USD396213S - Integrated circuit device - Google Patents
Integrated circuit device Download PDFInfo
- Publication number
- USD396213S USD396213S US29/068,465 US6846597F USD396213S US D396213 S USD396213 S US D396213S US 6846597 F US6846597 F US 6846597F US D396213 S USD396213 S US D396213S
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- circuit device
- view
- ornamental design
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of the top, front and left side of an integrated circuit device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Claims (1)
- The ornamental design for an integrated circuit device, as shown.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2683596 | 1996-09-09 | ||
| JP8-26835 | 1996-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD396213S true USD396213S (en) | 1998-07-21 |
Family
ID=71597861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/068,465 Expired - Lifetime USD396213S (en) | 1996-09-09 | 1997-03-03 | Integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD396213S (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
-
1997
- 1997-03-03 US US29/068,465 patent/USD396213S/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
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