DE69329103D1 - Leistungsmodulkühlsystem - Google Patents
LeistungsmodulkühlsystemInfo
- Publication number
- DE69329103D1 DE69329103D1 DE69329103T DE69329103T DE69329103D1 DE 69329103 D1 DE69329103 D1 DE 69329103D1 DE 69329103 T DE69329103 T DE 69329103T DE 69329103 T DE69329103 T DE 69329103T DE 69329103 D1 DE69329103 D1 DE 69329103D1
- Authority
- DE
- Germany
- Prior art keywords
- cooling system
- power module
- module cooling
- power
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/995,444 US5349498A (en) | 1992-12-23 | 1992-12-23 | Integral extended surface cooling of power modules |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69329103D1 true DE69329103D1 (de) | 2000-08-31 |
DE69329103T2 DE69329103T2 (de) | 2001-03-22 |
Family
ID=25541808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69329103T Expired - Lifetime DE69329103T2 (de) | 1992-12-23 | 1993-12-22 | Leistungsmodulkühlsystem |
Country Status (3)
Country | Link |
---|---|
US (1) | US5349498A (de) |
EP (1) | EP0603860B1 (de) |
DE (1) | DE69329103T2 (de) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4401607C2 (de) * | 1994-01-20 | 1997-04-10 | Siemens Ag | Kühleinheit für Leistungshalbleiter |
DE4416616C2 (de) * | 1994-05-11 | 1997-05-22 | Fichtel & Sachs Ag | Gehäuse |
TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
US5740015A (en) * | 1996-05-02 | 1998-04-14 | Chrysler Corporation | Heat exchanger |
US5692558A (en) * | 1996-07-22 | 1997-12-02 | Northrop Grumman Corporation | Microchannel cooling using aviation fuels for airborne electronics |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
DE19643717A1 (de) * | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
IT1293021B1 (it) * | 1997-07-10 | 1999-02-11 | Sme Elettronica Spa | Modulo di potenza a semiconduttori. |
DE19735531A1 (de) * | 1997-08-16 | 1999-02-18 | Abb Research Ltd | Leistungshalbleitermodul mit in Submodulen integrierten Kühlern |
FR2775416B1 (fr) * | 1998-02-23 | 2000-06-23 | Gec Alsthom Transport Sa | Element de refroidissement pour dispositif electronique de puissance et dispositif electronique de puissance comprenant un tel element |
US6055154A (en) * | 1998-07-17 | 2000-04-25 | Lucent Technologies Inc. | In-board chip cooling system |
DE19833707A1 (de) * | 1998-07-27 | 2000-02-10 | Abb Daimler Benz Transp | Kühler zur Fluidkühlung eines elektronischen Bauteils |
US6141219A (en) * | 1998-12-23 | 2000-10-31 | Sundstrand Corporation | Modular power electronics die having integrated cooling apparatus |
US6213195B1 (en) * | 1998-12-23 | 2001-04-10 | Hamilton Sundstrand Corporation | Modular coolant manifold for use with power electronics devices having integrated coolers |
DE10006215A1 (de) * | 2000-02-11 | 2001-08-16 | Abb Semiconductors Ag Baden | Kühlvorrichtung für ein Hochleistungs-Halbleitermodul |
US6892796B1 (en) * | 2000-02-23 | 2005-05-17 | General Motors Corporation | Apparatus and method for mounting a power module |
US6434003B1 (en) * | 2001-04-24 | 2002-08-13 | York International Corporation | Liquid-cooled power semiconductor device heatsink |
US6587345B2 (en) | 2001-11-09 | 2003-07-01 | International Business Machines Corporation | Electronic device substrate assembly with impermeable barrier and method of making |
US6988531B2 (en) * | 2002-01-11 | 2006-01-24 | Intel Corporation | Micro-chimney and thermosiphon die-level cooling |
US7061775B2 (en) * | 2002-01-16 | 2006-06-13 | Rockwell Automation Technologies, Inc. | Power converter having improved EMI shielding |
US6898072B2 (en) * | 2002-01-16 | 2005-05-24 | Rockwell Automation Technologies, Inc. | Cooled electrical terminal assembly and device incorporating same |
US6972957B2 (en) * | 2002-01-16 | 2005-12-06 | Rockwell Automation Technologies, Inc. | Modular power converter having fluid cooled support |
US7187548B2 (en) * | 2002-01-16 | 2007-03-06 | Rockwell Automation Technologies, Inc. | Power converter having improved fluid cooling |
US6965514B2 (en) * | 2002-01-16 | 2005-11-15 | Rockwell Automation Technologies, Inc. | Fluid cooled vehicle drive module |
US7032695B2 (en) * | 2002-01-16 | 2006-04-25 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved terminal design |
US7187568B2 (en) | 2002-01-16 | 2007-03-06 | Rockwell Automation Technologies, Inc. | Power converter having improved terminal structure |
US7177153B2 (en) | 2002-01-16 | 2007-02-13 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved cooling configuration |
US7142434B2 (en) * | 2002-01-16 | 2006-11-28 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved EMI shielding |
US6898082B2 (en) * | 2002-05-10 | 2005-05-24 | Serguei V. Dessiatoun | Enhanced heat transfer structure with heat transfer members of variable density |
US6992887B2 (en) * | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
US20050083655A1 (en) * | 2003-10-15 | 2005-04-21 | Visteon Global Technologies, Inc. | Dielectric thermal stack for the cooling of high power electronics |
US20050092478A1 (en) * | 2003-10-30 | 2005-05-05 | Visteon Global Technologies, Inc. | Metal foam heat sink |
WO2005055687A1 (de) * | 2003-12-05 | 2005-06-16 | Renk Aktiengesellschaft | Kühleinrichtung für elektrische leistungseinheiten von elektrisch betriebenen fahrzeugen |
JP4419742B2 (ja) | 2004-07-28 | 2010-02-24 | ブラザー工業株式会社 | 電子部品搭載基板及びインクジェットヘッド |
US7173823B1 (en) * | 2004-12-18 | 2007-02-06 | Rinehart Motion Systems, Llc | Fluid cooled electrical assembly |
US7298618B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
US7298617B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
EP1887847B1 (de) * | 2006-08-10 | 2011-06-15 | Continental Automotive GmbH | Elektronikeinheit mit abgedichteter Kühlmittelpassage |
JP5105801B2 (ja) * | 2006-09-05 | 2012-12-26 | 株式会社東芝 | 半導体装置 |
DE102007019576A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Modulträger für ein elektronisches Modul, elektronisches Modul mit einem derartigen Modulträger, Modulanordnung mit einer Mehrzahl von Modulen und Bausatz für eine Modulanordnung |
JP5024600B2 (ja) * | 2007-01-11 | 2012-09-12 | アイシン・エィ・ダブリュ株式会社 | 発熱体冷却構造及びその構造を備えた駆動装置 |
US8149579B2 (en) | 2008-03-28 | 2012-04-03 | Johnson Controls Technology Company | Cooling member |
US8495890B2 (en) | 2007-01-22 | 2013-07-30 | Johnson Controls Technology Company | Cooling member |
US8014110B2 (en) | 2007-01-22 | 2011-09-06 | Johnson Controls Technology Company | Variable speed drive with integral bypass contactor |
US8081462B2 (en) * | 2007-09-13 | 2011-12-20 | Rockwell Automation Technologies, Inc. | Modular liquid cooling system |
US7957166B2 (en) | 2007-10-30 | 2011-06-07 | Johnson Controls Technology Company | Variable speed drive |
ATE507711T1 (de) * | 2008-10-24 | 2011-05-15 | Fiat Ricerche | Kraftfahrzeugwechselrichtereinheit |
DE102009012042B4 (de) * | 2009-03-07 | 2011-01-05 | Esw Gmbh | Vorrichtung zur Kühlung von elektrischen oder elektronischen Bauteilen |
FR2954971B1 (fr) | 2010-01-06 | 2012-02-10 | Paul Benoit | Radiateur electrique utilisant des processeurs de calcul comme source chaude. |
JP5702988B2 (ja) | 2010-01-29 | 2015-04-15 | 株式会社 日立パワーデバイス | 半導体パワーモジュール及びそれが搭載される電力変換装置並びに半導体パワーモジュール搭載用水路形成体の製造方法 |
US20120235293A1 (en) * | 2011-03-15 | 2012-09-20 | Infineon Technologies Ag | Semiconductor device including a base plate |
US8531822B2 (en) | 2011-07-29 | 2013-09-10 | Hamilton Sundstrand Corporation | Cooling and controlling electronics |
DE102011052707A1 (de) * | 2011-08-15 | 2013-02-21 | Pierburg Gmbh | Kühlvorrichtung für ein thermisch belastetes Bauteil |
JP5682713B2 (ja) * | 2011-09-28 | 2015-03-11 | 富士電機株式会社 | 電力変換装置 |
FI126026B (fi) * | 2012-12-13 | 2016-05-31 | Vacon Oy | Tehoelektroniikkalaite ja sen jäähdytysjärjestely |
DE102013212724B3 (de) * | 2013-06-28 | 2014-12-04 | TRUMPF Hüttinger GmbH + Co. KG | Kühlvorrichtung zur Kühlung eines Elektronikbauteils und Elektronikanordnung mit einer Kühlvorrichtung |
DE102013109592B3 (de) * | 2013-09-03 | 2014-10-23 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung |
US20190343020A1 (en) * | 2018-05-01 | 2019-11-07 | General Electric Company | Cooling device with integral shielding structure for an electronics module |
US11224146B2 (en) | 2019-05-24 | 2022-01-11 | Deka Products Limited Partnership | Apparatus for electronic cooling on an autonomous device |
DE102019210192A1 (de) * | 2019-07-10 | 2020-08-20 | Siemens Aktiengesellschaft | Kühlung von elektrischen Bauelementen |
US11388839B2 (en) | 2020-08-14 | 2022-07-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics cooling assemblies and methods for making the same |
US11439039B2 (en) * | 2020-12-07 | 2022-09-06 | Hamilton Sundstrand Corporation | Thermal management of electronic devices on a cold plate |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3788393A (en) * | 1972-05-01 | 1974-01-29 | Us Navy | Heat exchange system |
CH581420A5 (de) * | 1975-01-22 | 1976-10-29 | Sprecher & Schuh Ag | |
JPS55165659A (en) * | 1979-06-11 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
FR2500215A1 (fr) * | 1981-02-13 | 1982-08-20 | Thomson Csf | Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif |
CA1229155A (en) * | 1983-03-29 | 1987-11-10 | Toshihiko Watari | High density lsi package for logic circuits |
US4782893A (en) * | 1986-09-15 | 1988-11-08 | Trique Concepts, Inc. | Electrically insulating thermally conductive pad for mounting electronic components |
US4805691A (en) * | 1986-12-22 | 1989-02-21 | Sundstrand Corporation | Cooling technique for compact electronics inverter |
DE3744353C1 (en) * | 1987-12-29 | 1989-04-13 | Flender Himmelwerk Gmbh | Cooling body for a semiconductor component |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
US5043845A (en) * | 1989-10-16 | 1991-08-27 | Eastman Kodak Company | High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
US5046552A (en) * | 1990-07-20 | 1991-09-10 | Minnesota Mining And Manufacturing | Flow-through heat transfer apparatus with movable thermal via |
US5070936A (en) * | 1991-02-15 | 1991-12-10 | United States Of America As Represented By The Secretary Of The Air Force | High intensity heat exchanger system |
-
1992
- 1992-12-23 US US07/995,444 patent/US5349498A/en not_active Expired - Lifetime
-
1993
- 1993-12-22 DE DE69329103T patent/DE69329103T2/de not_active Expired - Lifetime
- 1993-12-22 EP EP93120717A patent/EP0603860B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0603860A3 (de) | 1995-03-15 |
DE69329103T2 (de) | 2001-03-22 |
EP0603860B1 (de) | 2000-07-26 |
US5349498A (en) | 1994-09-20 |
EP0603860A2 (de) | 1994-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication of lapse of patent is to be deleted | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART |
|
8380 | Miscellaneous part iii |
Free format text: PFANDRECHT |
|
8380 | Miscellaneous part iii |
Free format text: PFANDRECHT AUFGEHOBEN |
|
8380 | Miscellaneous part iii |
Free format text: PFANDRECHT |