USD358806S - Socketed integrated circuit package - Google Patents

Socketed integrated circuit package Download PDF

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Publication number
USD358806S
USD358806S US29/013,438 US1343893F USD358806S US D358806 S USD358806 S US D358806S US 1343893 F US1343893 F US 1343893F US D358806 S USD358806 S US D358806S
Authority
US
United States
Prior art keywords
integrated circuit
circuit package
socketed
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/013,438
Inventor
Harry M. Siegel
Michael J. Hundt
Krishnan Kelappan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Priority to US29/013,438 priority Critical patent/USD358806S/en
Assigned to SGS-THOMSON MICROELECTRONICS, INC. reassignment SGS-THOMSON MICROELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUNDT, MICHAEL J., KELAPPAN, KRISHNAN, SIEGEL, HARRY MICHAEL
Application granted granted Critical
Publication of USD358806S publication Critical patent/USD358806S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the integrated circuit package;
FIG. 2 is a side elevation view of the integrated circuit package;
FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;
FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;
FIG. 5 is a top plan view of the integrated circuit package; and,
FIG. 6 is a bottom plan view of the integrated circuit package.

Claims (1)

  1. The ornamental design for the socketed integrated circuit package, as shown and described.
US29/013,438 1993-09-24 1993-09-24 Socketed integrated circuit package Expired - Lifetime USD358806S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/013,438 USD358806S (en) 1993-09-24 1993-09-24 Socketed integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/013,438 USD358806S (en) 1993-09-24 1993-09-24 Socketed integrated circuit package

Publications (1)

Publication Number Publication Date
USD358806S true USD358806S (en) 1995-05-30

Family

ID=64341951

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/013,438 Expired - Lifetime USD358806S (en) 1993-09-24 1993-09-24 Socketed integrated circuit package

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US (1) USD358806S (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD421597S (en) * 1998-04-24 2000-03-14 Sony Corporation Semiconductor element
USD421967S (en) * 1997-08-06 2000-03-28 Sony Corporation Semiconductor element
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD421967S (en) * 1997-08-06 2000-03-28 Sony Corporation Semiconductor element
USD432505S (en) * 1997-08-06 2000-10-24 Sony Corporation Semiconductor element
USD421597S (en) * 1998-04-24 2000-03-14 Sony Corporation Semiconductor element
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus
USD819581S1 (en) 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module

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