CN202013901U - Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source - Google Patents
Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source Download PDFInfo
- Publication number
- CN202013901U CN202013901U CN2011201361992U CN201120136199U CN202013901U CN 202013901 U CN202013901 U CN 202013901U CN 2011201361992 U CN2011201361992 U CN 2011201361992U CN 201120136199 U CN201120136199 U CN 201120136199U CN 202013901 U CN202013901 U CN 202013901U
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- CN
- China
- Prior art keywords
- light source
- heat
- led light
- cooling baseplate
- radiating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a cooling baseplate device used for surface-mounting an LED (Light Emitting Diode) light source. The cooling baseplate device comprises the cooling baseplate and a printed circuit board; wherein the printed circuit board is stuck on the cooling baseplate and is a flexible printed circuit board; and through holes are arranged at the LED light source installing positions on the flexible printed circuit board, so that the bottoms of the installed LED light sources are stuck on the surface of the cooling baseplate. In the cooling baseplate device, as the LED light sources and the cooling baseplate have no insulating layer to separate, the heat generated by LED chips can be directly transmitted to the cooling baseplate, the cooling effect is good, the LED light source is very reliable, and the service life of the LED light source can be prolonged.
Description
Technical field
The utility model relates to a kind of heat-radiating substrate device that is used for the surface mount led light source.
Background technology
Make the light fixture of light source with surface mount LED, the heat-radiating substrate device is selected the aluminium base preferably copper-clad plate of heat conductivility usually for use, as the printed circuit plate substrate of fixed L ED light source, led light source is fixed on by aluminium base copper-clad plate surface by the mode of pin welding simultaneously in this aluminium base copper-clad plate.Copper layer, insulating barrier that the defective of this heat-radiating substrate is the heat that produces of led chip by aluminium base copper-clad plate are delivered on the aluminium base, though the heat-conducting effect of aluminium base is stronger, but because the insulating barrier thermal resistance is bigger, seriously hindered effective derivation of heat, cause the LED junction temperature to raise, cause the LED reliability decrease.
Summary of the invention
The purpose of this utility model is at the deficiencies in the prior art part, and a kind of heat-radiating substrate device that is used for the surface mount led light source is provided, and has the advantage of good heat dissipation effect.
For achieving the above object, the utility model has adopted following technical scheme: it comprises the heat dissipation metal substrate and sticks on the printed circuit board of heat-radiating substrate, described printed circuit board is a flexible PCB, flexible PCB has through hole in the led light source installation site, makes that the led light source bottom after installing is attached to the heat-radiating substrate surface.Do not have insulating barrier to intercept between led light source and the heat-radiating substrate, the heat that led chip produces is directly delivered on the heat dissipation metal substrate, good heat dissipation effect, and the LED good reliability can prolong its useful life.
Described heat-radiating substrate can adopt the high temperature-uniforming plate of heat transfer efficiency, and the heat that can rapidly led light source be produced is taken away, and can significantly improve the LED reliability.
As shown from the above technical solution, the utility model adopts heat-radiating substrate to add flexible PCB as surface mount led light source carrier, there is not insulating barrier to intercept between led light source and the heat-radiating substrate, the heat that led chip produces is directly delivered on the heat-radiating substrate, good heat dissipation effect, the LED good reliability can prolong its useful life.
Description of drawings
Fig. 1 is a vertical view of the present utility model.
Embodiment
As shown in Figure 1, the utility model is formed by heat-radiating substrate 1 and by the flexible PCB 2 that viscose glue sticks on the heat-radiating substrate 1, and heat-radiating substrate 1 can adopt metal aluminum sheet, the copper coin of good heat conduction effect, also can adopt the better temperature-uniforming plate of radiating effect.
Claims (2)
1. the heat-radiating substrate device that is used for the surface mount led light source, comprise heat-radiating substrate (1) and stick on the printed circuit board of heat-radiating substrate, it is characterized in that: described printed circuit board is flexible PCB (2), flexible PCB (2) has through hole (4) in the led light source installation site, make that the led light source bottom after installing is attached to heat-radiating substrate (1) surface.
2. the heat-radiating substrate device that is used for the surface mount led light source according to claim 1 is characterized in that: described heat-radiating substrate (1) is a temperature-uniforming plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201361992U CN202013901U (en) | 2011-05-03 | 2011-05-03 | Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201361992U CN202013901U (en) | 2011-05-03 | 2011-05-03 | Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202013901U true CN202013901U (en) | 2011-10-19 |
Family
ID=44784516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201361992U Expired - Fee Related CN202013901U (en) | 2011-05-03 | 2011-05-03 | Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202013901U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036618A (en) * | 2012-12-13 | 2013-04-10 | 深圳市易飞扬通信技术有限公司 | Light transmit-receive element and sealing method thereof |
-
2011
- 2011-05-03 CN CN2011201361992U patent/CN202013901U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036618A (en) * | 2012-12-13 | 2013-04-10 | 深圳市易飞扬通信技术有限公司 | Light transmit-receive element and sealing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111019 Termination date: 20140503 |