GB2335075A - Heat transfer from a single electronic device - Google Patents

Heat transfer from a single electronic device Download PDF

Info

Publication number
GB2335075A
GB2335075A GB9804402A GB9804402A GB2335075A GB 2335075 A GB2335075 A GB 2335075A GB 9804402 A GB9804402 A GB 9804402A GB 9804402 A GB9804402 A GB 9804402A GB 2335075 A GB2335075 A GB 2335075A
Authority
GB
United Kingdom
Prior art keywords
thermally conductive
conductive body
board
heat sink
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9804402A
Other versions
GB9804402D0 (en
Inventor
Lester Kevin Wareham
David Alexandre Jennings Lopes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to GB9804402A priority Critical patent/GB2335075A/en
Publication of GB9804402D0 publication Critical patent/GB9804402D0/en
Publication of GB2335075A publication Critical patent/GB2335075A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

To increase heat transfer from a power amplifier 4, through a printed circuit board 2 to a heat sink 6; solid thermally conductive copper pins are inserted into via holes in the circuit board. The pins may be soldered into the holes and the pins may be shorter than the holes. Solder 14. 18 may thermally connect the pins both to the device 4 and the heat sink 6. The assembly may be held together by screws 8.

Description

2335075
HEAT TRANSFER FIELD OF THE INVENTION
This invention relates to the field of electronic circuits, and in particular to a technique for cooling a device which generates heat. BACKQROUND OF THE INVENTION
In many electronic circuits, there are components, for example power amplifiers, which generate heat.. Since many electronic components have properties which are temperature-dependent, it is necessary to dissipate the heat which is generated, to maintain the circuit within an appropriate operating temperature range.
Therefore, when mounting a component such as a power amplifier to a printed circuit board, it is known to mount a heat sink device to the opposite side of the board, and to increase the thermal contact between the power amplifier and the heat sink by filling the via holes through the board, in that region, with solder.
However, it is difficult to ensure that the via holes are completely filled, and indeed it is likely that there will be small cavities, which reduce the thermal conductivity, and hence reduce the effectiveness of the arrangement in heat dissipation. SIMWY OF THE INVENTION The present invention relates to a manufacturing method which, in preferred embodiments, results in improved thermal contact between a component and a heat sink, and to a circuit produced thereby.
In particular, in preferred embodiments of a method in accordance with the invention, an electronic component is mounted to one side of a circuit board and a heat sink is mounted to an opposite side of the circuit board, the circuit having holes passing through. A solid thermally conductive body is included within the hole. BRIEF DESCRIPTION OF DRAWINGS is Figure 1 is a cross-sectional view of an electronic device in accordance with an aspect of the invention.
Figure 2 is an enlarged cross-sectional view through a printed circuit board forming part of the device shown in Figure 1. DETAILED DESCRIPTION OF PREFERRED EMIRODIMENTS.
Figure 1 shows a part of an electronic device, mounted on a printed circuit board 2. A component of the device is a power amplifier 4 which, as is well known, generates heat when in use. Other components of the device are not illustrated, in the interests of clarity.
In order to dissipate the heat generated by the power amplifier 4, a heat sink 6, for example in the form of a copper block, is mounted to the printed circuit board 2 by screws 8.
The printed circuit board 2 includes a large number of via holes 10 across its whole area, of which only a few are shown in Figure 1. The power amplifier 4 is mounted to an upper surface 12 of the printed circuit board 2 using solder paste 14, and thermal contact between the heat sink 6 and lower surface 16 of the printed circuit board 2 is assured by a further layer of solder 18.
To this extent, the arrangement of Figure 1 is conventional. However, in the prior art, the via holes 10 are themselves filled with solder, to the largest extent possible.
In accordance with the invention, however, and as shown in Figure 2, those via holes 10 in the region close to the power amplifier 4 have a solid thermally conductive body, for example a copper pin 20, pressfitted therein. The area below and above the pin 20, and around the pin to the extent that there is any gap between the pin 20 and the side walls of the via hole is 10, is then filled with solder.
The pin which is used is therefore preferably of a length which is close to that of the via holes, but which is, if anything, slightly shorter than the holes, to avoid interfering with the thermal contact between the pin and the adjacent components through the layer of solder. Moreover, the pin is sized to fit as closely as possible into the hole, to maximise its thermal conductivity, consistent with ease of insertion into the hole.
Then, the power amplifier 4 can be attached to the printed circuit board 2 using a layer of solder 14 and the heat sink 6 can be thermally contacted therewith through the layer of solder 18 as shown in Figure 1.
There is thus disclosed an arrangement which maximises the thermal conductivity from the power amplifier to the heat sink.
is 1

Claims (8)

1. A method of mounting an electronic component to a circuit board having first and second sides, the method comprising mounting the component an the first side of said board over at least one hole in the board, and mounting a heat sink on the second side of said board over the or each said hole in the board, and including within said hole a solid thermally conductive body.
2. A method as claimed in claim 1, wherein the thermally conductive body has a cross-sectional shape corresponding to a cross-sectional shape of the hole.
3. A method as claimed in claim 1, wherein the thermally conductive body has a length less than or equal to a thickness of the circuit board.
4. A method as claimed in claim 1, comprising soldering the component to the thermally conductive body.
5. A method as claimed in claim 1, comprising soldering the heat sink to the thermally conductive body.
6. A method as claimed in claim 1, wherein the solid thermally conductive body is included substantially wholly within said hole.
7. A method as claimed in claim 1, wherein the component and the heat sink are mounted over a plurality of holes in the board, each said hole including a solid thermally conductive body therein.
8. An electrical circuit, comprising:
a circuit board having first and second sides and having a plurality of holes therethrough; a heat-generatIng component mounted to the first side of the board over at least one of the holes; a heat sink mounted to the second side of the board over at least one of the same holes as the heatgenerating component; and a solid thermally conductive body located within at least one of said same holes.
GB9804402A 1998-03-02 1998-03-02 Heat transfer from a single electronic device Withdrawn GB2335075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9804402A GB2335075A (en) 1998-03-02 1998-03-02 Heat transfer from a single electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9804402A GB2335075A (en) 1998-03-02 1998-03-02 Heat transfer from a single electronic device

Publications (2)

Publication Number Publication Date
GB9804402D0 GB9804402D0 (en) 1998-04-29
GB2335075A true GB2335075A (en) 1999-09-08

Family

ID=10827845

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9804402A Withdrawn GB2335075A (en) 1998-03-02 1998-03-02 Heat transfer from a single electronic device

Country Status (1)

Country Link
GB (1) GB2335075A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005001943A1 (en) * 2003-06-30 2005-01-06 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
WO2010060417A1 (en) * 2008-11-28 2010-06-03 Osram Opto Semiconductors Gmbh Light diode module and light diode component
EP2212617A2 (en) * 2007-10-25 2010-08-04 Nexxus Lighting, Inc. Apparatus and methods for thermal management of electronic devices
US7974099B2 (en) 2007-11-19 2011-07-05 Nexxus Lighting, Inc. Apparatus and methods for thermal management of light emitting diodes
US8192054B2 (en) 2007-11-19 2012-06-05 Nexxus Lighting, Inc. Apparatus and method for thermal dissipation in a light

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135525A (en) * 1983-02-22 1984-08-30 Smiths Industries Plc Heat-dissipating chip carrier substrates
EP0139431A2 (en) * 1983-09-16 1985-05-02 LUCAS INDUSTRIES public limited company Method of mounting a carrier for a microelectronic silicon chip
EP0180730A1 (en) * 1984-10-31 1986-05-14 Contraves Ag Arrangement for the tension compensation and the heat dissipation of an electronic component
EP0654821A2 (en) * 1993-11-23 1995-05-24 Motorola, Inc. Electronic device having co-planar heatsink and electrical contacts
WO1996025763A2 (en) * 1995-02-15 1996-08-22 International Business Machines Corporation Organic chip carriers for wire bond-type chips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135525A (en) * 1983-02-22 1984-08-30 Smiths Industries Plc Heat-dissipating chip carrier substrates
EP0139431A2 (en) * 1983-09-16 1985-05-02 LUCAS INDUSTRIES public limited company Method of mounting a carrier for a microelectronic silicon chip
EP0180730A1 (en) * 1984-10-31 1986-05-14 Contraves Ag Arrangement for the tension compensation and the heat dissipation of an electronic component
EP0654821A2 (en) * 1993-11-23 1995-05-24 Motorola, Inc. Electronic device having co-planar heatsink and electrical contacts
WO1996025763A2 (en) * 1995-02-15 1996-08-22 International Business Machines Corporation Organic chip carriers for wire bond-type chips

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005001943A1 (en) * 2003-06-30 2005-01-06 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
CN100411204C (en) * 2003-06-30 2008-08-13 皇家飞利浦电子股份有限公司 Light-emitting diode thermal management system
EP2212617A2 (en) * 2007-10-25 2010-08-04 Nexxus Lighting, Inc. Apparatus and methods for thermal management of electronic devices
CN101883950A (en) * 2007-10-25 2010-11-10 耐克斯照明公司 Apparatus and methods for thermal management of electronic devices
EP2212617A4 (en) * 2007-10-25 2010-12-22 Nexxus Lighting Inc Apparatus and methods for thermal management of electronic devices
US7911797B2 (en) 2007-10-25 2011-03-22 Nexxus Lighting Apparatus and methods for thermal management of electronic devices
US8400771B2 (en) 2007-10-25 2013-03-19 Nexxus Lighting, Inc. Apparatus and methods for thermal management of electronic devices
US7974099B2 (en) 2007-11-19 2011-07-05 Nexxus Lighting, Inc. Apparatus and methods for thermal management of light emitting diodes
US8192054B2 (en) 2007-11-19 2012-06-05 Nexxus Lighting, Inc. Apparatus and method for thermal dissipation in a light
US8564956B2 (en) 2007-11-19 2013-10-22 Nexxus Lighting, Incorporated Apparatus and methods for thermal management of light emitting diodes
US8858034B2 (en) 2007-11-19 2014-10-14 Revolution Lighting Technologies, Inc. Apparatus and method for thermal dissipation in a light
WO2010060417A1 (en) * 2008-11-28 2010-06-03 Osram Opto Semiconductors Gmbh Light diode module and light diode component

Also Published As

Publication number Publication date
GB9804402D0 (en) 1998-04-29

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)