USD1009819S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD1009819S1 USD1009819S1 US29/834,030 US202229834030F USD1009819S US D1009819 S1 USD1009819 S1 US D1009819S1 US 202229834030 F US202229834030 F US 202229834030F US D1009819 S USD1009819 S US D1009819S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- design
- side perspective
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 4
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Description
The even broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021022273F JP1711418S (en) | 2021-10-13 | 2021-10-13 | Semiconductor element |
JP2021-022273D | 2021-10-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1009819S1 true USD1009819S1 (en) | 2024-01-02 |
Family
ID=80912953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/834,030 Active USD1009819S1 (en) | 2021-10-13 | 2022-04-08 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1009819S1 (en) |
JP (1) | JP1711418S (en) |
Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
US5594282A (en) * | 1993-12-16 | 1997-01-14 | Seiko Epson Corporation | Resin sealing type semiconductor device and method of making the same |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396211S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
US5910681A (en) * | 1996-05-15 | 1999-06-08 | Kabushiki Kaisha Toshiba | Resin sealed semiconductor device |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
JP1632999S (en) | 2018-06-12 | 2019-06-03 | ||
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
-
2021
- 2021-10-13 JP JP2021022273F patent/JP1711418S/en active Active
-
2022
- 2022-04-08 US US29/834,030 patent/USD1009819S1/en active Active
Patent Citations (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
USD288922S (en) * | 1984-04-19 | 1987-03-24 | Thomson Components-Mostek Corporation | Zero power random access memory package |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
US5434357A (en) * | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD359028S (en) * | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD358806S (en) * | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5646443A (en) * | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package |
US5594282A (en) * | 1993-12-16 | 1997-01-14 | Seiko Epson Corporation | Resin sealing type semiconductor device and method of making the same |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
US5910681A (en) * | 1996-05-15 | 1999-06-08 | Kabushiki Kaisha Toshiba | Resin sealed semiconductor device |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396212S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396211S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396213S (en) * | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
US5959842A (en) * | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof |
USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
JP1632999S (en) | 2018-06-12 | 2019-06-03 | ||
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
Non-Patent Citations (5)
Title |
---|
AIT Discrete Semiconductor, Model Name/No. A317BSR,https://www.indiamart.com/proddetail/discrete-semiconductor-22209945062.html?pos=1, 2023. (Year: 2023). * |
Cypress Semiconductor, Model Name/No. Cy Series,https://www.indiamart.com/proddetail/cypress-semiconductor-23350528897.html?pos=6&pla=n, 2023. (Year: 2023). * |
First Office Action issued for Chinese Patent Application No. 202230202914.1, dated Jul. 21, 2023, 3 pages including English machine translation. |
Notification to Make Rectification issued for Chinese Patent Application No. 202230203076.X, dated Jul. 21, 2023, 3 pages including English machine translation. |
Siddhi Electronics Aluminum Semiconductor Device, For Industrial, https://www.indiamart.com/proddetail/semiconductor-device-11687884748.html, 2023. (Year: 2023). * |
Also Published As
Publication number | Publication date |
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JP1711418S (en) | 2022-03-31 |
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