USD1037187S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD1037187S1
USD1037187S1 US29/838,459 US202229838459F USD1037187S US D1037187 S1 USD1037187 S1 US D1037187S1 US 202229838459 F US202229838459 F US 202229838459F US D1037187 S USD1037187 S US D1037187S
Authority
US
United States
Prior art keywords
power semiconductor
semiconductor module
view
module
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/838,459
Inventor
Zhiqiang Niu
Bum-Seok Suh
Jong-mu LEE
Jia-long Yuan
JunHo Lee
Xiaorong Ge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha and Omega Semiconductor Cayman Ltd
Original Assignee
Alpha and Omega Semiconductor Cayman Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha and Omega Semiconductor Cayman Ltd filed Critical Alpha and Omega Semiconductor Cayman Ltd
Priority to US29/838,459 priority Critical patent/USD1037187S1/en
Application granted granted Critical
Publication of USD1037187S1 publication Critical patent/USD1037187S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a right, front, top perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
The broken lines are shown for environmental purposes only and form no part of the claimed design.
All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor module, as shown and as described.
US29/838,459 2022-05-12 2022-05-12 Power semiconductor module Active USD1037187S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/838,459 USD1037187S1 (en) 2022-05-12 2022-05-12 Power semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/838,459 USD1037187S1 (en) 2022-05-12 2022-05-12 Power semiconductor module

Publications (1)

Publication Number Publication Date
USD1037187S1 true USD1037187S1 (en) 2024-07-30

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ID=91959727

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/838,459 Active USD1037187S1 (en) 2022-05-12 2022-05-12 Power semiconductor module

Country Status (1)

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US (1) USD1037187S1 (en)

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US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
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USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
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USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
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USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Patent Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4951122A (en) * 1987-05-27 1990-08-21 Hitachi, Ltd. Resin-encapsulated semiconductor device
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
US5594282A (en) * 1993-12-16 1997-01-14 Seiko Epson Corporation Resin sealing type semiconductor device and method of making the same
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
US5910681A (en) * 1996-05-15 1999-06-08 Kabushiki Kaisha Toshiba Resin sealed semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US6716670B1 (en) * 2002-01-09 2004-04-06 Bridge Semiconductor Corporation Method of forming a three-dimensional stacked semiconductor package device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FS820R08A6P2BBPSA1,https://www.mouser.com/ProductDetail/Infineon-Technologies/FS820R08A6P2BBPSA1?qs=%252BbzPfv9VPAH4B6v94SM3qg%3D%3D&mgh=1&gclid=EAlalQobChMIrO3dl8iOgAMVDi3UAR2mgQMbEAkYAiABEgKdZfD_BwE,Copyright © 2023 Mouser Electronics, Inc. (Year: 2023). *
IGBT Module PIM,https://www.fujielectric.com/products/semiconductor/model/igbt/pim.html,2023. (Year: 2023). *

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