USD416872S - Single component computer - Google Patents
Single component computer Download PDFInfo
- Publication number
- USD416872S USD416872S US29/079,005 US7900597F USD416872S US D416872 S USD416872 S US D416872S US 7900597 F US7900597 F US 7900597F US D416872 S USD416872 S US D416872S
- Authority
- US
- United States
- Prior art keywords
- single component
- component computer
- computer
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a single component computer embodying my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof, the other side being identical;
FIG. 4 is a front elevational view thereof, the rear view being identical; and,
FIG. 5 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a single component computer, as described and claimed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/079,005 USD416872S (en) | 1997-11-06 | 1997-11-06 | Single component computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/079,005 USD416872S (en) | 1997-11-06 | 1997-11-06 | Single component computer |
Publications (1)
Publication Number | Publication Date |
---|---|
USD416872S true USD416872S (en) | 1999-11-23 |
Family
ID=71618046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/079,005 Expired - Lifetime USD416872S (en) | 1997-11-06 | 1997-11-06 | Single component computer |
Country Status (1)
Country | Link |
---|---|
US (1) | USD416872S (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD906989S1 (en) * | 2017-05-03 | 2021-01-05 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD927438S1 (en) * | 2019-09-09 | 2021-08-10 | Thales Alenia Space France | Housing for electronic modules |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
US4506938A (en) * | 1982-07-06 | 1985-03-26 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD318271S (en) * | 1987-07-04 | 1991-07-16 | Terutomi Hasegawa | Substrate for mounting semiconductors |
US5206792A (en) * | 1991-11-04 | 1993-04-27 | International Business Machines Corporation | Attachment for contacting a heat sink with an integrated circuit chip and use thereof |
US5346402A (en) * | 1992-03-09 | 1994-09-13 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit device and manufacturing method thereof |
US5422790A (en) * | 1994-02-18 | 1995-06-06 | Chen; Pao-Chin | Computer chip mounting hardware for heat dissipation |
US5513073A (en) * | 1994-04-18 | 1996-04-30 | International Business Machines Corporation | Optical device heat spreader and thermal isolation apparatus |
US5574627A (en) * | 1995-07-24 | 1996-11-12 | At&T Global Information Solutions Company | Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices |
US5640305A (en) * | 1995-06-07 | 1997-06-17 | Thermalloy, Inc. | Anchor for securing a heat sink to a printed circuit board |
US5743748A (en) * | 1995-04-04 | 1998-04-28 | Mitsubishi Electric Semiconductor Software Co., Ltd. | Emulator probe |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5844307A (en) * | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation |
USD402274S (en) * | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
-
1997
- 1997-11-06 US US29/079,005 patent/USD416872S/en not_active Expired - Lifetime
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
US4506938A (en) * | 1982-07-06 | 1985-03-26 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD318271S (en) * | 1987-07-04 | 1991-07-16 | Terutomi Hasegawa | Substrate for mounting semiconductors |
US5206792A (en) * | 1991-11-04 | 1993-04-27 | International Business Machines Corporation | Attachment for contacting a heat sink with an integrated circuit chip and use thereof |
US5346402A (en) * | 1992-03-09 | 1994-09-13 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit device and manufacturing method thereof |
US5422790A (en) * | 1994-02-18 | 1995-06-06 | Chen; Pao-Chin | Computer chip mounting hardware for heat dissipation |
US5513073A (en) * | 1994-04-18 | 1996-04-30 | International Business Machines Corporation | Optical device heat spreader and thermal isolation apparatus |
US5743748A (en) * | 1995-04-04 | 1998-04-28 | Mitsubishi Electric Semiconductor Software Co., Ltd. | Emulator probe |
US5640305A (en) * | 1995-06-07 | 1997-06-17 | Thermalloy, Inc. | Anchor for securing a heat sink to a printed circuit board |
US5574627A (en) * | 1995-07-24 | 1996-11-12 | At&T Global Information Solutions Company | Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices |
US5844307A (en) * | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD402274S (en) * | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
USD906989S1 (en) * | 2017-05-03 | 2021-01-05 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD907592S1 (en) * | 2017-05-03 | 2021-01-12 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD927438S1 (en) * | 2019-09-09 | 2021-08-10 | Thales Alenia Space France | Housing for electronic modules |
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