TWI426202B - Optical lighting module - Google Patents

Optical lighting module Download PDF

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Publication number
TWI426202B
TWI426202B TW099144549A TW99144549A TWI426202B TW I426202 B TWI426202 B TW I426202B TW 099144549 A TW099144549 A TW 099144549A TW 99144549 A TW99144549 A TW 99144549A TW I426202 B TWI426202 B TW I426202B
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Taiwan
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metal substrate
printed circuit
circuit layer
optical
lighting module
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TW099144549A
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Chinese (zh)
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TW201226777A (en
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何彥緯
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玉晶光電股份有限公司
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Description

光學照明模組Optical lighting module

本案係關於一種光學照明模組,尤指一種提供使用者能自行將複數光學照明模組予以串接使用,而在電氣特徵上具有並聯模式之創新技術者。The present invention relates to an optical lighting module, and more particularly to an innovative technology that provides a user with the ability to connect a plurality of optical lighting modules in series and has a parallel mode in electrical characteristics.

按以,與本案相關之先前公開技術,如TW I244776「發光裝置」,其揭示包括:複數個具有一發光二極體基座、金屬散熱板以及至少一發光二極體發光單元之發光二極體模組,其中每一發光二極體發光單元係具有複數個電氣連接端;該發光二極體基座係承載該至少一發光二極體發光單元,該發光二極體基座表面設有複數個對應電氣連結於該等電氣連結端的電氣接點;該金屬散熱板係與該發光二極體基座相連接,用以移除該至少一發光二極體發光單元所產生的熱能;一定位單元,其係包括:一具有複數個貫孔之定位板,且該等貫孔貫穿該定位單元並容置該發光二極體模組;以及一散熱單元,係與該等發光二極體模組的各該金屬散熱板接觸,用以將該等金屬散熱板所具有之熱能移除。其中該定位單元更包括一具有一電路圖案之印刷電路板,該印刷電路板並夾置於該定位板與散熱單元之間,該當該等發光二極體模組容置於該等貫孔後,該電路圖樣係與位於該等發光二極體基座的該等電氣接點電氣連接。The prior art disclosed in connection with the present invention, such as TW I244776 "Lighting Device", discloses a plurality of LEDs having a light-emitting diode base, a metal heat sink and at least one light-emitting diode light-emitting unit. The body module, wherein each of the light emitting diodes has a plurality of electrical connecting ends; the light emitting diode base carries the at least one light emitting diode light emitting unit, and the light emitting diode base surface is provided a plurality of electrical contacts electrically connected to the electrical connecting ends; the metal heat dissipating plate is connected to the light emitting diode base for removing thermal energy generated by the at least one light emitting diode light emitting unit; The positioning unit includes: a positioning plate having a plurality of through holes, the through holes penetrating the positioning unit and accommodating the LED module; and a heat dissipating unit connected to the LEDs Each of the metal heat sinks of the module is in contact with the heat energy of the metal heat sinks. The positioning unit further includes a printed circuit board having a circuit pattern, and the printed circuit board is sandwiched between the positioning board and the heat dissipation unit, and the light emitting diode modules are received in the through holes. The circuit pattern is electrically connected to the electrical contacts located on the base of the light emitting diodes.

上述係以發光二極體模組作為發光元件之一般通用結構,即會先將複數的發光二極體模組連結於一印刷電路板上,之後再將該印刷電路板一端面抵觸連結於金屬散熱板相對端面,以間接傳導散移除發光二極體產生的熱能。The above-mentioned light-emitting diode module is generally used as a general structure of a light-emitting element, that is, a plurality of light-emitting diode modules are first connected to a printed circuit board, and then the printed circuit board is end-contacted to the metal. The opposite end faces of the heat sink are used to indirectly conduct the heat energy generated by the light emitting diodes.

惟前述結構缺點係:供發光二極體連結之印刷電路板和金屬散熱板係屬於兩個不同材質製成的獨立個體,必需分開獨立製造加工,故有製造加工程序較為繁雜及耗時,整體組合後重量較重之缺點。However, the above-mentioned structural disadvantages are: the printed circuit board and the metal heat sink which are connected by the light-emitting diode are independent individuals made of two different materials, and must be separately manufactured and processed separately, so the manufacturing and processing procedures are complicated and time-consuming, and the whole is The disadvantage of heavy weight after combination.

此外,發光二極體透過印刷電路板間接傳導其產生的熱能至金屬散熱板上,尚有導熱及散熱效能不佳之待改進之處。In addition, the light-emitting diode indirectly transmits the heat generated by the light-emitting diode to the metal heat-dissipating plate through the printed circuit board, and there is still a need for improvement in heat conduction and heat dissipation performance.

設於印刷電路板上的複數發光二極體未再以單一光學透鏡進行整合,故,各別發光二極體產生的光束是彼此獨立照射,其光分佈區域有不均勻之缺點。The plurality of light-emitting diodes disposed on the printed circuit board are not integrated by a single optical lens. Therefore, the light beams generated by the respective light-emitting diodes are independently irradiated with each other, and the light distribution region is uneven.

鑑於上述缺點,本案發明技術主要乃針對光學照明模組加以改良設計,在完成本發明技術後,進一步提出本案之新型專利申請。In view of the above disadvantages, the invention technology of the present invention is mainly directed to an improved design of an optical lighting module. After completing the technology of the present invention, a new patent application of the present invention is further proposed.

本發明之主要目的,係提供一種光學照明模組,其具有如下功效特徵:The main object of the present invention is to provide an optical lighting module having the following features:

1.本發明使用之金屬基板,為具有高導散熱功能之板體,其正面設有印刷電路層和複數發光二極體,並且以一光學透鏡覆蓋前述複數發光二極體進行光束整合分散,利於均勻照射在被照物上。1. The metal substrate used in the present invention is a plate body having a high heat dissipation function, and a printed circuit layer and a plurality of light emitting diodes are disposed on a front surface thereof, and the plurality of light emitting diodes are covered by an optical lens to perform beam integration and dispersion. Conducive to uniform illumination on the object.

2.光學照明模組之光學透鏡一端係呈外露狀態,並且在提供光學透鏡套設之燈罩預定處設有一內止水環,使光學透鏡與燈罩間具有止水功能。2. The optical lens of the optical illumination module is exposed at one end, and an inner water stop ring is arranged at a predetermined position of the lamp cover for providing the optical lens, so that the optical lens and the lamp cover have a water stopping function.

3.採用高導熱及高散熱效能的金屬基板,其正面直接設有一印刷電路層,而背面係以塗裝材料披覆有一散熱漆層,以將各發光二極體所產生的熱能經由金屬基板及散熱塗層進行快速散熱作用。3. A metal substrate with high thermal conductivity and high heat dissipation performance, the front side of which is directly provided with a printed circuit layer, and the back surface is coated with a heat-dissipating paint layer to coat the heat energy generated by each light-emitting diode through the metal substrate. And the heat-dissipating coating for rapid heat dissipation.

4.具高導熱和高散熱功能的金屬基板,為一平板,該金屬基板完全沒有鰭片結構,在製程方面有成本降低的功能。4. The metal substrate with high thermal conductivity and high heat dissipation function is a flat plate, and the metal substrate has no fin structure at all, and has a cost reduction function in the process.

5.金屬基板上有防水措施設計,是完整的戶外產品,非習用公開之發光二極體的零件模組。5. The waterproof design of the metal substrate is a complete outdoor product, and the component module of the light-emitting diode that is not conventionally used.

6.設於金屬基板之印刷電路層已內建並聯電路設計,並且連結有一電性連接輸入件和一電性連接輸出件,可供將複數個本案光學照明模組進行串接使用。6. The printed circuit layer of the metal substrate has a built-in parallel circuit design, and is connected with an electrical connection input member and an electrical connection output member for connecting a plurality of optical lighting modules of the present invention in series.

為達到上述目的,本發明提供一種光學照明模組,其包括:一金屬基板,為具備質輕、高導熱及高散熱效能之金屬板體,其在本較佳實施例中係採用一鋁基板配合說明,其在金屬基板的正面設有印刷電路層,背面設計有散熱塗層;前述金屬基板與印刷電路層間係介設有絕緣層,在設置印刷電路層區域內預定處設有一組電源輸入端、一組電源輸出端和複數電線連接孔,每一組電源輸入/輸出端皆有一正、負極接口,以提供 一電性連接輸入件和一電性連接輸出件一端進行接合與印刷電路層進行電性連接;而金屬基板在印刷電路層區域的外圍係分佈設有複數鎖孔,可供配合複數鎖合元件連結於一燈罩內部,使金屬基板之正面隱藏於燈罩內部,而金屬基板之背面則外露狀態;在本案光學照明模組中,該金屬基板之背面係直接裸露在模組外部,此具有提昇散熱效果和降低製造成本之實質效益;再者,該印刷電路層於預定處係直接固定接合有二個以上的複數發光二極體,以及一供電驅動模組,且該印刷電路層內建有並聯電路設計,可將複數個本案光學照明模組進行串接接合。In order to achieve the above object, the present invention provides an optical illumination module comprising: a metal substrate, which is a metal plate body having light weight, high thermal conductivity and high heat dissipation performance, and in the preferred embodiment, an aluminum substrate is used. According to the cooperation description, a printed circuit layer is disposed on the front surface of the metal substrate, and a heat dissipation coating is disposed on the back surface; an insulating layer is disposed between the metal substrate and the printed circuit layer, and a set of power input is preset in the area where the printed circuit layer is disposed. End, a set of power output terminals and a plurality of wire connection holes, each set of power input/output terminals has a positive and negative interface to provide An electrical connection input member and an electrical connection output member are electrically connected to one end of the printed circuit layer, and the metal substrate is provided with a plurality of keyholes on the periphery of the printed circuit layer region for matching the plurality of locking components Connected to the inside of a lamp cover, the front side of the metal substrate is hidden inside the lamp cover, and the back side of the metal substrate is exposed; in the optical lighting module of the present case, the back side of the metal substrate is directly exposed outside the module, which has improved heat dissipation The effect and the substantial benefit of reducing the manufacturing cost; further, the printed circuit layer is directly fixedly bonded to the two or more complex light-emitting diodes at a predetermined location, and a power supply driving module, and the printed circuit layer is internally connected in parallel The circuit design can connect a plurality of optical lighting modules of the present invention in series.

上述供電驅動模組,係可供整流並驅動前述複數發光二極體;上述燈罩,設有一開口向下的容槽,供金屬基板容置,該容槽相對於開口端之頂面中央設有一穿孔,該穿孔於底部外圍設有一內凹環,該內凹環套有一內止水環,且在容槽內部沿頂面外圍間隔適距設有一外框牆,沿該外框牆底部套有一外止水環,該外止水環底部係貼觸在金屬基板相對端面,將印刷電路層框圍在其內部;一光學透鏡,設有一平台,其一端設有一內凹弧槽,可供前述複數發光二極體容置,該內凹弧槽頂面為一入光凹曲面,位在內凹弧槽的相對外側係設有一凸曲面,該凸曲面係可套置在燈罩之穿孔內部,並且外露於本案光學照明模組之外部,此外,套於穿孔底部外圍之內止水環係可抵觸於前述平台頂端相對端面;該光學透鏡主要係提供前複數發光二極體容置進行光束分散作用,以利於均勻照射在被照物上;俾以藉由上述構件組成在金屬基板上直接結合光學功能,且由光學照明模組外觀直接使用金屬基板,進而使得整體模組具有質輕、散熱功能佳、以複數發光二極體藉由單一光學透鏡進行光束折射整合、以及具備防水功能,可適用安裝於戶外使用之光學照明模組。The power supply driving module is configured to rectify and drive the plurality of light emitting diodes; the lamp cover is provided with a downwardly facing pocket for receiving the metal substrate, and the receiving slot is disposed at a center of the top surface of the open end Perforation, the perforation is provided with an inner concave ring on the outer periphery of the bottom, the inner concave ring is sleeved with an inner water stop ring, and an outer frame wall is disposed at a proper interval along the outer periphery of the top surface of the inner cavity, and a bottom frame is arranged along the bottom of the outer frame wall An outer water stop ring, the bottom of the outer water stop ring is attached to the opposite end surface of the metal substrate, and the printed circuit layer frame is enclosed therein; an optical lens is provided with a platform, and one end thereof is provided with a concave arc groove for the foregoing The plurality of light-emitting diodes are received, and the top surface of the concave arc groove is a concave concave curved surface, and a convex curved surface is disposed on the opposite outer side of the concave concave groove, and the convex curved surface can be sleeved inside the perforation of the lamp cover. And exposed outside the optical illumination module of the present invention, in addition, the water stop ring sleeve on the periphery of the bottom of the perforation can be in contact with the opposite end surface of the platform top; the optical lens mainly provides the front complex LED housing for beam dispersion effect In order to facilitate uniform illumination on the object; the optical component is directly combined on the metal substrate by the above-mentioned component composition, and the metal substrate is directly used by the appearance of the optical illumination module, thereby making the overall module light in weight and good in heat dissipation. The light-emitting diode of the plurality of light-emitting diodes is integrated by a single optical lens, and has a waterproof function, and can be applied to an optical lighting module for outdoor use.

再者,本發明光學照明模組,尚包括:在金屬基板的底外部架設一背板,該背板可將金屬基板托住,並且配合鎖合元件連結於燈罩者。Furthermore, the optical lighting module of the present invention further comprises: arranging a back plate outside the bottom of the metal substrate, the back plate can support the metal substrate, and the locking member is coupled to the lamp cover.

餘下,茲再配合本發明各較佳實施例之圖式進一步說明如后,以期能使熟悉本發明相關技術之人士,得依本說明書之陳述據以實施:首先,敬請配合參閱第一至五圖所示,為本發明一種光學照明模組,包括:一金屬基板10、複數發光二極體20、一供電驅動模組30、一燈罩40、一光學透鏡50及一背板60所組成;其中,該金屬基板10,為具備質輕、高導熱及高散熱效能之金屬板體,前述金屬基體10係採用一鋁基板配合說明,該金屬基板10於正面直接設有一印刷電路層11,該印刷電路層11係設在一結合於金屬基板10端面之絕緣層(圖中未示),且該金屬基板10在設置印刷電路層11區域內預定處設有複數電線連接孔12,各電線連接孔12主要提供對應至少一電性連接輸入件131和一電性連接輸出件132進行套合連接,以便與印刷電路層11之正負極接口電路進行電性連接,前述一電性連接輸入件131和一電性連接輸出件132皆包含有一正、負極電源連接線13,以供進行電路佈局,俾以可供複數光學照明模組進行串接接合者;其中,該電性連接輸入件131和電性連接輸出件132係可被一般習知技術可產生等效之組材、電線或一端子台、或二端子台任一種所取代。In the following, the drawings of the preferred embodiments of the present invention will be further described in the following, in order to enable those skilled in the relevant art of the present invention to implement the statements according to the present specification: First, please refer to the first to 5 is an optical lighting module of the present invention, comprising: a metal substrate 10, a plurality of light emitting diodes 20, a power supply driving module 30, a lamp cover 40, an optical lens 50 and a back plate 60. The metal substrate 10 is a metal plate body having light weight, high heat conductivity and high heat dissipation performance. The metal substrate 10 is provided with an aluminum substrate. The metal substrate 10 is directly provided with a printed circuit layer 11 on the front surface. The printed circuit layer 11 is provided with an insulating layer (not shown) bonded to the end surface of the metal substrate 10, and the metal substrate 10 is provided with a plurality of wire connecting holes 12 at predetermined places in the area where the printed circuit layer 11 is disposed. The connecting hole 12 mainly provides a socket connection corresponding to the at least one electrical connection input member 131 and an electrical connection output member 132 for electrically connecting with the positive and negative interface circuits of the printed circuit layer 11, the foregoing The sexual connection input member 131 and the electrical connection output member 132 each include a positive and negative power supply connection line 13 for circuit layout, and the plurality of optical illumination modules are connected in series; wherein the electrical connection The connection input member 131 and the electrical connection output member 132 can be replaced by any of the conventional materials that can produce equivalent components, wires or a terminal block, or a two terminal block.

此外,該金屬基板10正面在印刷電路層11區域的外圍係分佈設有複數鎖孔14,可供配合複數鎖合元件70鎖固於一燈罩40內部。其中,前述印刷電路層11係內建有並聯電路設計,以供複數組光學照明模組進行串接接合。又前述一電性連接輸入件131和一電性連接輸出件132與金屬基板10連接端係各套有一雙孔止水塞15。而金屬基板10位在設置印刷電路層11的另一相對端面,即金屬基板10的背面係設有一散熱塗層16,該散熱塗層16,為一種高散熱效能之漆料塗佈而成。In addition, a plurality of keyholes 14 are disposed on the front surface of the printed circuit layer 11 on the front surface of the metal substrate 10 for locking the inside of a lamp cover 40 with the plurality of locking components 70. The printed circuit layer 11 has a built-in parallel circuit design for serially connecting the multiple array optical illumination modules. Further, the first electrical connection input member 131 and the electrical connection output member 132 are connected to the metal substrate 10 to form a double hole water stop plug 15 . The metal substrate 10 is disposed on the other opposite end surface of the printed circuit layer 11, that is, the back surface of the metal substrate 10 is provided with a heat dissipation coating 16 which is coated with a paint having high heat dissipation performance.

至少二個以上的發光二極體20,採用串接方式集中固設於前述印刷電路層11預設位置;前述複數發光二極體20產生的功率係設定介在2W(瓦)~5W(瓦)之間;一供電驅動模組30,係固設於前述印刷電路層11區域,與該印刷電路層11之電路連接以整流並驅動前述發光二極體20,該供電驅動模組30內部係增設有保險絲(圖中未示),以提供當電流異常時,具自動斷電功能,以大幅提昇產品的安全性;一燈罩40,設有一開口向外/下的容槽41,可供金屬基板10容置,該容槽41相對於開口端之頂面中央設有一穿孔42,該穿孔42於底部外圍設有一內凹環43,該內凹環43套有一內止水環44,該燈罩40在容槽41內部沿頂面外圍間隔適距設有一外框牆45,沿該外框牆45底部套有一外止水環46,該外止水環46底部係貼觸在金屬基板10相對端面,此為金屬基板10之正面,可將印刷電路層11予以框圍;再者,燈罩40在容槽41頂部外框牆45的外圍分佈設有數連結孔47,該各連結孔47可供與前述金屬基板10之複數鎖孔14相對合;一光學透鏡50,設有一平台51,其底部可貼合於金屬基板10之印刷電路層11預定處,該平台51底部設有一內凹弧槽52,可供複數發光二極體20同時容置,該內凹弧槽52頂面為一入光凹曲面,在內凹弧槽52的相對外側係設有一凸曲面53,該凸曲面53係可套置在燈罩40之穿孔42內部,其為一出光面,當該凸曲面53套於穿孔42後,該設於穿孔42底部外圍之內止水環44係可抵觸於前述平台51頂端相對端面;一背板60,可自金屬基板10底部將其托住,該背板60於兩側設有複數通孔61,可供與金屬基板10之複數鎖孔14相對合,以供配合複數鎖合元件70連結於燈罩40預設之連結孔47;該背板60位在金屬基板10設置複數電線連接孔12的對應位置兩長形孔62,以提供分別套設在一電性連接輸入件131和一電性連接輸出件132的雙孔止水塞15一端容套限位;再者,該背板60在底部兩邊配合複數鎖合元件70各連結有一電源固定座63,每一電源固定座63位在對應背板60底部的端面皆預設有一溝槽631,每一溝槽631至少可供一電性連接輸入件131或一電性連接輸出件132容置收納者;俾以藉由上述構件組成,可利用在光學照明模組內部預定處設置之內止水環44、外止水環46,以構成一外戶防水功能,更且具有可達到上述目的之實質功效者。At least two or more LEDs 20 are fixedly disposed in a predetermined position on the printed circuit layer 11 in a series connection manner; the power generation of the plurality of LEDs 20 is set in a range of 2 W (Watts) to 5 W (Watts). A power supply driving module 30 is fixed in the printed circuit layer 11 region, and is connected to the circuit of the printed circuit layer 11 to rectify and drive the light emitting diode 20, and the power supply driving module 30 is internally provided. A fuse (not shown) is provided to provide an automatic power-off function when the current is abnormal, so as to greatly improve the safety of the product; a lamp cover 40 is provided with an opening/outward opening 41 for the metal substrate The receiving portion 41 is provided with a through hole 42 at the center of the top surface of the open end. The through hole 42 is provided with a concave ring 43 at the periphery of the bottom portion. The inner concave ring 43 is sleeved with an inner water stop ring 44. The lamp cover 40 An outer frame wall 45 is disposed at a distance from the periphery of the top surface of the cavity 41, and an outer water stop ring 46 is disposed along the bottom of the outer frame wall 45. The bottom of the outer water stop ring 46 is attached to the opposite end surface of the metal substrate 10. This is the front side of the metal substrate 10, and the printed circuit layer 11 can be framed; Furthermore, the lamp cover 40 is provided with a plurality of connecting holes 47 at the periphery of the top outer frame wall 45 of the receiving slot 41. The connecting holes 47 are opposite to the plurality of locking holes 14 of the metal substrate 10; an optical lens 50 is provided with a The platform 51 has a bottom portion that can be attached to the printed circuit layer 11 of the metal substrate 10. The bottom of the platform 51 is provided with a concave arc groove 52 for receiving the plurality of light-emitting diodes 20 at the same time. The top surface is a concave concave curved surface, and a convex curved surface 53 is disposed on the opposite outer side of the inner concave arc groove 52. The convex curved surface 53 can be sleeved inside the through hole 42 of the lamp cover 40, which is a light emitting surface. After the curved surface 53 is sleeved on the perforation 42 , the water stop ring 44 disposed on the outer periphery of the bottom of the through hole 42 can abut the opposite end surface of the top surface of the platform 51; a back plate 60 can be supported from the bottom of the metal substrate 10, the back The plate 60 is provided with a plurality of through holes 61 on both sides thereof for engaging with the plurality of keyholes 14 of the metal substrate 10 for engaging the plurality of locking elements 70 to the predetermined connecting holes 47 of the lamp cover 40; Two elongated holes 62 are provided at corresponding positions of the plurality of wire connecting holes 12 in the metal substrate 10 to provide separate sleeves A double-hole water stop plug 15 is disposed at one end of the electrical connection input member 131 and an electrical connection output member 132. The back plate 60 is coupled to the plurality of locking elements 70 on the bottom side. The fixing base 63 has a groove 631 defined in each of the end faces of the corresponding power supply holder 63 at the bottom of the corresponding back plate 60. Each of the grooves 631 can be electrically connected to the input member 131 or an electrical connection output member 132. The container is configured by the above-mentioned components, and the water stop ring 44 and the outer water stop ring 46 disposed at predetermined places inside the optical lighting module can be utilized to constitute a waterproof function of the foreign household, and more achievable The substance of the above purpose.

綜上所陳,僅為本發明之一較佳實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所做之均等變化與修飾,皆為本發明專利範圍所涵蓋。In the above, it is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent variations and modifications made by the scope of the present invention are the scope of the present invention. Covered.

10...金屬基板10. . . Metal substrate

11...印刷電路層11. . . Printed circuit layer

12...電線連接孔12. . . Wire connection hole

131...電性連接輸入件131. . . Electrical connection input

132...電性連接輸出件132. . . Electrical connection output

13...電源連接線13. . . Power cable

14...鎖孔14. . . keyhole

15...雙孔止水塞15. . . Double hole stop plug

16...散熱塗層16. . . Heat sink coating

20...發光二極體20. . . Light-emitting diode

30...供電驅動模組30. . . Power supply driver module

40...燈罩40. . . lampshade

41...容槽41. . . Crate

42...穿孔42. . . perforation

43...內凹環43. . . Inner ring

44...內止水環44. . . Inner water ring

45...外框牆45. . . Frame wall

46...外止水環46. . . Outer water ring

47...連結孔47. . . Link hole

50...光學透鏡50. . . optical lens

51...平台51. . . platform

52...內凹弧槽52. . . Concave arc groove

53...凸曲面53. . . Convex surface

60...背板60. . . Backplane

61...通孔61. . . Through hole

62...長形孔62. . . Long hole

63...電源固定座63. . . Power supply holder

631...溝槽631. . . Trench

70...鎖合元件70. . . Locking element

第一圖:本發明結構較佳實施例之俯視分解圖。First Figure: A top exploded view of a preferred embodiment of the structure of the present invention.

第二圖:為第一圖之組合圖。The second picture is a combination picture of the first picture.

第三圖:本發明結構較佳實施例之仰視分解圖。Third Figure: A bottom view exploded view of a preferred embodiment of the structure of the present invention.

第四圖:為第三圖之組合圖。The fourth picture is a combination picture of the third picture.

第五圖:為第二圖之A-A剖視圖。Fig. 5 is a cross-sectional view taken along line A-A of the second figure.

10...金屬基板10. . . Metal substrate

11...印刷電路層11. . . Printed circuit layer

12...電線連接孔12. . . Wire connection hole

13...電源連接線13. . . Power cable

131...電性連接輸入件131. . . Electrical connection input

132...電性連接輸出件132. . . Electrical connection output

14...鎖孔14. . . keyhole

15...雙孔止水塞15. . . Double hole stop plug

20...發光二極體20. . . Light-emitting diode

30...供電驅動模組30. . . Power supply driver module

40...燈罩40. . . lampshade

41...容槽41. . . Crate

42...穿孔42. . . perforation

43...內凹環43. . . Inner ring

44...內止水環44. . . Inner water ring

45...外框牆45. . . Frame wall

46...外止水環46. . . Outer water ring

47...連結孔47. . . Link hole

50...光學透鏡50. . . optical lens

51...平台51. . . platform

52...內凹弧槽52. . . Concave arc groove

53...凸曲面53. . . Convex surface

60...背板60. . . Backplane

61...通孔61. . . Through hole

62...長形孔62. . . Long hole

63...電源固定座63. . . Power supply holder

631...溝槽631. . . Trench

70...鎖合元件70. . . Locking element

Claims (13)

一種光學照明模組,包括:一高導散熱之金屬基板,其正面設有印刷電路層,該印刷電路層固接有複數發光二極體;一供電驅動模組,電性相接於前述印刷電路層,可整流並驅動前述發光二極體;其特徵在於:該金屬基板在設置印刷電路層區域內外接有一電性連接輸入件和一電性連接輸出件與印刷電路層之電路進行電性連接,該電性連接輸入件和電性連接輸出件各包含一正、負極電源連接線;該印刷電路層於複數發光二極體外部套設有一光學透鏡,該光學透鏡內側有一內凹弧槽供發光二極體容置,外側設有一凸曲面,另於印刷電路層連結有一電性連接輸入件和一電性連接輸出件,可供與複數光學照明模組進行串接;且在該金屬基板背面設有散熱塗層,該散熱塗層可直接曝露於外部。 An optical illumination module comprising: a high-conductivity heat-dissipating metal substrate having a printed circuit layer on a front surface thereof, the printed circuit layer being fixed with a plurality of light-emitting diodes; and a power supply driving module electrically connected to the printing a circuit layer for rectifying and driving the light-emitting diode; wherein the metal substrate is electrically connected to an electrical connection input member and a circuit electrically connected to the printed circuit layer in a region where the printed circuit layer is disposed Connecting, the electrical connection input member and the electrical connection output member each comprise a positive and negative power supply connection line; the printed circuit layer is sleeved on the outer surface of the plurality of LEDs with an optical lens, and the optical lens has a concave arc groove inside The light-emitting diode is accommodated, and a convex curved surface is disposed on the outer side, and an electrical connection input member and an electrical connection output member are coupled to the printed circuit layer for serial connection with the plurality of optical illumination modules; and the metal is A heat dissipating coating is disposed on the back surface of the substrate, and the heat dissipating coating can be directly exposed to the outside. 如申請專利範圍第1項所述之光學照明模組,其中,每一組正、負極電源連接線與金屬基板連接端各套有一雙孔止水塞。 The optical lighting module of claim 1, wherein each of the set of positive and negative power supply connecting lines and the metal substrate connecting end has a double hole water stop plug. 如申請專利範圍第1項所述之光學照明模組,其中,該電性連接輸入件和電性連接輸出件為電線、一端子台或二端子台其中任一種。 The optical lighting module of claim 1, wherein the electrical connection input member and the electrical connection output member are any one of an electric wire, a terminal block or a two terminal block. 如申請專利範圍第1項所述之光學照明模組,其中,該金屬基板在印刷電路層區域的外圍分佈設有複數鎖孔,並且配合 套設有複數鎖合元件將金屬基板鎖固在一燈罩之內部;該光學透鏡更包括有一平台,而內凹弧槽和凸曲面係設在平台之相對外端面;該燈罩,設有一開口向外的容槽,供金屬基板容置,該容槽相對於開口端之頂面設有一穿孔,該穿孔可供光學透鏡之凸曲面容置,其底部與光學透鏡之平台間介置有一內止水環,且在容槽內部周圍自頂面向下延伸設有一外框牆,該外框牆底部套有一外止水環,該外止水環底部可貼觸在金屬基板之印刷電路層外圍。 The optical lighting module of claim 1, wherein the metal substrate is provided with a plurality of keyholes at a periphery of the printed circuit layer region, and is matched The sleeve is provided with a plurality of locking elements for locking the metal substrate inside a lamp cover; the optical lens further comprises a platform, and the concave arc groove and the convex curved surface are disposed on opposite outer end faces of the platform; the lamp cover is provided with an opening The outer cavity is received by the metal substrate. The cavity is provided with a perforation relative to the top surface of the open end. The perforation can be accommodated by the convex curved surface of the optical lens, and the bottom of the cavity is interposed with the platform of the optical lens. The water ring has an outer frame wall extending from the top surface to the bottom of the cavity, and the bottom of the outer frame wall is provided with an outer water stop ring, and the bottom of the outer water ring can be attached to the periphery of the printed circuit layer of the metal substrate. 如申請專利範圍第4項所述之光學照明模組,其中,該燈罩於穿孔底部外圍設有一內凹環,該內凹環套有一內止水環。 The optical lighting module of claim 4, wherein the lamp cover is provided with a concave ring on the periphery of the bottom of the perforation, and the inner concave ring is sleeved with an inner water stop ring. 如申請專利範圍第4項所述之光學照明模組,其中,尚包括:一背板,係架設於金屬基板底部,且配合複鎖合元件連結於燈罩;該背板在底部兩邊配合複數鎖合元件各連結有一電源固定座,每一電源固定座位在對應背板底部的端面皆預設有一溝槽,每一溝槽至少可供一電性連接輸入件或一電性連接輸出件容置收納。 The optical lighting module of claim 4, further comprising: a backing plate mounted on the bottom of the metal substrate and coupled to the lamp cover by the multi-locking component; the backing plate is matched with the plurality of locks on both sides of the bottom Each of the components is connected to a power supply fixing seat, and each of the power fixing seats has a groove at an end surface corresponding to the bottom of the corresponding back plate, and each groove can be at least one electrical connection input member or an electrical connection output member. Storage. 如申請專利範圍第6項所述之光學照明模組,其中,該燈罩在容槽頂部外框牆的外圍分佈設有數連結孔,該金屬基板設有複數鎖孔與前述各連結孔相對合,而背板設有複數通孔,與前述金屬基板之鎖孔相對合,以供配合複數鎖合元件連結於前述對應之連結孔。 The optical lighting module of claim 6, wherein the lamp cover is provided with a plurality of connecting holes on the outer periphery of the outer frame wall of the receiving slot, and the metal substrate is provided with a plurality of locking holes and the connecting holes. The back plate is provided with a plurality of through holes, which are opposite to the locking holes of the metal substrate, so as to be coupled to the corresponding connecting holes by the plurality of locking elements. 如申請專利範圍第1項所述之光學照明模組,其中,該光學 透鏡之內凹弧槽頂面為一入光凹曲面,而該凸曲面為一出光面。 The optical lighting module of claim 1, wherein the optical The top surface of the concave arc groove in the lens is a concave concave curved surface, and the convex curved surface is a light emitting surface. 如申請專利範圍第1項所述之光學照明模組,其中,該供電驅動模組內部設置有保險絲。 The optical lighting module of claim 1, wherein the power supply driving module is internally provided with a fuse. 如申請專利範圍第1項所述之光學照明模組,其中,該設於印刷電路層之複數發光二極體產生的功率介定在2W(瓦)~5W(瓦)之間。 The optical lighting module of claim 1, wherein the power generated by the plurality of light emitting diodes disposed on the printed circuit layer is between 2 W (Watts) and 5 W (Watts). 如申請專利範圍第1項所述之光學照明模組,其中,該設於印刷電路層之複數發光二極體採用串接方式。 The optical lighting module of claim 1, wherein the plurality of light emitting diodes disposed on the printed circuit layer are connected in series. 一種光學照明模組,其包括:一金屬基板正端面設有印刷電路層,於印刷電路層上設有複數發光二極體;其特徵在於:該金屬基板於印刷電路層連結有一電性連接輸入件和一電性連接輸出件,供複數光學照明模組進行串接,且該金屬基板背面設有散熱塗層,前述散熱塗層直接曝露於外部;一燈罩,供金屬基板容置,該燈罩連結有一背板以固定金屬基板,該燈罩係套設有一光學透鏡,該光學透鏡內側設有一凹弧槽供前述複數發光二極體容置,外側設有凸曲面,可曝露在模組外部,並且在燈罩與光學透鏡之間套置有一內止水環,在燈罩與金屬基板之間套置有一外止水環,使其具有戶外防水功能。 An optical lighting module comprising: a metal substrate having a printed circuit layer on a front end surface thereof; and a plurality of light emitting diodes on the printed circuit layer; wherein the metal substrate is electrically connected to the printed circuit layer And an electrical connection output member for serial connection of the plurality of optical illumination modules, and the heat dissipation coating is disposed on the back surface of the metal substrate, the heat dissipation coating is directly exposed to the outside; and a lamp cover is disposed for the metal substrate, the lamp cover A back plate is attached to fix the metal substrate, and the lamp cover sleeve is provided with an optical lens. The inner side of the optical lens is provided with a concave arc groove for receiving the plurality of light emitting diodes, and the outer side is provided with a convex curved surface, which can be exposed outside the module. And an inner water stop ring is disposed between the lamp cover and the optical lens, and an outer water stop ring is disposed between the lamp cover and the metal substrate to provide an outdoor waterproof function. 如申請專利範圍第12項所述之光學照明模組,其中,該光學透鏡設有一平台,該平台底部設有一內凹弧槽供發光二極 體容置,前述內凹弧槽頂面為一入光凹曲面,而平台相對於內凹弧槽的外側設有一凸曲面,該凸曲面為一出光面。 The optical lighting module of claim 12, wherein the optical lens is provided with a platform, and the bottom of the platform is provided with a concave arc groove for the light emitting diode The top surface of the concave arc groove is a concave concave curved surface, and the platform is provided with a convex curved surface opposite to the outer concave arc groove, and the convex curved surface is a light emitting surface.
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200534506A (en) * 2004-04-06 2005-10-16 Yu-Chao Wu Light emitting diode device, heat sink system of light emitting diode and the lighting apparatus using the same
US20070096136A1 (en) * 2005-10-28 2007-05-03 Iled Photoelectronics, Inc. Cladding layer structure of a LED package structure
TW200828617A (en) * 2006-12-22 2008-07-01 Foxconn Tech Co Ltd LED assembly and method of fabrication
CN101275735A (en) * 2008-05-12 2008-10-01 张春涛 High-power LED lamp structure and manufacturing method thereof
CN201198999Y (en) * 2008-05-12 2009-02-25 张春涛 Spherical high power LED lamp
JP2009141219A (en) * 2007-12-07 2009-06-25 Panasonic Electric Works Co Ltd Light emitting device
CN201539737U (en) * 2009-10-14 2010-08-04 深圳市瑞丰光电子有限公司 LED lamp
CN201651869U (en) * 2010-02-10 2010-11-24 吴嘉烨 LED bulb

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200534506A (en) * 2004-04-06 2005-10-16 Yu-Chao Wu Light emitting diode device, heat sink system of light emitting diode and the lighting apparatus using the same
US20070096136A1 (en) * 2005-10-28 2007-05-03 Iled Photoelectronics, Inc. Cladding layer structure of a LED package structure
TW200828617A (en) * 2006-12-22 2008-07-01 Foxconn Tech Co Ltd LED assembly and method of fabrication
JP2009141219A (en) * 2007-12-07 2009-06-25 Panasonic Electric Works Co Ltd Light emitting device
CN101275735A (en) * 2008-05-12 2008-10-01 张春涛 High-power LED lamp structure and manufacturing method thereof
CN201198999Y (en) * 2008-05-12 2009-02-25 张春涛 Spherical high power LED lamp
CN201539737U (en) * 2009-10-14 2010-08-04 深圳市瑞丰光电子有限公司 LED lamp
CN201651869U (en) * 2010-02-10 2010-11-24 吴嘉烨 LED bulb

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