USD731491S1 - Embedded cellular modem - Google Patents

Embedded cellular modem Download PDF

Info

Publication number
USD731491S1
USD731491S1 US29/481,573 US201429481573F USD731491S US D731491 S1 USD731491 S1 US D731491S1 US 201429481573 F US201429481573 F US 201429481573F US D731491 S USD731491 S US D731491S
Authority
US
United States
Prior art keywords
cellular modem
embedded cellular
embedded
modem
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/481,573
Inventor
Kurt T. Larson
Christopher J. Elmquist
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NimbeLink Corp
Original Assignee
NimbeLink Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NimbeLink Corp filed Critical NimbeLink Corp
Priority to US29/481,573 priority Critical patent/USD731491S1/en
Assigned to NimbeLink L.L.C. reassignment NimbeLink L.L.C. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LARSON, KURT T., ELMQUIST, CHRISTOPHER J.
Application granted granted Critical
Publication of USD731491S1 publication Critical patent/USD731491S1/en
Assigned to NIMBELINK CORP. reassignment NIMBELINK CORP. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: NimbeLink L.L.C.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a downward perspective view of an embedded cellular modem, according to an embodiment of the invention;
FIG. 2 is an upward perspective view of the embedded cellular modem of FIG. 1;
FIG. 3 is a top plan view of the embedded cellular modem of FIG. 1:
FIG. 4 is a bottom plan view of the embedded cellular modem of FIG. 1;
FIG. 5 is a from elevational view of the embedded cellular modem of FIG. 1;
FIG. 6 is a rear elevational view of the embedded cellular modem of FIG. 1;
FIG. 7 is a right-side, elevational view of the embedded cellular modem of FIG. 1; and,
FIG. 8 is a left-side, elevational view of the embedded cellular modem of FIG. 1.
Broken lines and entirely unshaded portions contained within broken lines are not claimed.

Claims (1)

    CLAIM
  1. We claim the ornamental design for an embedded cellular modem, as shown and described.
US29/481,573 2014-02-07 2014-02-07 Embedded cellular modem Active USD731491S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/481,573 USD731491S1 (en) 2014-02-07 2014-02-07 Embedded cellular modem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/481,573 USD731491S1 (en) 2014-02-07 2014-02-07 Embedded cellular modem

Publications (1)

Publication Number Publication Date
USD731491S1 true USD731491S1 (en) 2015-06-09

Family

ID=53268370

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/481,573 Active USD731491S1 (en) 2014-02-07 2014-02-07 Embedded cellular modem

Country Status (1)

Country Link
US (1) USD731491S1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
USD768585S1 (en) * 2014-12-15 2016-10-11 General Electric Company Electronics enclosure
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD785609S1 (en) * 2016-01-06 2017-05-02 Symbol Technologies, Llc WLAN module
USD791748S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc Locationing module
USD791747S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc RFID module
USD827671S1 (en) 2016-09-30 2018-09-04 Sonos, Inc. Media playback device
USD829687S1 (en) 2013-02-25 2018-10-02 Sonos, Inc. Playback device
USD838680S1 (en) * 2015-02-20 2019-01-22 Microduino Inc. Modular electronic device
USD842271S1 (en) 2012-06-19 2019-03-05 Sonos, Inc. Playback device
USD851057S1 (en) * 2016-09-30 2019-06-11 Sonos, Inc. Speaker grill with graduated hole sizing over a transition area for a media device
USD855587S1 (en) 2015-04-25 2019-08-06 Sonos, Inc. Playback device
US10412473B2 (en) 2016-09-30 2019-09-10 Sonos, Inc. Speaker grill with graduated hole sizing over a transition area for a media device
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD873819S1 (en) * 2018-06-19 2020-01-28 Seagate Technology Llc Storage device
USD886765S1 (en) 2017-03-13 2020-06-09 Sonos, Inc. Media playback device
USD906278S1 (en) 2015-04-25 2020-12-29 Sonos, Inc. Media player device
USD920278S1 (en) 2017-03-13 2021-05-25 Sonos, Inc. Media playback device with lights
USD921611S1 (en) 2015-09-17 2021-06-08 Sonos, Inc. Media player

Citations (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4218724A (en) * 1978-11-21 1980-08-19 Kaufman Lance R Compact circuit package having improved circuit connectors
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD261760S (en) * 1978-12-22 1981-11-10 Pitney Bowes Inc. Electronic postal rate memory
USD286053S (en) * 1983-09-29 1986-10-07 International Business Machines Corporation Data memory module
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD316848S (en) * 1987-07-04 1991-05-14 Terutomi Hasegawa Mounting substrate for semiconductors
USD317300S (en) * 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD320212S (en) * 1989-04-11 1991-09-24 Ricoh Company, Ltd. Adapter for telephone data communication equipment
US5221859A (en) * 1990-02-26 1993-06-22 Hitachi, Ltd. Lead frame for semiconductor device
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5369551A (en) * 1993-11-08 1994-11-29 Sawtek, Inc. Surface mount stress relief interface system and method
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD358805S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
USD364399S (en) * 1994-09-07 1995-11-21 Quanta Computer Inc. Modem connector
US5552631A (en) * 1992-06-04 1996-09-03 Lsi Logic Corporation Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die
US5635670A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
USD396471S (en) * 1996-05-31 1998-07-28 Nokia Mobile Phones Limited Terminal for wireless local loop
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
US5959846A (en) * 1996-12-26 1999-09-28 Citizen Electronics, Co., Ltd. Modular surface mount circuit device and a manufacturing method thereof
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US5998242A (en) * 1997-10-27 1999-12-07 Lsi Logic Corporation Vacuum assisted underfill process and apparatus for semiconductor package fabrication
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6166430A (en) * 1998-05-27 2000-12-26 Matsushita Electronics Corporation Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device
USD442171S1 (en) * 2000-02-18 2001-05-15 Bellwave, Inc. Radio frequency modem
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD453746S1 (en) * 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US6358776B1 (en) * 1999-11-08 2002-03-19 Towa Corporation Method of fabricating an electronic component and apparatus used therefor
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD472547S1 (en) * 2002-02-27 2003-04-01 Allied Telesis K.K. Modem
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US20030192949A1 (en) * 2002-04-10 2003-10-16 Industrial Data Entry Automation Systems, Inc. Mirrored surface optical symbol scanner
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD502684S1 (en) * 2002-11-15 2005-03-08 Nintendo Co., Ltd. Conversion adapter for game machine
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD507544S1 (en) * 2003-04-25 2005-07-19 Harvatek Corporation Light emitting diode package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6995461B2 (en) * 2001-07-23 2006-02-07 Fuji Electric Co., Ltd. Semiconductor device
USD515046S1 (en) * 2002-07-30 2006-02-14 Gabe Kaprelian Semi-flush mounted air conditioner disconnect housing with moisture intrusion resistant flanges
US20060041919A1 (en) * 2004-08-19 2006-02-23 Kabushiki Kaisha Toshiba Cable modem module device, cable modem device, and broadcast receiving device
USD530316S1 (en) * 2005-07-13 2006-10-17 Inventec Multimedia Telecom Corporation Switch hub
US7130942B2 (en) * 2001-03-15 2006-10-31 Italtel S.P.A. Interface bus protocol for managing transactions in a system of distributed microprocessor interfaces toward marco-cell based designs implemented as ASIC or FPGA bread boarding
US7166496B1 (en) * 2005-08-17 2007-01-23 Ciclon Semiconductor Device Corp. Method of making a packaged semiconductor device
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD550172S1 (en) * 2006-12-08 2007-09-04 Alpine Electronics, Inc. Container for an electronic device
US7299427B2 (en) * 2002-08-30 2007-11-20 Lsi Corporation Radio prototyping system
USD564502S1 (en) * 2006-06-02 2008-03-18 Digi International Inc. Radio modem with circuit board
US20080155630A1 (en) * 2006-12-25 2008-06-26 Kabushiki Kaisha Toshiba Distributor-embedded cable modem module, tv receiver, set-top-box, and method for connecting distributor-embedded modem module to tuner module
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD590827S1 (en) * 2007-02-16 2009-04-21 Ncomputing Inc. Network computing terminal
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US7706146B2 (en) * 2006-04-20 2010-04-27 Fairchild Korea Semiconductor Ltd Power system module and method of fabricating the same
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US7868451B2 (en) * 2006-05-30 2011-01-11 Kokusan Denki Co. Ltd. Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
US7881457B1 (en) * 2003-02-26 2011-02-01 Wintec Industries, Inc. Apparatus and method of single-in-line embedded modem
USD635106S1 (en) * 2009-10-13 2011-03-29 Askey Computer Corp. Housing for communication equipment
US8049312B2 (en) * 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
US20110298137A1 (en) * 2007-12-14 2011-12-08 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
US8093692B2 (en) * 2007-03-26 2012-01-10 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
US8102655B2 (en) * 2007-09-27 2012-01-24 Sanyo Semiconductor Co., Ltd. Circuit device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD655697S1 (en) * 2010-01-20 2012-03-13 Cinterion Wireless Modules Gmbh Radio frequency module
USD664544S1 (en) * 2010-07-20 2012-07-31 Cisco Technology, Inc. Router interface card
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
US20130088251A1 (en) * 2011-10-06 2013-04-11 Samsung Electro-Mechanics Co., Ltd. Probe card and manufacturing method thereof
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD696653S1 (en) * 2011-10-27 2013-12-31 Namiki Seimitsu Houseki Kabushiki Kaisha Vibration actuator
US20140001652A1 (en) * 2012-06-29 2014-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package structure having polymer-based material for warpage control
US20140001651A1 (en) * 2012-06-29 2014-01-02 Robert Nickerson Package substrates with multiple dice
US20140008776A1 (en) * 2012-07-05 2014-01-09 Infineon Technologies Ag Chip package and method of manufacturing the same
US20140061950A1 (en) * 2012-09-06 2014-03-06 Jun Zhai Stackable flip chip for memory packages
US20140084478A1 (en) * 2012-09-26 2014-03-27 Bogdan M. Simion Mold chase for integrated circuit package assembly and associated techniques and configurations
US20140091461A1 (en) * 2012-09-30 2014-04-03 Yuci Shen Die cap for use with flip chip package
US20140113460A1 (en) * 2012-10-18 2014-04-24 Samsung Electronics Co., Ltd. Memory card and memory card adaptor
US20140110820A1 (en) * 2012-10-18 2014-04-24 Infineon Technologies Austria Ag Passive component as thermal capacitance and heat sink
US20140119690A1 (en) * 2011-06-22 2014-05-01 Panasonic Corporation Optical module
US20140131854A1 (en) * 2012-11-13 2014-05-15 Lsi Corporation Multi-chip module connection by way of bridging blocks
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
US20140140657A1 (en) * 2012-11-20 2014-05-22 Fujitsu Limited Optical module and fabrication method
USD706249S1 (en) * 2012-12-18 2014-06-03 Sdi Technologies, Inc. Wireless bluetooth receiver/transmitter
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device
US20140177997A1 (en) * 2012-12-24 2014-06-26 Hon Hai Precision Industry Co., Ltd. Waveguide lens including planar waveguide and media grating
US20140270629A1 (en) * 2013-03-15 2014-09-18 Apic Corporation Optical waveguide network of an interconnecting ic module
US20140270626A1 (en) * 2013-03-14 2014-09-18 Corning Cable Systems Llc Circuit board(s) employing optical interfaces optically connected to surface-accessible, planar-shaped, inter-board optical fiber traces, and related connectors, assemblies, and methods
US20140270630A1 (en) * 2010-08-26 2014-09-18 Vi Systems Gmbh Opto-electronic assembly for parallel high speed transmission
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
US20140321807A1 (en) * 2012-01-10 2014-10-30 Hitachi Chemical Company, Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
US20140348462A1 (en) * 2010-11-25 2014-11-27 Fci Optical Circuit Board
USD719115S1 (en) * 2013-03-15 2014-12-09 Allegro Microsystems, Llc Housing for an electronic device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
US20150003775A1 (en) * 2013-06-26 2015-01-01 Micron Technology, Inc. Photonic device having a photonic crystal lower cladding layer provided on a semiconductor substrate
US20150023632A1 (en) * 2011-09-09 2015-01-22 Centera Photonics Inc. Optical electrical module used for optical communication used for optical communication
US20150030281A1 (en) * 2013-07-25 2015-01-29 Avago Technologies General IP (Singapore) Pte, Ltd. Methods and apparatuses for preventing an optics system of an optical communications module from being damaged or moved out of alignment by external forces
US20150036970A1 (en) * 2013-08-01 2015-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing

Patent Citations (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
US4218724A (en) * 1978-11-21 1980-08-19 Kaufman Lance R Compact circuit package having improved circuit connectors
USD261760S (en) * 1978-12-22 1981-11-10 Pitney Bowes Inc. Electronic postal rate memory
USD286053S (en) * 1983-09-29 1986-10-07 International Business Machines Corporation Data memory module
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD316848S (en) * 1987-07-04 1991-05-14 Terutomi Hasegawa Mounting substrate for semiconductors
USD317300S (en) * 1987-07-04 1991-06-04 Terutomi Hasegawa Semi-conductor mounting substrate
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD320212S (en) * 1989-04-11 1991-09-24 Ricoh Company, Ltd. Adapter for telephone data communication equipment
US5221859A (en) * 1990-02-26 1993-06-22 Hitachi, Ltd. Lead frame for semiconductor device
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5552631A (en) * 1992-06-04 1996-09-03 Lsi Logic Corporation Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5635670A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD358805S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
US5369551A (en) * 1993-11-08 1994-11-29 Sawtek, Inc. Surface mount stress relief interface system and method
USD364399S (en) * 1994-09-07 1995-11-21 Quanta Computer Inc. Modem connector
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396471S (en) * 1996-05-31 1998-07-28 Nokia Mobile Phones Limited Terminal for wireless local loop
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5959846A (en) * 1996-12-26 1999-09-28 Citizen Electronics, Co., Ltd. Modular surface mount circuit device and a manufacturing method thereof
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5998242A (en) * 1997-10-27 1999-12-07 Lsi Logic Corporation Vacuum assisted underfill process and apparatus for semiconductor package fabrication
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6166430A (en) * 1998-05-27 2000-12-26 Matsushita Electronics Corporation Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6358776B1 (en) * 1999-11-08 2002-03-19 Towa Corporation Method of fabricating an electronic component and apparatus used therefor
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD442171S1 (en) * 2000-02-18 2001-05-15 Bellwave, Inc. Radio frequency modem
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
US7130942B2 (en) * 2001-03-15 2006-10-31 Italtel S.P.A. Interface bus protocol for managing transactions in a system of distributed microprocessor interfaces toward marco-cell based designs implemented as ASIC or FPGA bread boarding
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US6995461B2 (en) * 2001-07-23 2006-02-07 Fuji Electric Co., Ltd. Semiconductor device
USD453746S1 (en) * 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472547S1 (en) * 2002-02-27 2003-04-01 Allied Telesis K.K. Modem
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US20030192949A1 (en) * 2002-04-10 2003-10-16 Industrial Data Entry Automation Systems, Inc. Mirrored surface optical symbol scanner
USD515046S1 (en) * 2002-07-30 2006-02-14 Gabe Kaprelian Semi-flush mounted air conditioner disconnect housing with moisture intrusion resistant flanges
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7299427B2 (en) * 2002-08-30 2007-11-20 Lsi Corporation Radio prototyping system
USD502684S1 (en) * 2002-11-15 2005-03-08 Nintendo Co., Ltd. Conversion adapter for game machine
US7881457B1 (en) * 2003-02-26 2011-02-01 Wintec Industries, Inc. Apparatus and method of single-in-line embedded modem
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD507544S1 (en) * 2003-04-25 2005-07-19 Harvatek Corporation Light emitting diode package
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20060041919A1 (en) * 2004-08-19 2006-02-23 Kabushiki Kaisha Toshiba Cable modem module device, cable modem device, and broadcast receiving device
USD530316S1 (en) * 2005-07-13 2006-10-17 Inventec Multimedia Telecom Corporation Switch hub
US7166496B1 (en) * 2005-08-17 2007-01-23 Ciclon Semiconductor Device Corp. Method of making a packaged semiconductor device
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US7706146B2 (en) * 2006-04-20 2010-04-27 Fairchild Korea Semiconductor Ltd Power system module and method of fabricating the same
US7868451B2 (en) * 2006-05-30 2011-01-11 Kokusan Denki Co. Ltd. Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
USD564502S1 (en) * 2006-06-02 2008-03-18 Digi International Inc. Radio modem with circuit board
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
USD550172S1 (en) * 2006-12-08 2007-09-04 Alpine Electronics, Inc. Container for an electronic device
US20080155630A1 (en) * 2006-12-25 2008-06-26 Kabushiki Kaisha Toshiba Distributor-embedded cable modem module, tv receiver, set-top-box, and method for connecting distributor-embedded modem module to tuner module
USD590827S1 (en) * 2007-02-16 2009-04-21 Ncomputing Inc. Network computing terminal
US8093692B2 (en) * 2007-03-26 2012-01-10 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
US8102655B2 (en) * 2007-09-27 2012-01-24 Sanyo Semiconductor Co., Ltd. Circuit device
US20110298137A1 (en) * 2007-12-14 2011-12-08 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US8049312B2 (en) * 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
USD635106S1 (en) * 2009-10-13 2011-03-29 Askey Computer Corp. Housing for communication equipment
USD655697S1 (en) * 2010-01-20 2012-03-13 Cinterion Wireless Modules Gmbh Radio frequency module
USD664544S1 (en) * 2010-07-20 2012-07-31 Cisco Technology, Inc. Router interface card
US20140270630A1 (en) * 2010-08-26 2014-09-18 Vi Systems Gmbh Opto-electronic assembly for parallel high speed transmission
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
US20140348462A1 (en) * 2010-11-25 2014-11-27 Fci Optical Circuit Board
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US20140119690A1 (en) * 2011-06-22 2014-05-01 Panasonic Corporation Optical module
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
US20150023632A1 (en) * 2011-09-09 2015-01-22 Centera Photonics Inc. Optical electrical module used for optical communication used for optical communication
US20130088251A1 (en) * 2011-10-06 2013-04-11 Samsung Electro-Mechanics Co., Ltd. Probe card and manufacturing method thereof
USD696653S1 (en) * 2011-10-27 2013-12-31 Namiki Seimitsu Houseki Kabushiki Kaisha Vibration actuator
US20140321807A1 (en) * 2012-01-10 2014-10-30 Hitachi Chemical Company, Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
US20140001651A1 (en) * 2012-06-29 2014-01-02 Robert Nickerson Package substrates with multiple dice
US20140001652A1 (en) * 2012-06-29 2014-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package structure having polymer-based material for warpage control
US20140008776A1 (en) * 2012-07-05 2014-01-09 Infineon Technologies Ag Chip package and method of manufacturing the same
US20140061950A1 (en) * 2012-09-06 2014-03-06 Jun Zhai Stackable flip chip for memory packages
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
US20140084478A1 (en) * 2012-09-26 2014-03-27 Bogdan M. Simion Mold chase for integrated circuit package assembly and associated techniques and configurations
US20140091461A1 (en) * 2012-09-30 2014-04-03 Yuci Shen Die cap for use with flip chip package
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
US20140110820A1 (en) * 2012-10-18 2014-04-24 Infineon Technologies Austria Ag Passive component as thermal capacitance and heat sink
US20140113460A1 (en) * 2012-10-18 2014-04-24 Samsung Electronics Co., Ltd. Memory card and memory card adaptor
US20140131854A1 (en) * 2012-11-13 2014-05-15 Lsi Corporation Multi-chip module connection by way of bridging blocks
US20140140657A1 (en) * 2012-11-20 2014-05-22 Fujitsu Limited Optical module and fabrication method
USD706249S1 (en) * 2012-12-18 2014-06-03 Sdi Technologies, Inc. Wireless bluetooth receiver/transmitter
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device
US20140177997A1 (en) * 2012-12-24 2014-06-26 Hon Hai Precision Industry Co., Ltd. Waveguide lens including planar waveguide and media grating
US20140270626A1 (en) * 2013-03-14 2014-09-18 Corning Cable Systems Llc Circuit board(s) employing optical interfaces optically connected to surface-accessible, planar-shaped, inter-board optical fiber traces, and related connectors, assemblies, and methods
US20140270629A1 (en) * 2013-03-15 2014-09-18 Apic Corporation Optical waveguide network of an interconnecting ic module
USD719115S1 (en) * 2013-03-15 2014-12-09 Allegro Microsystems, Llc Housing for an electronic device
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
US20150003775A1 (en) * 2013-06-26 2015-01-01 Micron Technology, Inc. Photonic device having a photonic crystal lower cladding layer provided on a semiconductor substrate
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
US20150030281A1 (en) * 2013-07-25 2015-01-29 Avago Technologies General IP (Singapore) Pte, Ltd. Methods and apparatuses for preventing an optics system of an optical communications module from being damaged or moved out of alignment by external forces
US20150036970A1 (en) * 2013-08-01 2015-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD906284S1 (en) 2012-06-19 2020-12-29 Sonos, Inc. Playback device
USD842271S1 (en) 2012-06-19 2019-03-05 Sonos, Inc. Playback device
USD829687S1 (en) 2013-02-25 2018-10-02 Sonos, Inc. Playback device
USD848399S1 (en) 2013-02-25 2019-05-14 Sonos, Inc. Playback device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
USD767571S1 (en) 2014-09-16 2016-09-27 Daishinku Corporation Piezoelectric vibration device
USD768585S1 (en) * 2014-12-15 2016-10-11 General Electric Company Electronics enclosure
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD838680S1 (en) * 2015-02-20 2019-01-22 Microduino Inc. Modular electronic device
USD906278S1 (en) 2015-04-25 2020-12-29 Sonos, Inc. Media player device
USD934199S1 (en) 2015-04-25 2021-10-26 Sonos, Inc. Playback device
USD855587S1 (en) 2015-04-25 2019-08-06 Sonos, Inc. Playback device
USD921611S1 (en) 2015-09-17 2021-06-08 Sonos, Inc. Media player
USD791747S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc RFID module
USD791748S1 (en) * 2016-01-06 2017-07-11 Symbol Technologies, Llc Locationing module
USD785609S1 (en) * 2016-01-06 2017-05-02 Symbol Technologies, Llc WLAN module
US10412473B2 (en) 2016-09-30 2019-09-10 Sonos, Inc. Speaker grill with graduated hole sizing over a transition area for a media device
USD851057S1 (en) * 2016-09-30 2019-06-11 Sonos, Inc. Speaker grill with graduated hole sizing over a transition area for a media device
USD827671S1 (en) 2016-09-30 2018-09-04 Sonos, Inc. Media playback device
USD924832S1 (en) 2016-09-30 2021-07-13 Sonos, Inc. Speaker grill with graduated hole sizing over a transition area for a media device
USD930612S1 (en) 2016-09-30 2021-09-14 Sonos, Inc. Media playback device
USD886765S1 (en) 2017-03-13 2020-06-09 Sonos, Inc. Media playback device
USD920278S1 (en) 2017-03-13 2021-05-25 Sonos, Inc. Media playback device with lights
USD873819S1 (en) * 2018-06-19 2020-01-28 Seagate Technology Llc Storage device

Similar Documents

Publication Publication Date Title
USD731491S1 (en) Embedded cellular modem
USD723562S1 (en) Scanner
USD795308S1 (en) Boom lift cover
USD762651S1 (en) Mobile device case
USD712133S1 (en) Shoe upper
USD803834S1 (en) Keyboard assembly
USD710686S1 (en) Single serving cup
USD729393S1 (en) Outsole for an orthopedic device
USD721795S1 (en) Drain cover
USD767808S1 (en) Trim for a recessed luminaire
USD767295S1 (en) Seating
USD704385S1 (en) Portable hanging animal feeder
USD741618S1 (en) Seating
USD723139S1 (en) Drain cover
USD762055S1 (en) Shoe upper
USD722365S1 (en) Drain cover
USD899922S1 (en) Package
USD721424S1 (en) Drain cover
USD721080S1 (en) Electronic device cover
USD722139S1 (en) Drain cover
USD754534S1 (en) Package
USD830560S1 (en) Spineboard with cover
USD770999S1 (en) Mobile phone
USD720837S1 (en) Drain cover
USD741055S1 (en) Shoe