USD416872S - Single component computer - Google Patents

Single component computer Download PDF

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Publication number
USD416872S
USD416872S US29/079,005 US7900597F USD416872S US D416872 S USD416872 S US D416872S US 7900597 F US7900597 F US 7900597F US D416872 S USD416872 S US D416872S
Authority
US
United States
Prior art keywords
single component
component computer
computer
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/079,005
Inventor
Jonathan Christopher Burke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Micro Solutions Inc
Original Assignee
Z Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to ZF MICROSYSTEMS, INC. reassignment ZF MICROSYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BURKE, JONATHAN CHRISTOPHER
Application filed by Z Microsystems Inc filed Critical Z Microsystems Inc
Priority to US29/079,005 priority Critical patent/USD416872S/en
Assigned to ZF EMBEDDED, INC. reassignment ZF EMBEDDED, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ZF MICROSYSTEMS, INC.
Application granted granted Critical
Publication of USD416872S publication Critical patent/USD416872S/en
Assigned to ZF LINUX DEVICES, INC. reassignment ZF LINUX DEVICES, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ZF EMBEDDED, INC.
Assigned to ZF MICRO DEVICES, INC. reassignment ZF MICRO DEVICES, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ZF LINUX DEVICES, INC.
Assigned to ZF MICRO SOLUTIONS, INC. reassignment ZF MICRO SOLUTIONS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZF MICRO DEVICES, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a single component computer embodying my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof, the other side being identical;
FIG. 4 is a front elevational view thereof, the rear view being identical; and,
FIG. 5 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a single component computer, as described and claimed.
US29/079,005 1997-11-06 1997-11-06 Single component computer Expired - Lifetime USD416872S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/079,005 USD416872S (en) 1997-11-06 1997-11-06 Single component computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/079,005 USD416872S (en) 1997-11-06 1997-11-06 Single component computer

Publications (1)

Publication Number Publication Date
USD416872S true USD416872S (en) 1999-11-23

Family

ID=71618046

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/079,005 Expired - Lifetime USD416872S (en) 1997-11-06 1997-11-06 Single component computer

Country Status (1)

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US (1) USD416872S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD927438S1 (en) * 2019-09-09 2021-08-10 Thales Alenia Space France Housing for electronic modules

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4506938A (en) * 1982-07-06 1985-03-26 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
US5206792A (en) * 1991-11-04 1993-04-27 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5346402A (en) * 1992-03-09 1994-09-13 Matsushita Electric Industrial Co., Ltd. Electronic circuit device and manufacturing method thereof
US5422790A (en) * 1994-02-18 1995-06-06 Chen; Pao-Chin Computer chip mounting hardware for heat dissipation
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
US5640305A (en) * 1995-06-07 1997-06-17 Thermalloy, Inc. Anchor for securing a heat sink to a printed circuit board
US5743748A (en) * 1995-04-04 1998-04-28 Mitsubishi Electric Semiconductor Software Co., Ltd. Emulator probe
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
USD402274S (en) * 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4506938A (en) * 1982-07-06 1985-03-26 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
US5206792A (en) * 1991-11-04 1993-04-27 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5346402A (en) * 1992-03-09 1994-09-13 Matsushita Electric Industrial Co., Ltd. Electronic circuit device and manufacturing method thereof
US5422790A (en) * 1994-02-18 1995-06-06 Chen; Pao-Chin Computer chip mounting hardware for heat dissipation
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
US5743748A (en) * 1995-04-04 1998-04-28 Mitsubishi Electric Semiconductor Software Co., Ltd. Emulator probe
US5640305A (en) * 1995-06-07 1997-06-17 Thermalloy, Inc. Anchor for securing a heat sink to a printed circuit board
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD402274S (en) * 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD907592S1 (en) * 2017-05-03 2021-01-12 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD927438S1 (en) * 2019-09-09 2021-08-10 Thales Alenia Space France Housing for electronic modules

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