USD359028S - Socketed integrated circuit package - Google Patents
Socketed integrated circuit package Download PDFInfo
- Publication number
- USD359028S USD359028S US29/012,499 US1249993F USD359028S US D359028 S USD359028 S US D359028S US 1249993 F US1249993 F US 1249993F US D359028 S USD359028 S US D359028S
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- circuit package
- socketed
- package
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of the integrated circuit package;
FIG. 2 is a side elevation view of the integrated circuit package;
FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;
FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;
FIG. 5 is a top plan view of the integrated circuit package; and,
FIG. 6 is a bottom plan view of the integrated circuit package.
Claims (1)
- The ornamental design for the socketed integrated circuit package, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/012,499 USD359028S (en) | 1993-09-02 | 1993-09-02 | Socketed integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/012,499 USD359028S (en) | 1993-09-02 | 1993-09-02 | Socketed integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD359028S true USD359028S (en) | 1995-06-06 |
Family
ID=65242554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/012,499 Expired - Lifetime USD359028S (en) | 1993-09-02 | 1993-09-02 | Socketed integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD359028S (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD788722S1 (en) * | 2014-07-17 | 2017-06-06 | Advantest Corporation | Socket for an electronic device testing apparatus |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
-
1993
- 1993-09-02 US US29/012,499 patent/USD359028S/en not_active Expired - Lifetime
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD427977S (en) * | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
| USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD819581S1 (en) | 2014-07-17 | 2018-06-05 | Advantest Corporation | Socket for electronic device testing apparatus |
| USD788722S1 (en) * | 2014-07-17 | 2017-06-06 | Advantest Corporation | Socket for an electronic device testing apparatus |
| USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
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