FR2706730B1 - Module électronique de puissance ayant un support d'évacuation de la chaleur. - Google Patents
Module électronique de puissance ayant un support d'évacuation de la chaleur.Info
- Publication number
- FR2706730B1 FR2706730B1 FR9307399A FR9307399A FR2706730B1 FR 2706730 B1 FR2706730 B1 FR 2706730B1 FR 9307399 A FR9307399 A FR 9307399A FR 9307399 A FR9307399 A FR 9307399A FR 2706730 B1 FR2706730 B1 FR 2706730B1
- Authority
- FR
- France
- Prior art keywords
- heat dissipation
- power module
- electronic power
- dissipation support
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9307399A FR2706730B1 (fr) | 1993-06-18 | 1993-06-18 | Module électronique de puissance ayant un support d'évacuation de la chaleur. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9307399A FR2706730B1 (fr) | 1993-06-18 | 1993-06-18 | Module électronique de puissance ayant un support d'évacuation de la chaleur. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2706730A1 FR2706730A1 (fr) | 1994-12-23 |
FR2706730B1 true FR2706730B1 (fr) | 1995-08-25 |
Family
ID=9448300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9307399A Expired - Fee Related FR2706730B1 (fr) | 1993-06-18 | 1993-06-18 | Module électronique de puissance ayant un support d'évacuation de la chaleur. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2706730B1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9413819U1 (de) * | 1994-08-26 | 1994-11-03 | Blaupunkt-Werke Gmbh, 31139 Hildesheim | Durchkontaktierungen aufweisende Leiterplatte |
FR2766051B1 (fr) * | 1997-07-09 | 1999-10-15 | Sagem | Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit |
DE19752797A1 (de) * | 1997-11-28 | 1999-06-10 | Bosch Gmbh Robert | Kühlvorrichtung für ein auf einer Leiterplatte angeordnetes, wärmeerzeugendes Bauelement |
FR2801763B1 (fr) * | 1999-11-30 | 2002-02-15 | Sagem | Module electronique de puissance et procede de fabrication d'un tel module |
FR2835689A1 (fr) * | 2002-02-01 | 2003-08-08 | Siemens Vdo Automotive | Procede de collage d'un circuit imprime rigide sur une plaque d'aluminium |
FR2867014B1 (fr) * | 2004-03-01 | 2006-06-23 | Giga Byte Tech Co Ltd | Procede de dissipation thermique pour un appareil electronique |
AT507589B1 (de) * | 2008-11-25 | 2012-11-15 | Sti Power Drives Gmbh | Kühlung und isolation für elektrischen bauteil |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2207401B1 (fr) * | 1972-11-22 | 1975-09-12 | Cii | |
DE3115017A1 (de) * | 1981-04-14 | 1982-11-04 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Elektronisches bauelement |
US4922324A (en) * | 1987-01-20 | 1990-05-01 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
US4941067A (en) * | 1989-04-07 | 1990-07-10 | Motorola Inc. | Thermal shunt for electronic circuits |
-
1993
- 1993-06-18 FR FR9307399A patent/FR2706730B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2706730A1 (fr) | 1994-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |