CN201884987U - High-heat-conducting integrated light-emitting diode (LED) structure - Google Patents
High-heat-conducting integrated light-emitting diode (LED) structure Download PDFInfo
- Publication number
- CN201884987U CN201884987U CN2010205740692U CN201020574069U CN201884987U CN 201884987 U CN201884987 U CN 201884987U CN 2010205740692 U CN2010205740692 U CN 2010205740692U CN 201020574069 U CN201020574069 U CN 201020574069U CN 201884987 U CN201884987 U CN 201884987U
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- heat
- heat sink
- hole
- fin
- heat dispersion
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a high-heat-conducting integrated light-emitting diode (LED) structure, comprising a plurality of LED chips, a ceramic base and a heat sink, wherein the middle part of the ceramic base is provided with a through hole, the heat sink is arranged inside the through hole, the upper end of the heat sink and the through hole form a concave-cup reflection cavity, all the LED chips are arrayed and attached to the interior of the concave-cup reflection cavity on the upper end of the heat sink, the lower end of the heat sink is connected with a cooling fin, and heat-dissipating silicone grease is coated between the heat sink and the cooling fin. The high-heat-conducting integrated LED structure has a simple structure, and because the cooling fin is additionally arranged on the lower end of the heat sink, the heat-dissipating area is effectively increased and the heat-dissipating effect is enhanced.
Description
Technical field
The utility model relates to a kind of integrated LED structure of LED assembly, particularly a kind of high heat conduction.
Background technology
Along with electronic product develops to light, thin, little, high density, multifunction, component on circuit board packing density and integrated level are more and more higher, power consumption is increasing, thermal diffusivity to circuit board (PCB substrate) requires more and more urgent, if the thermal diffusivity of circuit board is bad or very poor, gently can cause on the printed circuit board components and parts overheated, heavy then make the reliability decrease of whole system or device.For the fast development of electronic technology now, the market demand of high-thermal conductive metal base plate is heated up, also more and more higher to its specification requirement simultaneously, obviously oneself asks through closing it the existing practice, and in addition improved necessity certainly will be arranged.
Summary of the invention
The purpose of this utility model is exactly the weak point in the background technology, and a kind of integrated LED structure of high heat conduction is provided, and it dispels the heat to heat dispersion heat sink by fin.
For achieving the above object, the utility model adopts following technical scheme: the integrated LED structure of high heat conduction, comprise some led chips, base of ceramic and heat dispersion heat sink, the base of ceramic middle part is provided with through hole, heat dispersion heat sink is positioned at through hole, and forms recessed cup reflection chamber with through hole on it, and each led chip is all arranged in the recessed cup reflection chamber of the upper end that is attached to heat dispersion heat sink, described heat dispersion heat sink lower end is connected with fin, is coated with heat dissipating silicone grease between heat dispersion heat sink and the fin junction.
For a kind of optimization of the present utility model, described fin comprises substrate and radiating fin, the vertical or horizontal arrangement of some radiating fins, and all connect and compose integral body with substrate.
For a kind of optimization of the present utility model, described substrate middle part is provided with installing hole, and middle part, heat dispersion heat sink lower end is provided with screwed hole, and screw passes installing hole and screwed hole engagement.
The utility model is compared with background technology, has simple in structurely, owing to added fin in the heat dispersion heat sink lower end, effectively increases area of dissipation, strengthens radiating effect.
Description of drawings
Fig. 1 is the structural representation of the integrated LED structure of high heat conduction.
The specific embodiment
Embodiment 1: with reference to Fig. 1.The integrated LED structure of high heat conduction, comprise some led chips 3, base of ceramic 5 and heat dispersion heat sink 4, the middle part of base of ceramic 5 is provided with through hole, heat dispersion heat sink 4 is positioned at through hole, and its upper end forms recessed cup reflection chamber 5a with through hole, each led chip 3 is all arranged in the recessed cup reflection chamber 5a of the upper end that is attached to heat dispersion heat sink 4, be filled with the layer of silica gel 2 that contains fluorescent material in the recessed cup reflection chamber 5a, described heat dispersion heat sink 4 lower ends are connected with fin 6, are coated with heat dissipating silicone grease between heat dispersion heat sink 4 and fin 6 junctions.Described fin 6 comprises substrate 6a and radiating fin 6b, the vertical or horizontal arrangement of some radiating fin 6b, and all connect and compose integral body with substrate 6a.The middle part of described substrate 6a is provided with installing hole, and middle part, heat dispersion heat sink 4 lower ends is provided with screwed hole 4a, and screw 1 passes installing hole and screwed hole 4a engagement, so that fin 6b is fixedlyed connected with heat dispersion heat sink 4.
What need understand is: though present embodiment is to the utility model detailed explanation of contrasting; but these explanations; just to simple declaration of the present utility model; rather than to restriction of the present utility model; any innovation and creation that do not exceed in the utility model connotation all fall in the protection domain of the present utility model.
Claims (3)
1. the integrated LED structure of a high heat conduction, comprise some led chips, base of ceramic and heat dispersion heat sink, the base of ceramic middle part is provided with through hole, heat dispersion heat sink is positioned at through hole, and its upper end forms recessed cup reflection chamber with through hole, each led chip is all arranged in the recessed cup reflection chamber of the upper end that is attached to heat dispersion heat sink, be filled with the layer of silica gel that contains fluorescent material in the recessed cup reflection chamber, it is characterized in that: described heat dispersion heat sink lower end is connected with fin, is coated with heat dissipating silicone grease between heat dispersion heat sink and the fin junction.
2. the integrated LED structure of high heat conduction according to claim 1, it is characterized in that: described fin comprises substrate and radiating fin, the vertical or horizontal arrangement of some radiating fins, and all connect and compose integral body with substrate.
3. the integrated LED structure of high heat conduction according to claim 1 is characterized in that: described substrate middle part is provided with installing hole, and middle part, heat dispersion heat sink lower end is provided with screwed hole, and screw passes installing hole and meshes with screwed hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205740692U CN201884987U (en) | 2010-10-25 | 2010-10-25 | High-heat-conducting integrated light-emitting diode (LED) structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205740692U CN201884987U (en) | 2010-10-25 | 2010-10-25 | High-heat-conducting integrated light-emitting diode (LED) structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201884987U true CN201884987U (en) | 2011-06-29 |
Family
ID=44182532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205740692U Expired - Fee Related CN201884987U (en) | 2010-10-25 | 2010-10-25 | High-heat-conducting integrated light-emitting diode (LED) structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201884987U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780701A (en) * | 2015-04-17 | 2015-07-15 | 浪潮电子信息产业股份有限公司 | Heat radiator for simplify PCB design |
| CN109630991A (en) * | 2019-01-16 | 2019-04-16 | 高建文 | A kind of LED illumination device of the good heat dissipation effect for indoor square |
-
2010
- 2010-10-25 CN CN2010205740692U patent/CN201884987U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780701A (en) * | 2015-04-17 | 2015-07-15 | 浪潮电子信息产业股份有限公司 | Heat radiator for simplify PCB design |
| CN109630991A (en) * | 2019-01-16 | 2019-04-16 | 高建文 | A kind of LED illumination device of the good heat dissipation effect for indoor square |
| CN109630991B (en) * | 2019-01-16 | 2020-10-30 | 永康市恒纽工贸有限公司 | LED lighting equipment with good heat dissipation effect for indoor square |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20131025 |