點132，當該基板14與該頂部13() 二電路接，丨48即與該頂部別上的電’ : 光二極體晶粒16即無需再打線至=2 上而係先與該基板14電性連接。 該微形透鏡組18包含複數個突出184，該等突出丨 ，分佈設置於該微形透鏡組18之一表面182上。每一個突^脱 為一半球。該微形透鏡組18之俯視圖如圖一 ^所示。該 ^佈^形不關—C中顯示者為限，亦得以最密排列來分佈， ==所示。雖_ — c及时顯示料突出184係平均地分 佈在該表面182上，但是本發明不以此為限。亦即該等突 的分佈可能在某些區域較密集’而在某些區域較稀疏應視產品 8 ;定而在靠近該表面182周圍的分佈密 示‘❿在罪近該表面182中心的分佈密度較低，如圖一£所 =實際應财，該等突出184不限於前述，亦可為— :以所ί Τ ΐ錐微透鏡(如圖二B所示)。圖二A之剖面圖可 B。圖二B之剖面圖如圖二〇所示。此外，該等 η排列成複數個同心圓，或該等突出m係數個同心圓，如 r。每―個突出184之—截面為一半圓形(可參考圖-每-形(如圖二E)或一梯形(如圖二F所示）。補充說明的是， 狀亦184 *以相同為必要。並且’該等突出184的幾何形 =為前述的組合。另夕卜’該較佳具體實施例中之有關該等突 tit圖中:示。並且’該等突出184亦可朝向該= 元一極體晶粒16形成於該微形透鏡組18上。 請參閱圖一 Α及β，根據該較佳具體實施例，該支 C 202 ’致使該支撐體2〇可固定於該導熱元件22上。該g 件22包含一平坦部222。該平坦部222上設置該導熱相變材 砷，然後該基板14在設置在該導熱相變材料24上。^ ΪΪΪ ^填充該基板14與該平坦部222之間的空隙 板4 /、該平坦部222間之介面熱阻。由於該基板ΐ4已嵌入 u第一凹陷部128，因此可藉由固定該載台12來達到固美 14之目的。以數個螺絲26將該載台12固定於該支撐體2〇上，致 使該基板14壓縮該導熱相變材料24以達到固定在該平坦部232 之目的。由於該基板14之一底表面146與該載台12之該底表面 124大致共平面。因此該導熱相變材料24可充分地填充在該美板 14與該平坦部222之間。補充說明較，該導熱相變材料2'^以 亦填充於該載台12與該支撐體20之間為必要。 根據該較佳具體實施例，該導熱相變材料24具有一相變溫 度。該相變溫度在4GU6G〇C之間，但本發明不以此為限。於^ 1===:其流動性，，可更有效填充於該基板 極體晶粒16避免軋至的產生，有效將該發光二 逸出去。該導生之熱傳導至該導熱元件U並散 黏性，因此外’該導熱相變材料24本身具有 熱元件22可包含個㈣亥平坦部222上。另外，該導 部边料的由該平坦 於產品計設，在此不再贅述4則祕出去。該等則之設置取決 所干支撐體2〇固定該载台12的方式亦不以圖一 A 2 揮體2〇亦可以結構上來卡住該載台12,。 C步兩麵定方式。該發光二極體照明裝置1 -極二I ! ff材料未顯示於圖中)。該封裝材料位於該等發光 6與該微形透鏡組18之間，並且覆魏等發光二極 ’但是不以完全填充該第一凹陷部⑶為必要。另外， 么明’該載台12可為—低溫共燒喊板、—印刷電路板、 ^屬核，d路板或其他可無基板14補讀料。該基板Μ 1為金屬、低溫共燒喊或其他可承載縣二極體晶粒之材 Ια ^ “發光二極體晶粒16可為一半導體發光二極體或一半導體帝 導熱70件22可為~~熱導管熱導柱或其他具有導熱特性 之材質或裝置。 值得一提的是，該較佳具體實施例雖僅包含一基板14，但本 發明並不以此為限。請參閱圖三，亦即於一具體實施例中，該載 台12*可包含複數個第二凹陷部128(未標示於圖三中），每一個”第二 凹陷部128均嵌入一基板14'，每個基板14'上設置有至少一個發光 一極體晶粒16。 綜上所述，本發明之發光二極體照明裝置使用微形透鏡組以 調制由該發光二極體晶粒所發射出之光線，以達到聚光的效果。 並且藉由設計該等突出之幾何形狀，該微形透鏡組可將穿透該微 乂組之光線之光束角度大幅縮小以提供有效的照明，進而減 &率發光二極體晶粒的使用量並節省能源。另外，本發明之 二極體照明裝置使用該導熱相變材料，將該基板黏著在該平 二^卩十°於該導熱相變材料相變後，其流動性增加，該導熱相變 料可更有效填充於該基板與該平坦部之間。並且於長時間使用 後，導熱相變材料仍可保持相當流動性、導熱性，使得該基板 與该導熱元件間之介面熱阻不致升高 ，進而本發明之發光二極體 照明裝置之使用壽命較傳統的發光二極體照明裝置來得長。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本 發明之特徵與精神’而並非以上述所揭露的較佳具體實施例來對 本發明之範嘴加以限制。相反地，其目的是希望能涵蓋各種改變 及具相等性的安排於本發明所欲申請之專利範圍的範疇内。 【圖式簡單說明】 圖 A係繪不根據本發日月$ — 照明裝置之局部剖面圖。 —較佳具體實施例之發光二極體 二 B:繪示該發光二極體照明裂置之部分爆炸圖。 置之微形透鏡組之俯視圖。 讀示該微形透鏡組之突出之另—分佈示意圖。 圖一Ε係綠示該微形透鏡組之突出之另一分佈示意圖。 圖- Α係繪示該微形透鏡組之突出之另—幾何形狀之示意圖。 圖^係繪示該微形透鏡組之突出之另—幾何形狀之示意圖。 圖-C係緣示圖二B中之該微形透鏡組之剖面圖。 圖二1)鱗示該微形透鏡組之突出之另一幾何形狀之示意圖。 圖二E係繪示圖二D中之該微形透鏡虹之剖面圖。 圖二F係繪示圖二D中之該微形透鏡經之另—气面圖。 置之根據本發明之—具體實_之發k極體照明裝 【主要元件符號說明】 1 :發光二極體照明裝置 14、14’ ：基板 18 :微形透鏡組 22 :導熱元件 26 :螺絲 124 :底表面 12、12':載台 16 :發光二極體晶粒 20 :支撐體 24 :導熱相變材料 122 :頂表面 12 1,324671 126 :第一凹陷部 128 130 :頂部 132 142 :第三凹陷部 144 146 :底表面 148 182 :表面 184 202 :通孔 222 :第二凹陷部 :電路接點 :反射層 :電路接點 :突出 :平坦部 13IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lighting device, and in particular, to a light-emitting diode lighting device having a micro lens group. [Prior Art], the development of the light-emitting elements, the light-emitting diode has become an emerging light, suitable for mass production, etc. Many advantages. Therefore, ... has also become a trend. In order to provide sufficient illumination, the == lighting device as a light source uses a high-power light-emitting diode. In addition, it is used in many! The occurrence is due to the lack of concentration of light, so that the power of the light-emitting diode to obtain the required brightness, in addition to wasting this source also causes other problems, such as heat dissipation. The light emitted by the ancient light-emitting body is unmodulated, and the light will be slightly lighter in all directions. In the art, a lens is typically used to gather the light emitted by the illuminated bet. When the ferrite is crystallized, it is formed at the same time. Or simply use a single convex 婉2丄 Xfe body to gather light. Regardless of the method described above, "the ΐί line can still be as high as about 145 degrees with a touch of dexterity. It is not enough for wireless to meet the needs of lighting applications. & for a light-emitting diode display device with a micro lens group, the clear can effectively (4) light bribes on the financial problem. [Invention] The present invention - the scale is provided - return light dipole Another aspect of the present invention is to provide a light-emitting diode 13246671 illumination device for a Lai lens group. The illumination LED device of the present invention comprises, and a scorpion, a depression. In the trapping portion, the first recessed portion and the second upper portion of the "2 ί substrate system are fascinating-concave (four). The light is on the second. The micro lens group is disposed on the first concave surface. n is placed on the plate with ί: a protrusion, and the plurality of protrusions are placed on the surface of one of the three-dimensional micro-opening/lens group in a two-dimensional distribution. Each protrudes a - or a pyramidal microlens. These highlights can also be plural: and two;: ίί=ί Τ a triangle or a trapezoid. Further, the shape = ΐ region and a second region, the protrusions being located at 9 degrees of the ^-& field being greater than the density of the protrusions at the second region. That is, it is necessary to distribute ί on the surface. In a specific embodiment, the light emitted by the microlens group can be limited to a beam angle of less than 20 degrees. In addition, the Lai Taiwan system - low temperature co-fired m - printed circuit board or a metal core circuit board. An adhesive may be filled between the substrate and the second recess to strengthen the substrate to the second recess. The substrate is a "dream, metal or low temperature co-fired ceramic." The luminescent monopole is a semiconductor light emitting diode or a semiconductor laser. The illuminating diode illuminating device of the present invention may further comprise a packaging material, wherein the encapsulating material is located between the illuminating diode die and the microlens ,, and the illuminating diode dies. In addition, in one embodiment, one of the first recesses has a diameter smaller than a diameter of the second recess, such that the second recess has a top portion, and the substrate is electrically connected to the top. In another embodiment, the substrate is provided with circuit contacts, and the top portion is also provided with a circuit contact. When the substrate is connected to the top, the circuit contacts on the substrate are on the top. The circuit contacts are electrically connected. In another embodiment, the substrate includes a third recessed portion and a reflective layer, and the reflective 6 layer is located on the second recessed portion, and the light emitting diode die is disposed in the third recessed portion. And the light-emitting diode lighting device of the present invention may further comprise a heat-conducting element and a support body. The heat-conducting element has a flat portion, and the substrate is disposed on the flat portion. The heat conducting component is coupled to the support body. The heat conducting component is a heat pipe or a heat conductive pillar. A heat conductive phase change material can be disposed on the flat portion and the substrate. The surface of the wire is substantially coplanar with the surface of the stage, so that the heat conductive material can be surely filled between the flat portion and the wire plate to reduce the occurrence of pores. The variable material is viscous' so the thermally conductive phase change material can be =. When the thermally conductive phase change material produces a phase change, its fluidity is: between the parts, and thus avoiding the generation of the gas chamber, effectively Heat generation To the heat-conducting element and dissipate ΐ 四 (4). In addition, 4. 〇 W / mKW. etc. coefficient 5 hai 导热 3.6 3.6 Κ 丄 丄 丄 丄 丄 丄 丄 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明 照明The micro-transparent point and spirit can be obtained by the following detailed description of the invention and the embodiment of the accompanying drawings. Please refer to FIG. 1A and B. FIG. 1A is in the light-emitting diode of the embodiment of the method-j. A partial cross-sectional view of a preferred embodiment of the present invention; FIG. 1B shows that the apparatus 1 of the 13246671 light-emitting diode lighting device 1 includes a stage 12, a fried map. Light-emitting diode illumination micro-transparent 18, - support! 14 = several mineral light two (four) grain 16, material 24. Zhao 20, a thermal conductive element 22 and a thermal phase change material top surface Π Π face 122 and a The bottom surface 124' the stage 12 is formed thereon - the second "portion f28" is recessed and the first stage is connected to the bottom surface 124. The substrate is embedded in a recess ==6 and the second recess 128 - ηη ^ Λ β 149 λ - ° Χ - recess.卩128. The substrate 14 includes a plurality of m-makes and a third recessed portion. The second recessed portion 126 is formed on the second recessed portion 128. The first recessed portion 126 is disposed on the third recessed portion 128. The second recessed portion is connected to the first recessed portion 126. λίί Π0 5 128 130 〇14 ^ "The λ plate portion 130 has the function of locking the substrate 14, and may be increased by two. 128 adhesion area, that is, increasing the substrate ϋ 亦 亦 , , , , , , “ “ “ “ “ “ “ “ 。 。 。 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The second recessed portion 128. The substrate 14 may be provided with a circuit contact 148 having a circuit contact 132. When the substrate 14 is connected to the top 13 () circuit, the top 48 is adjacent to the top portion. The upper electrode ': the photodiode die 16 is electrically connected to the substrate 14 without having to be wired to = 2. The microlens group 18 includes a plurality of protrusions 184, and the protrusions are distributed over The surface of the micro lens group 18 is 182. Each of the protrusions is a half ball. The top view of the micro lens group 18 is as shown in FIG. ^. The ^ cloth shape is not closed - the display in C is limited, and can be distributed in the most dense arrangement, ==. Although _ - c timely display material protrusion 184 is evenly distributed on the surface 182 However, the invention is not limited thereto, that is, the distribution of the protrusions may be denser in some areas, and the products 8 are sparse in some areas; the distribution is close to the surface 182. The distribution density of the sin near the surface of the surface 182 is relatively low, as shown in Fig. 1. The actual protrusion 184 is not limited to the foregoing, and may be -: 以 ΐ ΐ cone microlens (Fig. 2B The cross-sectional view of Figure 2A can be B. The cross-sectional view of Figure 2B is shown in Figure 2. In addition, the η is arranged in a plurality of concentric circles, or the congruent m-coordinates, such as r Each of the protrusions 184 has a semi-circular cross section (refer to the figure - each-shape (as shown in Figure 2E) or a trapezoid (as shown in Figure 2F). It is added that the shape is also the same as 184 * It is necessary and the geometry of the protrusions 184 is the combination of the foregoing. In addition, the preferred embodiment of the preferred embodiment is shown in the figures. And the protrusions 184 may also be formed on the microlens group 18 toward the finite element die 16. Referring to Figures 1 and β, according to the preferred embodiment, the C 202 'causes The support member 2 can be fixed on the heat conducting member 22. The g member 22 includes a flat portion 222. The flat portion 222 is provided with the thermally conductive phase change material arsenic, and then the substrate 14 is disposed on the thermally conductive phase change material 24. ^ ΪΪΪ ^ fills the gap between the substrate 14 and the flat portion 222 and the interface between the flat portion 222. Since the substrate 4 has been embedded in the first recess 128, it can be fixed by The stage 12 is used for the purpose of the Gumei 14. The stage 12 is fixed to the support body 2 by a plurality of screws 26, so that the substrate 14 compresses the thermally conductive phase change material 24 for the purpose of being fixed to the flat portion 232. Since one of the bottom surfaces 146 of the substrate 14 is substantially coplanar with the bottom surface 124 of the stage 12. Therefore, the thermally conductive phase change material 24 can be sufficiently filled between the sheet 14 and the flat portion 222. In addition, it is necessary that the thermally conductive phase change material 2' is also filled between the stage 12 and the support 20. According to the preferred embodiment, the thermally conductive phase change material 24 has a phase transition temperature. The phase transition temperature is between 4 GU6 G 〇 C, but the invention is not limited thereto. In the case of ^ 1 ===: its fluidity, it can be more effectively filled on the substrate. The polar body grains 16 avoid the occurrence of rolling, and effectively illuminate the light. The heat of the conduction is conducted to the thermally conductive element U and is viscous, so that the outer thermally conductive phase change material 24 itself has a thermal element 22 that can comprise a (four) flat portion 222. In addition, the guide material is set flat on the product, and the details are not described here. The arrangement of these means depends on the manner in which the support 2 is fixed to the stage 12, and the stage 12 can also be structurally clamped in the manner of Figure 2 A 2 . C step two sides to set the way. The light-emitting diode illumination device 1 - pole II I ff material is not shown in the figure). The encapsulating material is located between the illuminating light 6 and the microlens group 18, and covers the illuminating dipoles ' but does not completely fill the first recess (3). In addition, the display 12 can be a low temperature co-firing board, a printed circuit board, a nuclear core, a d-channel board or other substrate-free 14 reading material. The substrate Μ 1 is a metal, a low temperature co-firing or other material that can carry the county diode grain Ι α ^ "the light emitting diode die 16 can be a semiconductor light emitting diode or a semiconductor heat conductive 70 pieces 22 It is a heat pipe or other heat-conducting material or device. It is worth mentioning that the preferred embodiment only includes a substrate 14, but the invention is not limited thereto. Third, that is, in a specific embodiment, the stage 12* may include a plurality of second recesses 128 (not shown in FIG. 3), and each of the "second recesses 128" is embedded in a substrate 14'. At least one light-emitting monopole die 16 is disposed on each of the substrates 14'. In summary, the light-emitting diode lighting device of the present invention uses a micro lens group to modulate light emitted from the light-emitting diode crystal grains to achieve the effect of collecting light. And by designing the protruding geometry, the microlens group can substantially reduce the beam angle of the light passing through the micro-turn group to provide effective illumination, thereby reducing the use of the light-emitting diode die. And save energy. In addition, the diode lighting device of the present invention uses the thermally conductive phase change material, and the substrate is adhered to the flat surface of the thermally conductive phase change material after the phase change of the thermally conductive phase change material, and the thermal conductivity phase change material can be More effectively filled between the substrate and the flat portion. Moreover, after long-term use, the thermally conductive phase change material can maintain relatively fluidity and thermal conductivity, so that the interface thermal resistance between the substrate and the heat conducting element is not increased, and the service life of the light emitting diode lighting device of the present invention is further improved. It is longer than the traditional light-emitting diode lighting device. The features and spirits of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. [Simple description of the diagram] Figure A is a partial cross-sectional view of the lighting device not based on the date of the present day. - LED of a preferred embodiment II B: A partial exploded view of the illumination split of the LED. A top view of the microlens group. A schematic diagram of the other distribution of the protrusions of the microlens group is read. Fig. 1 is a schematic view showing another distribution of the protrusion of the microlens group. Figure - is a schematic diagram showing the other geometry of the protrusion of the microlens group. Figure 2 is a schematic view showing another geometric shape of the protrusion of the micro lens group. Figure-C is a cross-sectional view of the microlens group in Figure 2B. Figure 2)) Schematic diagram showing another geometry of the protrusion of the microlens group. Figure 2E is a cross-sectional view of the microlens in Figure 2D. Figure 2F is a cross-sectional view of the microlens in Figure 2D. According to the present invention - a specific embodiment of the k-electrode illumination device [main component symbol description] 1 : LED illumination device 14, 14': substrate 18: micro lens group 22: thermal conduction element 26: screw 124: bottom surface 12, 12': stage 16: light-emitting diode die 20: support body 24: thermally conductive phase change material 122: top surface 12 1,324671 126: first recess 128 130: top 132 142: Third recessed portion 144 146 : bottom surface 148 182 : surface 184 202 : through hole 222 : second recessed portion: circuit contact: reflective layer: circuit contact: protruding: flat portion 13