DE69325953D1 - Leistungshalbleitermodul - Google Patents
LeistungshalbleitermodulInfo
- Publication number
- DE69325953D1 DE69325953D1 DE69325953T DE69325953T DE69325953D1 DE 69325953 D1 DE69325953 D1 DE 69325953D1 DE 69325953 T DE69325953 T DE 69325953T DE 69325953 T DE69325953 T DE 69325953T DE 69325953 D1 DE69325953 D1 DE 69325953D1
- Authority
- DE
- Germany
- Prior art keywords
- power semiconductor
- semiconductor module
- module
- power
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Inverter Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4157988A JP2854757B2 (ja) | 1992-06-17 | 1992-06-17 | 半導体パワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69325953D1 true DE69325953D1 (de) | 1999-09-16 |
DE69325953T2 DE69325953T2 (de) | 2000-01-13 |
Family
ID=15661792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69325953T Expired - Lifetime DE69325953T2 (de) | 1992-06-17 | 1993-06-17 | Leistungshalbleitermodul |
Country Status (4)
Country | Link |
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US (1) | US5444297A (de) |
EP (1) | EP0575892B1 (de) |
JP (1) | JP2854757B2 (de) |
DE (1) | DE69325953T2 (de) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3316714B2 (ja) * | 1994-05-31 | 2002-08-19 | 三菱電機株式会社 | 半導体装置 |
JPH09148523A (ja) * | 1995-11-21 | 1997-06-06 | Toshiba Corp | 半導体装置 |
DE19601650A1 (de) * | 1996-01-18 | 1997-07-24 | Telefunken Microelectron | Anordnung zum Schutz elektrischer und elektronischer Bauelemente vor elektrostatischen Entladungen |
US5917230A (en) * | 1997-04-09 | 1999-06-29 | United Memories, Inc. | Filter capacitor construction |
US6060772A (en) * | 1997-06-30 | 2000-05-09 | Kabushiki Kaisha Toshiba | Power semiconductor module with a plurality of semiconductor chips |
US6166464A (en) * | 1998-08-24 | 2000-12-26 | International Rectifier Corp. | Power module |
US6252159B1 (en) | 1999-01-21 | 2001-06-26 | Sony Corporation | EMI/RFI and vibration resistant electronics enclosure |
WO2000055917A1 (de) | 1999-03-17 | 2000-09-21 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Leistungshalbleitermodul |
DE19912441A1 (de) * | 1999-03-19 | 2000-09-21 | Elfo Ag Sachseln Sachseln | Multi-Chip-Modul |
US7138708B2 (en) * | 1999-09-24 | 2006-11-21 | Robert Bosch Gmbh | Electronic system for fixing power and signal semiconductor chips |
DE19950026B4 (de) * | 1999-10-09 | 2010-11-11 | Robert Bosch Gmbh | Leistungshalbleitermodul |
US6362964B1 (en) * | 1999-11-17 | 2002-03-26 | International Rectifier Corp. | Flexible power assembly |
JP3351410B2 (ja) | 1999-12-20 | 2002-11-25 | 株式会社村田製作所 | インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール |
JP2001189416A (ja) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | パワーモジュール |
US6421262B1 (en) * | 2000-02-08 | 2002-07-16 | Vlt Corporation | Active rectifier |
DE10022968A1 (de) * | 2000-05-11 | 2001-11-15 | Bosch Gmbh Robert | Elektronikgerät |
JP4475757B2 (ja) * | 2000-07-19 | 2010-06-09 | 京セラ株式会社 | インバータ制御モジュール |
JP4218193B2 (ja) * | 2000-08-24 | 2009-02-04 | 三菱電機株式会社 | パワーモジュール |
JP3923258B2 (ja) * | 2001-01-17 | 2007-05-30 | 松下電器産業株式会社 | 電力制御系電子回路装置及びその製造方法 |
JP4490041B2 (ja) * | 2001-04-02 | 2010-06-23 | 三菱電機株式会社 | 電力用半導体装置 |
US6628138B2 (en) | 2001-11-30 | 2003-09-30 | Sun Microsystems, Inc. | Increasing decoupling capacitance using preferential shields |
US6687886B2 (en) | 2001-11-30 | 2004-02-03 | Sun Microsystems, Inc. | Logic optimization for preferential shields |
US6721936B2 (en) | 2001-11-30 | 2004-04-13 | Sun Microsystems, Inc. | Shield assignment using preferential shields |
US6629306B2 (en) | 2001-11-30 | 2003-09-30 | Sun Microsystems, Inc. | Signal routing based approach for increasing decoupling capacitance using preferential shielding |
AU2002365836A1 (en) * | 2001-11-30 | 2003-06-17 | Sun Microsystems, Inc. | Signal routing and shield assignment using preferential shielding |
DE10204200A1 (de) * | 2002-02-01 | 2003-08-21 | Conti Temic Microelectronic | Leistungsmodul |
JP2005039118A (ja) * | 2003-07-17 | 2005-02-10 | Mitsubishi Electric Corp | 半導体装置 |
JP4423462B2 (ja) * | 2003-12-22 | 2010-03-03 | 富士電機システムズ株式会社 | 半導体パワーモジュール |
DE102005016830A1 (de) * | 2004-04-14 | 2005-11-03 | Denso Corp., Kariya | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
JP4492454B2 (ja) * | 2005-06-20 | 2010-06-30 | 富士電機システムズ株式会社 | パワー半導体モジュール |
JP2007082359A (ja) * | 2005-09-16 | 2007-03-29 | Hitachi Ltd | インバータ装置および制御装置 |
JP4866143B2 (ja) * | 2006-05-15 | 2012-02-01 | 三菱電機株式会社 | 電力用半導体装置 |
JP4365388B2 (ja) * | 2006-06-16 | 2009-11-18 | 株式会社日立製作所 | 半導体パワーモジュールおよびその製法 |
JP4746497B2 (ja) * | 2006-08-29 | 2011-08-10 | 株式会社ケーヒン | 配線基板収納構造 |
DE602007012391D1 (de) * | 2006-08-29 | 2011-03-24 | Keihin Corp | Leiterplattengehäuseanordnung |
JP4793225B2 (ja) * | 2006-11-07 | 2011-10-12 | 株式会社デンソー | インバータ装置 |
JP4537370B2 (ja) * | 2006-12-04 | 2010-09-01 | 日立オートモティブシステムズ株式会社 | 電子装置 |
JP5125269B2 (ja) * | 2007-07-11 | 2013-01-23 | 三菱電機株式会社 | パワー半導体モジュール |
JP4933388B2 (ja) * | 2007-09-05 | 2012-05-16 | 株式会社ケーヒン | 複数の実装基板を有する集合基板 |
JP5241177B2 (ja) * | 2007-09-05 | 2013-07-17 | 株式会社オクテック | 半導体装置及び半導体装置の製造方法 |
JP2009081325A (ja) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | 回路装置 |
JP4969388B2 (ja) * | 2007-09-27 | 2012-07-04 | オンセミコンダクター・トレーディング・リミテッド | 回路モジュール |
JP4934559B2 (ja) * | 2007-09-27 | 2012-05-16 | オンセミコンダクター・トレーディング・リミテッド | 回路装置およびその製造方法 |
TWI402952B (zh) * | 2007-09-27 | 2013-07-21 | Sanyo Electric Co | 電路裝置及其製造方法 |
TW200915970A (en) * | 2007-09-27 | 2009-04-01 | Sanyo Electric Co | Circuit device, circuit module and outdoor equipment |
US7800222B2 (en) * | 2007-11-29 | 2010-09-21 | Infineon Technologies Ag | Semiconductor module with switching components and driver electronics |
JP4523632B2 (ja) * | 2007-12-11 | 2010-08-11 | 三菱電機株式会社 | 半導体装置 |
JP5444619B2 (ja) * | 2008-02-07 | 2014-03-19 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
JP5486820B2 (ja) * | 2009-02-09 | 2014-05-07 | 矢崎総業株式会社 | 混成回路の基板実装構造 |
JP5097797B2 (ja) * | 2010-05-31 | 2012-12-12 | 日立オートモティブシステムズ株式会社 | 電力変換装置及びそれを備えた移動体 |
US9888558B2 (en) * | 2010-06-03 | 2018-02-06 | Yazaki Corporation | Wiring substrate and manufacturing method thereof |
KR101343140B1 (ko) * | 2010-12-24 | 2013-12-19 | 삼성전기주식회사 | 3d 파워모듈 패키지 |
DE102011085629A1 (de) * | 2011-11-02 | 2013-05-02 | Robert Bosch Gmbh | Elektronikmodul zum Betrieb im Getriebe |
FR2995495B1 (fr) * | 2012-09-10 | 2015-09-04 | Valeo Sys Controle Moteur Sas | Dispositif electrique et compresseur electrique |
DE102013219780A1 (de) * | 2013-09-30 | 2015-04-02 | Infineon Technologies Ag | Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
DE102014101238A1 (de) * | 2014-01-31 | 2015-08-06 | Hs Elektronik Systeme Gmbh | In Leiterplatten eingebettetes Leistungsmodul |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
US9871464B2 (en) | 2014-05-14 | 2018-01-16 | Mitsubishi Electric Corporation | Ground structure for control unit |
WO2016088211A1 (ja) * | 2014-12-03 | 2016-06-09 | 日産自動車株式会社 | 電力変換装置 |
US10270357B2 (en) * | 2014-12-22 | 2019-04-23 | Mitsubishi Electric Corporation | Printed wiring board, circuit board, and control unit |
WO2017130381A1 (ja) * | 2016-01-29 | 2017-08-03 | 三菱電機株式会社 | 半導体装置 |
JP6770456B2 (ja) * | 2017-02-17 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | 電子装置 |
JP6549200B2 (ja) * | 2017-10-03 | 2019-07-24 | 三菱電機株式会社 | 電力変換回路 |
CN114365410A (zh) * | 2019-11-25 | 2022-04-15 | 株式会社爱信 | 控制基板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7502579A (nl) * | 1975-03-05 | 1976-09-07 | Philips Nv | Werkwijze voor het vervaardigen van hf-schakelingen, in het bijzonder uhf-televisietuners. |
JPS548976A (en) * | 1977-06-22 | 1979-01-23 | Nec Corp | Lsi package |
JPS5718340A (en) * | 1980-07-09 | 1982-01-30 | Fujitsu Ltd | Semiconductor device |
US4514749A (en) * | 1983-01-18 | 1985-04-30 | At&T Bell Laboratories | VLSI Chip with ground shielding |
JPS6286841A (ja) * | 1985-10-14 | 1987-04-21 | Mitsubishi Electric Corp | 高周波混成集積回路 |
US5043526A (en) * | 1986-03-13 | 1991-08-27 | Nintendo Company Ltd. | Printed circuit board capable of preventing electromagnetic interference |
JPS6369258A (ja) * | 1986-09-10 | 1988-03-29 | Nec Corp | 多層配線基板 |
JPH0265240A (ja) * | 1988-08-31 | 1990-03-05 | Seiko Epson Corp | 半導体集積装置 |
FR2652982B1 (fr) * | 1989-10-11 | 1993-04-30 | Alsthom Gec | Assemblage de composants en electronique de puissance. |
US4965710A (en) * | 1989-11-16 | 1990-10-23 | International Rectifier Corporation | Insulated gate bipolar transistor power module |
JP2735920B2 (ja) * | 1990-01-23 | 1998-04-02 | 三洋電機株式会社 | インバータ装置 |
US5077595A (en) * | 1990-01-25 | 1991-12-31 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JPH0432258A (ja) * | 1990-05-29 | 1992-02-04 | Seiko Epson Corp | 半導体集積回路の実装方法 |
US5241456A (en) * | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
-
1992
- 1992-06-17 JP JP4157988A patent/JP2854757B2/ja not_active Expired - Lifetime
-
1993
- 1993-06-11 US US08/075,316 patent/US5444297A/en not_active Expired - Lifetime
- 1993-06-17 EP EP93109693A patent/EP0575892B1/de not_active Expired - Lifetime
- 1993-06-17 DE DE69325953T patent/DE69325953T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2854757B2 (ja) | 1999-02-03 |
US5444297A (en) | 1995-08-22 |
DE69325953T2 (de) | 2000-01-13 |
EP0575892B1 (de) | 1999-08-11 |
EP0575892A1 (de) | 1993-12-29 |
JPH065847A (ja) | 1994-01-14 |
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